塑料封装集成电路结构热应力分布的解析解

由于集成电路的硅芯片与其周围的塑料封装材料热膨胀系数的不协调,产生的热残余力会直接导致封装结构的破坏及集成电路的失效.将硅芯片的角点结构模化成半无限大楔体,求得了热应力分布的解析解.在此基础上,应用应变能密度因子准则评价电子封装结构角点处的开裂强度及开裂方向.     

基于细观力学均匀化等效材料参数的复合泡沫热致应力预测方法

环氧复合泡沫采用空心玻璃微珠改性环氧树脂，对于降低电子封装材料的热致应力非常有效．为提高环氧复合泡沫的设计效率，本文提出了一种宏细观结合的环氧复合泡沫热致应力分析方法．首先通过细观力学建立不同微珠粒径、壁厚、微珠体积分数等微观结构参数下环氧复合泡沫的等效性能预测模型，然后结合宏观线弹性热应力分析模型，进行环氧复合泡沫电子封装的热致应力分析，最终获得了一种电子封装热致应力与环氧复合泡沫微观结构之间的关联模型．基于模型探讨了微珠壁厚、微珠体积分数、微珠配比等微观结构参数对封装热致应力的影响规律，并基于两种典型封装结构证明了方法的可行性，研究成果对于开发低应力封装技术、提高电子封装的可靠性及环境适应性具有重要的意义．     

Polythiophene encapsulated inside(13, 0) CNT: A nano-hybrid system

We present a first-principles calculation on the electronic and optical properties of a hybrid nanotube system consisting of a （13, 0） single-walled carbon nanotube encapsulated by polythiophene. This hybrid-system represents a complete new type of matter and is known as the peapod system. We analyze bow the polythiophene changes the electronic and optical properties of the nanotube. In particular, we examine new features in the dielectric function due to the transitions between the states of the polymer and the nanotube. The electronic structure of the combined system appears to be a simple superposition of the individual constituents. The density functional theory calculations demonstrate van der Waals interaction as the bonding mechanism between the tube and the encapsulated molecule.     

利用原子层沉积技术实现有机电致发光器件的薄膜封装EI北大核心CSCD

有机电致发光器件(Organic light emitting diode,OLED)具有轻薄、便于携带、自发光、能耗低、亮度更大、柔性显示等特点,可以增加显示产品的附加值,因此被科学和产业界广泛关注。然而,OLED器件中的有机材料对空气中的水汽和氧气十分敏感,若器件在无封装保护的情况下长期在空气中存放,将会严重影响OLED的工作性能和寿命。除了选择合适的传输层材料、表面层结构和利用界面工程提高材料水氧耐受能力之外,对器件进行可靠的封装是隔绝空气中水汽和氧气侵蚀的一种有效手段。原子层沉积(Atomic layer deposition,ALD)是一种已经在实验室验证的有效薄膜沉积封装技术,由于ALD的自限制反应特性,可以在低温下沉积出厚度精确可控且均匀致密的薄膜,利用ALD沉积的薄膜往往拥有良好的机械柔性、超高的阻隔性能和光学透过率。本文将回顾原子层沉积技术的原理,分析ALD制备薄膜的水汽透过率,比较ALD在单层、有机-无机叠层薄膜封装制备上的技术优势。     

低成本基板倒装焊底充胶分层裂缝扩展研究

采用MIL-STD-883C热循环疲劳加载标准，通过电学检测方法测定了B型和D型两种倒装焊封装焊点寿命。并使用无损声学C-SAM高频超声显微镜技术观测这两种倒装焊封装在焊点有无断裂两种情况时芯片／底充胶界面的分层和扩展，计算得到分层裂缝扩展速率。在有限元模拟中采用粘塑性和时间相关模量描述了SnPb焊点和底充胶的力学行为。使用裂缝尖端附近小矩形路径J积分方法作为断裂力学参量得到不同情况下的界面分层裂缝顶端附近的能量释放率。然后由实验裂缝扩展速率和有限元模拟给出的能量释放率得到可作为倒装焊封装可靠性设计依据的Par—is半经验方程。     

