PECVD腔室热流场数值仿真研究

等离子辅助化学气相沉积(PECVD)腔室的气流分布、温度分布是影响薄膜沉积工艺均匀性以及沉积速率的重要原因之一.本文对PECVD腔室气流建立连续流体和传热模型,研究了腔室内流场和温度分布特性;讨论了四种不同稳流室结构的PECVD腔室,在加热盘恒温400℃、质量流量5000 sccm、抽气口压力133 Pa的工艺条件下12英寸晶圆片附近上方流速、压力、温度分布情况;选择了其中一种稳流室结构作了多种质量流量( 20 ～ 5000 sccm)入口条件下的流场分析.仿真研究发现:在抽气口位置偏置的情况下,四种不同稳流室结构的腔室内热流场并未出现明显偏置,这表明抽气口偏置对工艺均匀性没有明显影响.加热盘附近上方2 mm处温度场大面均匀、稳定,且随入口质量流量变化波动很小,表现出良好的稳定性;气压分布呈现中心高边缘低的抛物线特征,流速呈现中心低边缘高的线性特征,且晶圆片附近以及喷淋头( Showerhead)入口压力和流速均随着入口质量流量的增加而升高.研究结果对PECVD腔室结构设计及工艺控制具有重要意义.     

湿法刻蚀腔室结构数值优化

为确定某种新型刻蚀机最优的晶圆与喷淋头间距(Gap),通过CFD仿真分析气体在不同Gap腔室内的物质输运分布,并结合乙醇环境下HF酸刻蚀SiO2工艺的物理化学过程,建立了刻蚀速率估算公式,以此分析了不同Gap腔室的刻蚀速率及刻蚀均匀性,最终获得了具有最佳刻蚀效果的腔室结构.研究分析表明:Gap较小时晶圆中心刻蚀速率偏高,Gap较大时晶圆边缘刻蚀速率偏高;平均刻蚀速率随着Gap的增大逐渐降低,而刻蚀不均匀度随Gap增大先减小后增大,在Gap取值70 mm时刻蚀均匀性最佳且刻蚀速率较高.     

湿法刻蚀机腔室关键结构及主要工艺参数对刻蚀性能的影响因素研究

以某18英寸湿法刻蚀机腔室为研究对象,建立了流-热耦合的数值分析模型,研究了刻蚀过程中工艺气体在圆筒式腔室内流速、压强、温度的分布规律,结合HF酸在乙醇环境下刻蚀SiO2的工艺原理,提出了由耗散系数、物质转换系数、物质量通量、品格结构等表征的刻蚀速率及刻蚀不均匀性评价方法,得到了腔室关键结构及主要工艺的参数对刻蚀性能的影响规律.     

基于正交试验的PECVD法沉积氮化硅薄膜工艺参数优化研究

利用多响应正交试验方法研究了PECVD法沉积氮化硅薄膜的工艺参数的优化问题.鉴于目前针对多输出影响过程,尚无有效的方法进行工艺参数优化这一问题,利用综合评分法对衬底温度、气体总流量、NH3/SiH4流量比、反应腔气体压力、高频电场功率5个对氮化硅薄膜的主要质量特性影响较大的工艺参数进行全局优化,再对不满足质量期望的工艺参数进行部分正交分析,对全局优化的结果进行调整,得到最终的氮化硅镀膜的最优工艺参数.国内某光伏企业的验证试验表明了所提方法的有效性.     

基于响应面法的直拉硅单晶生长工艺参数优化方法

在直拉法制备硅单晶的过程中,要得到优质的晶体必须建立合理的温度分布,而单晶炉内热场的分布与工艺参数的设定密切相关.其中以晶体转速、坩埚转速和拉速等三个工艺参数对热场分布的影响尤为显著.为了确定最佳热场分布下晶转、埚转及拉速的设定值,本文采用响应面算法通过方程拟合、回归分析等步骤求解这三个工艺参量与温度梯度之间的最佳函数模型,并在该模型下同时对这三个工艺参量进行优化分析,且通过仿真实验和拉晶实验表明该方法的有效性.     

