固相配位化学反应研究：LXVII.金属铜表面M—S（M=Mo,W）簇合物的组成

采用ＦＴＩＲ、ＸＰＳ和ＡＥＳ研究了金属铜表面Ｍ－Ｓ（Ｍ＝Ｍｏ，Ｗ）簇合物膜。结果表明，Ｍｏ（Ｗ）Ｓ＾２－４与铜表面的Ｃｕ２Ｏ反应，形成了Ｍｏ（Ｗ）－Ｓ－Ｃｕ键。簇合物膜由Ｍｏ（Ｗ），Ｓ，Ｃｕ，Ｏ元素组成，分别呈＋６、－２、＋１、－２价，膜为多分子层结构并保持，ＭｏＳ４或ＷＳ２单元，膜表面只有Ｃｕ，Ｏ而不存在Ｍｏ（Ｗ），Ｓ，膜层厚度与反应时间有关，时间越长，膜越厚，膜为多组分的复杂体系，其颜色是各组     

Mo(W)-Cu(Ag)-S原子簇化合物的研究现状

本文在研究Ｍｏ（Ｗ）－Ｃｕ（Ａｇ）－Ｓ原子簇化合物的低热固态合成化学基础上，详细地对该类簇合物进行了归纳，从中提出；１，ＭＯ４－ｎＳｎ＾２＾－（Ｍ＝Ｍｏ，Ｗ；ｎ＝２，３，４）作为配体中心。２，氧原子在簇合物中仅作为端基，不参与同其他金属成键。３，单个ＭＳ４（Ｍ＝Ｍｏ，Ｗ）基团最多只能键合六个Ｃｕ（Ａｇ）原子，即最大核数为七。４，迄今为止所有Ｍｏ（Ｗ）－Ｃｕ－Ｓ原子簇化合物中Ｃｕ均为＋１价。５，预计     

簇合物SFeCO2（CO）9的合成方法研究

簇合物ＳＦｅＣｏ＿２（ＣＯ）＿９的合成方法研究赵转云，武和平，殷元骐（中国科学院兰州化学物理研究所兰州７３００００）ＳＦｅＣｏ＿２（ＣＯ）＿９是一四面体构型的潜手性簇合物，由此为前体，合成簇合物ＳＦｅＣｏＭ（ＣＯ）＿ｘ（Ｍ＝Ｃｒ，Ｍｏ，Ｗ，Ｒｈ，Ｒｕ...     

Mo（W）－Cu（Ag）－S原子簇化合物的研究现状

本文在研究Ｍｏ（Ｗ）－Ｃｕ（Ａｇ）－Ｓ原子簇化合物的低热固态合成化学基础上，详细地对该类簇合物进行了归纳，从中提出：１．（Ｍ＝Ｍｏ，Ｗ；ｎ＝２，３，４）作为配体中心．２．氧原子在簇合物中仅作为端基，不参与同其他金属成键．３．单个ＭＳ４（Ｍ＝Ｍｏ，Ｗ）基团最多只能键合六个Ｃｕ（Ａｇ）原子，即最大核数为七．４．迄今为止所有Ｍｏ（Ｗ）－Ｃｕ－Ｓ原子簇化合物中Ｃｕ均为＋１价．５．预计合低价态Ｍｏ（Ｗ）的这类簇合物将会有很大进展．     

钢铁表面W—S簇合物彩色钝化膜的组成和结构

通过（ＮＨ４）２ＷＳ４溶液浸渍，在钢铁表面获得了具有良好装饰效果和耐蚀性能的彩色Ｗ－Ｓ簇合物膜．ＦＴ－ＩＲ、Ｆ－ＩＲ、ＦＴ－Ｒａｍａｎ、ＸＰＳ和ＡＥＳ分析结果表明，簇合物膜中存在Ｗ—Ｓ—Ｆｅ、端基Ｗ—Ｓ和端基Ｗ—Ｏ键，膜层由Ｗ、Ｓ、Ｆｅ、Ｏ元素组成，膜外层各元素价态分别为＋６、＋６（＋４）、＋３、－２，膜内层其价态则分别为＋６（＋４）、－２、＋２、－２．膜为多分子层结构，从ＡＥＳ深度分布曲线的组成恒定区求得了元素的相对原子分数和膜层厚度．反应时间越长，膜越厚．在２５０℃空气中加热２ｈ后膜层所含元素种类和价态不变，但各元素的分布和膜的结构发生了变化     

