酚醛-重氮萘醌正性抗蚀剂溶解抑制机理

本文综述了酚醛 重氮萘醌正性抗蚀剂的溶解抑制机理,主要包括(1)分子间氢键作用机理;(2)偶联反应机理;(3)两步即静态、动态溶解抑制机理;(4)表面沉积溶解抑制机理;(5)酚醛树脂的分子溶解及相关的抑制机理.     

Structural characteristics of phenol formaldehyde novolak resin depending on polycondensation type using molecular simulation

Phenol formaldehyde novolak resins have various structures depending on the polycondensation types. Their structures were characterized using molecular mechanics and molecular dynamics. Dimer, tetramer, hexamer, octamer, and decamer of the resins with the ortho–ortho, ortho–para, and para–para sequences were calculated. The ortho–ortho resins have the structural characteristics of intramolecular hydrogen bonds between hydroxyl groups of the adjacent phenolic units. For the ortho–para and para–para resins, the intramolecular hydrogen bonds are formed mainly between hydroxyl groups of the backbone phenolic units. The para–para resins also have intramolecular hydrogen bonds between hydroxyl groups of the branched phenolic units. A factor determining the structural characteristics of the resins was found to be the geometry of the basic unit (dimer). The order of the end‐to‐end distances between hydrogen atoms on the para‐position of the basic units of the resins is ortho–ortho resin < ortho–para resin < para–para resin. The calculational results were found to be consistent with the gel permeation chromatography (GPC) analysis. Copyright © 2001 John Wiley & Sons, Ltd.     

Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

The molecular mechanism of novolak-diazonaphthoquinone resists

Novolak-diazonaphthoquinone (DNQ) resists are photosensitive varnishes that are used in the fabrication of more than 80% of today's integrated circuits. They have played a crucial role in an unprecedented technical revolution, yet until quite recently nobody really knew how they work. We have been concerned with this problem for some time and we realize now that the principal functions of novolak resists, namely the inhibition by DNQ derivatives of the dissolution of novolak films, and the cessation of inhibition on exposure to radiation, are essentially physical phenomena. Dissolution inhibition is caused by an electric stress imposed on the phenol groups of the resin by the inhibitor. This effect penetrates deep into the material through the formation of hydrogen-bonded phenolic strings. Exposure relieves the stress by uncoupling the strings from the source of induction. The concept of phenolic strings is new and unusual, but it is essential for the understanding of dissolution inhibition. With it, all the many aspects of novolak resists can be interpreted in a unified manner.     

I-Line光刻胶材料的研究进展

酚醛树脂-重氮萘醌正型光刻胶由于其优异的光刻性能,在g-line(436 nm)、i-line(365 nm)光刻中被广泛使用.g-line光刻胶胶、i-line光刻胶,两者虽然都是用线型酚醛树脂做成膜树脂,重氮萘醌型酯化物作感光剂,但当曝光波长从g-line发展到i-line时,为适应对应的曝光波长以及对高分辨率的追求,酚醛树脂及感光剂的微观结构均有变化.在i-line光刻胶中,酚醛树脂的邻-邻'相连程度高,感光剂酯化度高,重氮萘醌基团间的间距远.溶解促进剂是i-line光刻胶的一个重要组分,本文对其也进行了介绍.     

TG-DTA study of melamine-urea-formaldehyde resins

The thermal behaviour of MUF resins from different suppliers with different content of melamine was studied, along with the ¹³C NMR spectroscopic analysis of resin structure and the testing of particleboards in current production at Estonian PB factory Pärnu Plaaditehas AS. The chemical structure of resins from DMSO-d₆ solutions was analysed by ¹³C NMR spectroscopy on a Bruker AMX500 NMR spectrometer. The melamine level in different MUF resins is compared by the ratios of carbonyl carbon of urea and triazine carbon of melamine in ¹³C NMR spectra. Curing behaviour of MUF resins was studied by stimultaneous TG-DTA techniques on the Labsys? instrument Setaram. The shape of DTA curves characterisises the resin synthesis procedure by the extent of polymerisation of UF and MF components and is in accordance with structural data.     

