PREPARATION OF POLYIMIDE-BaTiO3 HYBRID FILMS BY A DISPERSION PROCESS AND THEIR MICROSTRUCTURE*

 Barium titanate (BaTiO₃) powders with particle sizes of 30～50 nm were prepared from barium stearate, titanium alkoxides and stearic acid by stearic acid-gel method. Dispersing the agglomerate of BaTiO₃ nanoparticles into poly(amic acid) solution followed by curing led to the formation of polyimide hybrid films. The hybrid films were transparent and well distributed with BaTiO3 nanoparticles when the BaTiO₃ content was less than 1 wt%. Highly loaded hybrid film containing 30 wt % BaTiO₃ was tough, had a smooth surface and possessed much higher dielectric and piezoelectric constants than the parent polyimide.     

Fabrication of highly refractive BaTiO3 nanocomposite films using heat resistant polymer as matrix

Highly refractive, heat-resistant BaTiO₃ nanocomposite films were fabricated via in situ polymerization to homogeneously disperse barium titanate (BT) nanoparticles into polyimide (PI) matrix. BT nanoparticles surface-modified with O-phosphorylethanol phthalimide (PPHI) were employed to the in situ polymerization in which condensation reactions of a diphthalic anhydride and a diamine were conducted to form the prepolymer of poly(amic acid) (PAA) that was thermally imidized in the following step. The nanoparticles surface-modified were added to PAA solution at different times in the polymerization to examine the effect of PAA molecular weight on the refractive index (RI) of the nanocomposite films, which indicated that relatively low molecular weights (<10,000) of PAA formed at the point of nanoparticle addition was appropriate for enhancement of nanocomposite RI. An additional treatment of chemical imidization using acetic acid anhydride and pyridine, which was followed by the thermal imidization, was performed to examine the effect of polyimide structure on RI of nanocomposite films. The RI of nanocomposite films with excellent thermal stability could be successfully enhanced to n = 1.88 by the chemical imidization.     

One-step fabrication of ultralow dielectric polyimide films consisting of size-controlled mesoporous nanoparticles

Dielectric materials with ultralow dielectric constants (<2.0) are desiderated in the integrated circuits (ICs). In this work, we fabricated polyimide (PI) films consisting of mesoporous nanoparticles (MPNPs-PF) through a one-step solvent evaporation induced self-assembly method. Poly(amic acid) was selected as the polymer matrix; and the commercial triblock copolymer F127 was adopted as the mesoporous template as well as the nanoparticle morphology controller, respectively. After imidization and template removal, the dense films consisting of closed-packed PI nanoparticles with an average diameter less than 50 nm were obtained. Since the nanoparticles were fully composed of worm-like mesopores, the dielectric constant (k value) of the resultant porous PI films can reach as low as 1.92. When the reactive end-capper of maleic anhydride (MA) was blended into poly(amic acid), k value decreased even lower to 1.86. Meanwhile, the modulus of the resultant porous PI films was higher than 1 GPa.     

Preparation and characterization of polyimide/mesoporous silica hybrid nanocomposites based on water-soluble poly(amic acid) ammonium salt

Recently, mesoporous silica was blended with polyimide to develop low dielectric constant (k) materials with improving mechanical and thermal properties of polyimide by utilizing both the nanoporous structure and silica framework. However, even the use of mesoporous silica did not show a significant decrease of k due to the phase segregation in between polyimide and the mesoporous silica materials. In this work, we attempted to prepare polyimide/mesoporous silica hybrid nanocomposites having relatively good phase mixing behavior by utilizing polyimide synthesized from a water soluble poly(amic acid) ammonium salt, which lead to low k up to 2.45. The thermal properties of polyimide were improved by adding mesoporous silicas. For this work, we have fabricated mesoporous silicas through surfactant-templated condensation of tetraethyl orthosilicate (TEOS). Pyromellitic dianhydride (PMDA)-4,4′-oxydianiline (ODA) polyimide was prepared from poly(amic acid) ammonium salt, which had been obtained by incorporating triethylamine (TEA) into PMDA-ODA poly(amic acid) in dimethylacetamide (DMAc), followed by thermal imidization.     