系列线型[M2M‘S4O4]^2—簇的合成及光谱与结构的关系（M=Mo,W;M…

报道了６种线型簇合物（Ｅｔ４Ｎ）２（Ｍ２Ｍ＇Ｓ４Ｏ４）（Ｍ＝Ｍｏ，Ｗ；Ｍ＇＝ＣＯ，ＮＩ，Ｆｅ）的合成，通过对ＵＶ－Ｖｉｓ，ＩＲ及ＸＰＳ光谱的对比分析，讨论了簇阴离子（ＭＷＭ＇Ｓ４Ｏ４）＾２－中心金属Ｍ＇的ｄ电子结构、氧化态以及（Ｍ＇Ｓ４）的微环境，由此推了簇阴离子构型，并讨论了化合物的稳定性。     

簇离子Mo_3S_4M~（n＋）中M与Mo成键作用及电子光谱（M＝Fe、Ni，n＝4；M＝Cu，n＝5）

应用ＩＮＤＯ／Ｓ半经验量子化学方法，对簇合物离子Ｍｏ３Ｓ和Ｍｏ３Ｓ４Ｍｎ＋（Ｍ＝Ｆｅ、Ｎｉ，ｎ＝４；Ｍ＝Ｃｕ，ｎ＝５）分别进行分子轨道计算。根据计算得到的簇离子中的原子表观电荷和成键指标，说明Ｆｅ、Ｎｉ、Ｃｕ＋与Ｍｏ３Ｓ成键作用的相对强度依次是Ｆｅ－Ｍｏ＞Ｎｉ－Ｍｏ＞Ｃｕ＋－Ｍｏ。比较了用含组态作用的ＩＮＤＯ／Ｓ方法计算得到的电子跃迁能与实验得到的电子吸收光谱值，并讨论了吸收峰归属情况。对于Ｍ为Ｆｅ、Ｎｉ的簇离子Ｍｏ３Ｓ４Ｍ４＋，最低能量的电子跃迁吸收峰起源于异金属间电荷转移跃迁（ＭＭ’ＣＴ）；而Ｍｏ３Ｓ４Ｃｕ（５＋）簇离子观察到的吸收峰主要是Ｍｏ３Ｓ芯的局域内电荷转移跃迁。根据理论计算结果，由Ｃｕ＋离子到Ｍｏ３Ｓ的电荷转移跃迁谱线，大约在４６０００ｃｍ－１以上才能观察到吸收峰。从Ｍｏ３Ｓ４Ｆｅ４＋次低能量吸收峰的实验值１６６００ｃｍ－１和理论值１６５００ｃｍ－１与Ｍｏ３Ｓ的最低能量吸收峰的实验值１６６００ｃｍ－１和理论值１６９００ｃｍ－１比较，表明无论从理论上或实验上都能证实簇离子Ｍｏ３Ｓ４Ｆｅ４＋在能量为１６６００ｃｍ－１处的吸收峰是起因于Ｍｏ３Ｓ芯的局域内电荷转移跃迁。     

