The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading.Material damage is considered.By introducing the dislocation density function and using the integral transform,the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain.Time response of DSIF is calculated with the inverse Laplace integral transform.The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter,shear module and Poisson ratio,while decreases with the swell relaxation parameter.Damage shielding only occurs at the initial stage of crack propagation.The singular index of crack tip is -0.5 and independent on the material parameters,damage conditions of materials,and time.The oscillatory index is controlled by viscoelastic material parameters.