A low dielectric constant polyimide/polyoxometalate composite |
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| Authors: | Lin Tan Shumei Liu Fang Zeng Shukun Zhang Jianqing Zhao Yin‐e Yu |
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| Institution: | 1. College of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, P.R. China;2. The Key Lab of GD for High Property and Functional Macromolecular Materials, Guangzhou 510640, P.R. China;3. China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510640, P.R. China |
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| Abstract: | A silane‐modified mono‐lacunary Keggin‐type polyoxometalate (POM), (Bu4N)4SiW11O39{(CH2?CH? Si)2O}] (SiW11? CH?CH2), was obtained by reaction of vinyltrimethoxysilane with K8(SiW11O39) in acidic MeCN/H2O mixed solutions. Then, the modified polyoxometalate was physically blended with the pyromellitic dianhydride (PMDA)‐4,4′‐oxydianiline (ODA) poly(amic acid) and the blends were thermally imidized to form polyimide/ polyoxometalate composites. The X‐ray diffraction (XRD) analysis indicates that the polyoxometalate clusters cannot form crystalline structures in the composite, suggesting that the blending leads to improved compatibility between the polymer matrix and the modified polyoxometalate. The EDS (W‐mapping) studies on the composite films reveal that the polyoxometalate clusters are well dispersed in the polyimide matrix. The physical incorporation of modified POM into polyimide remarkably reduced the dielectric constant of the latter from 3.29 to 2.05 when 20 wt% of SiW11? CH?CH2 was used. Besides, the addition of the modified POM into polyimide increased the storage modulus of polyimide without severely affecting its thermal properties. Copyright © 2009 John Wiley & Sons, Ltd. |
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| Keywords: | dielectric constants dielectric loss polyoxometalate polyimide organic/inorganic hybrids |
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