Direct Ion Exchange Self‐Metallization: A Novel and Efficient Route for the Preparation of Double‐Surface‐Silvered Polyimide Films

Summary: Silvered polyimide films have been fabricated by direct ion exchange of a damp‐dry poly(amic acid) film with an aqueous silver solution such as silver nitrate. Thermal curing of the silver(I )‐containing films under tension leads to cycloimidization of the poly(amic acid) into polyimide with a concomitant silver(I ) reduction and aggregation at both film sides to give reflective and conductive double‐surface‐silvered polyimide films. The metallized films retain the essential properties of the parent polyimide.

Surface morphology of the prepared double‐surface‐silvered polyimide films.     

Highly reflective and conductive double-surface-silvered polyimide films prepared from silver fluoride and BTDA/4,4'-ODA

This work focuses on surface silver metallization on a 3,3',4,4'-benzophenonetetracarboxylic dianhydride/4,4'-oxydianiline (BTDA/ODA)-based polyimide matrix via a direct ion-exchange self-metallization technique using a simple silver salt, silver fluoride, as the silver precursor. The method involves performing an ion-exchange reaction of damp-dry poly(amic acid) films in silver aqueous solution to form silver(I)-containing precursor films. Thermal treatment under tension converts the poly(amic acid) into polyimide and simultaneously reduces the silver(I) to silver(0), yielding silver layers with excellent reflectivity and conductivity on both film sides. However, significant property differences were exhibited on the upside and underside surfaces of the metallized films and this has been discussed in detail. The variation of surface properties and surface morphologies during the thermal curing cycle was also investigated. The mechanical and thermal properties of the metallized polyimide films are essentially similar to those of the host polyimide.     

Structure and infrared emissivity of silicon-containing polyimide/BaTiO3 nanocomposite films

Silicon-containing polyimide/BaTiO₃ nanocomposite films were prepared by the direct mixing of silicon-containing polyamic acid and BaTiO₃ nanoparticles under ultrasonic wave irradiation, followed with thermal imidization. Structure and thermal properties were measured with FTIR, XPS, SEM, DSC and TGA. The results showed that the compatibility of BaTiO₃ and a polyimide might be improved by the introduction of dimethylsilylene groups into the backbone of a polyimide; and BaTiO₃ nanoparticles in the nanocomposites tended to form clusters. The clusters coalesced into a more uniform structure at a higher BaTiO₃ filling than at a lower one.The interfacial interaction between BaTiO₃ and the silicon-containing polyimide resulted in the increase of the glass transition and the thermal decomposition temperature. It was found that the nanocomposites exhibited lower infrared emissivity value than the pure polyimide and the magnitude of infrared emissivity value was related to the content of BaTiO₃ in the nanocomposites.     

Preparation, characterization and dielectric properties of 4,4-diphenylmethane diisocyanate (MDI) based cross-linked polyimide films

Four different types of cross-linked polyimides based on 4,4-diphenylmethane diisocyanate (MDI) were prepared by the reaction of different types of conventional poly(amic acid) intermediates with MDI as a cross-linking agent. Subsequently, they were thermally imidized in order to obtain corresponding cross-linked polyimide structure. The results of FTIR-ATR showed that MDI can effectively react with carboxylic acid groups of PAA to form cross-linked polyimide films. TGA, FTIR-ATR and SEM analyses were carried out for characterization of cross-linked polyimide (CPI) films. Moreover, the electrical properties such as dielectric breakdown strength, dielectric constant, I-V characteristics and loss factor of MDI based cross-linked polyimides have been checked. In addition, some physical properties such as water uptake, adhesion, hardness and solubility properties of the films were investigated.The results showed that all CPI films have good insulating properties such as high dielectric breakdown voltage, low loss factor (tan δ), leakage density and excellent physical properties.     

Chemical Factors That Influence the Production of Conductive and/or Reflective Silver-Doped Polyimide Films

ABSTRACT

Doping a poly(amide acid) resin with a silver containing additive (1,5-cyclooctadiene-hexafluoroacetylacetonato)-silver(I) [Ag(COD) (HFA)] resulted, after thermal cure, in either a highly reflective or highly eléctrically conductive polyimide film. The combination of monomers, which render films with low T_g (~210°C), and contained sulfur, produced films with surface resistance in the range 10^1–10³ ohms. On the other hand, films with specular reflectivity (relative to a silver mirror) in the range of 65–48% were obtained using both high T_g polyimides and polyimides void of sulfur in the polyimide backbone with low T_g. Our understanding regarding the structure-property relationship on these polyimide films and also the characterization of the doped-films are discussed.     