金属键有机化合物的研究──非对称型η~5－取代环戊二烯基三羰基钼（钨）金属单键化合物的合成及表征

通过η５－Ｒ~１Ｃ＿５Ｈ＿４（ＣＯ）＿３ＭＮａ与η~５－Ｒ~２Ｃ＿５Ｈ＿４（ＣＯ）＿３ＭＮａ（Ｍ＝Ｍｏ，Ｗ）以及η~５－Ｒ~１Ｃ＿５Ｈ＿４（ＣＯ）＿３ＭｏＮａ与η~５－Ｒ~２Ｃ＿５Ｈ＿４（ＣＯ）＿３ＷＮａ在Ｆｅ＿２（ＳＯ＿４）＿３醋酸水溶液作用下的交叉氧化偶联反应，合成了７个新的非对称型金属单键化合物η~５－Ｒ~１Ｃ＿５Ｈ＿４（ＣＯ）－３Ｍｏ─Ｍｏ（ＣＯ）＿３Ｃ＿５Ｈ＿４Ｒ~２－η~５（Ｒ~１，Ｒ~２：Ｃ（Ｏ）Ｍｅ，ＣＯ２Ｅｔ），η５－Ｒ１Ｃ５Ｎ４（ＣＯ）３Ｗ─Ｗ（ＣＯ）３Ｃ５Ｈ４Ｒ２－η５（Ｒ１，Ｒ２：Ｃ（Ｏ）Ｍｅ，ＣＯ２Ｅｔ；Ｈ，ＣＯ２Ｅｔ）和η５－Ｒ１Ｃ５Ｈ４（ＣＯ）３Ｍｏ─Ｗ（ＣＯ）３Ｃ５Ｈ４Ｒ２－η５（Ｒ１，Ｒ２：Ｃ（Ｏ）Ｍｅ，Ｈ；Ｅｔ，Ｃ（Ｏ）Ｍｅ；Ｃ（Ｏ）Ｍｅ，ｎ－Ｂｕ；ＣＯ２Ｍｅ，ｎ－Ｂｕ）．用Ｃ／Ｎ分析、ＩＲ、１ＨＮＭＲ和ＭＳ表征了它们的结构，并对该氧化偶联反应的特点进行了讨论．     

簇合物〔WOS_3Cu_3(V-pic)_6〕Br 的合成和晶体结构

簇合物〔ＷＯＳ３Ｃｕ３（γ－ｐｉｃ）６〕Ｂｒ（Ｃ３６Ｈ４２ＢｒＯＮ６Ｓ３Ｃｕ３Ｗ, Ｍｒ＝ １１２５．３４） 属于三方晶系,空间群为Ｐ３,晶胞参数为：ａ＝ １２．２６４（５）, ｃ＝ １５．９０５（８） , γ＝ １２０．００°, Ｖ＝２０７１（２）３, μ（ＭｏＫα）＝ ５．４９０ｍ ｍ － １, Ｚ＝ ２, Ｄｃ＝ １．８０４ｇ／ｃｍ ３, Ｆ（０００）＝ １１０４ , Ｒ＝ ０．０５２ , ｗ Ｒ＝ ０．０５３． 可观察衍射点１９０１ （Ｉ≥２σ（Ｉ））。该簇合物的分子由游离的阴离子Ｂｒ－ 和簇阳离子〔ＷＯＳ３Ｃｕ３（γ－ｐｉｃ）６〕＋ 构成。阳离子中的Ｗ 原子、Ｓ原子和Ｃｕ原子构成１ 个巢状骨架结构,且该结构中存在一个通过Ｗ 和Ｏ原子的Ｃ３ 轴。     

杂核簇合物μ_3－CphCoMM＇的合成及结构表征

本文利用等电子金属碎片交换法，由μ３－ＣＰｈＣｏ３（ＣＯ）９（１）与ＮａＭ（ＣＯ）３Ｃｐ’（Ｍ＝Ｍｏ，Ｗ；ＣＰ’＝ＣＨ３Ｃ５Ｈ４）反应根到μ３－ＣＰｈＣｏ２Ｍ（ＣＯ）８ＣＰ’（２ａ，ｂ），μ３—ＣＰｈＣｏＭｏ２（ＣＯ）７Ｃｐ＇２（４），再由２ａ与Ｎａ２［Ｆｅ（ＣＯ）４］反应得到手征性簇合物μ３－ＣＰｈＦｅＣｏＭｏ（ＣＯ）２ＣＰ＇Ｈ（３），对合成的簇合物进行了元素分析、ＩＲ、１ＨＮＭＲ．ＭＳ分析表征．     

