Simulation of local instabilities during crack propagation in the ductile–brittle transition region

The crack propagation for a cohesive zone model within an elastic-plastic material under small-scale yielding conditions is simulated numerically. The resulting crack growth resistance curves show local instabilities, so-called pop-ins even for homogeneous cohesive properties if the cohesive strength lies sufficiently close to the maximum stress of the corresponding blunting solution. The formation of secondary cracks and unloading zones in front of the actual crack tip is identified as the underlying mechanism. It is found that the shape of the cohesive law has a considerable influence on the crack arrest behavior. Furthermore, requirements to the mesh resolution are derived.     

Life prediction of thermally cracked railway wheels: Growth estimation of cracks with arbitrary shape

A computer program for railway wheel life prediction has been developed incorporating an elastoplastic calculation of both the residual stress field induced by shoe-braking and the superposed alternating rolling contact stresses. The possibilities of unstable propagation of surface cracks, crack arrest, fatigue propagation through a complex stress field and crack detention on reaching the threshold value have been accounted for. An approximate method for crack growth prediction is used providing bounds for instantaneous crack front position and estimations of crack shape within short computing times. Some examples of application for an UIC R7 wheel are presented.     

柱状电极屈曲或裂纹扩展的临界力学参数研究

柱形结构电极是近年来使用最为广泛的锂电池电极结构之一．本文以硅材料细长柱形电极为例，研究了充电电流大小、电极长径比、初始裂纹长度以及断裂韧性对于电极的屈曲现象和裂纹扩展现象发生时间的影响．计算结果表明，屈曲与裂纹扩展现象出现的先后顺序与充电电流大小无关；具有小的长径比，大的初始裂纹长度以及较小断裂韧性的电极，裂纹扩展比屈曲现象更早发生．对于硅材料，不同长径比的电极具有不同临界断裂韧性值，当材料的断裂韧性小于该临界值，在锂化过程中裂纹扩展会先于屈曲现象发生；该临界断裂韧性值随初始裂纹长度的增加而增加．本文的结论对于电极的结构设计以及材料选取具有一定指导意义．     

Periodic cracking of films supported on compliant substrates

When a tensile strain is applied to a film supported on a compliant substrate, a pattern of parallel cracks can channel through both the film and substrate. A linear-elastic fracture-mechanics model for the phenomenon is presented to extend earlier analyses in which cracking was limited to the film. It is shown how failure of the substrate reduces the critical strain required to initiate fracture of the film. This effect is more pronounced for relatively tough films. However, there is a critical ratio of the film to substrate toughness above which stable cracks do not form in response to an applied load. Instead, catastrophic failure of the substrate occurs simultaneously with the propagation of a single channel crack. This critical toughness ratio increases with the modulus mismatch between the film and the substrate, so that periodic crack patterns are more likely to be observed with relatively stiff films. With relatively low values of modulus mismatch, even a film that is more brittle than the substrate can cause catastrophic failure of the substrate. Below the critical toughness ratio, there is a regime in which stable crack arrays can be formed in the film and substrate. The depth of these arrays increases, while the spacing decreases, as the strain is increased. Eventually, the crack array can become deep enough to cause substrate failure.     

