三(3-乙炔基苯胺)-苯基硅烷改性含硅芳炔树脂的性能

以苯基三氯硅烷、3-氨基苯乙炔为原料,通过胺解反应合成了三(3-乙炔基苯胺)苯基硅烷(SZTA),并通过傅里叶变换红外光谱(FT-IR)和核磁共振氢谱(1 H-NMR)表征了其结构。随后通过熔融共混的方法制备了不同配比的改性含硅芳炔树脂(PSA/SZTA),借助黏度计、流变仪、差示扫描量热仪(DSC)、电子万能试验机、热重分析仪(TG)等考察了改性树脂的工艺性能、固化特性、弯曲性能、热稳定性能和热解动力学等。结果显示,引入SZTA后,改性PSA树脂的黏度降低62%;改性PSA树脂固化物的弯曲强度最高达到34.6MPa,比未改性的PSA树脂提高了约54%;且改性树脂固化物在N_2中的5%热失重温度(T_(d5))均高于500℃,保持了良好的耐热性能;PSA/SZTA-20固化物的热解表观活化能(Ea)的平均值为249kJ/mol。     

PAA对PLA流变性能和热性能的影响

通过熔融共混法制备了一系列的PLA/PAA共混物,考察了PLA/PAA共混体系的流变行为和热性能(结晶行为和热降解行为).FTIR测试结果证实PLA与PAA分子链之间形成了氢键网络.动态剪切流变测试和DSC测试均表明共混体系的流变行为和冷结晶行为会随着PAA含量的改变而改变,这可能是由于PLA与PAA的氢键作用受到PAA含量的影响.另外,DSC测试证实共混体系中的氢键网络还会受到试样热历史的影响.当PAA含量较低(低于5 wt%)时,PLA/PAA共混体系中PAA与PLA熔体两相的相分离不严重,使得PAA与PLA分子链能够较大限度地接触而形成较强的氢键作用,因而可以明显减缓增塑作用对黏度降低的影响.     

聚氧硫杂蒽树脂固化特性及其动力学的研究

以DSC、TG等技术手段研究了聚氧硫杂蒽树脂 (POSPF)的固化特性及其动力学 .结果表明 ,用六次甲基四胺 间二氯苄作固化剂 ,加热至 10 5～ 2 2 5℃能使POSPF树脂固化 ,在固化过程树脂中的活性羟甲基和固化剂参与反应生成亚甲基桥从而形成网状体型结构 ;动态DSC曲线上出现宽的固化放热峰 ,用T β外推法确定其凝胶温度Ti=10 0 0℃、固化温度Tp=181 5℃、后固化温度Tf=2 2 5 7℃ .固化后树脂具有优良的耐热性 ,失重 5 %时热分解温度高达 4 0 3℃ .     

双(N-间乙炔基苯基邻苯二甲酰亚胺)醚改性苯乙炔基硅氧硼烷

用双(N-间乙炔基苯基邻苯二甲酰亚胺)醚(DAIE)改性苯乙炔基硅氧硼烷(PESB)制得复合材料基体树脂(PESB-DAIE).通过FT-IR、DSC和TG研究了PESB-DAIE的固化反应及耐热性.将PESB-DAIE与纤维复合制得复合材料,研究了该材料的耐热性、弯曲强度及断面形貌.研究结果表明,固化物在氮气气氛下质...     

高耐热PLLA/PDLA共混物的热性能和结晶结构研究

通过熔融共混法制备了一系列等比例聚左旋乳酸(PLLA)/聚右旋乳酸(PDLA)共混试样,采用差示扫描量热法(DSC)、核磁共振(13C-NMR)及广角X射线衍射(WAXD)等方法对共混产物进行了表征和研究分析.结果表明,等比例PLLA和PDLA熔融共混生成了立构复合物(stereocomplex,sc),同时部分均聚物发生酯交换反应,生成了立体嵌段物(stereoblock,sb),从而在DSC升温曲线上sc晶体处出现特殊的熔融双峰现象;随着熔融共混温度升高,sc晶体的生成率和结晶度逐渐下降;聚乳酸立构复合物的加工稳定性较好,二次加工后,sc晶体熔点基本不变,生成率和结晶度提高;由于sc晶体的存在,PLLA/PDLA共混物的耐热性能提高,退火热处理后耐热性能得到进一步提高.这对于开发高耐热聚乳酸及其加工应用具有重要的应用价值.     

