基于液滴外延法的Al(In)纳米结构在GaAs(001)的形成机制

采用液滴外延法在GaAs(001)衬底上同时沉积In、Al液滴形成纳米结构,利用原子力显微镜(AFM)对实验样品进行形貌表征,并通过X射线光电子能谱(XPS)与扫描电子显微镜分析In、Al组分比样品表面元素分布。实验结果显示,混合沉积后的表面InAlAs纳米结构密度随着In组分的降低而降低,而单个纳米结构的尺寸变大。SEM与XPS测试结果证明表面的In并没有因为衬底温度过高而全部偏析。根据实验结果推测,In&Al液滴同时沉积到表面形成InAl混合液滴。当液滴完全晶化后纳米结构中心出现孔洞,而产生这一现象的主要原因是液滴向下刻蚀。     

分子束外延生长过程中GaAs(001)表面铝液滴的扩散成核过程

量子点的性质主要由其密度及尺寸参数控制,而原子在衬底上的成核运动又决定了量子点的密度、直径、高度等参数,因此研究原子的扩散成核过程对自组装制备量子点具有重要意义。本文通过分子束外延生长技术研究了GaAs(001)表面金属铝液滴的成核过程,发现衬底温度和金属铝沉积速率的变化直接影响了液滴的尺寸、密度以及形状等特征。根据经典成核理论分析GaAs(001)表面金属铝液滴空间分布与几何结构的演化规律,推导得出表面金属铝液滴密度与衬底温度、金属铝沉积速率的关系方程。在此基础上,进一步计算得出液滴形成过程中未成核态、临界成核态、成核态三种亚稳态所包含的最小原子数分别为1个、2个、5个。     

In原子在GaAs(001)表面的成核与扩散研究

近年来,半导体量子点特别是InAs量子点的基本物理性质和潜在应用得到了广泛研究。许多研究者利用InAs量子点结构的改变以调制其光电特性。本文采用液滴外延法在GaAs(001)表面沉积了不同沉积量的In(3 ML、4 ML、5 ML),以研究In的成核机制和表面扩散。实验发现,随着In沉积量的增加,液滴尺寸(包括直径、高度)明显增大。不仅如此,在相同的衬底温度下,沉积量越大,液滴密度越大。利用经典成核理论,计算了GaAs(001)表面In液滴形成的临界厚度为0.57 ML,计算的结果与已报道的实验一致。从In原子在表面的迁移和扩散,以及衬底中Ga和液滴中的In之间的原子互混原理解释了In液滴形成和形貌演化的机理。实验中得到的In液滴临界厚度以及In液滴在GaAs(001)上成核机理,可以为制备InAs量子点提供实验指导。     

Al液滴在GaAs表面的熟化行为研究

为探究Al液滴在GaAs表面的熟化行为,利用液滴外延法在GaAs衬底表面制备Al液滴.在零As压环境下,通过控制退火时间有效控制Al液滴的生长、成核.结合热力学原理和晶体生长理论对样品形貌变化现象进行物理解释,构建出液滴形貌变化过程中熟化、刻蚀和扩散行为的基本模型.理论计算表明,液滴在熟化行为达到退火239 s的平衡点后,被向下刻蚀和向外扩散两个行为同时消耗.     

温度对SiO2表面上磁控溅射制备Ge纳米点的生长模式和尺寸的影响

采用磁控溅射技术在SiO2/Si(100)表面上制备了一系列不同生长温度的Ge纳米点样品.原子力显微镜(AFM)的实验结果表明:不同衬底温度下Ge纳米点在SiO2薄膜上的生长模式和尺寸分布有所不同.当衬底生长温度达到500 ℃时,SiO2开始与Ge原子发生化学反应,并形成"Ge纳米点的Si窗口".在此温度条件下,外延生长实验可获得尺寸均匀且密度高达3.2×1010 cm-2的Ge纳米点.     

