电势诱导衰退和湿热衰退P-PERC太阳能电池的修复与增效

针对P型钝化发射极背面接触(PERC)太阳能电池在服役期间受到电势衰退和湿热诱导衰退影响而引起光电转换效率降低的问题,本文通过光电注入和热退火工艺对已衰退电池进行修复并研究其增效机制。实验结果表明:在光照强度为3倍标准太阳光、电注入电流为10 A、退火温度为150 ℃、工艺50 min实验条件下,对180片已衰退电池进行修复实验,其中94.32%的已衰退电池的光电转换效率得到修复,实验后电池光电转换效率平均提升8.96%。光致发光光谱和量子效率分析表明,光电注入和热退火工艺可有效减少电池因电势诱导衰退和湿热衰退形成的内部缺陷和背表面缺陷,提升衰退电池片的光电转换效率。     

n型IBC太阳电池选择性发射极工艺研究

为提升n型叉指背接触(IBC)太阳电池的光电转换效率,采用丝网印刷硼浆和高温扩散的方式形成选择性发射极结构,研究了硼扩散和硼浆印刷工艺对电池发射极钝化性能和接触性能的影响。实验结果表明,在硼扩散沉积时间和退火时间一定的条件下,硼扩散通源(BBr₃)流量为100 mL/min,沉积温度为830 ℃,退火温度为920 ℃时,发射极轻掺杂(p⁺)区域的隐开路电压达到710 mV,暗饱和电流密度为12.2 fA/cm²。发射极局部印刷硼浆湿重为220 mg时,经过高温硼扩散退火,重掺杂(p⁺⁺)区域的隐开路电压保持在683 mV左右,该区域方块电阻仅46 Ω/□,金属接触电阻为2.3 mΩ·cm². 采用该工艺方案制备的IBC电池最高光电转换效率达到24.40%,平均光电转换效率达到24.32%,相比现有IBC电池转换效率提升了0.28个百分点。     

全TOPCon电池正面多晶硅层硼掺杂工艺

为提升隧穿氧化层钝化接触(TOPCon)电池光电转换效率,本文通过高温扩散在n型TOPCon电池正面制作p型隧穿氧化层钝化接触结构,提升发射极钝化性能,减少正面金属复合。本文研究了不同沉积时间、推进温度、推进时间等工艺参数对实验样品钝化性能及掺杂曲线的影响。实验结果表明,当沉积时间为1 500 s,推进温度为920℃,推进时间为20 min时,掺硼多晶硅层可获得较优的钝化性能及掺杂浓度,其中样品多晶硅层硼掺杂浓度达到1.40×10²⁰ cm^-3,隐开路电压(iV_oc)大于720.0 mV。依据该参数制备的TOPCon电池光电转换效率可达23.89%,对应的短路电流密度为39.36 mA/cm²,开路电压(V_oc)达到726.4 mV,填充因子(FF)为83.54%。     

正交实验法分析单晶PERC电池背钝化最优条件

为了实现单晶背钝化PERC电池最优化背钝化效果,找出最佳工艺条件,利用正交实验方法对主要工艺参数因素进行了最优化研究.采用掺镓P型单晶硅片经过背钝化后测试膜厚、折射率以及电池片最终的转化效率等电学性能参数.通过正交实验表明,背钝化的最优化工艺条件为0.25 mbar的工艺腔压强、360℃温度设定、2.8的NH3/SiH4比率、1500 W的微波功率,在该条件下电池的平均测试效率可达22.35;,且Voc以及Isc等电学性能指标均达到较高水平.     

基于沉积温度优化和后退火工艺改善a-Si∶H/c-Si界面钝化质量的研究

a-Si∶H薄膜作为钝化层,在提高硅异质结太阳能电池效率方面发挥关键作用,工业化生产中通常采用PECVD法制备制备a-Si∶H薄膜.在本文中,首先对关键工艺参数如沉积温度进行了优化,并在160℃下获得了最佳的钝化效果.接着,通过傅里叶变换红外光谱法对a-Si∶H薄膜的微结构进行表征,以探索其钝化机理:低温下制备的a-Si∶H薄膜氢浓度高并有微空洞,从而影响钝化效果;高温下制备的a-Si∶H薄膜消除了微空洞而明显改善钝化质量.但是,过高的沉积温度又会导致a-Si∶H薄膜中微空位的产生从而影响钝化效果.此外,对比了两种典型后退火工艺对钝化效果的影响:一种是基于200℃退火10 min,一种是基于450℃退火30 s,并对相关钝化机理进行了研究.结果表明,第二种退火方式明显改善样品的钝化效果,主要原因是该退火消除了低温沉积样品中的微空洞和高温沉积样品中的微空位.最后,通过透射电镜研究了退火后的a-Si∶ H/c-Si界面微结构,并未观察到影响钝化效果的外延生长.     

