退火工艺对含Ti-Al阻挡层的硅基Pb(Zr_(0.4),Ti_(0.6))O_3铁电电容器结构和性能影响的研究

应用非晶的Ti-Al薄膜为导电阻挡层,采用射频磁控溅射法和溶胶-凝胶法在Si衬底上制备了La_(0.5)Sr_(0.5)CoO_3/Pb(Zr_(0.4),Ti_(0.6))O_3/La_(0.5)Sr_(0.5)CoO_3/Ti-Al/Si (LSCO/PZT/LSCO/Ti-Al/Si)异质结,研究了550 ℃常规退火(CTA)和快速退火(RTA)工艺对LSCO/PZT/LSCO/Ti-Al/Si结构和性能的影响.实验发现非晶Ti-Al薄膜在经过不同退火工艺后仍具有非晶结构,快速退火6 min的样品具有较好的物理性能.在418 kV/cm的外加电场下,LSCO/PZT/LSCO电容器的剩余极化强度和矫顽电场强度分别为22 μC/cm~2和83 kV/cm.LSCO/PZT/LSCO电容器的漏电行为不依赖于退火工艺,当电场强度低于46.7 kV/cm时为欧姆导电,高于46.7 kV/cm时为肖特基导电机制.     

(La0.5Sr0.5)CoO3为电极的Pb(Zr0.4Ti0.6)O3和Pb(Zr0.2Ti0.8)O3铁电电容器结构及电学性能

分别采用磁控溅射法和溶胶-凝胶法(Sol-gel)制备了(La0.5Sr0.5)CoO3(LSCO)和Pb(Zr1-xTix)O3(PZT)薄膜,在Pt(111)/Ti/SiO2/Si基片上构架了LSCO/Pb(Zr0.4Ti0.6)O3(PZT(40/60))/LSCO和LSCO/Pb(Zr0.2Ti0.8)O3(PZT(20/80))/LSCO铁电电容器,研究了两种铁电电容器的结构和性能。XRD结构分析表明:两种四方相的不同Zr/Ti比例的PZT薄膜均为结晶良好的多晶钙钛矿结构。在5 V测试电压下,LSCO/PZT(40/60)/LSCO和LSCO/PZT(20/80)/LSCO两种铁电电容器的剩余极化强度(Pr)和矫顽场(Ec)分别为:28μC/cm2和1.2 V以及32μC/cm2和2 V。相对于PZT(40/60),PZT(20/80)具有较大的剩余极化强度和矫顽场,是由于其矩形度(c/a)较大。两种电容器都具有较好的脉宽依赖性和抗疲劳性。在5 V的测试电压下,LSCO/PZT(40/60)/LSCO电容器的漏电流密度为3.2×10-5A/cm2,LSCO/PZT(20/80)/LSCO电容器的漏电流密度为3.11×10-4A/cm2,经拟合分析发现:在0～5 V的范围内,两种电容器都满足欧姆导电机制。     

La0.5Sr0.5CoO3/Pb(Zr0.4Ti0.6)O3/La0.5Sr0.5CoO3铁电电容器的结构和性能研究

采用磁控溅射法和脉冲激光沉积法,在SrTiO3(001)衬底上制备了La0.5Sr0.5CoO3(70 nm)/Pb(Zr0.4Ti0.6)O3(70 nm)/La0.5Sr0.5CoO3(70 nm) (LSCO/PZT/LSCO)铁电电容器异质结.X射线衍射结果表明:LSCO和PZT薄膜均为外延结构.在5 V的外加电压下, LSCO/PZT/LSCO电容器具有较低的矫顽电压(0.49 V),较高的剩余极化强度(41.7 μC/cm2 )和较低的漏电流密度(1.97×10-5 A/cm2),LSCO/PZT/LSCO电容器的最大介电常数为1073.漏电流的分析表明:当外加电压小于0.6 V时,电容器满足欧姆导电机制;当外加电压大于0.6 V时,符合空间电荷限制电流(SCLC)导电机制.     

