GaN-MOVPE气相自由基反应的量子化学研究

利用量子化学的密度泛函理论(DFT),对TMG/NH₃/H₂体系中自由基参与的金属有机气相外延(MOVPE)反应进行计算分析,特别针对H、NH₂自由基对Ga(CH₃)₃(简称TMG)热解路径、氢解路径以及加合路径的影响进行研究。通过计算不同反应路径的吉布斯自由能差ΔG和能垒ΔG^*/RT,确定了自由基参与的气相反应在不同温度下不同的反应路径。研究发现:当T<683 K时,TMG与NH₃反应生成加合物TMG:NH₃。当T>683 K时,TMG:NH₃重新分解为TMG和NH₃。TMG在MOVPE温度下很难直接热解,在H自由基作用下则易热解产生Ga(CH₃)₂(简称DMG)、GaCH₃(简称MMG)和Ga原子。当T<800 K时,TMG与NH₃的氨基反应速率大于自由基参与的热解反应,故氨基反应占主导;当T>800 K时,自由基参与的TMG热解反应速率大于氨基反应,故热解反应占主导。氢解反应由于能垒很高,因此可忽略。TMG及其热解产物与NH₂自由基反应很容易产生氨基物。氨基物DMGNH₂可以与H自由基继续反应,最终生成表面反应前体GaNH₂。     

MOCVD生长AlN的化学反应-输运过程数值模拟研究

针对垂直转盘式MOCVD反应器生长AlN的化学反应-输运过程进行数值模拟研究,特别探讨了反应室高度、操作压强和加合物衍生的三聚物对AlN生长的化学反应路径的影响.研究结果表明,AlN在MOCVD生长中以Al(CH3)3和NH3的加合路径为主,Al(CH3)3的热解路径很弱;加合路径衍生的二聚物是薄膜生长的主要前体,三聚物是纳米粒子的主要前体;降低反应室高度,寄生反应减弱,热解路径加强,使生长速率增大;增大压强,寄生反应加剧,使生长速率下降;添加由三聚物参加的表面反应后,生长速率提高了近4倍,证明三聚物不参加薄膜生长,只是提供纳米粒子前体.     

微反应器策略实现γ-CuI的形貌调控

γ-CuI较宽的能带空隙及较高的离子电导率等特点，使其在光能利用和超快闪烁材料领域有着广泛的应用。γ-CuI的形貌往往对其结构性质有重要的影响，精准地调控其形貌有很大的意义。因此，本文采用微反应法，通过控制不同NH₃·H₂O用量、Cu源、管内反应停留时间及合成温度等因素，结合SEM、XRD和FT-IR等测试手段，对不同合成条件下制备得到的γ-CuI的晶型与形貌进行了研究。并对传统液相沉淀法和微反应法制备的γ-CuI进行了比较。结果表明，当NH₃·H₂O使用量(C_NH3·H2O/C_N2H4)为0.4、管内停留时间为10 s、反应温度为20℃的条件下达到90.5%的最高产率。其中，NH₃·H₂O的使用量对形貌的影响最大，当NH₃·H₂O的使用量为0.4时，合成了形貌均一的棒状γ-CuI。...     

垂直转盘式MOCVD反应器中GaN化学反应路径的影响研究

对垂直转盘式MOCVD反应器生长GaN的气相化学反应路径进行研究.结合反应动力学模型,分别采用预混合进口但改变反应腔高度,以及采用环形分隔进口,对反应器的温场、流场和浓度场进行CFD数值模拟,由此确定反应器结构参数对化学反应路径的影响.通过观察主要含Ga粒子的浓度分布以及不同反应路径对生长速率的贡献,判断该反应器可能采取何种反应路径.研究发现,RDR反应器的主要反应路径是TMG热解为DMG,DMG为薄膜沉积的主要前体.反应腔高度变化对反应路径影响较小,但生长速率略有增大;当从预混合进口改为环形分隔进口时,生长更倾向于TMG热解路径,同时生长速率增大,但均匀性变差.     