利用维氏和玻氏压头表征半导体材料断裂韧性

压痕法是测量材料断裂韧性 ($K_{\rm IC})$ 的常用方法之一, 如何根据不同的材料、不同的压头选择适合的公式, 是当前面临的一大问题. 因此,在不同载荷下对单晶硅 (111) 和碳化硅 (4H-SiC, 0001面) 这两种半导体材料进行了维氏微米硬度和玻氏纳米压痕实验, 对实验产生的裂纹长度$c$进行了统计分析, 并采用13个压痕公式计算材料的$K_{\rm IC}$, 开展了微米划痕实验, 验证压痕法评估半导体材料$K_{\rm IC}$的适用性. 研究结果表明: 为了消除维氏压痕实验产生的$c$的固有离散性, 需要多次测量取平均值; 裂纹长度与压痕尺寸的比值随压痕载荷的增大而增大; 材料的裂纹类型与载荷相关且低载荷下表现为巴氏裂纹, 高载荷下表现为中位裂纹; 与微米划痕实验得到的单晶硅和碳化硅材料的$K_{\rm IC}$平均值 (分别为0.96 MPa,$\cdot$,$\sqrt{\rm m}$和2.89 MPa,$\cdot$,$\sqrt{\rm m}$) 相比, 在同一压头下无法从13个公式中获得同时适用于单晶硅和碳化硅材料的压痕公式,但在同一材料下可以获得同时适用于维氏和玻氏压头的$K_{\rm IC}$计算公式; 基于中位裂纹系统发展而来的压痕公式更适合用于评估半导体材料的$K_{\rm IC}$, 且维氏压头下的$K_{\rm IC}$与玻氏压头下$K_{\rm IC}$的关系不是理论上的1.073倍, 应为1.13$\pm 压痕法是测量材料断裂韧性(K_(IC))的常用方法之一,如何根据不同的材料、不同的压头选择适合的公式,是当前面临的一大问题.因此,在不同载荷下对单晶硅(111)和碳化硅(4H-Si C, 0001面)这两种半导体材料进行了维氏微米硬度和玻氏纳米压痕实验,对实验产生的裂纹长度c进行了统计分析,并采用13个压痕公式计算材料的K_(IC),开展了微米划痕实验,验证压痕法评估半导体材料K_(IC)的适用性.研究结果表明:为了消除维氏压痕实验产生的c的固有离散性,需要多次测量取平均值;裂纹长度与压痕尺寸的比值随压痕载荷的增大而增大;材料的裂纹类型与载荷相关且低载荷下表现为巴氏裂纹,高载荷下表现为中位裂纹;与微米划痕实验得到的单晶硅和碳化硅材料的K_(IC)平均值(分别为0.96 MPa·m~(1/2)和2.89 MPa·m~(1/2))相比,在同一压头下无法从13个公式中获得同时适用于单晶硅和碳化硅材料的压痕公式,但在同一材料下可以获得同时适用于维氏和玻氏压头的K_(IC)计算公式;基于中位裂纹系统发展而来的压痕公式更适合用于评估半导体材料的K_(IC),且维氏压头下的K_(IC)与玻氏压头下K_(IC)的关系不是理论上的1.073倍,应为1.13±0.01.     

采用压缩单裂纹圆孔板确定岩石动态起裂、扩展和止裂韧度

爆炸、冲击、地震等人为或自然灾害不可避免,经常造成大量土木工程设施的破坏,因此岩石在动态载荷作用下的行为受到特别关注.岩石动态断裂韧度是评价岩石抵抗裂纹动态起裂、扩展和止裂性能的材料参数,开展岩石动态断裂韧度测试方法的研究对相关理论基础和实验技术的要求较高.岩石动态断裂韧度分为动态起裂、动态扩展、动态止裂三种,虽然关于动态起裂和动态扩展的研究已有一些成果,对岩石动态止裂的研究仍是一个难题,至今几乎无人问津.研究表明,在分离式霍普金森压杆撞击压缩单裂纹圆孔板岩石试样的I型动态断裂试验中,动态起裂、扩展、止裂的全过程可以由黏贴在压缩单裂纹圆孔板试样上的裂纹扩展计监测,岩石的动态起裂、扩展、止裂韧度可以用实验-数值-解析法确定.特别值得一提的是首次测出了岩石的动态止裂韧度.裂纹扩展计信号还显示,压缩单裂纹圆孔板在止裂后,停止的裂纹还会再次动态起裂、扩展并超出裂纹扩展计的检测范围.从能量的角度分析了动态止裂的过程,指出测试动态止裂韧度时要注意的一些问题.结果显示,岩石动态起裂韧度和动态扩展韧度分别随动态加载率和裂纹扩展速度的增大而增大,岩石动态起裂韧度略大于动态止裂韧度.      