含NiTi阻挡层的硅基(La0.5Sr0.5)CoO3/Pb(Zr0.4Ti0.6)O3/(La0.5Sr0.5)CoO3铁电电容器异质结

应用磁控溅射法制备的非晶NiTi薄膜作阻挡层,在Si (100)衬底上构造了(La0.5Sr0.5)CoO3/ Pb(Zr0.4Ti0.6)O3/(La0.5Sr0.5)CoO3(LSCO/PZT/LSCO)铁电电容器异质结,研究了Pb(Zr0.4Ti0.6)O3铁电薄膜的结构和物理性能.实验发现LSCO/PZT/LSCO铁电电容器具有良好的电学性能,在417kV/cm的驱动场强下,PZT铁电电容器具有较低的矫顽场强(125kV/cm)和较高的剩余极化强度(19.0μC/cm2),良好电容-电压特性(C-V)和保持特性,铁电电容器经过1010次反转后,极化强度没有明显下降,表明了非晶NiTi薄膜可以用作高密度硅基铁电存储器的扩散阻挡层.     

含Ni-Nb阻挡层的硅基Pb(Zr0.4,Ti0.6)O3电容器的制备及铁电性能研究

采用Ni-Nb薄膜作为导电阻挡层,以La0.5Sr0.5CoO3(LSCO)为底电极,构建了LSCO/Pb(Zr0.4,Ti0.6)O3(PZT)/LSCO异质结电容器。使用X射线衍射仪和铁电测试仪对其进行结构表征和性能测试。实验发现:Ni-Nb薄膜为非晶结构,PZT薄膜结晶状况良好。LSCO/PZT/LSCO电容器在5 V外加电压测试下,电滞回线具有良好的饱和趋势,剩余极化强度Pr为35.5μC/cm2,矫顽电压Vc为1.42 V,电容器具有良好的抗疲劳特性和保持特性。     

SrRuO3导电层对快速退火制备Pb(Zr,Ti)O3薄膜结构和性能的影响

采用溶胶-凝胶法在Pt/Ti/SiO2/Si基片上,制备了Pt/Pb(Zr,Ti)O3(PZT)/Pt和SrRuO3(SRO)/PZT/SrRuO3(SRO)异质结电容器,并研究了快速退火条件下SRO导电层对PZT结构和性能的影响.XRD测试表明,两种结构电容器中的PZT薄膜均为钙钛矿结构,SRO/PZT/SRO、Pt/PZT/Pt均具有较好的铁电性和脉宽依赖性,5 V电压下两电容器的剩余极化强度Pr和矫顽电压Vc分别为28.3 μC/cm2、1.2 V和17.4 μC/cm2、2.1 V.在经过1010次翻转后,SRO/PZT/SRO铁电电容器疲劳特性相对于Pt/PZT/Pt电容器有了较大的改善,但SRO导电层的引入也带来了漏电流增大的问题.     

硅基外延SrRuO3/PbZr0.5Ti0.5O3/SrRuO3电容器的结构和性能研究

传统的方法很难直接在硅衬底上制备外延的氧化物铁电电容器,本实验采用生长在硅衬底上的外延SrTiO3为模板,直接生长了SrRuO3/PbZr0.5Ti0.5O3/SrRuO3电容器异质结,并对其结构及性能进行了研究.X射线衍射表明所制备的SrRuO3/PbZr0.5Ti0.5O3/SrRuO3异质结实现了在硅衬底上的外延生长.在5V测试电压下,铁电电容器的剩余极化强度和矫顽电压分别为19.6μC/cm2和0.8V.当极化翻转次数达到1010时,铁电电容器的极化强度没有明显的衰减,表明SrRuO3/PbZr0.5Ti0.5O3/SrRuO3电容器具有良好的抗疲劳性能.     