水热法合成CsxWO3纳米棒及其红外吸收性能

Cs_xWO₃纳米棒因其优异的近红外吸收性能得到研究人员的广泛关注,但目前水热法合成Cs_xWO₃纳米棒存在易形成等轴状纳米颗粒,或合成温度高,需要后续处理等问题。本文以钨酸铵((NH₄)₆ W₇O₂₄·6H₂O)、氯化铯(CsCl)、盐酸(HCl)和油胺(C₁₈H₃₇N)为原料,在220 ℃水热反应24 h合成了直径和长度分别为10~20 nm和100~250 nm的Cs_0.2WO₃纳米棒。研究了溶剂、合成路径以及HCl对Cs_0.2WO₃纳米棒的物相和形貌的影响,探讨了Cs_0.2WO₃纳米棒的形成机理,测试了Cs_0.2WO₃纳米棒的红外吸收性能。结果表明:过少和过量的HCl不利于合成Cs_0.2WO₃,改变HCl和CsCl的加入顺序,降低(NH₄)₆ W₇O₂₄·6H₂O、CsCl和HCl间的反应速率,有助于合成Cs_0.2WO₃纳米棒,且Cs_0.2WO₃纳米棒的红外吸收性能优于等轴状纳米颗粒。     

垂直转盘式MOCVD反应器进口温度对GaN生长的影响

针对垂直转盘式MOCVD反应器进口温度对GaN生长的影响进行数值模拟研究,分别考虑预混合进口和分隔进口两种情况.通过对包含主要化学反应路径的气体输运过程的模拟,对比不同进口温度下衬底前沿的反应前体浓度及其对应的生长速率的变化,从而确定进口温度对化学反应路径及生长速率的影响关系.结果表明,两种进口情况下,随着进口温度的升高,生长速率均呈现先增大后减小的趋势.预混合时,进口温度约500 K时生长速率最大;分隔进口时,进口温度约800 K时生长速率最大.这主要是由于,生长速率取决于衬底上方边界层内含Ga粒子的浓度梯度.预混合时,衬底前沿的含Ga粒子主要为MMGa,其浓度随进口温度的变化趋势与生长速率的变化趋势一致.分隔进口时,衬底前沿的含Ga粒子MMGa和DMGaNH2浓度处于同一数量级.随进口温度的升高,前者略有增加,而后者明显增大.当预混合的进口温度超过500 K、分隔进口的进口温度超过800 K时,衬底前沿的MMGa和DMGaNH2的峰值或明显下降、或明显离开衬底,使得含Ga粒子的浓度梯度显著下降,造成生长速率下降.     

Ca(H2PO4)2-H3PO4-K2SO4体系中石膏晶型及形貌调控

为将Ca(H₂PO₄)₂制备KH₂PO₄过程中的石膏资源化利用,以H₃PO₄与CaCO₃反应制备Ca(H₂PO₄)₂溶液,并与K₂SO₄溶液反应,进行Ca(H₂PO₄)₂-H₃PO₄-K₂SO₄体系中石膏晶型和形貌调控研究。结果表明:通过改变反应时间、反应温度、SO^2-₄过量系数和CaO含量等参数可对Ca(H₂PO₄)₂-H₃PO₄-K₂SO₄体系中石膏晶型和形貌进行调控,制得短柱状α-CaSO₄·0.5H₂O。体系在温度高于95 ℃和CaO含量为3.0%~5.0%(质量分数,下同)时形成α-CaSO₄·0.5H₂O,在CaO含量为5.5%主要形成CaSO₄·2H₂O;反应时间长于20 min和SO^2-₄过量系数大于1.4将形成K₂SO₄(CaSO₄)₅·H₂O,导致石膏晶体表面缺陷增加。本实验条件下,适宜反应条件为:反应时间10 min、反应温度95 ℃、SO^2-₄过量系数1.2和CaO含量5.0%,此条件下可制得长度42~70 μm、直径13~24 μm的短柱状α-CaSO₄·0.5H₂O,其抗折和抗压强度分别可达5.61 MPa和33.74 MPa,滤液中钾收率和脱钙率分别可达94.23%和83.80%。     

行星式MOCVD反应器进口结构对AlN生长的气相反应和生长速率的影响

针对行星式MOCVD(Metal Organic Chemical Vapor Deposition)反应器进口结构对AlN生长的化学反应路径和生长速率的影响进行数值模拟研究,通过改变反应器进口形式、数量以及隔板位置发现,二重进口反应器倒置进口(即Ⅲ族在下,Ⅴ族在上)时,衬底前端的含Al粒子浓度明显升高,尤其是MMAl的浓度比传统进口反应器高两个数量级,气相反应中热解路径占主导,薄膜生长速率明显提高.在倒置进口的基础上优化隔板位置,生长速率略微降低,但薄膜均匀性明显改善.当反应器进口数量从二重变为三重和五重,反应从热解路径占主导变为热解路径和加合路径共同作用,薄膜生长速率逐渐增加,而均匀性明显改善.     