基于同步辐射原位CT的水牛角结构性能关系研究

为探究水牛角的结构性能关系,基于上海同步辐射光源搭建了高分辨原位CT系统,对水牛角角鞘进行初始表征和准静态压缩下的实时表征,并通过Top-Hat方法提取了角鞘内孔洞三维形貌。结果显示,水牛角角鞘孔隙率在1%左右,椭圆柱状孔洞沿牛角生长方向排列成线,首尾相连却并未连通,均匀分布在波浪状片层之间。孔洞特征椭球的轴长分布满足对数正态分布,长轴和短轴的长度均值分别为7μm和3μm。原位CT结果表明,角鞘在屈服之后,初始孔洞首先扩张而形成微裂纹,随后微裂纹沿着片层界面由外向内发生桥接,片层发生局部屈曲和层间开裂,形成宏观裂纹,导致角鞘内裂纹密度急剧上升。片层之间不仅存在大量纤维黏接(提高了层间拉伸/剪切强度),而且孔洞互不连通,这些因素抑制了层间裂纹的快速传播,使得各处裂纹只能独立缓慢发展而无法贯通样品。波浪状片层使裂纹传播路径更加曲折,层间屈曲增加了片层摩擦耗能。这些机制使得牛角表现出加工硬化,也是牛角在纵向方向呈现优良韧性的主要原因。     

Bridging micro to macroscale fracture properties in highly heterogeneous brittle solids: weak pinning versus fingering

The effect of strong toughness heterogeneities on the macroscopic failure properties of brittle solids is investigated in the context of planar crack propagation. The basic mechanism at play is that the crack is locally slowed down or even trapped when encountering tougher material. The induced front deformation results in a selection of local toughness values that reflect at larger scale on the material resistance. To unravel this complexity and bridge micro to macroscale in failure of strongly heterogeneous media, we propose a homogenization procedure based on the introduction of two complementary macroscopic properties: An apparent toughness defined from the loading required to make the crack propagate and an effective fracture energy defined from the rate of energy released by unit area of crack advance. The relationship between these homogenized properties and the features of the local toughness map is computed using an iterative perturbation method. This approach is applied to a circular crack pinned by a periodic array of obstacles invariant in the radial direction, which gives rise to two distinct propagation regimes: A weak pinning regime where the crack maintains a stationary shape after reaching an equilibrium position and a fingering regime characterized by the continuous growth of localized regions of the fronts while the other parts remain trapped. Our approach successfully bridges micro to macroscopic failure properties in both cases and illustrates how small scale heterogeneities can drastically affect the overall failure response of brittle solids. On a broader perspective, we believe that our approach can be used as a powerful tool for the rational design of heterogeneous brittle solids and interfaces with tailored failure properties.     

冲击载荷作用下黑砂岩动态断裂参数的分形修正

基于分形理论研究了偏折裂纹扩展路径对动载荷作用下黑砂岩的动态断裂力学参数的测试误差影响作用,采用传统的分离式霍普金森压杆（split Hopkinson pressure bar, SHPB）实验装置对修正侧开单裂纹半孔板（improved single cleavage semi-circle specimen, ISCSC）试样进行动态冲击实验,随后采用裂纹扩展计进行裂纹起裂时间与裂纹扩展速度等动态断裂力学参数测试,采用分形理论对测试的裂纹扩展速度与动态应力强度因子进行修正,利用实验-数值法对黑砂岩的动态断裂韧度进行计算。研究结果表明,ISCSC构型构件能够有效应用于岩石材料动态裂纹扩展行为的研究,并发生了止裂现象,经分形修正的裂纹扩展速度与动态断裂韧度更接近实际裂纹动态扩展情况,修正前后得到黑砂岩材料的裂纹扩展速度误差为33.51%,动态断裂韧度最大误差为7.68%,说明利用分形理论对动态断裂韧度等动态断裂参数计算更合理。     