Preparation and dielectric properties of polyimide/silica nanocomposite films prepared from sol–gel and blending process

Using poly(amic acid) (PAA) as a precursor followed by thermal imidization, the polyimide/silica nanocomposite films were prepared via an improved sol–gel process and a blending process, respectively. FT‐IR, TEM and TGA measurements were used to characterize the structure and properties of the obtained films. The results confirmed that the introduction of silica did not yield negative effects on the conversion of the PAA precursor to the polyimide. With the increase of silica content, the aggregation of silica appeared in the polyimide matrix, and the thermal stability decreased slightly for both kinds of films. The dielectric constant (ε) of both films increased slowly with the increase of the silica concentration. The dielectric constant of the obtained polyimide/silica nanocomposite films displayed good stability within a wide range of temperatures or frequency. Based on modeling relation between ε and silica content, the difference in dielectric properties for two kinds of nanocomposites are discussed. Copyright © 2007 John Wiley & Sons, Ltd.     

Controlled formation of optically reflective and electrically conductive silvered surfaces on polyimide film via a direct ion-exchange self-metallization technique using silver ammonia complex cation as the precursor

Double-surface-silvered polyimide films have been successfully fabricated using silver ammonia complex cation ([Ag(NH3)2]+) as the silver precursor and 3,3',4,4'-benzophenonetetracarboxylic dianhydride/4,4'-oxidianile- (BTDA/ODA-) based poly(amic acid) (PAA) as the polyimide precursor via a direct ion-exchange self-metallization technique. The process has been clarified to involve the loading of silver(I) into PAA via ion exchange, the thermally induced reduction of silver(I) to silver(0) and the concomitant imidization of PAA to polyimide upon thermal treatment, the subsequent silver-catalyzed and oxygen-assisted decomposition of the polyimide overlayer, and the self-accelerated aggregation of silver clusters on the film surface to produce well-defined surface silver layers. By employing [Ag(NH3)2]+ solution with a concentration of only 0.01 M and an ion-exchange time of no more than 10 min, the controlled formation of highly reflective and conductive silver surfaces upon thermal treatment at 300 degrees C for less than 4.5 h indicates that the present work provides an efficient route and an effacious silver species for polyimide surface metallization. Although the alkaline characteristics of [Ag(NH3)2]+ have a strong hydrolysis effect on the polyimide precursor chains, the final metallized films retain the key mechanical and thermal properties of the pure polyimide. Films were characterized by ATR-FTIR, XPS, ICP-AES, SEM, TEM, DSC, TGA, reflectivity, conductivity, and mechanical measurements.     

Preparation of polyimide/BaTiO3‐nanocrystal hybrid thin films and their dielectric property

High dielectric constant is highly desirable in capacitors and memory devices. In this work, oleic acid (OA)‐capped BaTiO₃ nanocrystals were synthesized by a two‐phase approach. Polyimide (PI)/BaTiO₃‐nanocrystal composite thin films with high dielectric constant have been successfully fabricated. The morphologies and dielectric properties of the hybrid films were exploited. The results showed that BaTiO₃ nanocrystals can be uniformly dispersed in the PI thin films owing to the surface modification of OA‐capped BaTiO₃ nanocrystals. It was found that the dielectric constant of composite film varies with the volume fraction of BaTiO₃ nanocrystals and sintering temperatures and reaches a maximum value of 44.1, which is around 13 times higher than that of pristine PI thin film (3.2). These results demonstrated that PI/BaTiO₃‐nanocrystal composite films have considerable application potential in microelectronic fields.     

Core‐shell structured poly(glycidyl methacrylate)/BaTiO3 nanocomposites prepared by surface‐initiated atom transfer radical polymerization: A novel material for high energy density dielectric storage

