Design and modelling of high-operating temperature MWIR HgCdTe nBn detector with n- and p-type barriers

The paper present the numerical analysis of the electrical and optical properties of the mid-wave infrared (MWIR) HgCdTe nBn type detectors with a 3.4 μm cut-off wavelength (at 50% of the initial rise in the response) operating at 230 K. The analysed n⁺/B/n/N⁺ structure consists of four HgCdTe layers with n- and p-type barriers. Different structural parameters, as well as compositional and dopant profiles obtained in molecular beam epitaxy (MBE) and metal organic chemical vapour deposition (MOCVD) techniques were modelled with emphasis on conduction band and valence band-offset which determines the proper construction of the nBn type devices. The barrier must prevent the flow of the electron current from the cap region to the absorber while simultaneously ensure the flow and collection of thermally and optically generated holes from the absorber to the cap region. It was shown that proper p-type doping of the barrier reduce the valence band-offset and increase the offset in the conduction band leading to the optimal detector architecture.Theoretical results were related to the experimental data of the MWIR n⁺/B/n/N⁺ photodetectors grown by MOCVD. Dark currents of the first fabricated devices are limited by undesirable iodine diffusion from cap layer to the barrier. However, the nBn architecture might be a promising solution for HgCdTe infrared detectors grown by MOCVD, mainly due to the possibility of in situ acceptor doping of the barrier.     

Group 2 element β-diketonate complexes: synthetic and structural investigations

An overview of the Group 2 element β-diketonates is presented, including their synthesis, structural characteristics, physical properties, and some potential applications.     

温度对Si上MOCVD-ZnO成核与薄膜生长特性的影响

采用金属有机化学气相沉积(MOCVD)方法在Si衬底上进行了ZnO的成核与薄膜生长研究。ZnO薄膜的形貌和结晶特性由成核和后期生长过程共同决定,初期成核温度决定了其尺寸和密度,进而影响后期ZnO主层的生长行为,但由于高温对后期ZnO纳米柱横向生长的抑制,纳米柱的尺寸并没有因为成核尺寸的增大而变大,因此在560℃得到了晶柱尺寸最大、密度最小的ZnO薄膜。最后通过改变成核温度,优化了ZnO外延膜的结晶质量。     

Impact of the gas flow ratio on the physical properties of GaN grown by vertical flow metalorganic chemical vapour deposition

We studied the effect of gas flow ratio of the H₂ carrier gas to the NH₃ precursor on the physical and crystal properties of GaN. GaN was grown by vertical reactor metalorganic chemical vapour deposition (MOCVD) on a low-temperature-deposited GaN buffer layer. A (0 0 0 1) sapphire substrate was used. The impact of the gas flow ratio as it was varied from 0.25 to 1 was investigated and discussed. With increase in flow ratio, the concentrations of magnesium and carbon impurities in GaN increased. The flow ratio of 0.5 is the optimum value to minimise the background electron concentration and to maintain crystal quality. The decrease in the background electron concentration is due to the compensation mechanism of acceptor-like magnesium and carbon impurities.     

Fabrication and characterization of La-doped HfO2 gate dielectrics by metal-organic chemical vapor deposition

La-doped HfO₂ gate dielectric thin films have been deposited on Si substrates using La(acac)₃ and Hf(acac)₄ (acac = 2,4-pentanedionate) mixing sources by low-pressure metal-organic chemical vapor deposition (MOCVD). The structure, thermal stability, and electrical properties of La-doped HfO₂ films have been investigated. Inductive coupled plasma analyses confirm that the La content ranging from 1 to 5 mol% is involved in the films. The films show smaller roughness of ∼0.5 nm and improved thermal stability up to 750 °C. The La-doped HfO₂ films on Pt-coated Si and fused quartz substrates have an intrinsic dielectric constant of ∼28 at 1 MHz and a band gap of 5.6 eV, respectively. X-ray photoelectron spectroscopy analyses reveal that the interfacial layer is Hf-based silicate. The reliable value of equivalent oxide thickness (EOT) around 1.2 nm has been obtained, but with a large leakage current density of 3 A/cm² at V_g = 1V + V_fb. MOCVD-derived La-doped HfO₂ is demonstrated to be a potential high-k gate dielectric film for next generation metal oxide semiconductor field effect transistor applications.     