Coupled continuum and discrete analysis of random heterogeneous materials: Elasticity and fracture

Recent work has suggested that the heterogeneous distribution of mechanical properties in natural and synthetic materials induces a toughening mechanism that leads to a more robust structural response in the presence of cracks, defects or other types of flaws. Motivated by this, we model an elastic solid with a Young′s modulus distribution described by a Gaussian process. We study the pristine system using both a continuum and a discrete model to establish a link between the microscale and the macroscale in the presence of disorder. Furthermore, we analyze a flawed discrete particle system and investigate the influence of heterogeneity on the fracture mechanical properties of the solid. We vary the variability and correlation length of the Gaussian process, thereby gaining fundamental insights into the effect of heterogeneity and the essential length scales of heterogeneity critical to enhanced fracture properties. As previously shown for composites with complex hierarchical architectures, we find that materials with disordered elastic fields toughen by a ‘distribution-of-weakness’ mechanism inducing crack arrest and stress delocalization. In our systems, the toughness modulus can increase by up to 30% due to an increase in variability in the elastic field. Our work presents a foundation for stochastic modeling in a particle-based micromechanical environment that can find broad applications within natural and synthetic materials.     

冲击加载下巷道内裂纹的扩展特性及破坏行为

为了开展含预制裂纹的巷道模型试样在冲击载荷下的动态断裂响应实验,选用青砂岩作为模型材料制作巷道模型试样,以可调速落锤冲击实验机作为冲击加载装置进行试样的动态断裂实验,分析冲击载荷作用下的巷道内裂纹的扩展规律。采用裂纹扩展计及应变片测试系统监测裂纹的起裂时间、扩展速度及止裂时间,并借助于AUTODYN、ABAQUS有限元数值分析软件对实验模型进行数值模拟,计算裂纹的动态起裂韧度、动态扩展韧度、动态止裂韧度等断裂参数。结果表明:巷道内裂纹在扩展路径过程中存在着明显的止裂现象;采用实验-数值方法能够较好地得出裂纹的起裂韧度、扩展韧度和止裂韧度等参数。另外,对止裂现象进行了初步的分析,讨论了试样内应力反射波与透射波对止裂问题的影响。     

Transition of mode II cracks from sub-Rayleigh to intersonic speeds in the presence of favorable heterogeneity

Understanding sub-Rayleigh-to-intersonic transition of mode II cracks is a fundamental problem in fracture mechanics with important practical implications for earthquake dynamics and seismic radiation. In the Burridge-Andrews mechanism, an intersonic daughter crack nucleates, for sufficiently high prestress, at the shear stress peak traveling with the shear wave speed in front of the main crack. We find that sub-Rayleigh-to-intersonic transition and sustained intersonic propagation occurs in a number of other models that subject developing cracks to intersonic loading fields. We consider a spontaneously expanding sub-Rayleigh crack (or main crack) which advances, along a planar interface with linear slip-weakening friction, towards a place of favorable heterogeneity, such as a preexisting subcritical crack or a small patch of higher prestress (similar behavior is expected for a small patch of lower static strength). For a range of model parameters, a secondary dynamic crack nucleates at the heterogeneity and acquires intersonic speeds due to the intersonic stress field propagating in front of the main crack. Transition to intersonic speeds occurs directly at the tip of the secondary crack, with the tip accelerating rapidly to values numerically equal to the Rayleigh wave speed and then abruptly jumping to an intersonic speed. Models with favorable heterogeneity achieve intersonic transition and propagation for much lower prestress levels than the ones implied by the Burridge-Andrews mechanism and have transition distances that depend on the position of heterogeneity. We investigate the dependence of intersonic transition and subsequent crack propagation on model parameters and discuss implications for earthquake dynamics.     