Core‐shell structured barium titanate‐poly(glycidyl methacrylate) (BaTiO₃‐PGMA) nanocomposites were prepared by surface‐initiated atom transfer radical polymerization of GMA from the surface of BaTiO₃ nanoparticles. Fourier transform infrared spectroscopy confirmed the grafting of the PGMA shell on the surface of the BaTiO₃ nanoparticles cores. Transmission Electron Microscopy results revealed that BaTiO₃ nanoparticles are covered by thin brushes (～20 nm) of PGMA forming a core‐shell structure and thermogravimetric analysis results showed that the grafted BaTiO₃‐PGMA nanoparticles consist of ～13.7% PGMA by weight. Upon incorporating these grafted nanoparticles into 20 μm‐thick films, the resultant BaTiO₃‐PGMA nanocomposites have shown an improved dielectric constant (ε = 54), a high breakdown field strength (～3 MV/cm) and high‐energy storage density ～21.51 J/cm³. AC conductivity measurements were in good agreement with Jonscher's universal power law and low leakage current behavior was observed before the electrical breakdown field of the films. Improved dielectric and electrical properties of core‐shell structured BaTiO₃‐PGMA nanocomposite were attributed to good nanoparticle dispersion and enhanced interfacial polarization. Furthermore, only the surface grafted BaTiO₃ yielded homogenous films that were mechanically stable. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 719–728     

Synthesis and properties of polyimides derived from 1,6-bis(4-aminophenoxy)naphthalene and aromatic tetracarboxylic dianhydrides

1,6-Bis(4-aminophenoxy)naphthalene ( I ) was used as a monomer with various aromatic tetracarboxylic dianhydrides to synthesize polyimides via a conventional two-stage procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide (DMAc) to give poly(amic acid)s, followed by thermal cyclodehydration to polyimides. The diamine ( I ) was prepared through the nucleophilic displacement of 1,6-dihydroxynaphthal-ene with p-chloronitrobenzene in the presence of K₂CO₃, followed by catalytic reduction. Depending on the dianhydrides used, the poly(amic acid)s obtained had inherent viscosities of 0.73–2.31 dL/g. All the poly(amic acid)s could be solution cast and thermally converted into transparent, flexible, and tough polyimide films. The polyimide films had a tensile modulus range of 1.53–1.84 GPa, a tensile strength range of 95–126 MPa, and an elongation range at break of 9–16%. The polyimide derived from 4,4′-sulfonyldiphthalic anhydride (SDPA) had a better solubility than the other polyimides. These polyimides had glass transition temperatures between 248–286°C (DSC). Thermogravimetric analyses established that these polymers were fairly stable up to 500°C, and the 10% weight loss temperatures were recorded in the range of 549–595°C in nitrogen and 539–590°C in air atmosphere. © 1995 John Wiley & Sons, Inc.     

Ag负载KTa1-xNbxO3-BaTiO3颗粒掺杂P(VDF-TrFE-CTFE)复合材料的制备及介电性能

通过光照还原法制备了银颗粒负载的铌钽酸钾-钛酸钡复合粉体（Ag/KTN-BT）,并将其与聚偏氟乙烯-三氟乙烯-三氟氯乙烯（P（VDF-TrFE-CTFE））聚合物复合,获得Ag/KTN-BT聚合物基复合材料。研究发现,Ag/KTN-BT填料颗粒在聚合物基体中分散均匀,复合材料结构致密,无明显气孔和裂纹,且具有较好的柔韧性。银纳米颗粒的负载,一方面在复合材料中引入了额外的界面,导致界面极化作用增强,明显提高复合材料的介电常数;另一方面银纳米颗粒的量子尺寸效应和库伦阻塞效应使得复合材料保持较低的介电损耗。当填充体积分数为20%的Ag/KTN-BT颗粒时,聚合物基复合材料的介电常数大幅提升,从聚合物的37提升到125（100 Hz）,介电损耗仅为0.12。与KTN-BT基复合材料对比,Ag/KTN-BT基复合材料也显示出较好的介电性能。     

Ferrocene Containing Polyimides as a Route to Low-κ Dielectric Materials

Polyimides incorporating the ferrocene unit were prepared by in situ curing of poly (amic acid) macromolecules with ferrocene, for the molecular-level design of low dielectric constant (low-κ) materials. The effects of ferrocene on dielectric properties of polyimide are investigated in detail in this study. Ferrocene containing polyimides exhibit a number of desirable properties including low-water absorption and admirable thermal stability. Systematic studies demonstrate that proper insertion of ferrocene into a polyimide backbone can give rise to a reduction in the material's dielectric constant. All composites were subjected to DSC measurements for the purpose of examining Tg from all composition. Scanning electron microscopy (SEM), X-ray diffraction (XRD) and the other conventional techniques were used for structural characterization.     

