吡啶桥联的聚酰亚胺的合成与性能研究

以3,4-二甲基苯乙酮与3,5-双(三氟甲基)苯甲醛为原料,通过Chichibabin反应制备了吡啶桥联的四甲基化合物,该化合物再经氧化、脱水反应制备了主链含有吡啶环、侧链带有双三氟甲基取代苯侧基的新型含氟芳香族二酐单体,2,6双(3′,4′-二羧基苯基)-4-(3″-,5″-双三氟甲基苯基)吡啶二酐(6FDAPA).FT IR、NMR、质谱以及元素分析等测试结果表明,6FDAPA的结构与预期的相符.利用6FDAPA与另外一种不含氟的二酐单体2,6双(3′,4′二羧基苯基)4苯基吡啶二酐(DAPA)分别与含氟二胺单体,1,4双(2三氟甲基4氨基苯氧基)苯(6FAPB)通过两步热亚胺化法制备了两种聚酰亚胺(PI)薄膜.测试结果表明,6FDAPA6FAPB(PI2)与DAPA6FAPB(PI1)相比具有相近的耐热性能,玻璃化转变温度为280℃,起始热分解温度为580℃、700℃时的重量保持率64.5%.同时PI2具有更为优良的透光性,紫外可见光谱(UV Vis)测试表明,PI2与PI1薄膜在450nm处的透光率分别为85.7%与69.4%.     

短侧链可溶性聚酰亚胺的制备和表征

利用3种廉价易得的含短侧链(甲基或乙基)芳香族二胺单体分别与3,3′,4,4′-二苯甲醚四酸二酐(ODPA)进行溶液缩聚反应制备了聚酰胺酸,再在三乙胺催化、乙酸酐脱水作用下进行化学亚胺化反应,成功制备出聚酰亚胺(PI)。通过红外光谱(FT-IR)证明PI已经完全亚胺化。溶解性实验表明这3种PI具有优异的溶解性能,如:在极性非质子溶剂1-甲基-2-吡咯烷酮(NMP)、N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)乃至低沸点溶剂氯仿和四氢呋喃(THF)中都可以溶解。采用DSC、TG、频谱分析仪、交流耐压试验装置、电阻测量仪、万能电子拉力机等多种手段对PI薄膜进行了性能测试。结果表明这3种PI保持了优良的热性能、电性能、力学性能等。     

可溶性聚酰亚胺的制备及其在液晶显示器上的潜在应用

以3,5-二硝基苯甲酰氯和4-羟基联苯为原料,合成了功能性二胺单体3,5-二氨基苯甲酸联苯酯(DABBE).用此单体与3,3′-二甲基-4,4′-二氨基二苯甲烷(DMMDA)、3,3′,4,4′-二苯醚四甲酸二酐(ODPA)共缩聚,采用低温缩聚-化学亚胺化的方法,通过调节共聚物组成制备了5种聚酰亚胺(PI).利用FT-IR、NMR、UV-Vis与DSC等手段对合成二胺单体及聚酰亚胺进行了结构表征和性能测试;研究了其溶解性能、透光性能、取向性能和耐热性能.结果表明,5种聚酰亚胺均可溶于NMP、DMF等极性溶剂;对液晶分子取向时的预倾角随DABBE的比例增加而增大,可达1.8°.但当DABBE的比例增加时,PI的分子量降低,将影响其成膜性能.此外,实验所得的PI透过率大于80%,玻璃化转变温度在220℃以上.     

对苯醌二亚胺与吡啶共聚物的金属配合物催化法合成及性能

在二氯-1,3-双(二苯基磷)丙烷基镍(Ⅱ)存在下,通过N,N′-二氯苯醌二亚胺和2,5-二甲基-N,N′-二氯苯醌二亚胺与2,5-二溴吡啶的格氏(Grignard)试剂共聚,得到了两种新型共轭聚合物。采用FT-IR1、H-NMR、UV-Vis、XRD、循环伏安、充放电对共聚物进行结构与性能测试。结果表明:该类共聚物具有一定的电化学活性,每种聚合物均在-1.0~2.0 V出现一对氧化-还原峰。聚(N,N′-二氯苯醌二亚胺-吡啶)和聚(2,5-二甲基-N,N′-二氯苯醌二亚胺-吡啶)的比电容分别为126 F/g和63 F/g。     

基于苯醚型含氟二胺的聚酰亚胺膜材料的合成与表征

4,4′-二羟基二苯醚和2-氯-5-硝基三氟甲苯经Williamson反应得到4,4′-双(4-硝基-2-三氟甲基苯氧基)二苯醚;在Pd/C-水合肼还原作用下得到4,4′-双(4-氨基-2-三氟甲基苯氧基)二苯醚(p-6FAPE).采用3种苯醚型含氟二胺1,4-双(3-氨基-5-三氟甲基苯氧基)苯、1,4-双(4-氨基-2-三氟甲基苯氧基)苯和p-6FAPE分别与3,3′,4,4′-二苯醚四酸二酐(ODPA)和均苯四甲酸二酐通过两步法制备出6种含氟聚酰亚胺(PI),对其溶解性、热性能和光学性能进行研究.这些PI具有较好的溶解性,且具有良好的热稳定性;ODPA基PI在可见光波长范围具有优良的透明性,450 nm处的透光率超过80%.     