V-TiO2/凹凸棒石复合光催化材料的制备与研究

以凹凸棒石为载体,钛酸四丁酯为前驱体,采用溶胶-凝胶法制备了V-TiO2/凹凸棒石复合光催化材料.通过X射线衍射(XRD)、扫描电子显微镜(SEM)、透射电镜(TEM)以及紫外-可见漫反射光谱(UV-Vis DRS)对材料的晶体结构、微观形貌及光学性能进行了表征.研究表明:凹凸棒石显著提高了材料的吸附能力,有效抑制了催化剂纳米粒子的团聚;以10 mg/L的罗丹明B溶液为目标降解物,研究了不同热处理温度下制备的V-TiO2/凹凸棒石(V掺量0.5;)在模拟太阳光下的降解效果,结果表明:400℃下煅烧2h的样品性能最优;与其它对照材料相比,V-TiO2/凹凸棒石(V掺量0.5;)复合光催化材料性能更优.     

溶胶电泳沉积法制备PZT压电厚膜及其性能研究

采用溶胶-凝胶方法制备Pb(Zr0.52Ti0.48)O3(PZT)纳米粉末,将此粉末按一定比例加入到同成分PZT溶胶中,采用溶胶-电泳沉积技术在ITO玻璃衬底上制备PZT厚膜.采用X射线衍射分析、SEM及HP4294A阻抗分析仪等对PZT膜进行了微观结构和介电性能测试,研究了电泳电压、热处理温度及电泳时间对PZT膜结构及膜厚的影响,结果表明,在1V电压下进行电泳,600℃热处理20min,可以得到表面均匀平整的纯钙钛矿结构PZT膜,以(110)择优取向,通过控制电泳时间可有效控制膜的厚度.获得了膜厚为30μm、介电常数达到ε33T/ε0=781、介电损耗为tanδ=0.0083、剩余极化与矫顽电场强度分别为24.6μC/cm2与61.9kV/cm铁电性能较好的PZT膜材料.     

非晶 Ti-Al 过渡层对 Pt/Ba0.6Sr0.4TiO3/Pt电容器结构和性能的影响

应用磁控溅射法在 Pt/Ti/SiO2/Si(001)衬底上制备 5 mm 厚超薄非晶 Ti-Al 薄膜作为过渡层,利用脉冲激光沉积法制备 Ba0.6 Sr0.4TiO3 薄膜,构造了 Pt/Ba0.6Sr0.4TiO3/Pt(Pt/BST/Pt)和 Pt/Ti-Al/Ba0.6Sr0.4TiO3/Ti-Al/Pt(Pt/Ti-Al/BST/Ti-Al/Pt)结构的电容器,研究了 Ti-Al 过渡层对 Pt/BST/Pt 电容器结构及其性能的影响.实验表明,过渡层的引入有效地阻止了 Pt 电极和 BST 薄膜的互扩散,降低了 BST 薄膜氧空位的浓度,提高了铁电电容器的介电性能.当测试频率为 1 kHz、直流偏压为0 V时,介电常数由引入过渡层前的 530 增大到引入后的 601,介电损耗则由0.09减小到0.03.而且过渡层的引入有效地降低了 BST 薄膜的漏电流,使正负向漏电流趋于对称,在测试电压为5 V 时,漏电流密度由3.8×10-5 A/cm2 减小到 8.25 ×10-6 A/cm2.     

PZT基反铁电材料研究进展

在综述Pb(Zr,Ti)O3(PZT)基反铁电材料的研制与性能研究进展的基础上,重点探讨了PZT95/5反铁电材料和在PZT基础上掺杂改性的Pb(Zr,Sn,Ti)O3(PZST),(Pb,La)(Zr,Sn,Ti)O3 (PLZST)反铁电材料.总结了利用La3+、Nb4+、Hf4+、Sr2+、Ba2+和Nd3+等离子对富锆PZT以及PZST粉体、陶瓷以及薄膜材料的掺杂取代改性研究.讨论了各类PZT基反铁电材料的铁电(FE)-反铁电(AFE)相变机理以及其场致应变性能.展望了PZT基反铁电材料今后研究与应用的发展方向.     