MOCVD方法在Cu/Si(111)基板上生长ZnO薄膜

采用常压MOCVD方法在Cu／Si（111）基板上生长ZnO薄膜，研究了缓冲层的生长温度对ZnO外延膜性能的影响。实验通过干涉显微镜、原子力显微镜、高分辨X射线衍射仪、光致发光谱仪对样品的表面形貌、晶体结构以及发光性能进行了分析。实验结果表明：ZnO／Cu／Si（111）外延膜的性能与缓冲层的生长温度有一定关系。当缓冲层温度控制在400℃附近时ZnO外延膜C轴取向较为明显、晶粒大小较均匀、结构也更为致密，并且PL光谱中与缺陷有关的深能级发射峰也相对较弱。     

缓冲层厚度对Ti/Si模板上生长ZnO薄膜的影响

采用常压MOCVD法,以二乙基锌和去离子水为源,在不同厚度的ZnO缓冲层上生长了一组ZnO薄膜.分别采用X射线衍射(XRD)、干涉显微镜和光致发光谱(PL)对样品的结晶性能、表面形貌和发光性能进行分析,结果表明,随着缓冲层的引入,ZnO外延膜的质量得到很大提高,缓冲层的厚度对外延ZnO薄膜的质量有很大的影响,当缓冲层厚度为60 nm时,ZnO薄膜的结晶性能最好,表现出高度的择优取向,(002)面的ω摇摆曲线半峰全宽仅为1.72°,其表面平整,表现出二维生长的趋势,室温光致发光谱中只有与自由激子复合有关的近紫外发光峰,几乎观察不到与缺陷有关的深能级发光.     

Structural and optical properties of high-density (>10/cm) InAs QDs with varying Al(Ga)As matrix layer thickness

We have obtained high-density (>10¹¹/cm²) InAs quantum dot (QD) structures by using an Al(Ga)As matrix layer. With increase of the AlAs matrix layer thickness, the density of QDs increases a little and the luminescence intensity emitted from InAs QDs decreases. We have used a thin GaAs insertion layer (IL) for the reason of keeping InAs QDs from an aluminum intermixing towards QDs. As the thickness of GaAs IL increases, the density of QDs decreases slightly due to the reduction of the roughness of an AlAs matrix layer. However, the luminescence intensity increases with increase in the thickness of GaAs IL resulting from the efficient blocking of an aluminum intermixing towards QDs.     

TEM investigations of GaN layers grown on silicon and sintered GaN nano‐ceramic substrates

GaN nano‐ceramics were analyzed using transmission electron microscopy (TEM), showing that these ceramics are characterized by highly disoriented grains of the linear size of 100–150 nm. These GaN ceramics were used as substrates for GaN epitaxy in standard MOVPE conditions. For the comparison, MOVPE GaN layers on silicon substrates were grown using similar conditions. It is shown that MOVPE growth of GaN layers is highly anisotropic for both cases. However, the disorientation of the highly mismatched GaN layer on silicon is different from that characterizing GaN layer deposited on the ceramic substrate. In the latter case the disorientation is much higher, and three dimensional in nature, causing creation of polycrystalline structure having large number of the dislocations. In the case of the GaN layer grown on the silicon substrate the principal disorientation is due to rotation around c‐axis, causing creation of mosaic structure of edge dislocations. Additionally, it is shown that the typical grain size in AlN nucleation layer on Si is smaller, of order of 20 nm. These two factors contribute to pronounced differences in later stage of the growth of GaN layer on the ceramic. Due to high growth anisotropy an appropriately thick GaN layer can, eventually, develop flat surfaces suitable for construction of optoelectronic and electronic structures. As shown by the TEM data, this can be achieved only at the cost of creation of the relatively large density of dislocations and stacking faults. The latter defects were not observed for the GaN growth on Si substrates. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)