电流密度对钙磷沉积层组成和结构的影响(英文)

用X射线衍射、激光拉曼光谱以及等离子体原子发射光谱等技术研究了电化学沉积钙磷陶瓷过程中 ,电流密度对电沉积层组成和结构的影响 .实验表明阴极表面得到的沉积物是几种钙磷盐组成的混合物 ,且其成份随电流密度的改变而发生较大的变化 .在电解液温度为 75℃条件下 ,当控制电流密度较低时 ,沉积层主要由CaHPO4· 2H2 O (DCPD)和Ca8H2 (PO4) 6· 5H2 O (OCP)组成 ;随着电流密度的增加 ,阴极表面逐渐生成Ca3 (PO4) 2 ·nH2 O (TCP)和Ca10 (PO4) 6(OH) 2 (HAP) .当电流密度大于 5mA/cm2 时 ,电沉积层的主要成份为羟基磷灰石 (HAP) .     

Na_（1－x）Zr（2－x）Nb_xP_3O_（12）系列化合物的水热晶化研究

采用水热晶化反应，制备出传统需要高温固相反应合成的掺杂ＮＡＳＩＣＯＮ化合物Ｎａ（１－ｘ）Ｚｒ（２－ｘ）ＮｂｘＰ３Ｏ１２（０＜ｘ＜１），并应用ＸＲＤ、ＩＲ方法对产物的晶体结构进行了研究，表明水热晶化产物是纯的物相并具有与ＮａＺｒ２Ｐ３Ｏ１２相同的结构．固体３１ＰＮＭＲ研究证实Ｎｂ（５＋）部分取代了Ｚｒ（４＋）所在位置，参与骨架的组成，并统计分布于结构中．水热晶化产物与固相反应产物具有相同的离子电导性能．     

Evolution of Er^3＋ Distribution in the Oxyfluoride Glass Ceramics with Heating

The distribution characteristics of Er3+ ions doped in the oxyfluoride glass ceramics containing LaF3 nanocrystals heat-treated at 650 ℃ for different durations were investigated. The results of the integral absorption cross-section analysis demonstrated that the partition fraction of Er3+ in LaF3 nanocrystals increases with prolonging of heating time. The anomalous phenomena of Er3+ emissions in the up-and the down-conversion fluorescence spectra are well explained based on the calculated results.     

Kinetics of thermoset cure and polymerization in the glass transition region

A theoretical approach to thermoset cure kinetics based on Arrhenius kinetics and mobility was developed by considering the activation of the reacting group and chain mobility as elementary steps for reaction. This extended kinetic equation was successfully applied to the curing of an epoxy by an amine, the trimerization of a cyanate, and to the polymerization of methyl methacrylate. Full agreement between theory and experimental data was obtained in all cases. The activation energies for chain mobility were exceptionally low (0.3–1 kJ/mol for bisphenol-A-based epoxy and cyanate) which indicates that the structural units must undergo only small-angle rotational oscillations to allow a reaction. A theoretical time–temperature–transformation (TTT) diagram is also presented. © 1993 John Wiley & Sons, Inc.     

Thermal analysis of vinyl siding

Vinyl siding is typically produced by co-extruding a capstock (surface layer) over a PVC substrate formulation. The capstock is often non-PVC, these systems can result in warpage during or after production. In our study we will show that this warpage can result from an interfacial induced stress related to the mismatch between the glass transition of the substrate and the capstock. Additionally, both TMA and TMDSC were used to probe the stress release. Capstock formulations which better match the glass transition of the PVC substrate result in superior performance.     

Thermal decomposition of struvite

Struvite (NH₄MgPO₄·6H₂O) is a mineral often found in urinary tracts and kidneys. Thermal decomposition using slow low heating shows that the 'kidney' stone can be decomposed at temperatures below 40°C. At this temperature both ammonia and water are evolved. If more rapid heating is employed the decomposition occurs at around 80°C. The implication of this work rests with the use of low slow heat for the decomposition of the kidney stones. This revised version was published online in July 2006 with corrections to the Cover Date.     

Calorimetric study ofβ-cyclodextrin undecahydrate

Heat capacities of crystalline-cyclodextrin undecahydrate have been measured in the temperature range between 13 and 300K by use of a miniaturized adiabatic low-temperature calorimeter. A first-order phase transition occurred at 226K with a discontinuous entropy change of 45.0 ± 1.0J K ^–1 mol^–1. The highly disordered nature of the high temperature phase was considered in relation to the entropy contribution. A glass transition phenomenon observed around 150K was ascribed to the freezing of a configurational change of the protons engaged in the four-membered hydrogen-bonded ring which appeared only in the low temperature phase.     

Thermal Oxidative Stability of Heat-Stabilised Polyamide 66 by Differential Scanning Calorimetry

The thermal stability of heat-stabilised polyamide 66 in an oxidative environment is evaluated by DSC. The oxidative stability of the polyamide decreases as a result of repeated injection moulding. The results also indicate that the presence of glass fibres in the polyamide has a negative influence on the oxidative stability. Both isothermal and dynamic DSC measurements seem to be useful tools for assessing the stability of polyamides and there is a relationship between data determined using both procedures. This revised version was published online in July 2006 with corrections to the Cover Date.     

Acceleration of the cationic polymerization of an epoxy with hexanediol

Thin films of 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexane carboxylate were UV irradiated (1.1 J cm^-2) under isothermal conditions ranging from 0 to 50°C. Under these conditions the polymerization advanced quickly but only to a conversion level of less than 10% before the reaction rate slowed by more than an order of magnitude. This drop off in rate was not caused by the glass transition temperature, T _g, reaching or exceeding the reaction temperature, T _rxn, since the epoxide's T _g remained at least 40°C below T _rxn. Raising the sample temperature above 60°C caused a sharp increase in the conversion level. At 100°C conversion exceeds 80% and the ultimate T _g approaches 190°C. The addition of 10 mass% 1,6-hexanediol, HD, to the epoxy caused the conversion at room temperature to quintuple over the level obtained without the alcohol present. The heat liberated from this alcohol epoxy blend during cure on a UV conveyor belt system caused the sample's temperature to increase by about 100°C above ambient whereas the epoxy alone under these conditions only experienced a modest temperature rise of about 26°C. If the amount of HD in the blend is increased above 10% the heat of reaction at 23°C decreases due to HD being trapped in a nonreactive crystalline phase. Boosting reaction temperatures above 50°C melts the HD crystals and yields significantly improved conversion ratios. As the level of alcohol blended with the epoxy is raised its ultimate T _g is lowered and when the concentration of alcohol in the blend nears 30 mass%T _g drops below room temperature. This revised version was published online in July 2006 with corrections to the Cover Date.