苯并噁嗪改性液体成型环氧树脂的研究

采用具有低固化收缩特性的苯并噁嗪树脂(benzoxazine,BOZ)对液体成型环氧树脂进行改性,以期在不改变液体成型树脂耐热性、工艺性及力学性能的前提下,大幅度降低树脂的固化收缩率.对比研究了不同BOZ含量改性树脂的固化收缩特性、固化反应特性、液体成型工艺性及力学性能.并采用真空辅助树脂浸渗(vacuum assisted resin infusion,VARI)工艺制备了单向碳纤维织物增强复合材料,研究了复合材料的力学性能.结果表明,加入BOZ对液体成型树脂的反应性、工艺性及耐热性影响不大,改性树脂的固化收缩随BOZ含量的提高逐渐减小,其中BOZ质量分数为15 wt%的改性树脂,较未改性树脂的固化收缩减小约80%,拉伸强度提高约19%,冲击强度提高约148%.以此改性树脂作为基体的复合材料相对于未改性树脂复合材料的拉伸强度提高约23%,层间剪切强度提高约9%,具有良好的力学性能和界面结合性能.     

动态固化聚丙烯/环氧树脂共混物的研究

将动态硫化技术应用于热塑性树脂 热固性树脂体系 ,制备了动态固化聚丙烯 (PP) 环氧树脂共混物 .研究了动态固化PP 环氧树脂共混物中两组分的相容性、力学性能、热性能和动态力学性能 .实验结果表明 ,马来酸酐接枝的聚丙烯 (PP g MAH)作为PP和环氧树脂体系的增容剂 ,使分散相环氧树脂颗粒变细 ,增加了两组分的界面作用力 ,改善了共混物的力学性能 .与PP相比 ,动态固化PP 环氧树脂共混物具有较高的强度和模量 ,含 5 %环氧树脂的共混物拉伸强度和弯曲模量分别提高了 30 %和 5 0 % ,冲击强度增加了 15 % ,但断裂伸长率却明显降低 .继续增加环氧树脂的含量 ,共混物的拉伸强度和弯曲模量增加缓慢 ,冲击强度无明显变化 ,断裂伸长率进一步降低 .动态力学性能分析 (DMTA)表明动态固化PP 环氧树脂共混物是两相结构 ,具有较高的储能模量 (E′)     

氰酸酯树脂改性热固性丁苯树脂的固化及其动力学

利用傅里叶变换红外光谱法(FT-IR)和差示扫描量热法(DSC)研究了氰酸酯树脂改性热固性丁苯树脂的固化反应特性及其动力学.以温度-升温速率外推法计算得到固化反应起始温度(Ti0)、峰顶温度(Tp0)和终止温度(Tf0)分别为414.2、444.5、460.6 K,对改性树脂的固化过程进行优化.采用Freeman-Ca...     

液体聚硫橡胶增韧双酚A-苯胺型聚苯并噁嗪的研究

以液体聚硫橡胶(LP-3)为增韧剂,对双酚A-苯胺型苯并噁嗪(B-a)树脂进行了改性,通过核磁共振氢谱(1H-NMR)、红外光谱(FTIR)、示差扫描量热仪(DSC)对B-a与LP-3的共混和固化过程进行了研究,通过动态热机械分析仪(DMA)、弯曲和冲击实验、热失重分析仪(TGA)对固化物的机械性能和热性能进行了表征.结果表明,在共混过程中,B-a与LP-3发生了开环加成反应,加成产物的酚羟基对苯并噁嗪的开环聚合具有一定的促进作用,共混物较B-a具有更快的固化速率.当LP-3的加入量为5 wt%时,固化物的韧性就可以得到明显改善,冲击强度相比B-a固化物提高了3.4倍,而且此时的固化物具有高的储能模量(30℃时E'=3.9 GPa)、高的玻璃化转变温度(T_g=206℃)和良好的热稳定性(T_(5%)=322℃,T_(10%)=342℃),表现出最佳的综合性能.     