多片式热壁 MOCVD 反应器的设计与数值模拟分析

本文提出一种多反应腔并联的水平热壁 MOCVD 反应器,反应器上下(左右)壁面都采用高温,减少了热泳力的排斥作用,提高了衬底上方的 TMG 浓度.由于取消了传统反应器的冷壁,减少了寄生产物的凝结,提高了反应前体的利用率和 GaN 的生长速率.可以多个反应腔并联生长,从而实现反应器的扩容.针对这种热壁式反应器,结合 GaN 的 MOCVD 生长进行了二维数值模拟,计算了不同流速、高度、长度和压力时反应器内流场、温场、浓度场分布以及生长速率,发现存在一个最佳的气体流速、反应器高度和长度条件,在此条件下,反应前体的产生与沉积达到平衡,从而有效抵消反应前体的沿程损耗,实现均匀的 GaN 生长.     

耐等离子刻蚀陶瓷的研究现状

等离子刻蚀技术是超大规模集成电路制备工艺中不可或缺加工技术.在半导体晶圆尺寸不断增大以及特征尺寸不断缩少的发展进程中,晶圆的污染问题越来越突出.而刻蚀机腔室材料作为晶圆的主要污染源之一,其耐等离子刻蚀性日益受到人们的关注.本文主要介绍耐等离子体刻蚀腔体材料的特性及目前国内外的研究与发展现状.     

MPCVD金刚石薄膜微波功率和沉积压力匹配性研究

微波等离子体化学气相沉积(MPCVD)法制备的高质量金刚石在很多领域均有广泛应用前景。本研究采用9 kW微波功率,分别在13 kPa、14 kPa、15.5 kPa、17 kPa的腔室压力下进行薄膜沉积实验,发现在15.5 kPa、17 kPa的腔室压力下沉积的薄膜在中心区域出现异常生长情况,具体表现为中心存在明显的阶梯式凸起。为揭示薄膜中心出现异常沉积的原因,使用SEM和Raman分析薄膜表面形貌和质量,通过数值模拟进行沉积过程建模计算和分析功率密度和流场分布。结果表明在相同功率下,提高腔室压力,压缩等离子体,因平均自由程较短,扩散能力不足,将导致衬底中心区域比边缘区域更易密集生长,金刚石薄膜中心区域出现明显的阶梯。同时,薄膜整体的生长速率、均匀性、质量均会在超过压力极值后降低。     

一种多喷淋头式MOCVD反应器的设计与数值模拟

提出了一种多喷淋头式MOCVD反应器.针对新型反应器,对GaN生长的MOCVD过程进行了数值模拟,模拟考虑了热辐射和化学反应,计算了反应器内流场、温场和浓度场,导流(筒)壁面的寄生沉积以及GaN生长速率,并分析了反应室几何因素对生长均匀性的影响.模拟结果显示,衬底表面大部分区域具有均匀的温场和良好的滞止流.通过对浓度场和GaN生长速率的分析,得出MMGa是薄膜生长的主要反应前体.通过对反应器高度H、导流筒与托盘间距h、导流筒半径R等参数的优化,给出了提高薄膜生长速率和均匀性的条件.     

HFCVD系统中衬底温度场及气相空间场的数值分析

探讨了典型气氛中热丝辐射、气体热传导与对流、化学反应生热等因素对衬底温度的影响,建立了三维热丝辐射和二维热流耦合有限元模型,研究了各工艺参数对衬底温度场及气相空间场的影响.结果表明H2占主导地位的气氛中衬底表面的氢原子重组放热对衬底温度有较大影响,氩气气氛中原子重组放热对衬底温度影响很小;热丝温度对衬底温度的影响最大;进气口到衬底的距离及进气口气体流速对衬底附近的流场影响最大,适当提高进气口到衬底的距离有助于提高衬底附近流场均匀性,增大进气速度有助于突破热障提高衬底表面流速,但同时加剧了衬底附近流场的不均匀性.     

反向流动垂直喷淋式MOCVD反应器生长GaN的化学反应数值模拟

本文提出了MOCVD生长GaN的表面循环反应模型,将该反应模型应用于作者新近提出的反向流动垂直喷淋式反应器,进行三维数值模拟.得出反应器内流速、温度和TMGa浓度分布,以及GaN的生长速率分布.将此计算结果与传统的反应器情况进行对比,发现在相同参数情况下,两种反应器的衬底上方温度分布都比较均匀,近衬底处温度梯度较大,高温区域被压制在离衬底较近的区域,流线均比较平滑,在衬底上方没有明显的旋涡;新型反应器内反应气体在近衬底处的浓度均匀性以及GaN在基片表面的沉积均匀性都优于传统反应器,但沉积速率小于后者,大约只有后者的1/2.     

