非晶态锂离子导体B2O3-0.7Li2O-0.7LiCl-xAl2O3-0.1V2O5的电学性质和电子自旋共振研究

对两种非晶态B₂O₃-0.7Li₂O-0.7LiCl-xAl₂O₃-0.1V₂O₅(x=0.05和0.15),用差热分析、电导率测量、X射线衍射和电子自旋共振进行研究,发现:1)V₂O₅不仅作非晶网络形成剂,而且改变了晶化过程;2)对B₂O₃-Li_{2关键词：}     

NASICON型化合物结构的NMR研究

在水热晶化合成一系列NASICON型化合物的基础上,应用固体高分辨³¹P和²⁹Si MAS NMR,研究了几种NASICON化合物的结构,观察其骨架原子P和Si在结构中的状态及分布,并解释了由于在结构中发生取代作用而引起,Si或P的化学位移的变化.     

电子与原子、离子碰撞过程的相对论效应

在玻恩近似下,建立了高能电子与原子、离于非弹性碰撞过程的相对论性理论计算方法,并以类Li等电子系列为例,阐明了电子与原子、离子非弹性碰撞过程的相对论效应.它包括:1.靶原子的相对论效应,它随原子序数的增加而增大.低z靶(如Li)的相对论效应可以忽略;对Au~(+76)靶的2_3—3p跃迁,广义振子强度相对论性计算值比相应的非相对论性值小27.1%.2.入射电子的相对论效应,它随入射电子能量的增加而增大.对高能入射电子,在特殊角度,要考虑广义振子强度横场项对微分截面的影响.在极端相对论情况下,如入射电子动能 关键词：     

磁控溅射技术制备ZnO透光薄膜

采用RF磁控溅射方法,在玻璃衬底上制备了择优取向的ZnO薄膜;通过台阶仪、X射线衍射技术、原子力显微镜和分光光度计分别测量了不同溅射功率条件下淀积的ZnO薄膜厚度(淀积速率)、结晶质量、表面形貌与粗糙度、透光光谱,报道了该薄膜结晶质量、薄膜粗糙度与其在可见光区透光率的关系.     

Effect of Hydrogen Implantation on SIMOX SOI Materials

Hydrogen ions were implanted into separation by implantation of oxygen (SIMOX) silicon-on-insulator (SOI) wafers near the oxygen-implantation-induced damage peak under different conditions of energy and dose. It was found that the implanted hydrogen ions not only accelerate the diffusion of oxygen atoms from the annealing ambience into the wafer but also cause an outward diffusion of oxygen atoms in the buried oxide (BOX) layer. Thus, greatly broadened buried oxygen-rich (BOR) layers were formed in our experiments, which are 18%-79% broader than the BOX layer of standard SIMOX SOI wafers under the same conditions of oxygen implantation. The mechanism was discussed. A potential low cost method to fabricate SIMOX SOI wafers is proposed.     

Yb:FAP和Yb:C3S2-FAP晶体光谱的温度特性和选择激发

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Effects of Substrate Temperature on Helium Content and Microstructure of Nanocrystalline Titanium Films

Helium-charged nanocrystalline titanium films have been deposited by HeAr magnetron co-sputtering. The effects of substrate temperature on the helium content and microstructure of the nanocrystalline titanium films have been studied. The results indicate that helium atoms with a high concentration are evenly incorporated in the deposited titanium films. When the substrate temperature increases from 60℃ to 350℃ while the other deposition＇parameters are fixed, the helium content decreases gradually from 38.6 at.% to 9.2at.%, which proves that nanocrystalline Ti films have a great helium storage capacity. The 20 angle of the Bragg peak of （002） crystal planes of the He-charged Ti film shifts to a lower angle and that of （100） crystal plane is unchanged as compared with that of the pure Ti film, which indicates that the lattice parameter c increases and a keeps at the primitive value. The grain refining and helium damage result in the diffraction peak broadening.     

Total Dose Radiation Tolerance of Phase Change Memory Cell with GeSbTe Alloy

Phase change memory （PCM） cell array is fabricated by a standard complementary metal-oxide-semiconductor process and the subsequent special fabrication technique. A chalcogenide Ge2Sb2Te5 film in thickness 50hm deposited by rf magnetron sputtering is used as storage medium for the PCM cell. Large snap-back effect is observed in current-voltage characteristics, indicating the phase transition from an amorphous state （higher resistance state） to the crystalline state （lower resistance state）. The resistance of amorphous state is two orders of magnitude larger than that of the crystalline state from the resistance measurement, and the threshold current needed for phase transition of our fabricated PCM cell array is very low （only several μA）. An x-ray total dose radiation test is carried out on the PCM cell array and the results show that this kind of PCM cell has excellent total dose radiation tolerance with total dose up to 2 ×10^6 rad（Si）, which makes it attractive for space-based applications.