锆炔杂化树脂的制备及性能

以四氯化锆、三氯乙烯及苯乙炔为原料,通过有机锂法合成锆炔杂化树脂(PZA),通过FT-IR、1 H-NMR表征了其结构,利用FT-IR、DSC及TGA研究了PZA树脂的固化反应及耐热性能;采用XRD研究了PZA树脂固化物的烧结性能.结果表明:PZA树脂可以发生固化交联反应;其固化物具有一定的耐热性能,在氮气气氛中,失重10％的温度(Td10)达到500℃,1 000℃下的质量保留率达到80％;在空气气氛中,1 000℃下烧结可形成四方氧化锆陶瓷.     

环氧树脂/液晶聚合物体系的形态、力学性能和热稳定性

合成了一种端基含有活性基团的热致性液晶聚合物 (LCPU) ,用其改性环氧树脂CYD 12 8 4 ,4′ 二氨基二苯砜 (DDS)固化体系 ,对改性体系的冲击性能、拉伸性能、弯曲性能、弹性模量、断裂伸长率、玻璃化转变温度Tg、热失重温度TG与LCPU含量的关系进行了探讨 ,对不同种类液晶化合物改性CYD 12 8 DDS体系效果进行了比较 ,用扫描电镜 (SEM)研究了材料断面的形态结构 .结果表明 ,LCPU的加入可以使固化物的力学性能和热稳定性提高 ,改性后材料断裂面的形态逐渐呈现韧性断裂特征     

Epoxy-modified, unsaturated polyester hybrid networks

Hybrid polymer networks (HPNs) based on unsaturated polyester resin (UPR) and epoxy resins were synthesized by reactive blending. The epoxy resins used were epoxidised phenolic novolac (EPN), epoxidised cresol novolac (ECN) and diglycidyl ether of bisphenol A (DGEBA). Epoxy novolacs were prepared by glycidylation of the novolacs using epichlorohydrin. The physical, mechanical, and thermal properties of the cured blends were compared with those of the control resin. Epoxy resins show good miscibility and compatibility with the UPR resin on blending and the co-cured resin showed substantial improvement in the toughness and impact resistance. Considerable enhancement of tensile strength and toughness are noticed at very low loading of EPN. Thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA) and differential scanning calorimetry (DSC) were employed to study the thermal properties of the toughened resin. The EPN/UPR blends showed substantial improvement in thermal stability as evident from TGA and damping data. The fracture behaviour was corroborated by scanning electron microscopy (SEM). The performance of EPN is found to be superior to other epoxy resins.     

Thermal stability and viscoelastic properties of MF/PVAc hybrid resins on the adhesion for engineered flooring in under heating system; ONDOL

The thermal properties of blends of melamine-formaldehyde (MF) resin and poly(vinyl acetate) (PVAc) for engineered flooring used on the Korean traditional ONDOL house floor heating system were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The viscoelastic properties of the blends were also studied. Because MF resin is a thermosetting adhesive, the effect of MF rein was shown across all thermal behaviors. The addition of PVAc reduced the curing temperature. The TGA results showed that the DTG_max temperature and thermal stability of the blends increased with increasing PVAc content. The blends were examined in non-isothermal DSC experiments at a heating rate of 10 °C/min. There was an exothermic peak in all the heating scanning curves, with each blend displaying a single curing peak temperature (T_p), intermediate between those of the two pure components and varying with the blend composition. The DMTA thermogram of MF resin showed that the storage modulus (E′) increased as the temperature was further increased as a result of the cross-linking induced by the curing reaction of the resin. E′ of MF resin increased both as a function of increasing temperature and with increasing heating rate.     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Effect of fluorine functional groups on surface and mechanical interfacial properties of epoxy resins

To improve the surface and mechanical interfacial properties of epoxy resins, fluorine-containing epoxy resin (FEP) was prepared and blended with a commercially available tetrafunctional epoxy resin (TGDDM). As a result, when the fluorine content increased, the total surface energy of TGDDM/FEP blends was gradually decreased, while the water repellency of the blends was increased. The glass transition temperature and thermal stability factors of the blends showed maximum values at 20-40 wt% FEP compared with neat TGDDM epoxy resins. And the mechanical interfacial properties of the blend specimens were significantly increased with increasing the FEP content, which could be attributed to the intermacromolecular interactions in the cured TGDDM/FEP blends. These results indicate that the water repellency and toughness improvements have been achieved without significantly deterioration of the thermal properties in the TGDDM/FEP blends.     