反向流动垂直喷淋式MOCVD反应器设计与数值模拟

本文分析了现有的MOCVD反应器存在的不足,提出了一种新型的反向流动垂直喷淋式反应器:反应气体从基片上方的许多平行小喷管喷入反应区,反应后的尾气又从基片上方出口排出,从而减少了反应物浓度沿衬底径向的不均匀性.通过对反应器进行三维数值模拟,改变喷管的中心距、喷管端与衬底的距离、流量、气体压强等参数,确定了反应室内衬底上方温度场与浓度场为最佳时的参数组合.     

单晶炉导流筒、热屏及炭毡对单晶硅生长影响的优化模拟

在CZ法生长太阳能级单晶硅中,单晶炉的导流筒、热屏和炭毡对晶体生长有很大影响.通过对上述三个部件进行改进优化,并通过数值模拟对优化前后晶体和熔体的热场、热屏外表面与石英坩埚内壁面之间的氩气流场以及晶体中的热应力进行分析,得出以下结论:石墨导流筒的引入减少了炉体上部的氩气流动涡胞,进而减少了SiO在单晶炉上部的沉积;优化后的热屏减少了加热器对晶体的烘烤,使结晶速率加快;优化后的侧壁炭毡阻止了加热器向上部的热损失.优化后在加热器功耗不变时,结晶速率至少可提高35;,而不增加宏观位错的发生概率.     

喷淋式MOCVD反应器中AlN的生长速率和化学反应路径的数值模拟研究

利用数值模拟方法,结合反应动力学和气体输运过程,研究喷淋式MOCVD反应器中AlN的生长速率和气相反应路径与反应前体流量(NH₃和 H₂)、进口温度、压强、腔室高度等参数的关系。研究发现:薄膜生长前体和纳米粒子前体的浓度决定了不同的生长速率和气相反应路径。在低Ⅴ/Ⅲ比(2 000)、高H₂流量(12 L/min)、高进口温度(700 K)、低压强(2 kPa)、低腔室高度(5 mm)等条件下,气相反应路径由加合路径和热解路径并存,生长速率较高。反之,化学反应路径则由加合路径主导,生长速率较低。上述参数对反应路径的影响原因包括:气体流量(NH₃和H₂)较大,反应前体被带出生长区域或被稀释;低压强和低腔室高度使粒子碰撞频率降低、驻留时间缩短,进而削弱了寄生反应;进口温度导致温度梯度的变化。     

Systematic study of epitaxy growth uniformity in a specific MOCVD reactor

Gallium nitride (GaN) is a direct bandgap semiconductor widely used in bright light‐emitting diodes (LEDs). Thin‐film GaN is grown by metal‐organic chemical vapour deposition (MOCVD) technique. Reliability, efficiency and durability of LEDs are influenced critically by the quality of GaN films. In this report, a systematic study has been performed to investigate and optimize the growth process. Fluid flow, heat transfer and chemical reactions are calculated for a specific close‐coupled showerhead (CCS) MOCVD reactor. Influences of reactor dimensions and growth parameters have been examined after introducing the new conceptions of growth uniformity and growth efficiency. It is found that GaN growth rate is mainly affected by the concentration of (CH3)3Ga:NH3 on the susceptor, while growth uniformity is mainly influenced by the recirculating flows above the susceptor caused by natural convection. Effect of gas inlet temperature and the susceptor temperature over the growth rate can be explained by two competing mechanisms. High growth efficiency can be achieved by optimizing the reactor design.     