一种新型聚酰亚胺离子型共聚物的合成与表征

以过氧化氢为氧化剂,在三氟乙酸中对2,6-二氯吡啶进行氧化,制备了2,6-二氯吡啶氮氧化物,该单体与4,4′-二巯基二苯砜、3,3′-二甲基-双(4-氯代酰亚胺)-4,4′-二苯甲烷(4-BCPI)通过亲核取代反应生成了含有离子基团的聚酰亚胺。采用红外分析(FT-IR)、黏度测试、溶解度实验、热失重分析(TGA)和示差扫描量热分析(DSC)等测试方法,对所合成的聚酰亚胺的结构与性能进行了表征。测试结果表明:该类聚酰亚胺在室温下不仅可溶于常用的极性非质子有机溶剂,也能溶于氯仿、吡啶等溶剂。此外,10%热失重温度高于430℃,玻璃化转变温度高于210℃。     

新型(十)-樟脑酮亚胺的Pd(Ⅱ)、Co(Ⅱ)配合物的晶体结构研究

(+)-樟脑与6-甲基-2-氨甲基吡啶缩合得到一种新的手性双齿配体-1,7,7-三甲基-双环[2.2.1]-2-(6′-甲基-2′-氨甲基)吡啶亚胺(1),与二价钯生成配合物2,晶体属P2_1空间群,晶胞参数为a=10.641(2),b=10.706(2),c=11.011(2)(?);β=115.63(1)°;V=1131.15(40)(?)~3;Z=2。二价钴与1生成配合物3,晶体属PI空间群,晶胞参数为a=7.429(2),b=7.971(3),c=16.304(5)(?);α=80.19(3),β=77.10(2),γ=83.21(2)°;V=924.25(56)(?)~3;Z=2。根据晶体结构数据讨论了分子的结构特征,并对配合物的红外、紫外和核磁共振谱的变化作了解释。     

耐超高温双酮酐型聚酰亚胺的合成及性能

以4,4'-对苯二甲酰二邻苯二甲酸酐(TDPA)为芳二酐单体,对苯二胺(PPD)为芳二胺单体,经低温溶液缩聚制得成膜性能优良的高相对分子质量聚酰胺酸(PAA),再经过热亚胺化制备双酮酐型聚酰亚胺(PI)薄膜。 采用傅里叶变换红外光谱仪(FT-IR)、广角X射线衍射(WAXD)、差示扫描量热仪(DSC)、动态热机械分析仪(DMA)、热重分析仪(TGA)、紫外-可见分光光度计(UV-Vis)及力学性能等技术手段表征了聚酰亚胺膜的结构和性能,考察了不同亚胺化温度对合成的双酮酐型聚酰亚胺膜性能的影响。 结果表明,经程序升温至320 ℃能使PAA热亚胺化基本趋于完成。 PI薄膜为部分有序聚集态结构,玻璃化转变温度(T_g)为298 ℃,具有优异的热性能,热失重温度(T_5%)为523 ℃。 拉伸强度达到130 MPa,弹性模量为5.77 GPa。 PI薄膜紫外光透过截止波长为375 nm,在可见光区具有良好的透光性能及耐溶剂性能。     

基于串联反应的吡虫啉新合成工艺研究

以2-氯-5-氯甲基吡啶(CCMP)、无水乙二胺和硝基胍为原料,运用串联反应方法合成了吡虫啉[化学名:1-(6-氯-3-吡啶甲基)-N-硝基-2-咪唑啉亚胺]。该方法反应中间体无需纯化处理,操作简单,同时解决了活性中间体进一步进行副反应的难题。通过单因素实验,探讨了pH、反应溶剂、温度以及时间等因素对产物收率的影响,得到的优化工艺条件为:以乙腈为溶剂,nCCMP∶n无水乙二胺∶n硝基胍=1∶5∶1,于30℃反应120min,产率可达96.35%。其结构经1H NMR、13C NMR、IR表征。     