LPCVD法制备TOPCon太阳能电池工艺研究

本文主要对低压化学气相沉积(LPCVD)法制备N型高效晶硅隧穿氧化层钝化接触(TOPCon)电池工艺进行研究。分析LPCVD法制备隧穿氧化层及多晶硅层的影响因素，研究了不同氧化层厚度、多晶硅厚度及多晶硅层中P掺杂量对太阳能电池转换效率的影响。结果表明：当隧穿氧化层厚度在1.55 nm时，钝化效果最佳；多晶硅层厚度120 nm时V_oc达到最高值；多晶硅层厚度在90 nm时E_ff最高。当P掺杂量为3.0×10¹⁵ cm^-2时可获得较高的V_oc,原因是随着P掺杂量的增加，多晶硅层场钝化效果提高。     

超薄多晶硅的掺杂、钝化及光伏特性研究

本文对70 nm超薄多晶硅的掺杂工艺、钝化性能及光伏特性进行了研究。确定了70 nm超薄多晶硅的掺杂工艺,研究表明当离子注入剂量为3.2×10¹⁵ cm^-3,在855 ℃退火20 min时,70 nm超薄多晶硅的钝化性能可以达到与常规120 nm多晶硅相当的水平,且70 nm多晶硅的表面掺杂浓度达到5.6×10²⁰ atoms/cm³,远高于120 nm掺杂多晶硅的表面掺杂浓度(2.5×10²⁰ atoms/cm³)。基于70 nm超薄多晶硅厚度减薄和高表面浓度掺杂的特点,较低的寄生吸收和强场钝化效应使得在大尺寸(6英寸)直拉单晶硅片上加工的N型TOPCon太阳能电池的光电转换效率得到明显提升,主要电性能参数表现为:电流I_sc升高20 mA,串联电阻R_s降低,填充因子FF增加0.3%,光电转换效率升高0.13%。     

基于POLO钝化接触结构的晶硅电池技术及其研究进展

多晶硅氧化物(POLO)结构是在晶硅表面依次生长一层极薄的界面氧化层与多晶硅层所形成的钝化接触结构。基于POLO结构的钝化接触技术不仅能够获得优异的表面钝化特性,而且避免了金属与晶硅表面的直接接触,极大地降低了金属与晶硅表面的接触复合。目前应用POLO钝化接触结构制作的小面积晶硅太阳能电池转换效率高达26.1%,制作的大面积晶硅太阳能电池产业化效率已经超过24.5%。同时POLO钝化接触技术应用于晶硅电池的制作可以承受高温工艺,兼容现有的晶硅电池产业化设备,是未来极具产业化潜力的钝化接触技术方案。本文主要综述了POLO钝化接触结构中载流子的传输机理及相应的量化参数表征方法;对比了POLO结构制备中界面氧化层生长、多晶硅层的沉积、掺杂及氢化处理的方法;总结了多晶硅层的寄生吸收效应、晶硅表面形貌结构、掺杂浓度分布对POLO结构钝化接触特性的影响;简述了POLO钝化接触技术的研究进展及当前POLO电池制作面临的技术难点。     

高效背结异质结太阳电池硼掺杂非晶硅发射极研究

晶硅/非晶硅异质结(HJT)太阳电池由于具有高开压、高转换效率和低温度系数等优点而备受关注，其中硼掺杂p型非晶硅(p-a-Si∶H)发射极是高转换效率电池中不可忽视的重要部分，改变其硼掺杂浓度，可以调节p-layer薄膜的电学特性，从而直接影响电池转换效率。本文采用等离子体增强化学气相沉积(PECVD)设备制备HJT太阳电池，通过改变B₂H₆的掺杂浓度，对电池中p-a-Si∶H层进行优化，使HJT电池获得0.75%的相对效率提升。进一步地，将发射极设置为梯度掺杂的双层结构，经过优化，少子寿命(@Δn=5×10¹⁵ cm^-3)和隐开路电压(@1-Sun)分别提升400μs和3 mV,最终具有梯度掺杂发射极的电池其平均效率相对提升2.03%,主要表现为FF和V_oc的明显增加，实现了高效HJT电池p型发射极的工艺优化。     