含中心裂纹梯度纳晶金属的数值模拟

梯度纳晶金属由于其微观组织的梯度分布,力学属性也呈现梯度变化,这使得其表现出不同于传统均匀材料的断裂行为．利用材料力学参数的梯度分布来表征梯度纳晶金属中晶粒尺寸的梯度变化,并编写ABAQUS和MATLAB脚本程序建立分层有限元模型．通过数值模拟计算了含有初始中心裂纹的梯度纳晶金属在受远端均匀拉应力作用下的裂尖J积分,分别研究了屈服应力梯度、裂纹角度和裂纹长度对金属材料断裂韧性的影响,并与传统粗晶进行了对比．结果表明梯度纳米结构的存在导致梯度纳晶金属内部的中心裂纹两端表现出不同的断裂韧性,小晶粒一侧裂尖的抗裂韧性优于大晶粒一侧裂尖,且屈服应力梯度绝对值越大,两者差距越大．梯度纳晶金属的断裂韧性受中心裂纹角度和长度变化的影响与传统粗晶金属基本一致,同时在晶粒尺寸梯度的作用下梯度纳晶的裂尖J积分略低于粗晶,即整体上拥有更好的抗裂韧性．     

Numerical simulations of crack deflection at a twist-misoriented grain boundary between two ideally brittle crystals

Finite-element simulations are used to model crack propagation across twist-misoriented grain boundaries, which are an important source of toughness in lamellar microstructures such as TiAl. We consider a twist grain boundary (GB) between two adjacent grains, and assume that each grain has a single cleavage orientation. The cleavage planes and GB are modeled as a set of cohesive surfaces, and the crack path and effective toughness of the system are simulated using a dynamic finite-element method (FEM). As the crack approaches the GB under remote mode I loading, it is allowed to either deflect along the GB and/or induce the nucleation of a periodic array of cracks in the adjacent grain. The simulations predict (i) a critical toughness ratio between the GB and the cleavage planes for the crack to propagate into the adjacent grain; (ii) an array of cracks in the GB and the twisted grain; (iii) the macroscopic mode I toughness of the solid as a function of a generalized measure of crack length; and (iv) the influence of GB toughness and twist misorientation on the effective toughness of the solid.     

Effects of static electric field on the fracture behavior of piezoelectric ceramics

The paper gives an overview on experimental observations of the failure behavior of electrically insulating and conducting cracks in piezoelectric ceramics. The experiments include the indentation fracture test, the bending test on smooth samples, and the fracture test on pre-notched (or pre-cracked) compact tension samples. For electrically insulating cracks, the experimental results show a complicated fracture behavior under electrical and mechanical loading. Fracture data are much scattered when a static electric field is applied. A statistically based fracture criterion is required. For electrically conducting cracks, the experimental results demonstrate that static electric fields can fracture poled and depoled lead zirconate titanate ceramics and that the concepts of fracture mechanics can be used to measure the electrical fracture toughness. Furthermore, the electrical fracture toughness is much higher than the mechanical fracture toughness. The highly electrical fracture toughness arises from the greater energy dissipation around the conductive crack tip under purely electric loading, which is impossible under mechanical loading in the brittle ceramics. The project supported by an RGC grant from the Research Grant Council of the Hong Kong Special Administrative Region, China     

Electrically driven cracks in piezoelectric ceramics: experiments and fracture mechanics analysis

Piezoelectric systems like multilayer actuators are susceptible to damage by crack propagation induced by strain incompatibilities. These can arise under electric fields for example between the electroded and external regions. Such incompatibilities have been realised in thin rectangular model specimens from PZT-piezoelectric ceramics with top and bottom electrodes only close to one edge. Under an electric field, controlled crack propagation has been observed in situ in an optical microscope. The crack paths are reproducible with very high accuracy. Small electrode widths lead to straight cracks with two transitions between stable and unstable crack growth regions, while large electrode widths result in curved cracks with four transitions. Fracture mechanics analysis is able to explain the different crack paths. An iteration method is developed to simulate the curved crack propagation also for strong curvature of the crack paths using the finite element method. The computed crack contours exhibit excellent quantitative agreement with the experiment with respect to their shape, the stages of stable and unstable crack propagation and the transitions between them. Finally, also the crack length as a function of the electric field can be predicted.     