Synthesis, characterization, thermal properties and flame retardancy of a novel nonflammable phosphazene-based epoxy resin

Hexakis(4-hydroxyphenoxy)-cyclotriphosphazene (PN-OH) was synthesized through nucleophilic substitution of the chloride atoms of hexachlorocyclotriphosphazene and reduction of the aldehyde groups, and its chemical structure was characterized by elemental analysis, ¹H and ³¹P NMR, and Fourier transform infrared (FTIR) spectroscopy. A new phosphazene-based epoxy resin (PN-EP) was successfully synthesized through the reaction between diglycidyl ether of bisphenol-A (DGEBA) and PN-OH, and its chemical structure was confirmed by FTIR and gel permeation chromatography. Four PN-EP thermosets were obtained by curing with 4,4′-diaminodiphenylmethane (DDM), dicyandiamide (DICY), novolak and pyromellitic dianhydride (PMDA). The reactivity of PN-EP with the four curing agents presents an increase in the order of DDM, PMDA, novolak and DICY. An investigation on their thermal properties shows that the PN-EP thermosets achieve higher glass-transition and decomposition temperatures in comparison with the corresponding DGEBA ones while their char yields increase significantly. The PN-EP thermosets also exhibit excellent flame retardancy. The thermosets with novolak, DICY and PMDA achieve the LOI values above 30 and flammability rating of UL94 V-0, whereas the one with DDM reaches the V-1 rating. The nonflammable halogen-free epoxy resin synthesized in this study has potential applications in electric and electronic fields in consideration of the environment and human health.     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Changes in curing behaviour of aminoresins during storage

Summary The curing behaviour of commercial UF and MUF resins, stored at room temperature nearly up to gelation, is studied by simultaneous TG-DTA technique and structural changes of resins are also followed during aging. On the basis of ¹³C NMR spectra, the main chemical reaction during UF resin storage is the formation of methylenes and dimethylene ethers linked to secondary amino groups. Aging of resins results in a decrease of cure rate which is related to lower concentration of active functional groups and decrease in molecular mobility. On DTA curve, the resin with higher content of methylol groups reveals the curing exotherm earlier. With decreasing methylol content during storage, the peak maximum of exotherm is shifted to higher temperature value. Advanced polycondensation and sedimentation processes during storage produce partly locked in macromolecule structure water, and the water evaporation endotherm on DTA curve shifts to considerably higher temperature. The aged MUF resins are chemically less changed than UF resins and the aging process mainly involves noncovalent network formation due to complex molecular structure.     

Solid state 13C NMR study of hexa(methoxy methyl)melamine and melamine-formaldehyde selfcondensates

The structure and molecular dynamics of self-condensation products of three different melamine resins based on hexa(methoxy methyl)melamine are studied by ¹³C NMR in the solid state. The application of direct (DP) and cross-polarization (CP) pulse sequences shows that uncured and cured melamine resins are motionally heterogeneous systems, with the mobile and rigid parts consisting of the same basic structural units. Viscous lightly cured samples based on commercial melamine-formaldehyde resins contain low-molecular weight species which act as plasticizers. In these resins, three motionally different methyl groups are observed. Their existence is confirmed either by spectral deconvolution or by fitting the experimental signal intensities to the cross-polarization dynamics with the assumption of two cross-polarization-transfer rates. Fast cross-polarizing rigid methyl groups are accompanied with the spinning sidebands. On the basis of DP and CP relaxation measurements, quantitative results for three major structural units are calculated. Problems concerning the ¹⁴N-¹³C quadrupolar interactions and quantitative analysis are discussed. ©1995 John Wiley & Sons, Inc.     