Thin-film encapsulation for top-emitting organic light-emitting diode with inverted structure

We theoretically study the light outcoupling efficiency of top-emitting organic light-emitting diode(OLED) with inverted structure and thin-film encapsulation.Thin-film optics is used to optimize the layer thickness to obtain high transmittance.Dipole mode is used to analyze the light outcoupling efficiency of the top-emitting OLED.Through this process,we can optimize the thin-film thickness with high transmittance and optimize the outcoupling efficiency of OLED.Compared with previous research,the current design method is a novel process.     

BGA封装FPGA焊点失效故障诊断系统设计

针对BGA(Ball Grid Array)封装FPGA(Field Programmable Gate Array)焊接点连接失效的故障诊断问题,提出了一种故障检测系统设计方案;该方案分别从焊点级、芯片级和系统级故障诊断3个层次构建故障检测系统;方案基于Altera公司的DE2硬件平台构建单个焊点健康信息提取IP核;针对芯片焊点众多,难以全部监控的问题采用Canary故障检测法监测4个角落的敏感焊点的健康信息;敏感焊点的健康信息经菊花链式通信链路实现了不同FPGA芯片之间的信息互联,完成整个系统的焊点健康信息整合。     

有机电致发光器件的封装热特性研究

有机电致发光器件的稳定性与其封装结构密切相关,封装技术的优劣直接影响有机电致发光二极管器件的寿命.本文采用热阻抗模型对三种常用有机电致发光二极管器件封装结构进行热阻抗分析,并利用ANSYS有限元分析软件的热分析模块对热特性进行研究,得出各种器件封装结构的温度场分布,根据温度场分布比较得出各种封装结构散热性能的差异.分析得出,传统后盖式封装结构与混合封装结构散热效果相差不大,Barix封装结构具有最好的散热性能.模拟仿真结果显示,当玻璃厚度从0.5 mm增加至0.9 mm时,传统封装结构的发光层温度升高了0.124℃,Barix封装结构的发光层温度升高了0.262℃,表明玻璃层厚度的增减对有机电致发光二极管器件的散热影响较小.改变器件表面空气流动速度,使对流系数从25W/(m²·K)变为85W/(m²·K)时,传统封装结构有机电致发光二极管发光层的温度由42.911℃递减到26.85℃,可见增大表面空气流动速度对降低有机电致发光二极管有源层的温度作用显著.     

A density functional theory study of the electronic structures and magnetic properties of Fe（1-x）Cox alloy nanowires encapsulated in （10,0） carbon nanotubes

Under the generalized gradient approximation, the electronic structures and magnetic properties of Fe_(1-x)Co_x alloy nanowires encapsulated inside zigzag (10,0) carbon nanotubes (CNTs) are investigated systematically using firstprinciple density functional theory calculations. For the fully relaxed Fe_(1-x)Co_x/CNT structures, all the C atoms relax outwards, and thus the diameters of the CNTs are slightly increased. Formation energy analysis shows that the combining processes of all Fe_(1-x)Co_x/CNT systems are exothermic, and therefore the Fe_(1-x)Co_xalloy nanowires can be encapsulated into semiconducting zigzag (10,0) CNTs and form stable hybrid structures. The charges are transferred from the Fe_(1-x)Co_xnanowires to the more electronegative CNTs, and the Fe-C/Co-C bonds formed have polar covalent bond characteristics. Both the spin polarization and total magnetic moment of the Fe_(1-x)Co_x/CNT system are smaller than those of the corresponding freestanding Fe_(1-x)Co_xnanowire, and the magnetic moment of the Fe_(1-x)Co_x/CNT system decreases monotonously with increasing Co concentration, but the Fe_(1-x)Co_x/CNT systems still have a large magnetic moment, implying that they can be utilized in high-density magnetic recording devices.