A density functional theory study of the electronic structures and magnetic properties of Fe（1-x）Cox alloy nanowires encapsulated in （10,0） carbon nanotubes

Under the generalized gradient approximation, the electronic structures and magnetic properties of Fe_(1-x)Co_x alloy nanowires encapsulated inside zigzag (10,0) carbon nanotubes (CNTs) are investigated systematically using firstprinciple density functional theory calculations. For the fully relaxed Fe_(1-x)Co_x/CNT structures, all the C atoms relax outwards, and thus the diameters of the CNTs are slightly increased. Formation energy analysis shows that the combining processes of all Fe_(1-x)Co_x/CNT systems are exothermic, and therefore the Fe_(1-x)Co_xalloy nanowires can be encapsulated into semiconducting zigzag (10,0) CNTs and form stable hybrid structures. The charges are transferred from the Fe_(1-x)Co_xnanowires to the more electronegative CNTs, and the Fe-C/Co-C bonds formed have polar covalent bond characteristics. Both the spin polarization and total magnetic moment of the Fe_(1-x)Co_x/CNT system are smaller than those of the corresponding freestanding Fe_(1-x)Co_xnanowire, and the magnetic moment of the Fe_(1-x)Co_x/CNT system decreases monotonously with increasing Co concentration, but the Fe_(1-x)Co_x/CNT systems still have a large magnetic moment, implying that they can be utilized in high-density magnetic recording devices.     

提高硅光电探测器树脂封装可靠性研究

树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。但它的可靠性,特别足抗潮湿性差。本文通过抗潮湿性能分析,比较了几种树脂封装,发现用F S203 C十G N522封装可提高其可靠性。     

云纹干涉法现场测量技术及其在微电子封装中的应用

本文研制了多功能微观云纹干涉仪系统.该系统可以现场测量电子封装组件热疲劳、热湿耦合、热载荷引起的变形,被应用于电子封装组件的可靠性分析中.由现场云纹干涉技术测得的疲劳寿命与加速热循环实验的结果相吻合.本系统还被应用于铜焊点的断裂行为分析中.实验证明本系统可以测量多层结构材料的应力强度因子、应变能释放率以及位相角.     

纳米银焊膏封装大功率COB LED模块的性能研究

为提高大功率LED的散热能力,采用具有更高熔点和更优良的导电导热性能的纳米银焊膏作为芯片粘结材料,以Al2O3基陶瓷基板封装COB LED模块。同时以Sn/Ag3.0/Cu0.5和导电银胶两种粘结材料作为对比,分别在27,50,80,100,120℃等环境温度中测试3种模块的光电性能来评估模块的热管理水平;在100℃环境下进行加速老化实验,评估3种LED模块的可靠性。测试结果表明,纳米银焊膏封装的大功率LED模块光电性能优异,且具有较强的长期可靠性。     

基于横向热流抑制的半导体激光芯片封装实验研究

为降低半导体激光芯片的慢轴远场发散角,提高其慢轴方向的光束质量,设计了横向热流抑制的封装结构。利用热沉间的物理隔离,削弱了半导体激光芯片慢轴方向上的温度梯度,有效降低了半导体激光芯片慢轴方向的发散角。采用热分析模拟了不同封装结构下芯片发光区的温度分布,并对波长915 nm的窄条宽半导体激光芯片进行封装。实验结果表明,在工作电流15 A,封装在隔离槽长4 mm,脊宽120 μm刻槽热沉上的芯片,其慢轴远场发散角由12.25°降低至10.49°,相应的光参量积（BPP）由5.344 mm·mrad 降低至4.5763 mm·mrad,慢轴方向亮度提升了约5.5%。实验结果表明,横向热流抑制的封装结构可以有效地削弱半导体激光芯片慢轴方向上由热透镜效应引起的高阶模激射,从而降低其慢轴远场发散角。     

超声显微检测技术在电子封装中的应用与发展

超声显微检测技术应用于电子封装领域始于上世纪80年代,如今已是检测电子封装可靠性和完整性的重要手段,被广泛应用到了电子封装的缺陷检测和精密测量等方面。针对电子封装的超声显微检测存在回波重叠、信噪比低等问题,近年来,发展了许多时频分析方法,用于获得优于常规方法的纵向分辨率,即实现超分辨率。本文首先介绍了超声显微检测的发展历史,对其检测原理和分辨率理论进行了简述;其次,综述了超声显微检测技术在电子封装中的主要应用与发展现状;然后,对超声显微检测的超分辨率成像方法进行了综述,分别介绍了基于小波分析的反卷积、连续小波变换和稀疏表示在实现超分辨率时的原理及适用场景;最后,探讨归纳了电子封装超声显微检测的主要研究方向及难点。     

刚性非共平面的环氧树脂体系的制备及性能研究

基于新型的刚性非共平面二胺4',4″-(2,2-diphenylethene-1,1-diyl)dibiphenyl-4-amine(TPEDA)环氧树脂固化剂,采用动态机械分析(DMA)、热机械分析(TMA)和阻抗分析全面研究了其固化环氧树脂(E51)所制备的环氧固化物(E51/TPEDA)的热、机械和介电等综合性能.并与商业化的固化剂2,4-二氨基二苯甲烷(DDM)、4,4二氨基二苯砜(DDS)固化环氧树脂体系进行对比,结果表明由于TPEDA特有的刚性非共平面结构的引入,E51/TPEDA体系表现了较高的玻璃化转变温度、拉伸强度和较低的热膨胀系数、介电常数与损耗等优异物理性能.因此,基于新型非共平面二胺的环氧树脂固化物表现了在电子封装领域的潜在应用前景.     

EFFECT OF LOADING TYPE ON FATIGUE CRACK GROWTH BEHAVIOR OF SOLDER JOINT IN ELECTRONIC PACKAGING

Fatigue cracking tests of a solder joint were carried out using in-situ scanning electron microscopy （SEM） technology under tensile and bending cyclic loadings. The method for predicting the fatigue life is provided based on the fatigue crack growth rate of the solder joint. The results show that the effect of the loading type on the fatigue crack growth behavior of a solder joint cannot be ignored. In addition, the finite element analysis results help quantitatively estimate the response relationship between solder joint structures. The fatigue crack initiation life of a solder joint is in good agreement with the fatigue life （N50%） of a totally electronic board with 36 solder joints.