Modified cyanate ester resins with lower dielectric loss,improved thermal stability,and flame retardancy

Novel modified cyanate ester (CE) resins with decreased dielectric loss, improved thermal stability, and flame retardancy were developed by copolymerizing CE with hyperbranched phenyl polysiloxane (HBPPSi). HBPPSi was synthesized through the hydrolysis of phenyltrimethoxysilane, and its structure was characterized by ¹H‐NMR, ²⁹Si‐NMR, and Fourier transform infrared spectra. The effect of the incorporation of HBPPSi into CE resin on the curing behavior, chemical structure of cured networks, and typical performance of HBPPSi/CE resins were systemically evaluated. It is found that the incorporation of HBPPSi into CE network obviously not only catalyzes the curing of CE, but also changes the chemical structure of resultant networks, and thus results in significantly decreased dielectric loss, improved thermal stability, and flame retardancy as well as water absorption resistance. For example, in the case of the modified CE resin with 10 wt% HBPPSi, its limited oxygen index is about 36.0, about 1.3 times of that of neat CE resin, its char yield at 800°C increases from 31.6 to 35.4 wt%; in addition, its dielectric loss is only about 61% of that of neat CE resin at 1 kHz. All these changes of properties are discussed from the view of the structure–property relationship. The significantly improved integrated properties of CE resin provide a great potential to be used as structural and functional materials for many cutting‐edges fields. Copyright © 2011 John Wiley & Sons, Ltd.     

高分子药物－可乐定阴离子丙烯酸树脂盐的研制及释药性能探索

研制了高分子药物－可乐定阴离子丙烯酸树脂盐并在模拟胃和小肠ｐＨ的缓冲液中进行了高分子药物的溶解释放试验。结果表明其中某些试样能够在微碱性的缓冲液中缓慢溶解释放，可望达到减少用药量。降低副作用和延长药效的目的。     

Electroluminescence of Organoaluminum Complexes in the Presence of Silica Gel

It was demonstrated that light-emitting materials can be produced by the photochemical dissolution of aluminum in composites based on a cresol–formaldehyde novolak resin and CBr₄in the presence of triphenylmethane dyes such as aluminon, pyrocatechol violet, and malachite green. The electroluminescence (EL) is due to the formation of organoaluminum complexes. The SnO₂(anode)/novolak resin + pyrocatechol violet/Al (cathode) diodes exhibited the highest EL intensity. Compositions based on aluminon are characterized by weak EL, which increased by a factor of 30 upon the additional introduction of silica gel into the composition. As a result of supporting a PVA film on the diode surface (on the cathode side), the EL increased by a factor of 1.5 and became as high as 10 cd/m². This value is comparable to the EL of pyrocatechol violet–containing diodes. The possible mechanism of the influence of silica gel and the importance of a PVA film for increasing the EL intensity are discussed. In the aluminon-based compositions, the dependence of EL on the diode storage time both with and without an applied voltage was measured.     

Investigation of artificial resin-based adhesives in works carried out by the all-Russia Scientific Research Institute of Aviation Materials in 1936–1937

The main preconditions for developing principally new (for the examined period of time) adhesives based on artificial resins are presented. The results of application of the combined (casein and resin) adhesives, adhesives based on novolak, karbolit and barite phenol formaldehyde resins are given. It is shown that the phenol-barite resin of VIAM-6 grade was the most suitable for the aviation industry at that time.     

Investigation of the artificial resin-based adhesives in works carried out by the All-Russia Scientific Research Institute of Aviation Materials in 1938–1939

The main preconditions for developing principally new (for the examined period of time) adhesives based on artificial resins are presented. The results of application of the combined (casein and resin) adhesives, adhesives based on novolak, karbolit and barite phenol formaldehyde resins are given. It is shown that the phenol-barite resin of VIAM-6 grade was the most suitable for the aviation industry at that time.     

Study the radiation effects on 4-vinylpyridine-based porous resins in 99Tc adsorption

The 4-vinylpyridine-based porous resins (4VP–DVB and 4VP–DVBQ) were synthesized to adsorb ⁹⁹Tc from radioactive waste. The radiation stability of the synthesized resins were investigated in air, water, HCl, and HNO₃ mediums. The radiolytic degradation of resins was evaluated by the total organic carbon analysis. The weakly basic resin (4VP–DVB) and strongly basic resin (4VP–DVBQ) showed a remarkable resistance to radiation in HCl and HNO₃ solutions respectively. Moreover, adsorption behavior of irradiated 4VP–DVB and 4VP–DVBQ resins toward ⁹⁹Tc was studied by the batch experimental method.