基于串联反应的吡虫啉新合成工艺研究

以2-氯-5-氯甲基吡啶(CCMP)、无水乙二胺和硝基胍为原料,运用串联反应方法合成了吡虫啉[化学名:1-(6-氯-3-吡啶甲基)-N-硝基-2-咪唑啉亚胺]。该方法反应中间体无需纯化处理,操作简单,同时解决了活性中间体进一步进行副反应的难题。通过单因素实验,探讨了pH、反应溶剂、温度以及时间等因素对产物收率的影响,得到的优化工艺条件为:以乙腈为溶剂,nCCMP∶n无水乙二胺∶n硝基胍=1∶5∶1,于30℃反应120min,产率可达96.35%。其结构经1H NMR、13C NMR、IR表征。     

含硫醚结构均苯型聚酰亚胺的合成及表征

以4,4′-二氨基二苯硫醚(SDA)和均苯四酸酐(PMDA)为原料,通过溶液缩聚法-热酰亚胺/化学酰亚胺化的方法制备了一种含硫醚结构均苯型聚酰亚胺.利用高级旋转流变仪建立了在线跟踪反应进程的方法,采用热失重分析仪研究反应条件对热酰亚胺化及化学酰亚胺化法的影响,这些方法的建立为进一步制备高性能的聚酰亚胺提供有效的实验手段.采用小角激光光散射法、红外光谱、元素分析、接触角仪、DSC等方法对聚合物的结构与性能进行表征.结果显示,硫醚结构的引入,可有效改善聚合物薄膜的表面性能,其与铜箔之间的粘附功明显大于传统聚酰亚胺,在无胶挠性线路板应用方面显示出较好的应用前景.所获聚合物的Mw为(6.7±1.6)×104,分解温度均高于560℃;DSC的结果显示所制备的两种酰亚胺化聚合物均具有较高的玻璃化转变温度,相比之下,化学酰亚胺化更有利于获得高酰亚胺化程度的聚合物,产物的玻璃化转变温度也更高.     

Statistical Analysis of Microdomain Ensembles on the Surface of Poly(4,4'-oxyphenylenepyromellitimide) Films in the Course of Imidization

The statistical ensembles of supramolecular formations (microdomains) on the surface of films of the polyamido acid derived from pyromellitic dianhydride and 4,4'-oxydiphenylenediamine and evolution of these ensembles in the course of thermal and chemical imidization were studied using the reversible aggregation model. The regular trends in variation of the distribution parameters (aggregation energy and mean microdomain size) in the course of thermal imidization were established. The distribution parameters were compared for polyimide films prepared by thermal and chemical imidization.     

Influence of temperature and imidization method on the structure and properties of polyimide fibers prepared by wet spinning

A polyamic acid (PAA) based on 4,4′-bis(4-aminophenoxy)diphenyldiamine and 1,3-bis-(3′,4-dicarboxyphenoxy)benzene dianhydride was synthesized. PAA fibers were prepared by wet spinning. Subsequent cyclization of PAA units was achieved using chemical or thermal imidization. The influence of the imidization method and process conditions on the chemical structure, porosity, morphology, thermal and mechanical properties of polyimide (PI) fibers was studied. Thermal imidization was carried out in the temperature range from 60 to 300 °C at different process durations. The degree of imidization of PI fibers was studied by IR spectroscopy. The structure and properties of PI fibers were studied by scanning electron microscopy, thermal analysis, and by measuring the stress-strain properties.

     

Synthesis of anew siloxane-containing diamine and related polyimide

A novel siloxane-containing diamine, bis[4-(p-aminophenoxy)phenoxy]dimethylsilane (APPMS), was successfully synthesized in three steps using hydroquinone as starting material, which was reacted with 4,4'-oxydiphthalic anhydride (ODPA) via a conventional two-step thermal or chemical imidization method to produce a new siloxane-containing polyimide. The resulting polyimide exhibited excellent solubility, and film-forming capability.     

Synthesis of a new aromatic dianhydride monomer and related polyimide

A novel aromatic dianhydride monomer,3,3′-oxybis[(3,4-dicarboxyphenoxy)phenol]dianhydride,was successfully synthe- sized in three steps using 3,3′-oxybis(phenol)as starting material,which was reacted with 4,4′-oxydianiline(ODA)via a conventional thermal or chemical imidization method to produce a new polyimide.The resulting polyimide exhibited excellent solubility,and film-forming capability.     