Curing characteristics of carboxyl functionalized glucose resin and epoxy resin

The curing characteristics of carboxylic functionalized glucose resin (glucose maleic acid ester vinyl resin: GMAEV) and epoxy resin have been studied using DSC and FTIR methods. Exothermic reactions attributed to esterification and etherification reactions of the hydroxyl and carboxyl functionalities of GMAEV with the epoxy groups were identified. Exothermic reactions showed very different patterns according to the degree of carboxyl group substituent of GMAEV. The results showed that esterification reaction occurs in the early stage of cure and then etherification followed after completion of the esterification. A cured matrix containing epoxy resin and 50 wt.% of GMAEV was prepared and characterized. The cured matrix showed thermal stability up to 300 °C. The average glass transition temperature and storage modulus of the matrix were as high as 95 °C and 2700 MPa, respectively. The cured matrix of epoxy resin and GMAEV with higher degree of carboxyl group was found to have a lower density due to the formation of bulky groups in the crosslinks.     

Diglycidyl ether of bisphenol-A epoxy resin–polyether sulfone/polyether sulfone ether ketone blends: phase morphology, fracture toughness and thermo-mechanical properties

The properties of diglycidyl ether of bisphenol-A epoxy resin toughened with poly(ether sulfone ether ketone) (PESEK) and poly(ether sulfone) (PES) polymers were investigated. PESEK was synthesised by the nucleophilic substitution reaction of 4,4’-difluorobenzophenone with dihydroxydiphenylsulfone using sulfolane as solvent and potassium carbonate as catalyst at 230 °C. The T _g–composition behaviour of the homogeneous epoxy resin/PESEK blend was modelled using Fox, Gordon–Taylor and Kelley–Bueche equations. A single relaxation near the glass transition of epoxy resin was observed in all the blend systems. From dynamic mechanical analysis, the crosslink density of the blends was found to decrease with increase in the thermoplastic concentration. The storage modulus of the epoxy/PESEK blends was lower than that of neat resin, whilst it is higher for epoxy/PES blends up to glass transition temperature, thereafter it decreases. Scanning electron microscopic studies of the blends revealed a homogeneous morphology. The homogeneity of the blends was attributed to the similarity in chemical structure of the modifier and the cured epoxy network and due to the H-bonding interactions between the blend components. The fracture toughness of epoxy resin increased on blending with PESEK and PES. The increase in fracture toughness was due to the increase in ductility of the matrix. The thermal stability of the blends was comparable to that of neat epoxy resin.     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.     

含芳基噻唑基团环氧树脂材料的制备及热性能

制备了一种含芳基噻唑基团热稳定环氧树脂材料(TDABZ),通过傅里叶变换红外光谱(FTIR)对其结构进行了表征,采用热重分析-微熵热重分析(TGA-DTG)计算了TDABZ的热分解动力学参数,利用热重分析(TGA)和动态热机械分析(DMTA)探讨了TDABZ的耐热性能。 结果表明,TDABZ通过TGDDM结构中的环氧基团与混合固化剂(DDS和2-ABZ)结构中的活泼氢反应,在较低的温度下就能完全交联固化。 通过Kissinger和Ozawa方法求得TDABZ的热分解活化能分别为205.5和221.9 kJ/mol。 TDABZ固化物具有优异的耐热性能,双悬臂梁法测得的玻璃化转变温度(T_g)达到242.3 ℃,在N₂气气氛下失重5%对应的温度(T_d5)为340.2 ℃,最大失重速率对应的温度(T_dmax)为395.5 ℃,600 ℃的质量保留率为24.1%,显著提高了环氧树脂的热稳定性能,拓宽了其应用领域。