基于氢等离子体处理改善氢化非晶硅/晶体硅界面钝化效果的工艺研究

薄层a-Si∶H钝化技术对于提高硅异质结太阳能电池的效率至关重要,通常有三类工艺可显著改善a-Si∶H薄膜的钝化效果:晶硅表面湿化学处理(薄膜沉积前);氢等离子体处理(薄膜沉积过程中);后退火处理(薄膜沉积后).该论文基于等离子增强型化学气相沉积系统,采用氢等离子处理和后退火处理改善a-Si∶ H/c-Si界面的钝化效果,样品的有效少数载流子寿命最高达到1 ms,并研究了射频功率密度、腔体压力、氢气流量等工艺参数对钝化效果的影响;采用光发射谱、台阶仪等对氢等离子体处理所涉及的物理过程进行研究,得出该工艺对a-Si∶H薄膜具有刻蚀作用;根据钝化效果和刻蚀速率的关系,得出低刻蚀速率由于给予薄膜充足的时间进行结构弛豫或重构,显著改善钝化效果;基于快速热退火方法进一步改善钝化效果,采用傅里叶变换红外光谱对a-Si∶H薄膜的钝化机理进行研究,并基于化学退火模型进行讨论;采用透射电镜研究了a-Si∶ H/c-Si界面的微结构,并没有观测到影响钝化效果的外延生长.     

MOCVD growth of high-quality AlGaAs on Si substrates for high-efficiency solar cells

The crystallinity and solar cell efficiency of Al_0.22Ga_0.78As layers grown on Si substrates have been studied by varying the thermal cycle annealing (TCA) temperature. The optimum TCA temperature to obtain an Al_0.22Ga_0.78As layer with long minority carrier lifetime and high conversion efficiency has been presented. The active-area conversion efficiency of an Al_0.22Ga_0.78As solar cell on a Si substrate as high as 10.2% has been obtained under AM0 and 1 sun conditions.     

Influence of surface treatments on crystalline germanium heterojunction solar cell characteristics

Hydrogenated amorphous Si (a-Si:H) has been applied to crystalline germanium (c-Ge) heterojunction solar cells and the influence of the surface treatments applied before a-Si:H deposition process has been studied. We found that PH₃ exposure treatment after surface oxide removal by annealing is effective to improve c-Ge heterojunction solar cell performance. The conversion efficiency of the c-Ge heterojunction solar cell applied PH₃ exposure treatment was up to 5.29% and the solar cell had better temperature coefficient than the c-Ge homojunction solar cell. These results suggest that the c-Ge substrate surface after oxide removal by annealing is covered with negatively charged dangling bonds, and the phosphorus adsorbed onto the c-Ge surface provides electron as a donor and corrects the band bending induced by negatively charged dangling bonds.     

Defect passivation by hydrogen reincorporation for silicon quantum dots in SiC/SiOx hetero-superlattice

The SiC/SiO_x hetero-superlattice (HSL) consisting of alternating near-stoichiometric SiC barrier layers for the electrical transport and silicon rich SiO_x matrix layers for the quantum dot formation is a promising approach to the realization of silicon quantum dot (Si–QD) absorbers for 3rd generation solar cells. However, additional defect states are generated during post deposition annealing needed for the Si–QD formation causing an increase in sub-band gap absorption and a decrease in PL intensity. Proper passivation of excess defects is of major importance for both the optical and electrical properties of the SiC/SiO_x HSL Si–QD absorber. In this work, we investigate the effectiveness of the hydrogen reincorporation achieved with hydrogen plasma in a plasma-enhanced chemical vapor deposition (PECVD) reactor, hydrogen dissociation catalysis in hot-wire chemical vapor deposition (HWCVD) reactor and annealing in forming gas atmosphere (FGA). Both the HSL samples and single layer reference samples are tested. The passivation quality of the hydrogen reincorporation was examined by comparing electrical and optical properties measured after deposition, after annealing and after passivation. In addition, the formation of Si–QDs in SiC/SiO_x HSL was evaluated using high resolution transmission electron microscopy. We demonstrated that hydrogen can be successfully reincorporated into the annealed HSL sample and its single layer reference samples. FGA passivation is most effective for SiO_1.2 single layers and HSL samples. Passivation with PECVD appeared to be only effective for SiC single layers.     