共沉淀法合成ZnMoO4粉体及其抗菌性能

以Zn(NO₃)₂·6H₂O、(NH₄)₆Mo₇O₂₄·4H₂O为主要原料,采用共沉淀法合成ZnMoO₄粉体。利用XRD、SEM等测试方法对合成样品的物相组成、微观结构进行表征。以培养的大肠杆菌为消杀对象,研究了不同热处理温度下的样品对大肠杆菌的抗菌性能。结果表明,前驱体主要为非晶态,含少量ZnMoO₄、Zn₂Mo₃O₈、Zn(OH)₂和MoO₃;前驱体经400~600 ℃、保温30 min热处理,其产物转化为ZnMoO₄,且随着热处理温度的升高,合成的ZnMoO₄晶型逐渐完善,抗菌性能增加,当热处理温度为600 ℃时,可以获得结晶良好的ZnMoO₄,其晶粒呈颗粒状和片状,平均粒径约为1.5 μm。不同热处理温度合成的ZnMoO₄均具有一定的抗菌性能,其中经600 ℃热处理得到的ZnMoO₄具有最佳抗菌性能,经过24 h抗菌检测,其抗菌率达到99.2%,在商用涂料料浆中外加5%的ZnMoO₄粉体,所制备涂层对大肠杆菌的抗菌率达到95.7%,表明ZnMoO₄及其涂料具有良好的应用前景。     

Ru掺杂MoS2对SO2F2和H2S气体吸附的第一性原理研究

本文基于第一性原理探讨了Ru掺杂的单层MoS₂(Ru-MoS₂)的结构及其对SF₆绝缘设备中的两种主要分解气体SO₂F₂和H₂S的传感和吸附行为。Ru原子进入硫空位从而产生Ru-MoS₂,结果表明，Ru-MoS₂对SO₂F₂和H₂S气体的吸附能(E_ad)分别为-1.52和-2.11 eV,属于化学吸附。通过能带分析(BS)和态密度(DOS)分析进一步证明了两个体系的吸附性能，并阐述了Ru-MoS₂用于电阻式气体传感器时的气体吸附传感机制。除此之外，本文在理论上探索了不同温度下Ru-MoS₂解吸附SO₂F₂和H₂S的恢复时间，在598 K温度下，SO₂F₂吸附体系的恢复时间为6...     

Effect of NH3 on the growth characterization of TiN films at low temperature

Titanium nitride (TiN) films were obtained by the atmospheric pressure chemical vapor deposition method of the TiCl₄–N₂–H₂ system with various flow rates of NH₃ at 600°C. The growth characteristics, morphology and microstructure of the TiN films deposited were analyzed by X-ray diffraction, scanning electron microscopy and transmission electron microscopy. Without NH₃ addition, no TiN was deposited at 600°C as shown in the X-ray diffraction curve. However, by adding NH₃ into the TiCl₄–N₂–H₂ system, the crystalline TiN was obtained. The growth rate of TiN films increased with the increase of the NH₃ flow rate. The lattice constant of TiN films decreased with the increase of the NH₃ flow rate. At a low NH₃ flow rate, the TiN (2 2 0) with the highest texture coefficient was found. At a high NH₃ flow rate, the texture coefficient of TiN (2 0 0) increased with the increase of the NH₃ flow rate. In morphology observation, thicker plate-like TiN was obtained when the NH₃ flow rate was increased. When the flow rate of NH₃ was 15 sccm, Moiré fringes were observed in the TiN film as determined by TEM analysis. The intrinsic strain was found in the TiN film as deposited with 60 sccm NH₃.     

Low-pressure chemical vapor deposition of TaCN films by pyrolysis of ethylamido-tantalum

Thin films of Tantalum nitride (TaN) were deposited from tetra-ethylamido-tantalum (Ta (NEt₂)₄) by low-pressure chemical vapor deposition. Good-quality step coverage is achieved below 400°C, because the deposition rate is determined by the reaction rates on the surface. The film resistivity increases, however, as the substrate temperature decreases. In order to obtain the low resistivity of films deposited at lower temperatures, we have increased the amount of injected H₂ gas during the deposition. The resistivity decreases by the increase in the H₂ gas flow rate, and it is shown that a large amount of H₂ gas injection during the deposition is an effective method for obtaining both low resistivity and high-quality step coverage. The residual carbon concentration in the film is measured to be >10%, on the other hand, the concentration of N less than 1%. The microstructural investigation using transmission electron microscopy (TEM) reveals that crystalline structure of the deposited film has an amorphous phase.     