Numerical design of Metal‐Organic Vapour Phase Epitaxy process for gallium nitride epitaxial growth

The paper presents the results of numerical simulations and experimental measurements of the epitaxial growth of gallium nitride in Metal Organic Vapor Phase Epitaxy within a AIX‐200/4RF‐S reactor. The aim was to develop optimal process conditions for obtaining the most homogeneous crystal layer. Since there are many factors influencing the chemical reactions on the crystal growth area such as: temperature, pressure, gas composition or reactor geometry, it is difficult to design an optimal process. In this study various process pressures and hydrogen volumetric flow rates have been considered. Due to the fact that it is not economically viable to test every combination of possible process conditions experimentally, detailed 3D modeling has been used to get an overview of the influence of process parameters. Numerical simulations increased the understanding of the epitaxial process by calculating the heat and mass transfer distribution during the growth of gallium nitride. Appropriate chemical reactions were included in the numerical model which allowed for the calculation of the growth rate of the substrate. The results obtained have been applied to optimize homogeneity of GaN film thickness and its growth rate.     

Influence of the crucible bottom shape on the heat transport and fluid flow during the seeding process of oxide Czochralski crystal growth

For the seeding process of oxide Czochralski crystal growth, influence of the crucible bottom shape on the heat generation, temperature and flow field of the system and the seed‐melt interface shape have been studied numerically using the finite element method. The configuration usually used in a real Czochralski crystal growth process consists of a crucible, active afterheater, induction coil with two parts, insulation, melt, gas and seed crystal. At first, the volumetric distribution of heat inside the metal crucible and afterheater inducted by the RF‐coil was calculated. Using this heat generation in the crucible wall as a source the fluid flow and temperature field of the entire system as well as the seed‐melt interface shape were determined. We have considered two cases, flat and rounded crucible bottom shape. It was observed that using a crucible with a rounded bottom has several advantages such as: (i) The position of the heat generation maximum at the crucible side wall moves upwards, compared to the flat bottom shape. (ii) The location of the temperature maximum at the crucible side wall rises and as a result the temperature gradient along the melt surface increases. (iii) The streamlines of the melt flow are parallel to the crucible bottom and have a curved shape which is similar to the rounded bottom shape. These important features lead to increasing thermal convection in the system and influence the velocity field in the melt and gas domain which help preventing some serious growth problems such as spiral growth. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Three‐dimensional study of the pressure field and advantages of hemispherical crucible in silicon Czochralski crystal growth

The effects of several growth parameters in cylindrical and spherical Czochralski crystal process are studied numerically and particularly, we focus on the influence of the pressure field. We present a set of three‐dimensional computational simulations using the finite volume package Fluent in two different geometries, a new geometry as cylindro‐spherical and the traditional configuration as cylindro‐cylindrical. We found that the evolution of pressure which is has not been studied before; this important function is strongly related to the vorticity in the bulk flow, the free surface and the growth interface. It seems that the pressure is more sensitive to the breaking of symmetry than the other properties that characterize the crystal growth as temperature or velocity fields. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Design and operating considerations for a water-cooled close-spaced reactant injector in a production scale MOCVD reactor

In a previous paper, we described experimental results of the growth of a wide range of III–V materials using a water-cooled close-spaced injector that permits organometallic and hydride reactants to be injected 1 cm above the hot wafer. In this paper, we describe important design and operating considerations for this new metalorganic chemical vapor deposition (MOCVD) injector, including construction details, deposition efficiency and process window considerations. Our theoretical modeling indicates that the gas flow patterns are very different from those in a typical rotating disk reactor. By making analytical approximations for the velocity and temperature profiles, we have developed a flow stability parameter and find that the thermal stability depends on the square of the injector-to-substrate gap.     

大尺寸非规则碲锌镉晶片双面抛光技术

碲锌镉(CdZnTe)晶体性能优越，是高性能碲镉汞(HgCdTe)外延薄膜的首选衬底材料。双面抛光是一种加工质量较高的碲锌镉晶片表面抛光方式，其具有效率高、平整度好、晶片应力堆积少的优点。但当碲锌镉晶片尺寸增大后，其加工难度也随之上升，易出现碎片多、加工速率慢、表面平整度差等问题。本文开展了大尺寸非规则碲锌镉晶片双面抛光技术研究，深入分析了面积大于50 cm²的非规则碲锌镉晶片双面抛光工艺中，不同参数对抛光质量的影响，通过模拟并优化晶片运动轨迹，优化抛光液磨粒粒型、抛光压力、抛光液流量等抛光工艺参数，实现了具有较高抛光速率和较好表面质量的大尺寸非规则碲锌镉晶片双面抛光加工，对进一步深入研究双面抛光技术有着重要意义。