半平面多边缘裂纹反平面问题的奇异积分方程

利用复变函数和奇异积分方程方法,求解弹性范围内半平面多边缘裂纹的反平面问题．提出了满足半平面边界自由的由分布位错密度表示的单边缘裂纹的基本解,此基本解由主要部分和辅助部分组成．将半平面多边缘裂纹问题看作是许多单边缘裂纹问题的叠加,建立了一组Cauchy型奇异积分方程．然后,利用半开型积分法则求解该奇异积分方程,得到了裂纹端处的应力强度因子．最后,给出了几个数值算例．     

折线型裂纹对SH波的动力响应

利用Fourier积分变换方法,得出了无限平面中用裂纹位错密度函数表示的单裂纹散射场．根据无穷积分的性质,把单裂纹的散射场分解为奇异部分和有界部分．利用单裂纹的散射场建立了折线裂纹在SH波作用下的Cauchy型奇异积分方程．根据折线裂纹散射场和所得的积分方程讨论了裂纹在折点处的奇性应力及折点处的奇性应力指数．利用所得的奇性应力定义了折点处的应力强度因子．对所得Cauchy型奇积分方程的数值求解,可得裂纹端点和折点处的动应力强度因子。     

基体裂纹与界面刚性线的弹性干涉

研究两种材料界面上的刚性线与其它任意位置处直线裂纹弹性干涉的反平面问题。基于界面上刚性线与任意位置处螺型位错干涉的基本解,运用连续位错密度模型法将问题转化为奇异积分方程。用半开型积分法求解奇异积分方程,得到位错密度函数的离散值,计算裂纹尖端处的应力强度因子。算例说明该方法可用于工程实际问题。     

剪切波作用下埋藏刚性椭圆柱与周围介质部分脱胶时的动力分析

本文利用波函数展开法和奇异积分方程技术研究了ＳＨ型反平面剪切波作用下埋藏刚性椭圆柱与周围介质部分脱胶时的动力特性．将脱胶区看作表面不相接触的椭圆弧形界面裂纹，利用波函数（Ｍａｔｈｉｅｕ函数）展开法，并引人裂纹面的位错密度函数为未知量，将问题归结为奇异积分方程，通过数值求解积分方程获得了远场和近场物理参量，并讨论了共振特性和各参数对共振的影响．     

界面下主微裂纹间干涉的研究

涉及两相正交各向异性体界面干涉问题的研究,多裂纹问题被分解为只含单裂纹的子问题,利用位错理论和裂面应力自由条件,列出一组可数值求解位错密度函数的奇异积分方程,从耐 注得应力强度因子。     

黏弹性体界面裂纹的冲击响应

研究两半无限大黏弹性体界面Griffith裂纹在反平面剪切突出载荷下,裂纹尖端动应力强度因子的时间响应,首先,运用积分变换方法将黏弹性混合黑社会问题化成变换域上的对偶积分方程,通过引入裂纹位错密度函数进一步化成Cauchy型奇异积分方程,运用分片连续函数法数值求解奇异积分方程,得到变换域内的动应力强度因子,再用Laplace积分变换数值反演方法,将变换域的解反演到时间域内,最终求得动应力强度因子的时间响应,并对黏弹性参数的影响进行分析。     

反平面圆形夹杂和多圆孔多裂纹相互作用问题

动用复变函数及积分方法方法求解了反平面圆形夹杂和多圆孔多裂纹相互作用问题。为解决该问题,建立了两种类型的基本解。利用叠加原理和所得的基本解没圆孔和裂纹表面取待定的基本解密度函数,可得一组Ｆｒｅｄｈｏｌｍ积分方程,通过积分方程组的数值求解,可以得到密度函数的离散值,进而得到应力强度因子。     

平面环形域单裂纹问题的弹性力学解

平面环形域的裂纹问题,是一个尚未很好解决的重要问题。本文在文献[2]的基础上,结合使用Muskhelishvili的复函数方法求解了此问题。获得以裂纹面位错密度函数表示的环形域单裂纹问题的解析解,而位错密度函数由求解一组带柯西核的奇异积分方程得到。文中的几个数例均绘成了应力强度因子的曲线图,本文给出的解对研究环形域上的一般径向裂纹系有重要作用。     

多个纵向环形界面裂纹对P波散射的动应力强度因子

研究多个纵向环形界面裂纹的Ｐ波散射问题。以裂纹面的位错密度函数为未知量,利用Ｆｏｕｒｉｅｒ积分变换,将问题归结为第二类奇异积分方程,然后通过数值求解,获得裂纹尖端的动应力强度因子。最后给出了双裂纹动应力强度因子随入射波频率变化的关系曲线。     

曲线裂纹和反平面圆形夹杂相交问题

建立了和反平面圆夹杂界面相交的曲线裂纹的弱奇异积分方程,利用Cauchy型奇异积分方程主部分析方法研究了穿过反平面圆夹杂界面的曲线裂纹在交点处的奇性应力指数以及交点处角形域内的奇性应力,并根据奇性应力定义了交点处的应力强度因子。通过对弱奇异积分方程的数值求解,可得裂纹端点和交点处的应力强度因子。     

Crack kinking in piezoelectric materials

A solution is presented for a class of two-dimensional electroelastic branched crack problems. Explicit Green's function for an interface crack subject to an edge dislocation is developed using the extended Stroh formulation allowing the branched crack problem to be expressed in terms of coupled singular integral equations. The integral equations are obtained by the method that models a kink as a continuous distribution of edge dislocations, and the dislocation density function is defined on the line of the branch crack only. Competition between crack extension along the interface and kinking into the substrate is investigated using the integral equations and the maximum energy release rate criterion. Numerical results are presented to show the effect of electric field on the path of crack extension. The work was supported by the Australian Research Council through a Queen Elizabeth II fellowship and by the Australian Academy of Science through the J.G. Russell Award.     