Synthesis of Polyimide Nanocomposites

A series of polyimide nanocomposite (PINC) films were prepared by using poly(amic acid) and Ba, Sr, Sn, TiO₃ nanoparticles via in-situ polymerization method. Poly(amic acid) was synthesized from benzophenone tetracarboxylic anhydride and diamino diphenyl ether by ring-opening polyaddition reaction. The PINC films were characterized by FTIR spectroscopy. The thermal properties of PINC films were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TG) methods. The prepared PINC showed major weight loss in the range of 550–600°C in nitrogen atmosphere. These had char yield in the range of 50–60% at 800°C. The morphological studies of PINC films were carried out using SEM method.     

A low dielectric constant polyimide/polyoxometalate composite

A silane‐modified mono‐lacunary Keggin‐type polyoxometalate (POM), (Bu₄N)₄[SiW₁₁O₃₉{(CH₂?CH? Si)₂O}] (SiW₁₁? CH?CH₂), was obtained by reaction of vinyltrimethoxysilane with K₈(SiW₁₁O₃₉) in acidic MeCN/H₂O mixed solutions. Then, the modified polyoxometalate was physically blended with the pyromellitic dianhydride (PMDA)‐4,4′‐oxydianiline (ODA) poly(amic acid) and the blends were thermally imidized to form polyimide/ polyoxometalate composites. The X‐ray diffraction (XRD) analysis indicates that the polyoxometalate clusters cannot form crystalline structures in the composite, suggesting that the blending leads to improved compatibility between the polymer matrix and the modified polyoxometalate. The EDS (W‐mapping) studies on the composite films reveal that the polyoxometalate clusters are well dispersed in the polyimide matrix. The physical incorporation of modified POM into polyimide remarkably reduced the dielectric constant of the latter from 3.29 to 2.05 when 20 wt% of SiW₁₁? CH?CH₂ was used. Besides, the addition of the modified POM into polyimide increased the storage modulus of polyimide without severely affecting its thermal properties. Copyright © 2009 John Wiley & Sons, Ltd.     

Glass fiber reinforced bismaleimide/epoxy BaTiO3 nano composites for high voltage applications

BaTiO₃/bismaleimide/epoxy/glass fiber reinforced composites were prepared using E-glass fiber (E-GF) and silane coated E-glass fiber (SC-EGF) separately as reinforcement. BaTiO₃ nanoparticles were prepared by hydrothermal method. Results show that the addition of BaTiO₃ nanoparticles has significant effects on the mechanical and dielectric properties of the composite. Both E-GF and SC-EGF reinforced BaTiO₃/bismaleimide/epoxy composites with 2 wt percentages of BaTiO₃ nanoparticles showed improved tensile strength, flexural strength and dielectric constant and those with 3% showed high dielectric strength indicating this composition is more adaptable for high voltage insulating applications. Dielectric constants and dielectric loss of the fabricated nanocomposites have been obtained at higher frequencies (in GHz) by using Vector Network Analyser at room temperature and was found to be highest for the BMI-Epoxy nanocomposite with 1% weight nanofiller.     

Structure and properties of a photosensitive polyimide: Effect of photosensitive group

The photosensitive poly(p-phenylene biphenylteracarboximide) (BPDA-PDA) precursor was synthesized by attaching photocross-linkable 2-(dimethylamino)ethyl methacrylate (DMAEM) monomer to its poly(amic acid) through acid/base complexation. The polyimide thin films were prepared by a conventional cast/softbake/thermal imidization process from the photosensitive precursors with various concentrations of DMAEM. The structure and properties of the polyimide films were investigated by small-angle and wide-angle x-ray scattering, refractive indices and birefringence analysis, residual stress and relaxation analysis, stress-strain analysis, and dynamic mechanical thermal analysis. In comparison with the polyimide film from the poly(amic acid), the films, which were imidized from the photosensitive precursors, exhibited a better molecular order and microstructure; however, they exhibited less molecular orientation in the film plane. Despite the enhancement in both the molecular order and microstructure, the film properties (i.e., mechanical properties, thermal expansion, residual stress, optical properties, dielectric constant, and water sorption) degraded overall due to both the decrease in molecular in-plane orientation and the formation of microvoids caused by the bulky photosensitive group during thermal imidization. That is, on one hand, the PSPI precursor formation provides an advantageous, direct patternability to the BPDA-PDA precursor, and on the other hand, it results in degraded properties to the resulting polyimide film. © 1995 John Wiley & Sons, Inc.