MoS^2^-~4在铜表面的配位化学反应

MoS^2^-~4与铜表面作用可以形成几种颜色的簇合物膜。FT-IR, XPS和AES结果表明, 膜中存在Cu-S-Mo键; 簇合物膜含Cu, Mo, S, O四种元素, 分别呈+1, +6,-2, -2价, 并含少量+4和+6价硫; 膜为多分子层的双层结构 . 反应时间越长, 膜越厚;加热后膜层仍含Cu, Mo, S, O 元素, Mo向内层渗透, S则在表面富集, Cu呈+1和+2价, S呈-2, +4, +6价, Mo和O价态不变;膜层是多组分的复杂体系; 其颜色是各化合物吸附、叠加的结果。     

Cooperativity of copper and molybdenum centers in polyoxometalate-based electrocatalysts: cyclic voltammetry, EQCM, and AFM characterization

Electrochemical behaviors of selected Dawson-type polytungstates including 2-K10[P2W15Mo2O61box] where the symbol [box] designates a vacant site, alpha2-K7[Fe(OH2)P2W15Mo2O61], alpha2-K8[Cu(OH2)P2W15Mo2O61], alpha1- and alpha2-K8[Cu(OH2)P2W17O61], alpha2-K8[Cu(OH2)P2W13Mo4O61], and alpha2-K8[Cu(OH2)P2W12Mo5O61] were investigated by cyclic voltammetry (CV) coupled with the electrochemical quartz microbalance (EQCM), and the results were completed by atomic force microscopy (AFM) observations of the electrodeposited films. The electrocatalytic abilities of these polyoxometalates (POMs) in the reduction of dioxygen, hydrogen peroxide, and NOx were also assessed by CV and EQCM. It turns out that the remarkable electrocatalysis obtained at the reduction potential of Mo centers within alpha2-K8[Cu(OH2)P2W15Mo2O61], but in a domain where Cu2+ is not deposited, benefits from the assistance of the copper center because such catalysis could not be observed in the absence of Cu2+. EQCM confirms that no copper deposition occurs under the experimental conditions used. Analogous behaviors are encountered in the electrocatalytic reduction of nitrite where assistance by the presence of the Cu2+ center induced the observation of catalysis at the potential location of Mo centers. Finally, the reduction of nitrate is triggered by electrodeposited copper but was remarkably favored by the presence of molybdenum atoms within these polyoxometalates (POMs). All of the results converge to indicate a cooperative effect between the Mo and Cu centers within these POMs. The various results suggest that copper deposition from these POMs should give morphologically different surfaces. AFM studies confirm this expectation, and the observed morphologies and sizes of particles were rationalized by taking into account the role of the POM skeleton and its atomic composition in the electrodeposition process.     

锌镀层P—Mo—V三元杂多酸盐配合物膜的性能和结构

在锌镀层材料表面,磷钼矾(P-Mo-V)三元杂多酸盐具有较好的配位能力,获得了多种具有金属光泽的不溶性彩色配合物膜,有良好的耐蚀性能和装饰效果。加速化学和电化学腐蚀实验(LSV)研究结果表明,Na6(PMo9V3O40).xH2O与锌镀层材料表面反应时,形成的一种新型金黄色杂多酸盐配合物膜(P-Mo-V金黄色配合物膜)的耐蚀性最佳。XPS和AES分析表明,P-Mo-V金黄色配合物膜层中Mo在膜表面的价态为 6,而在膜内层则以 6、 4价共存,其它元素的价态分别为Zn( 2),P( 5),V( 5),从其AES深度剥蚀曲线的组成恒定区求得膜的组成分别为Zn 19.7%,Mo 29.3%,V 21.2%,P 16.1%,O 13.5%;膜层的厚度约为160 nm。     