In-plane analysis of a cracked orthotropic half-plane

The stress fields in an orthotropic half-plane containing Volterra type climb and glide edge dislocations under plane stress condition are derived. The dislocation solutions are utilized to formulate integral equations for dislocation density functions on the surface of smooth cracks embedded in the half-plane under in-plane loads. The integral equations are of Cauchy singular type which are solved numerically. The dislocation density functions are employed to evaluate modes I and II stress intensity factors for multiple cracks with different configurations.     

Interaction of general plane P wave and cylindrical inclusion partially debonded from its viscoelastic matrix

The interaction of a general plane P wave and an elastic cylindrical inclusion of infinite length partially debonded from its surrounding viscoelastic matrix of infinite extension is investigated. The debonded region is modeled as an arc-shaped interface crack between inclusion and matrix with non-contacting faces. With wave functions expansion and singular integral equation technique, the interaction problem is reduced to a set of simultaneous singular integral equations of crack dislocation density function. By analysis of the fundamental solution of the singular integral equation, it is found that dynamic stress field at the crack tip is oscillatory singular, which is related to the frequency of incident wave. The singular integral equations are solved numerically, and the crack open displacement and dynamic stress intensity factor are evaluated for various incident angles and frequencies. The project supported by the National Natural Science Foundation of China (19872002) and Climbing Foundation of Northern Jiaotong University     

Dynamic stress intensity factors of multiple cracks in a functionally graded orthotropic half-plane

In the present paper dynamic stress intensity factor and strain energy density factor of multiple cracks in the functionally graded orthotropic half-plane under time-harmonic loading are investigated. By utilizing the Fourier transformation technique the stress fields are obtained for a functionally graded orthotropic half-plane containing a Volterra screw dislocation. The variations of the material properties are assumed to be exponential forms which the equilibrium has an analytical solution. The dislocation solution is utilized to formulate integral equation for the half-plane weakened by multiple smooth cracks under anti-plane deformation. The integral equations are of Cauchy singular type at the location of dislocation which are solved numerically to obtain the dislocation density on the faces of the cracks. The dislocation densities are employed to determined stress intensity factor and strain energy density factors (SEDFs) for multiple smooth cracks under anti-plane deformation. Numerical examples are provided to show the effects of material properties and the crack configuration on the dynamic stress intensity factors and SEDFs of the functionally graded orthotropic half-plane with multiple curved cracks.     

Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials

Summary For a two-dimensional piezoelectric plate, the thermoelectroelastic Green's functions for bimaterials subjected to a temperature discontinuity are presented by way of Stroh formalism. The study shows that the thermoelectroelastic Green's functions for bimaterials are composed of a particular solution and a corrective solution. All the solutions have their singularities, located at the point applied by the dislocation, as well as some image singularities, located at both the lower and the upper half-plane. Using the proposed thermoelectroelastic Green's functions, the problem of a crack of arbitrary orientation near a bimaterial interface between dissimilar thermopiezoelectric material is analysed, and a system of singular integral equations for the unknown temperature discontinuity, defined on the crack faces, is obtained. The stress and electric displacement (SED) intensity factors and strain energy density factor can be, then, evaluated by a numerical solution at the singular integral equations. As a consequence, the direction of crack growth can be estimated by way of strain energy density theory. Numerical results for the fracture angle are obtained to illustrate the application of the proposed formulation. Received 10 November 1997; accepted for publication 3 February 1998     

Isotropic/orthotropic two-layered strips containing cracks terminating at and going through an interface

Crack problems for isotropic/orthotropic two-layered strips have been investigated. A system of two singular integral equations can be derived by using Fourier integral transformation and boundary conditions of crack problems. After stress singularities at crack tips or other special points are determined for internal and edge cracks, and for cracks terminating at and going through the interface, the system of singular integral equations is solved numerically by Gauss-Jacobi or Gauss-Chebyshev integration formulas for stress intensity factors at the tips and other singular points of cracks. Finally, possible crack growth behavior for cracks approaching and going through the interface is discussed.     

Solutions of thermoelastic crack problems in bonded dissimilar media or half-plane medium

The two-dimensional thermoelastic crack problem in bonded dissimilar media or in a half-plane medium is considered. The proposed method for solving this problem consists of two parts. In the first part, complex potential functions are derived which are enforced to satisfy the continuity conditions across the interface, while the second part consists of the derivation of singular integral equations by introducing the dislocation functions along the crack border which are solved numerically. For both half-plane and two bonded half-plane problems associated with an insulated crack, the thermal stress intensity factors are computed numerically by using the appropriate interpolation formulae. The results compared with those of the homogeneous case given in the literature show that the method proposed here is effective, simple and general.     

ELASTODYNAMIC ANALYSIS OF A FUNCTIONALLY GRADED HALF-PLANE WITH MULTIPLE SUB-SURFACE CRACKS

The stress fields are obtained for a functionally graded half-plane containing a Volterra screw dislocation.The elastic shear modulus of the medium is considered to vary exponentially.The dislocation s...