溅射制备不同厚度Pb(Zr0.52Ti0.48)O3薄膜结晶态的研究

研究了射频磁控溅射的Pb(Zr0.52Ti0.48)O3(PZT52/48)薄膜在退火晶化时,厚度对其结晶态及表面形貌的影响.首先利用Materials Studio软件对PZT分子进行了模拟,并模拟了X射线衍射(XRD)得到PZT的特征峰图;实验上,采用退火炉对不同厚度的PZT(52/48)薄膜进行了不同温度及时间的退火;接着采用XRD对各样片薄膜进行了结晶物相分析;采用FIB对部分样片薄膜表面形貌进行了观察.实验结果显示,薄膜的厚度及退火条件在一定程度上对其结晶态的影响是一致的;对于一定厚度的薄膜,合适且相同的退火(650 ℃)条件都可以使其形成单一的PZT(52/48)物相;二次退火对较厚薄膜结晶化有一定的作用,但随着溅射薄膜厚度的增加而累加了内应力,退火后形成有PZT(52/48)物相的较厚薄膜表面出现裂纹越明显.     

Crystal structure, carrier concentration and IR-sensitivity of PbTe thin films doped with Ga by two different methods

The comparison of the results of chemical composition, crystal structure, electronic properties and infrared photoconductivity investigations of PbTe/Si and PbTe/SiO₂/Si heterostructures doped with Ga atoms by two different techniques is presented in this work. One of these techniques is principally based on the vapour-phase doping procedure of PbTe/Si and PbTe/SiO₂/Si heterostructures, which were previously formed by the modified “hot wall” technique. The second method of PbTe(Ga)/Si and PbTe(Ga)/SiO₂/Si heterostructure preparation is based upon the fabrication of lead telluride films, which have been doped with Ga atoms in the layer condensation process directly. The lattice parameter and charge carrier density evolutions with the Ga impurity concentration show principally the different character of PbTe(Ga)/Si films prepared by these techniques. It has been proposed that complicated amphoteric (donor or acceptor) behaviour of Ga atoms may be explained by different mechanisms of substitution or implantation of impurity atoms in the crystal structure of lead telluride.     

沉积温度对磁控溅射BiFeO3薄膜结构和性能的影响

应用磁控溅射法在以SrRuO3 (SRO)薄膜为缓冲层的Pt/TiO2/SiO2/Si(001)基片上制备了多晶BiFeO3 (BFO)薄膜,构架了SRO/BFO/SRO异质结电容器.采用X射线衍射、铁电测试仪等研究沉积温度对BFO薄膜结构和性能的影响.X射线衍射图谱显示BFO薄膜为多晶结构.在2.5 kHz测试频率下,500℃生长的BFO薄膜呈现比较饱和的电滞回线,2Pr为145μC/cm2,矫顽场Ec为158 kV/cm,漏电流密度约为2.4×104 A/cm2.漏电机制研究表明,在低电场区,SRO/BFO/SRO电容器满足欧姆导电机制,在高电场区,满足普尔-弗兰克导电机理.实验发现:SRO/BFO/SRO电容器经过109翻转后仍具有良好的抗疲劳特性.     

纳微米PZT/水泥基压电复合材料的研究

采用溶胶-凝胶法合成了锆钛酸铅(PZT)纳微米粉体.XRD与SEM分析结果表明,经700 ℃煅烧的PZT粉体的平均晶粒尺寸约为26.4 nm,粉体团聚体的平均尺寸约为200 nm.采用干压成型-水化法制备了纳微米PZT/水泥基压电复合材料,研究了复合材料的压电及介电性能.SEM结果表明,PZT陶瓷相在基体中呈网状分布.PZT颗粒之间的良好连通性使复合材料具有优良的压电性能.     

