Nonstationary mathematical models of the electrochemical processes in volumetric porous flow electrodes

Model representations of the nonstationary processes caused by the nonstationary electrolysis regimes on three-dimensional flow electrodes (TFEs) were developed. A change in the electrode and electrolyte parameters with time was taken into account. As an illustration of the efficiency of a model of two-dimensional electrochemical system, co-electrodeposition of two metals with hydrogen evolution on TFE was considered for the case of mutually perpendicular directions of current and electrolyte flow.     

Pulse Plating of Zn-Co Alloy Coatings

Pulse plating of Zn-Co alloys was studied using square pulse containing reverse current.The surface morphologies of Zn-Co alloy deposits were examined using scanning elecron microscopy （SEM）, and an attendant energy dispersive X-ray analyzer （EDA） was used to analyze the composition of Zn-Co alloy deposits. Results obtained showed that the average current density and reverse current density amongst all the variables investigated had very strong effects on the cobalt content and surface morphologies of Zn-Co alloy deposits. It is possible to elecrodeposit Zn-Co alloy coatings with a very wide cobalt content range of 10-90 wt% by modulating pulse parameters.     

透射强度比X射线荧光光谱法测定金属镀层组分

本文介绍了X射线荧光光谱透射强度比测定中等可变厚度金属镀层的组分方法。采用镀层元素强度和基片透射强度之比对镀层元素镀布分量制作工作曲线。     

稀土添加剂对镍,铜刷镀层质量的影响

通过在刷镀镀液中加入稀土添加剂，研究稀土对刷镀层质量的影响。实验结果表明，稀土起到平整、光亮、细化镀层晶粒、减少镀层应力的作用，并增强镀层结合力，提高镀层的耐磨性、耐蚀性。     

Chemical Nickel Plating

Metal layers can be deposited from aqueous solutions not only by electric current as in electroplating but also by strong reducing agents. Chemical deposition of nickel on metallic and nonmetallic substrates, together with the long-known silvering of glass, are the most widespread examples. This remarkable reaction has recently found a variety of industrial applications mainly in the preparation of corrosion-resistant, hard, and wear-resistant protective layers, in the metallizing of plastics, and in electronics.     

Ion-pair chromatography of bis (sodium-sulfopropyl) disulfide brightener in acidic copper plating baths

Quantitative analysis of the brightener component bis (sodium-sulfopropyl) disulfide (SPS) in acidic copper plating baths poses a real challenge due to the complex chemical matrix containing large amounts of Cu(II) ion and sulfuric acid together with other organic additives and additive decomposition products. We developed a new ion-pair chromatography method to analyze micro-molar amounts of SPS directly in plating bath samples without the need for sample pre-treatment. Addition of tetra-N-methylammonium cation as ion-pairing agent to a methanol-sulfuric acid-water eluent increases the retention time of the anionic SPS2- on a C18 column sufficiently to separate this compound from Cu(II) ion and additive by-products.     

Deposition of TiSiN coatings by arc ion plating process

Titanium silicon nitride (TiSiN) thin films were deposited on tungsten cemented carbide tools by cathode arc ion plating (AIP) process using alloy TiSi targets. The effects of silicon addition and negative substrate bias on the development of the textures of films were studied systematically by varying the bias voltage from −20 to −200 V. The structural features of the films were investigated in detail using X-ray diffraction. The effect of the texture on such mechanical properties as hardness and adhesion of the films was also studied. A maximum hardness of 42 GPa was obtained at a DC substrate bias of −150 V. The characteristics of TiSiN thin films exhibited excellent adhesion of over 150 N. The cutting performance of end-mills and drillers was evaluated by milling and drilling of highly hardened material under high-speed cutting conditions. The results reveal that cutting tools with TiSiN coatings markedly outperformed those with TiN coatings, and the uncoated cutting tools. TiSiN coating increased the cutting lifetime to seven times that of the uncoated one.     

ICF靶用泡沫铜的制备与表征

 以次磷酸钠为还原剂的化学镀进行导电化处理,研究了ICF靶用泡沫铜的电沉积工艺。采用扫描电子显微境和X射线衍射仪对制备过程中各阶段泡沫铜的微观结构进行了表征。结果表明：经化学镀后可获得晶粒尺寸小、分布均匀的铜沉积层。电沉积后铜沉积层主要由0.55 μm的小颗粒组成,并且出现突出大颗粒的形貌特征。在氢气氛围下,经700 ℃热处理后,铜颗粒进一步长大,沉积层结晶致密。制备的泡沫铜呈3维网络状结构,分布均匀,密度为0.19 g/cm³,孔径分布为400～600 μm,孔隙率达97.9％。     

电镀铜实验中镀层性质及其影响因素的探究*

电镀实验是电解原理应用的重要案例,通过实验不仅要获得定性的感性认知,还应该获得定量的理性数据。针对电镀铜实验,通过改变铜离子浓度、pH、电解时间、电解电压和电解温度等因素,探究其对镀层厚度、均匀性和致密性等性质的影响,在电解原理的基础上分析其形成机制,从而确定了电镀铜较适宜的操作条件,以此为学生开展电镀实验提供参考案例与研究思路。     

EMI shielding performance of electroless coated iron nanoparticles on graphite in low-density polyethylene composite for X-band applications

In the proposed work, an investigation of shielding effectiveness (SE) for varying compositions of Graphene, Multiwall carbon nanotubes (MWCNT), and Iron nanoparticles coated on Graphite (Fe@Graphite) was conducted in X-band (8.2 GHz–12.4 GHz). All these are mixed in an LDPE matrix. The nanomaterial was subjected to chemical characterization, i.e., Scanning electron microscopy (SEM), X-ray diffraction (XRD), and vibrating sample magnetometry (VSM). The shielding observed is dominantly due to absorption. The lattice structure which facilitates the shielding due to absorption was the hexagonal graphite structure on whose surface iron nanoparticles were embedded and used as the magnetic filler. At the same time, Graphene and MWCNT act as electrically conducting fillers. The Total shielding effectiveness(SE_T) was maximum for LDPE, MWCNT, Graphene, and Fe@Graphite, in the ratio of 50: 5: 25: 20 by weight %, and is 49 dB at 9.65 GHz for a sample thickness of 3 mm.