     

CURING AND RHEOLOGICAL BEHAVIOR OF VINYL ESTER RESINS PREPARED IN THE PRESENCE OF TERTIARY AMINES

Vinyl ester resins V₁, V₂ & V₃ of acid value (～6 mg KOH g^?1 solid) were synthesized using bisphenol-A epoxy and acrylic acid in the presence of triethyl-, tripropyl- and tributyl-, amines in 210, 270 and 340 minutes, respectively. The synthesized resins were characterized by FTIR spectroscopy and a new peak at 2360 cm^?1 was observed which is due to attachment of amines to resin structure by hydrogen bond. The curing behavior of synthesized resin containing 40% styrene (w/w) and 2% benzoyl peroxide was studied using DSC technique and found to be affected by presence of amines. Activation energy and frequency factor for the curing reaction increases from 14 Kcal mol^?1 to 23 Kcal mol^?1. Rheological behavior of resins containing 40% styrene was studied using a Haake Rotovisco RV20 viscometer, and viscosity was found to increase with shear rate up to 200 sec^?1. The average values of activation energy at constant shear stress (6-15 Pa) were 12.94, 13.20, 13.70 Kcal mol^?1 for V₁, V₂ and V₃, respectively. The activation energy at constant shear rate decreases with an increase in the shear rate.     

Synthesis and characterization of high bio-based content unsaturated polyester resin for wood coating from itaconic acid: Effect of various reactive diluents as an alternative to styrene

The present work focuses on the ability of 2-hydroxyethyl methacrylate (HEMA), isobornyl methacrylate (IBOMA) and methyl methacrylate (MMA) as reactive diluents to replace styrene in unsaturated polyester resin based on itaconic acid, sebacic acid, 1,4-Butanediol, 1,6-Hexanediol and glycerol. The structural analysis confirmed the presence of itaconate linkages in the UPs. The synthesized resins were characterized by infrared spectroscopy and their physiochemical properties such as appearance, viscosity, acid value, %volatile content, curing characteristics like gel time, peak exotherm temperature and total cure time. Among all the resins formed; the resin based on 1,6-Hexanediol showed optimum molecular weight and viscosity needed for final application. The cured resins were investigated for their thermal stability by thermo-gravimetric analysis which revealed that all the diluted resins had good thermal stability. From the results it could be concluded that styrene-free bio-based unsaturated polyester resin can be synthesized having properties equivalent to the commercial styrene based resin.GRAPHICAL ABSTRACT     

Synthesis and characterization of itaconic‐based epoxy resins

A trifunctional epoxy resin from itaconic acid (TEIA) was synthesized from a renewable resource‐based itaconic acid by allylation of itaconic acid to form diallyl itaconate by using m‐chloroperoxybenzoic acid as oxidizing agents followed by epoxidation of allylic C═C bond of diallyl itaconate methylhexahydropthalic anhydride as curing agent in the presence of 2‐methyl imidazole as a catalyst. The chemical structure of the synthesized resins was confirmed by Fourier transform infrared and nuclear magnetic resonance (¹H‐NMR and ¹³C‐NMR) spectroscopy analysis. The mechanical, thermal, and rheological performances of the TEIA were also investigated and compared with diglycidyl ether of bisphenol A and a plant‐based epoxidized soybean oil bioresin cured with the same curing agent. The higher epoxy value of 1.02, lower viscosity (0.96 Pa s at 25°C), higher mechanical, and higher curing reactivity toward methylhexahydropthalic anhydride of TEIA as compared with epoxidized soybean oil and comparable with diglycidyl ether of bisphenol A demonstrated significant evidence to design and develop a novel bio‐based epoxy resin with high performance to substitute the petroleum‐based epoxy resin.