Structural Features of PLZT Films

Lead zirconate titanate (PZT) films doped with lanthanum, Pb(_1–х)La_х(Zr_0.48Ti_0.52) (х = 0, 0.02, 0.05, 0.08, or 0.01), have been investigated by electron microscopy and X-ray diffraction. Films were formed on Si–SiO₂–TiO₂–Pt substrates by chemical vapor deposition from a solution and annealed at temperatures T = 650 and 750°C. The main structural features of the films, differing them from undoped PZT films fabricated by the same method, have been established. It is found that doping with lanthanum delays the pyrochlore–perovskite transformation in the film bulk, i.e., in the regions distant from the film–substrate interface. The fraction of metastable pyrochlore phase increases with an increase in the La molar content in the films. The main reason for the delay is the deficit of lead in the intergranular perovskite space, especially in the upper part of the film. Annealing at T = 750°C reduces the content of pyrochlore phase but does not completely remove it, which was never observed for undoped PZT films. Doping with lanthanum leads to a change in the lattice period c and a tetragonal distortion of the perovskite lattice (c/a ratio). Hence, the [100] texture of the films obtained, in contrast to the typical [111] texture of PZT films, is due to the increase in the lattice mismatch between the film and platinum layer when lead atoms are replaced with lanthanum. Lattice distortions of “transrotational” character, whose value exceeds 160 deg/μm, are found to arise in growing crystals.     

Nitridation of (Ba,Sr)TiO3 films in an inductively coupled plasma

The effects of surface treatment, using ammonia in an inductively coupled plasma, of (Ba,Sr)TiO₃ films on the leakage and dielectric properties of the Pt/(Ba, Sr) TiO₃/Pt capacitors were investigated. To obtain data of the ammonia plasma, a Langmuir probe was used during the experiments. As a result of the exposure of (Ba,Sr)TiO₃ to the plasma, the leakage current density of the (Ba,Sr)TiO₃ capacitor was decreased by two orders of magnitude as compared to that of the non-plasma-treated sample at an applied voltage of 1.5 V. The decrease of leakage currents of (Ba,Sr)TiO₃ films is attributed to the reduction of oxygen vacancies. However, the dielectric constant may be changed by the plasma-induced space charge or ion bombardment. The X-ray photoelectron spectroscopy measurements detected the N 1s peak in the plasma-treated sample. Additional space charges were induced and result in the reduction of the dielectric constant. We assume that the competition of nitrogen incorporation into the oxygen vacancies and plasma-induced damage is the main effect of the nitridation of (Ba,Sr)TiO₃ films in ammonia plasma.     

便携式电子设备用无铅压电扬声器的研制

用丝网印刷法在印有Pt电极的Al2O3基片上制备了BaTiO3(BT)掺杂Bi0.5(Na0.82K0.18)0.5 TiO3(BNKT)厚膜,研究了BT掺杂对BNKT厚膜相结构、微观形貌、介电、压电及铁电性能的影响.研究发现,(1-x)BNKT-xBaTiO3厚膜体系的准同型相界(MPB)位于3mol;相似文献   

煅烧时间与温度对超导/铁磁复合材料性能的影响

采用传统的固相反应法在较低的烧结温度与较短的煅烧时间下制备了(La1.85Sr0.15CuO4)1-x(La2/3 Sr1/3MnO3)x(简写为LSCO/LSMO)超导/铁磁复合材料.结果显示:复合后LSMO中的结构没有发生明显改变,随着温度的降低,所有的复合材料在38 K左右均会出现电阻急剧下降,最终呈现超导现象.甚至当LSMO铁磁性材料掺入达到O.20mol时,复合材料仍旧呈现超导态.同时所有复合样品的超导转变温度TC随着x的增加呈现线性下降的趋势.因此,通过低温与短时的烧结方法可以避免处于晶界处的LSCO的CuO面被破坏,进而提高超导/铁磁复合材料中在晶界处的铁磁的共存含量.