Thermodynamic stability of a bi-layer of copper nitride on Cu(100) surface

Ultrathin insulating films composed of a few atomic layers are being extensively used for controlling the electronic coupling of nanostructures deposited on a substrate. Ultrathin film, for example, a single layer of Cu(2)N deposited on a Cu(100) surface (known as Cu(2)N/Cu(100) surface) has been used to determine the spectral properties of nanomagnets using scanning tunneling spectroscopy. However, recent experiments that measure spin relaxation times in a single atom suggest that the single layer of Cu(2)N does not provide efficient electronic decoupling. In this work, we study the thermodynamic stability of a bi-layer of copper nitride on the Cu(100) surface. We calculate adsorption and co-adsorption energies of Cu and N as a function of their concentration on the Cu(2)N/Cu(100) surface using density functional theory. We find that the adsorption and co-adsorption energies of Cu and N on the Cu(2)N/Cu(100) surface are of the order of a few eV. This suggests that the bi-layer of copper nitride is thermodynamically stable on the Cu(100) surface. We also find that the work function of N-adsorbed Cu(2)N/Cu(100) increases with the N concentration, suggesting a better insulating character of the bi-layer of copper nitride on the Cu(100) surface.     

Nanoscale assemblies of gigantic molecular {Mo154}-rings: (dimethyldioctadecylammonium)20[Mo154O462H8(H2O)70

Clusters based on the mixed-valence gigantic inorganic ring [Mo154O462H14(H2O)70]14- ({Mo154}-ring) and dimethyldioctadecylammonium (DODA) were combined to form novel molecular assemblies of an inorganic-organic hybrid molecular system as Langmuir-Blodgett (LB) and cast films. (DODA)20[Mo154O462H8(H2O)70] (2) was prepared by cation exchange and was characterized by a combination of thermogravimetry, IR, UV-vis-NIR, 1H NMR, and XRD measurements. The salt 2 was soluble in common organic solvents, and the chemical stability of {Mo154}-ring encapsulated by DODA cationic surfactants in CHCl3 was found to be higher than that of the "native" sodium salt of the {Mo154}-ring in H2O. Uniform spherical vesicle-like molecular assemblies of (DODA)20[Mo154O462H8(H2O)70] were observed in dilute THF, whose average diameter of 95 nm and a normalized variance of 5.7% were confirmed by a X-ray small-angle scattering. Deposition of 2 as a cast film showed circular domains with a typical diameter of approximately 100 nm, indicating possible similarities between solution and surface-deposited structures. The resulting LB films of salt 2 were transferred from an acidic buffer subphase with pH = 1.5 onto mica, giving a two-dimensional film surface with a unity transfer ratio. Further, the electronic absorption spectra of the LB multilayer were consistent with the classic type II mixed-valence MoV/MoVI electronic state well know for molybdenum blue {Mo154}-ring systems, and it appears that on the surface the plane of the {Mo154}-ring is approximately parallel to the substrate surface, as indicated by polarized electronic spectra, while the alkyl chains of DODA were relatively normal to the substrate surface. Therefore, the layer between the {Mo154}-rings and DODA cations was alternately stacked along the direction of film propagation. Finally, it was found that the surface morphology of the cast and LB films was determined by the molecular assembly of (DODA)20[Mo154O462H8(H2O)70] in solution and the air-water interface, respectively.     