衬底温度对In2S3薄膜结构及其性能的影响

采用超声喷雾热解法,在玻璃基底上一步合成了In2S3薄膜.研究了衬底温度对In2S3薄膜的结构、表面形貌、电学和光学性能影响.结果表明:所制备的In2S3薄膜均具有沿(220)面择优取向生长特性且无其他杂相,衬底温度对薄膜的均匀性、致密度、结晶程度均有明显影响,并因此影响薄膜的光电性能.薄膜的导电件随着衬底温度的升高迅速增强,但足在衬底温度为350℃时有所降低.衬底温度为300℃所制备的薄膜在可见光区透光率最高达到90;以上,禁带宽度达到2.43 eV.     

退火温度对In2O3（ZnO）m超晶格纳米线的拉曼光谱的影响

采用化学气相沉积方法,在硅衬底上合成了In2O3(ZnO)m超晶格纳米线。扫描电镜的测试结果表明,纳米线的直径和长度分别在80～100 nm和15～25μm之间。透射电镜图像显示,In-O层与In/Zn-O block沿纳米线生长方向<0001>交替堆垛。在不同温度下对样品进行退火并利用拉曼散射技术对处理后的样品进行研究。研究结果发现随退火温度的提高,材料中的VO和Zni减少,AM模和A1(LO)模的逐渐频移到571 cm-1和619 cm-1位置,峰型对称性增强,即退火使In2O3(ZnO)m超晶格纳米线的晶体质量明显提高。最佳的退火温度为1000℃。     

Li0.5Bi0.5MoO4对Li2Zn2(MoO4)3陶瓷的微波介电性能影响

采用传统固相反应法制备了xLi_0.5Bi_0.5MoO₄-(1-x)Li₂Zn₂(MoO₄)₃ [xLBM-(1-x)LZM]复合陶瓷,研究添加不同质量分数(x=25%,30%,35%,40%和45%)的LBM对LZM陶瓷的烧结特性、物相组成、微观结构以及微波介电性能的影响。结果表明:添加一定量的LBM不仅能将LZM的谐振频率温度系数(τ_f)调节近零,还能降低LZM的烧结致密化温度;LBM可与LZM共存,且不发生化学反应生成其他新相。随着LBM添加量增加,复合陶瓷的烧结致密化温度逐渐降低、体积密度先增大后减小、介电常数(ε_r)与τ_f逐渐增大而品质因数(Q×f)逐渐减小。当LBM添加量为40%时,LZM-LBM复合陶瓷在600 ℃烧结2 h获得最大体积密度为4.41 g/cm³,以及优异的微波介电性能:ε_r为13.8,Q×f为28 581 GHz,τ_f为-4×10^-6/℃。     

衬底温度对共蒸发制备GaSb多晶薄膜性质的影响

采用共蒸发的方法在玻璃衬底上制备出GaSb多晶薄膜材料.研究了薄膜生长速率与衬底温度、Ga源温度和Sb源温度的关系.通过XRD、UV-Vis、Hall效应和AFM等测试方法,研究了衬底温度对于GaSb薄膜的结构特性、光电性质以及表面形貌的影响.GaSb多晶薄膜具有(111)择优取向,薄膜的吸收系数达到105 cm-1,晶粒尺寸随衬底温度升高逐渐增大;衬底温度为540℃时,薄膜的迁移率达到127 cm2/V·s,空穴浓度为3×1017 cm-3.GaSb薄膜的表面粗糙度随温度增加而增加.     

磁控溅射衬底加热温度和后退火温度对制备β-Ga2O3薄膜材料的影响

作为宽禁带半导体材料的一员,结构稳定的β-Ga₂O₃具有比SiC和GaN更宽的禁带宽度和更高的巴利加优值,近年来受到科研人员的广泛关注。本文采用射频(RF)磁控溅射法在C面蓝宝石衬底上生长β-Ga₂O₃薄膜,探究溅射过程中衬底加热温度的影响。溅射完成后通过高温退火处理提升薄膜质量,研究衬底加热温度和后退火温度对氧化镓薄膜晶体结构和表面形貌的影响。利用X射线衍射(XRD)、原子力显微镜(AFM)等测试手段对β-Ga₂O₃薄膜晶体结构、表面形貌等进行分析表征。实验结果表明,随着衬底加热温度的升高,β-Ga₂O₃薄膜表面粗糙度逐渐降低,薄膜晶体质量得到显著提升;在氧气气氛中进行后退火,合适的后退火温度有利于氧化镓薄膜重新结晶、增大晶粒尺寸,能够有效修复薄膜的表面态和点缺陷,对于改善薄膜晶体质量有明显优势。     