Effect of heat treatment on phase transformation of aluminum nitride ultrafine powder prepared by chemical vapor deposition

Ultrafine aluminum nitride (AlN) powders were obtained by chemical vapor deposition via AlCl₃–NH₃–N₂ system operated at various temperatures and at a same 200 cm³/min flow rate of NH₃ and N₂, respectively. It has been shown that when the reaction temperature of AlCl₃ and NH₃ was above 600°C, then crystalline AlN powder can be formed; whereas, amorphous AlN was obtained with NH₄Cl if reacted in a lower-temperature zone of the reaction chamber. The amorphous AlN powder was heat treated at 1400°C under NH₃ and N₂ atmosphere for 2 h, then the crystalline phases of the obtained powder belong to a single phase of AlN; a mixture of AlN and Al₂O₃ and only AlON, respectively. On the other hand, if crystalline AlN powder is heat treated at 1400°C under N₂ atmosphere for 2 h, the crystalline phases were composed of the major phase of AlN and a minor phase of Al₂O₃. The morphology, particle size and agglomerate size of the AlN powder were strongly dependent on the heat-treatment temperature. The particle size of AlN powder increases from 28.1 to 45.0 nm, as the heat treatment temperature increases from 800 to 1400°C.     

高质量硼掺杂单晶金刚石同质外延及电学性质研究

突破高质量、高效金刚石掺杂技术是实现高性能金刚石功率电子器件的前提。本文利用微波等离子体化学气相沉积(MPCVD)法,以三甲基硼为掺杂源,制备出表面粗糙度0.35 nm,XRD(004)摇摆曲线半峰全宽28.4 arcsec,拉曼光谱半峰全宽3.05 cm^-1的高质量硼掺杂单晶金刚石。通过改变气体组分中硼元素的含量,实现了10¹⁶~10²⁰ cm^-3的p型金刚石可控掺杂工艺。随后,研究了硼碳比、生长温度、甲烷浓度等工艺条件对p型金刚石电学特性的影响,结果表明:在硼碳比20×10^-6、生长温度1 100 ℃、甲烷浓度8%、腔压160 mbar(1 mbar=100 Pa)时p型金刚石迁移率达到207 cm²/(V·s)。通过加氧生长可以提升硼掺杂金刚石结晶质量,降低杂质散射。当氧气浓度为0.8%时,样品空穴迁移率提升至 614 cm²/(V·s)。     

High quality GaN grown by MOVPE

Several nitrogen precursors have been used for the growth of GaN in MOVPE, but so far the best results were obtained using NH₃, even though NH₃ does not produce a significant amount of active species at the growing interface. To produce active species from N₂ or NH₃, a remote plasma-enhanced chemical vapour deposition (RPECVD) process has been implemented. In addition, nitrogen metalorganic precursors, triethylamine and t-butylamine, were also used. To accurately control the critical parameters of the MOVPE of GaN, we have implemented a laser reflectometry equipment, which allows a real-time in situ monitoring of the different steps of the growth, i.e. nitridation of the substrate, nucleation, heat treatment, and deposition. Using an appropriate buffer layer, GaN grown on sapphire using NH₃ as nitrogen precursor, shows sharp low temperature photoluminescence lines (4 meV at 9 K), whereas other nitrogen precursors did not lead to comparable electronic quality.     

Hydrogen and nitrogen ambient effects on epitaxial growth of GaN by hydride vapour phase epitaxy

This study presents the influence of the composition of the carrier gas on the growth of GaN by HVPE. Since no hydrogen is introduced in the vapour phase, the deposition is expected to be controlled by Cl desorption in the form of GaCl₃, as has been proposed for GaAs. However, our published model predicts much lower growth rates than those observed. We can account for both the observed parasitic deposition and GaN growth rate if we assume that GaCl₃ is not at its equilibrium pressure in the deposition zone and where nucleation takes place on the walls as well as on the substrate. This yields a high rate of parasitic nucleation even though the nominal supersaturation is vanishing small. Very little growth takes place on the substrate where the equilibrium pressure of GaCl₃ is reached. We describe similar experiments performed with a H₂/N₂ mixture as the carrier gas. In this case, we expect GaN deposition to be controlled by desorption of Cl as HCl, which is known as the H₂ mechanism. It is speculated that the results show the existence of a new growth mechanism.