Synthesis and properties of poly(amic acid)s and polyimides based on 2,2′,6,6′‐biphenyltetracarboxylic dianhydride

Poly(amic acid)s (PAAs) having the high solution stability and transmittance at 365 nm for photosensitive polyimides have been developed. PAAs with a twisted conformation in the main chains were prepared from 2,2′,6,6′‐biphenyltetracarboxylic dianhydride (2,2′,6,6′‐BPDA) and aromatic diamines. Imidization of PAAs was achieved by chemical treatment using trifluoroacetic anhydride. Among them, the PAA derived from 2,2′,6,6′‐BPDA and 4,4′‐(1,3‐phenylenedioxy)dianiline was converted to the polyimide by thermal treatment. The heating at 300 °C under nitrogen did not complete thermal imidization of PAAs having glass‐transition temperatures (T_g)s higher than 300 °C to the corresponding PIs. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6385–6393, 2006     

Structure and properties of a photosensitive polyimide: Effect of photosensitive group

The photosensitive poly(p-phenylene biphenylteracarboximide) (BPDA-PDA) precursor was synthesized by attaching photocross-linkable 2-(dimethylamino)ethyl methacrylate (DMAEM) monomer to its poly(amic acid) through acid/base complexation. The polyimide thin films were prepared by a conventional cast/softbake/thermal imidization process from the photosensitive precursors with various concentrations of DMAEM. The structure and properties of the polyimide films were investigated by small-angle and wide-angle x-ray scattering, refractive indices and birefringence analysis, residual stress and relaxation analysis, stress-strain analysis, and dynamic mechanical thermal analysis. In comparison with the polyimide film from the poly(amic acid), the films, which were imidized from the photosensitive precursors, exhibited a better molecular order and microstructure; however, they exhibited less molecular orientation in the film plane. Despite the enhancement in both the molecular order and microstructure, the film properties (i.e., mechanical properties, thermal expansion, residual stress, optical properties, dielectric constant, and water sorption) degraded overall due to both the decrease in molecular in-plane orientation and the formation of microvoids caused by the bulky photosensitive group during thermal imidization. That is, on one hand, the PSPI precursor formation provides an advantageous, direct patternability to the BPDA-PDA precursor, and on the other hand, it results in degraded properties to the resulting polyimide film. © 1995 John Wiley & Sons, Inc.     

反相非水乳液法制备聚酰亚胺微球

在N,N-二甲基甲酰胺(DMF)/Pluronic-F127、十二烷基苯磺酸钠(SDBS)/液体石蜡(LP)反相非水乳液体系中,以均苯四甲酸二酐(PMDA)和4,4′-二氨基二苯醚(ODA)为单体合成聚酰胺酸(PAA),采用吡啶/乙酸酐脱水剂,对PAA化学酰亚胺化,并进一步热酰亚胺化,制得PI耐热微球.产物通过红外、热重、扫描电镜表征.结果表明,较高的固含量和良好的乳液分散性有利于PI微球的形成;反相非水乳液体系稳定的配比条件是,VDMF∶VLP为1∶4,MF127∶MSDBS为3:2,乳化剂用量为9 wt%;在此配比条件下,当固含量为20%,热酰亚胺化温度不高于330℃时,可制得分散良好、球形规整、高热稳定性的PI微球,其粒径约为10μm.     

Synthesis of a New Asymmetrical Ether Diamine with Aromatic Structure and Related Polyimide

Aromatic polyimides are widely used in the microelectronic industry as electrical insulators, passivation layers, and liquid-crystal alignment layers, because of their excellent mechanical, electrical, chemical, and thermal properties1,2. Despite their ou…     

Formation of new banded spherulites in polyimides

The crystalline morphology and structural development of aromatic polyimides during an optimum continuous thermal imidization procedure were examined by means of polarized optical microscopy and X‐ray diffraction. During thermal imidization, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride/1,3‐diaminobenzene polyimide samples formed complicated spherulites, which, in addition to zigzag Maltese crosses, also showed concentric extinction rings, which are characteristic of banded spherulites. The factors affecting the formation of banded spherulites were studied. The initial imidization conditions dramatically affected the formation of the banded spherulite morphology: slow heating (0.5 °C/min) or fast heating (20 °C/min) led to relatively small polyimide spherulites and less identifiable extinction rings. The morphological features were also affected by the molecular weight of the polyimide: higher molecular weight samples showed typical banded spherulites, whereas low‐molecular‐weight samples formed degenerated banded spherulites. In all the spherulites formed in 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride/1,3‐diaminobenzene polyimides, special zigzag Maltese crosses, instead of normal Maltese crosses, were observed. The relationship between the imidization procedure and the spherulite morphology formation was also studied. X‐ray and Fourier transform infrared together revealed that after several minutes of thermal treatment, the crystallization was nearly complete, with a 42.5% degree of crystallinity; meanwhile, only some poly(amic acid) converted to the corresponding polyimide, with a 27% degree of imidization. The crystalline morphology and structure formed in the initial stage of the imidization process were maintained during the following imidization processing at an elevated temperature. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1997–2004, 2005