The growth of InGaAsP by CBE for SCH quantum well lasers operating at 1.55 and 1.4 μm

InGaAsP has been grown by CBE at compositions of 1.1, 1.2 and 1.4 μm for the development of MQW-SCH lasers. The observed incorporation coefficients for TMI and TEG show strong temperature sensitivity while the phosphorus and arsenic incorporation behavior is constant over the substrate temperature range explored, 530 to 580°C setpoint. For higher substrate temperatures the growth rate increases with the largest growth rates occurring for the 1.4 μm quaternary. Low temperature photoluminescence indicates the possibility of compositional grading or clustering for the 1.1 μm material and also for the 1.2 μm material grown at the lowest substrate temperature. The final laser structure was grown with the InP cladding regions grown at 580°C with the inner cladding and active regions grown at 555°C. Using this approach we have successfully grown MQW-SCH lasers with the composition of the active In_xGa_1−xAs ranging from x=0.33 to x=0.73. Threshold current densities as low as 689 A/cm² have been measured for an 800 μm×90 μm broad area device with x=0.68.     

基底加热温度对ITO薄膜的性能影响研究

氧化铟锡(ITO)薄膜被广泛用作光电器件中的透明导电电极,其透光率、导电性、表面粗糙度、与基底的功函数匹配及其电流传输特性都会对光电器件的性能造成影响。本文采用射频(RF)磁控溅射方法制备ITO薄膜,系统研究了基底加热温度对其各方面性能的影响,并确认了最佳基底温度。实验采用锡掺氧化铟陶瓷为靶材,组分摩尔比为m(In₂O₃)∶m(SnO₂)=90∶10。采用XRD、SEM对所制备的薄膜进行表征,系统分析不同基底温度对ITO薄膜结晶性能、形貌的影响;采用紫外可见分光光度计、霍尔效应测试仪、紫外光电子谱仪(UPS)、电流电压曲线系统研究了基底温度对薄膜光电特性、载流子浓度、薄膜功函数以及电流传输特性的影响。研究结果表明,基底温度200 ℃为最佳,此时ITO薄膜结晶良好、表面平整、可见光波段平均透过率超过80%,导电性能和电流传输特性均较佳,且薄膜组分与靶材组分一致。     

High carbon doping of Ga1−xInxAs (x≈0.01) grown by molecular beam epitaxy

We have grown layers of Ga_1−xIn_xAs:C (x ≈ 0.01) on (100) GaAs by molecular beam epitaxy. As C source a graphite filament was used. Structures coherent with the substrate were obtained by adjusting properly the In and C concentrations. With simultaneous incorporation of In and C the strain is compensated and, consequently, the defect density is reduced. A maximum hole concentration value of p = 6×10¹⁹ cm⁻³ was achieved, which is twice higher than the saturation value of C doping of GaAs produced under the same conditions. There is evidence that this value is not in the saturation limit. The product of the hole density times the mobility increases, so the resistance decreases with higher C doping. Raman spectra show that the C_As peak broadens and shifts to lower frequencies for increasing concentration of indium. In H-passivated samples, Raman spectroscopy shows that C_As is surrounded by Ga atoms only. Indium atoms are thus present only in the second group III shell.     