Electrochemical and surface analytical study of the formation of oxide films on monel-400 and copper in alkaline media

The nature of the oxide films formed on monel-400 and copper in presence of NaOH and N-methylpyrrolidine (a volatile amine) at pH 9.5 and in 0.1 M KNO₃ medium were investigated. The oxide films were grown by applying an anodic potential of +0.4 V (vs saturated calomel electrode) for 30 min. The compositions of the surface oxide films were analysed by X-ray photoelectron spectroscopy. In the case of copper in NaOH medium, Cu(0) and a very small amount of copper hydroxide were observed. However, in amine medium, Cu(0) and Cu-amine complex were found. For monel in NaOH, the anodic film was found to contain hydroxides of both copper and nickel. After sputtering, this film showed a small amount of metal oxide below the hydroxide layer as confirmed by the oxygen peak. In amine medium the anodic film was found to contain only nickel hydroxide and metallic copper. The depth profile analysis of films showed that the film developed was very thin and the nickel hydroxide was sputtered very easily from the film. Received: 27 May 1997 / Accepted: 8 September 1997     

Electrochromic multilayer films of tunable color by combination of copper or iron complex and monolacunary dawson-type polyoxometalate

Electrochromic multilayer films consisting of polyoxometalate (POM) cluster alpha-K(10)[P(2)W(17)O(61)].17H(2)O (P(2)W(17)), copper(II) complex [Cu(II)(phen)(2)](NO(3))(2) (phen = 1,10-phenithroline), and iron complex [Fe(II)(phen)(3)](ClO(4))(2) were fabricated on silicon, quartz and ITO substrates by layer-by-layer self-assembly method. The multilayer films, PSS/Cu(II)(phen)(2)/[(P(2)W(17)/Cu(II)(phen)(2))](n) and PSS/Fe(II)(phen)(3)/[(P(2)W(17)/Fe(II) (phen)(3))](n) were characterized by UV-vis spectra, X-ray photoelectron spectra, cyclic voltammetry (CV), chronoamperometric (CA) and in-situ spectral electrochemical measurements. The interesting feature of the electrochromic film is its adjustable color by reduction of both transition metal complex and polyoxometalate at different potentials. The multilayer films also exhibit high optical contrast, suitable response time and low operation potential due to the presence of mono-lacunary-substituted polyoxometalate and transition metal complex. This is the first example that the color of electrochromic film can be adjustable, which gives valuable information for exploring new electrochromic materials with tunable colors.     

Anodic oxidation of foil copper on fiber-glass plastic in sulfate-chloride electrolyte

The effect of the conditions of galvanostatic anodizing of copper foil at fiber-glass plastic on growth kinetic parameters of Cu₂O films is studied. It is shown that the anodic treatment current density in the sulfate-chloride electrolyte features a logarithmic dependence on the electric field strength in the anodic Cu₂O film, which is probably caused by the presence of either a p-n-transition, or an inversion layer of electronic conductivity at the Cu/Cu₂O interface. It is found that the dependence of the film thickness on the formation time at different current densities is nonlinear.     

Electroless Copper Plating on Liquid Crystal Polymer Films Using Dimethylamine Borane as Reducing Agent

Dimethylamine borane (DMAB) was used in electroless copper plating on liquid crystal polymer (LCP) films. An orthogonal test was applied to optimize the plating condition. With Cu film resistivity as the evaluation index, the optimum plating condition is: 10 g/L of CuSO₄ ? 5H₂O, 14 g/L of EDTA‐2Na, 6 g/L of DMAB, 9.5 of pH value and 50 °C. As pH value increases, the Cu film resistivity decreases and the depo‐ sition rate increases. As temperature increases, the Cu film resistivity decreases first and then increases with a minimum at 50 °C while the deposition rate increases first and then decreases with a maximum at 50 °C. The decreased Cu film resistivity can be attributed to the occurrence of CuO. The adhesive strength of copper layer to LCP film is constant at pH values lower than 8.5 and decreases slightly with the increase in pH value. As temperature increases, the adhesive strength decreases slightly. The decreased adhesive strength with both pH and temperature may be a result of an increased corrosion attack from the bath to the surface of LCP films. Low Cu film resistivity and high deposition rate as well as high adhesive strength can be obtained using DMAB reducing agent.