岩石偏心圆孔单裂纹平台圆盘的动态裂纹扩展与止裂

针对平台圆环构型的优点, 提出偏心圆孔单裂纹平台圆盘(cracked eccentrically holed flattened disc, CEHFD), 该试样具有更长的断裂路径。利用霍普金森压杆加载系统, 径向冲击CEHFD试样, 完成Ⅰ型动态断裂实验。砂岩试样表面粘贴应变片和裂纹扩展计, 用于监测裂纹动态起裂、扩展和止裂的全过程。实验表明, 在整个断裂过程中, 裂纹非匀速扩展, 裂纹扩展速度在裂纹起裂后加速上升, 在裂纹止裂前有明显的减速, 与地震时断层的动态破裂全过程完全吻合。采用实验-数值-解析法得到动态应力强度因子, 其时间历程呈现先增大后减小的趋势。根据断裂过程不同时刻, 得到相应的动态起裂韧度、扩展韧度及止裂韧度。在动态断裂全过程中, 动态扩展韧度为速度的函数, 变化趋势与速度一致, 随着时间先增大后减小; 动态起裂韧度大于动态止裂韧度, 止裂韧度随着裂纹最大扩展速度的增大而降低, 并且有较大的离散性。     

Equivalent thickness conception for corner cracks

Thickness dependence of the one-parameter-based fracture toughness has been well recognized and widely studied. However, it is still a challenge to predict the fracture of structures with curved cracks from the fracture toughness data obtained from the standard through-the-thickness cracked specimens. The complicated three-dimensional (3D) stress fields near the crack front play a vital role in the fracture strength of materials. Based on a systematical numerical study of the 3D stress fields near the crack tip of quarter elliptic corner cracks and comparison with that of ideal through-the-thickness cracks, an equivalent thickness conception for curved cracks is proposed from the viewpoint of out-of-plane constraint, and a semi-analytical solution for the equivalent thickness of corner cracks is obtained. With the evaluated equivalent thickness, the fracture toughness of corner cracked specimens is predicted efficiently by the plane-strain toughness value of the material obtained from the standard through-the-thickness specimen.     

The effect of indentation sequence on rock breakages: A study based on laboratory and numerical tests

Rock may response differently to external loads applied in different sequences. Thus, we conducted indentation tests to investigate the effect of the indentation sequence on rock breakages. Sequential indentations, consuming less indentation energy, usually resulted in larger and deeper grooves and then led to lower specific energies. Thus, we conclude that sequential indentations occur instead of simultaneous indentations form larger grooves with the same indentation energy. To further validate this conclusion, we performed a series of numerical tests. The numerical analysis of stress evolution shows that, for simultaneous indentations, the propagation of an internal crack from an inner rim restrained the propagation of the other internal crack from the other inner rim. However, the chipping pattern varied for sequential indentations. In the first indentation process, an internal crack, initiating from an inner rim, is usually connected with an internal crack caused by the second indentation. The deflection angles of the internal cracks for the sequential indentations were smaller because of the lower compressive stress in the horizontal direction. Then, these smaller deflection angles led to larger chips.     

Crack front pinning by design in planar heterogeneous interfaces

The propagation of an interfacial crack front along the weak plane of a thin film stack is considered. A simple patterning technique is used to create a toughness contrast within this perfectly two-dimensional weak interface. The transparency of the specimens allows us to directly observe the propagation of the purely planar crack obtained during a DCB (double cantilever beam) test. The effect on the crack front morphology of macroscopic unidimensional patterns in the direction of propagation is studied. In these weak pinning conditions, the geometry of the front quantitatively agrees with the first-order expansion proposed by Gao and Rice [1989. First-order perturbation analysis of crack trapping by arrays of obstacles. J. Appl. Mech. 56, 828-836] which accounts for the effect of the interfacial crack front geometry on the stress intensity factor.