Heavily carbon-doped p-type InGaAs by MOMBE

Carbon-doped In_xGa_1−xAs layers (x=0−0.96) were grown by metalorganic molecular beam epitaxy (MOMBE) using trimethylgallium (TMG), solid arsenic (As₄) and solid indium (In) as sources of Ga, As and In, respectively. The carrier concentration is strongly affected by growth temperature and indium beam flux. Heavy p-type doping is obtained for smaller In compositions. The hole concentration decreases with the indium composition from 0 to 0.8, and then the conductivity type changes from p to n at x=0.8. Hole concentrations of 1.0×10¹⁹ and 1.2×10¹⁸ cm^-3 are obtained for x=0.3 and 0.54, respectively. These values are significantly higher than those reported on carbon-doped In_xGa_1−xAs by MBE. Preliminary results on carbon-doped GaAs/In_xGa_1−xAs strained layer superlattices are also discussed.     

Influence of substrate temperature on the properties of vacuum evaporated InSb films

Indium Antimonide (InSb) thin films were grown onto well cleaned glass substrates at different substrate temperatures (303, 373 and 473 K) by vacuum evaporation. The elemental composition of the deposited InSb film was found to be 52.9% (In) and 47.1% (Sb). X‐ray diffraction studies confirm the polycrystallinity of the films and the films show preferential orientation along the (111) plane. The particle size (D), dislocation density (δ) and strain (ε) were evaluated. The particle size increases with the increase of substrate temperature, which was found to be in the range from 22.36 to 32.59 nm. In Laser Raman study, the presence of longitudinal mode (LO) confirms that the deposited films were having the crystalline nature. Raman peak located at 191.26 cm^–1 shift towards the lower frequencies and narrows with increase in deposition temperature. This indicates that the crystallinity is improved in the films deposited at higher substrate temperatures. Hall measurements indicate that the films were p‐type, having carrier concentration ≅10¹⁶ cm^–3 and mobility (4–7.7) ×10³ cm²/Vs. It is observed that the carrier concentration (N) decreases and the Hall mobility (μ) increases with the increase of substrate temperature. (© 2005 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Growth of InAs on GaAs(1 0 0) by low-pressure metalorganic chemical vapor deposition employing in situ generated arsine radicals

InAs was grown by low-pressure metalorganic chemical vapor deposition on vicinal GaAs(1 0 0) substrates misoriented by 2° toward [0 0 1]. We observed InAs crystal growth, at substrate temperatures down to 300°C, employing in situ plasma-generated arsine radicals as the arsenic source. The in situ generated arsine was produced by placing solid arsenic downstream of a microwave driven hydrogen plasma. Trimethylindium (TMIn) feedstock carried by hydrogen gas was used as the indium source. The Arrhenius plot of InAs growth rate vs. reciprocal substrate temperature displayed an activation energy of 46.1 kcal/mol in the temperature range of 300–350°C. This measured activation energy value is very close to the energy necessary to remove the first methyl radical from the TMIn molecule, which has never been reported in prior InAs growth to the best of authors’ knowledge. The film growth mechanism is discussed. The crystallinity, infrared spectrum, electrical properties and impurity levels of grown InAs are also presented.     

AlGaN双势垒结构对高In组分InGaN/GaN MQWs太阳能电池材料晶体质量和发光性能的影响

本文利用金属有机化合物化学气相沉积(MOCVD)技术在(001)面图形化蓝宝石衬底(PSS)上生长了一种含有AlGaN-InGaN/GaN MQWs (multiple quantum wells)-AlGaN双势垒结构的高In组分太阳能电池外延材料。高分辨率X射线衍射(HRXRD)和光致发光(PL)谱分析表明,与含有AlGaN电子阻挡层的低In组分的量子阱结构太阳能电池外延材料相比,该结构材料具有较小的半峰全宽(FWHM),计算表明:此结构材料的位错密度降低了一个数量级,达到10⁷ cm^-2;同时,有源区中的应变弛豫降低了51%;此外,此结构材料的发光强度增强了35%。研究结果表明含有AlGaN双势垒结构的外延材料可以减小有源区的位错密度,降低非辐射复合中心的数目,增大有源区有效光生载流子的数目,为制备高质量太阳能电池提供实验依据。