Hydrogen removal by annealing from C-doped InGaAs grown on InP by metalorganic chemical vapor deposition

Hydrogen removal from C-doped InGaAs grown on InP substrate by metalorganic chemical vapor deposition is discussed based on the dependence of hole concentration on various annealing conditions. It is revealed that the hydrogen removal rate becomes higher as the annealing temperature is higher and the activation energy of hydrogen removal is about 1.9 eV regardless of C-doped layer thickness. The hydrogen removal rate is also found to be inversely proportional to C-doped layer thickness, suggesting that the hydrogen removal reaction is mainly governed by hydrogen diffusion.     

Improving the performance of amorphous and crystalline silicon heterojunction solar cells by monitoring surface passivation

The influence of thermal annealing on the crystalline silicon surface passivating properties of selected amorphous silicon containing layer stacks (including intrinsic and doped films), as well as the correlation with silicon heterojunction solar cell performance has been investigated. All samples have been isochronally annealed for 1 h in an N₂ ambient at temperatures between 150 °C and 300 °C in incremental steps of 15 °C. For intrinsic films and intrinsic/n-type stacks, an improvement in passivation quality is observed up to 255 °C and 270 °C, respectively, and a deterioration at higher temperatures. For intrinsic/n-type a-Si:H layer stacks, a maximum minority carrier lifetime of 13.3 ms at an injection level of 10¹⁵ cm^? 3 has been measured. In contrast, for intrinsic/p-type a-Si:H layer stacks, a deterioration in passivation is observed upon annealing over the whole temperature range. Comparing the lifetime values and trends for the different layer stacks to the performance of the corresponding cells, it is inferred that the intrinsic/p-layer stack is limiting device performance. Furthermore, thermal annealing of p-type layers should be avoided entirely. We therefore propose an adapted processing sequence, leading to a substantial improvement in efficiency to 16.7%, well above the efficiency of 15.8% obtained with the ‘standard’ processing sequence.     

Te溶剂Bridgman法CdMnTe晶体核辐射探测器的制备和表征

碲锰镉(CdMnTe)作为性能优异的室温核辐射探测器材料,可用于环境监测和工业无损检测领域。本文中采用Te溶剂Bridgman法生长In掺杂Cd_0.9Mn_0.1Te晶体,制备成10 mm×10 mm×2 mm大小的室温单平面探测器,研究了该探测器对²⁴¹Am@59.5 keV γ射线源的能谱响应。通过表征红外透过率、电阻率以及探测器能谱响应等参数,综合评定了探测器用CdMnTe晶体的质量、电学和探测器性能。结果表明,晶片的红外透过率均在55%以上,最好可达到60%。采用湿法钝化,100 V偏压下的漏电流由钝化前的9.48 nA降为钝化后的7.90 nA,钝化后的电阻率为2.832×10¹⁰ Ω·cm。在-400 V反向偏压下,CdMnTe探测器对²⁴¹Am@59.5 keV γ射线源的能量分辨率在钝化前后分别为13.53%和12.51%,钝化后的电子迁移率寿命积为1.049×10^-3 cm²/V。研究了探测器的能量分辨率随电压的变化特性,当偏压≤400 V时,探测器的能量分辨率主要由载流子的收集效率决定,而当偏压>400 V时,能量分辨率由漏电流决定。本文研究结果表明,Te溶剂Bridgman法生长的CdMnTe晶体质量较好,电阻率和电子迁移率寿命积满足探测器制备需求。     

磁控溅射衬底加热温度和后退火温度对制备β-Ga2O3薄膜材料的影响

作为宽禁带半导体材料的一员,结构稳定的β-Ga₂O₃具有比SiC和GaN更宽的禁带宽度和更高的巴利加优值,近年来受到科研人员的广泛关注。本文采用射频(RF)磁控溅射法在C面蓝宝石衬底上生长β-Ga₂O₃薄膜,探究溅射过程中衬底加热温度的影响。溅射完成后通过高温退火处理提升薄膜质量,研究衬底加热温度和后退火温度对氧化镓薄膜晶体结构和表面形貌的影响。利用X射线衍射(XRD)、原子力显微镜(AFM)等测试手段对β-Ga₂O₃薄膜晶体结构、表面形貌等进行分析表征。实验结果表明,随着衬底加热温度的升高,β-Ga₂O₃薄膜表面粗糙度逐渐降低,薄膜晶体质量得到显著提升;在氧气气氛中进行后退火,合适的后退火温度有利于氧化镓薄膜重新结晶、增大晶粒尺寸,能够有效修复薄膜的表面态和点缺陷,对于改善薄膜晶体质量有明显优势。