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1.
Modeling the strengthening effect of grain boundaries (Hall-Petch effect) in metallic polycrystals in a physically consistent way, and without invoking arbitrary length scales, is a long-standing, unsolved problem. A two-scale method to treat predictively the interactions of large numbers of dislocations with grain boundaries has been developed, implemented, and tested. At the first scale, a standard grain-scale simulation (GSS) based on a finite element (FE) formulation makes use of recently proposed dislocation-density-based single-crystal constitutive equations (“SCCE-D”) to determine local stresses, strains, and slip magnitudes. At the second scale, a novel meso-scale simulation (MSS) redistributes the mobile part of the dislocation density within grains consistent with the plastic strain, computes the associated inter-dislocation back stress, and enforces local slip transmission criteria at grain boundaries.Compared with a standard crystal plasticity finite element (FE) model (CP-FEM), the two-scale model required only 5% more CPU time, making it suitable for practical material design. The model confers new capabilities as follows:
(1)
The two-scale method reproduced the dislocation densities predicted by analytical solutions of single pile-ups.
(2)
Two-scale simulations of 2D and 3D arrays of regular grains predicted Hall-Petch slopes for iron of 1.2 ± 0.3 MN/m3/2 and 1.5 ± 0.3 MN/m3/2, in agreement with a measured slope of 0.9 ± 0.1 MN/m3/2.
(3)
The tensile stress-strain response of coarse-grained Fe multi-crystals (9-39 grains) was predicted 2-4 times more accurately by the two-scale model as compared with CP-FEM or Taylor-type texture models.
(4)
The lattice curvature of a deformed Fe-3% Si columnar multi-crystal was predicted and measured. The measured maximum lattice curvature near grain boundaries agreed with model predictions within the experimental scatter.
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2.
Inspired by recent molecular dynamic simulations of nanocrystalline solids, a generalized self-consistent polycrystal model is proposed to study the transition of yield strength of polycrystalline metals as the grain size decreases from the traditional coarse grain to the nanometer scale. These atomic simulations revealed that a significant portion of atoms resides in the grain boundaries and the plastic flow of the grain-boundary region is responsible for the unique characteristics displayed by such materials. The proposed model takes each oriented grain and its immediate grain boundary to form a pair, which in turn is embedded in the infinite effective medium with a property representing the orientational average of all these pairs. We make use of the linear comparison composite to determine the nonlinear behavior of the nanocrystalline polycrystal through the concept of secant moduli. To this end an auxiliary problem of Christensen and Lo (J. Mech. Phys. Solids 27 (1979) 315) superimposed on the eigenstrain field of Luo and Weng (Mech. Mater. 6 (1987) 347) is first considered, and then the nonlinear elastoplastic polycrystal problem is addressed. The plastic flow of each grain is calculated from its crystallographic slips, but the plastic behavior of the grain-boundary phase is modeled as that of an amorphous material. The calculated yield stress for Cu is found to follow the classic Hall-Petch relation initially, but as the gain size decreases it begins to depart from it. The yield strength eventually attains a maximum at a critical grain size and then the Hall-Petch slope turns negative in the nano-range. It is also found that, when the Hall-Petch relation is observed, the plastic behavior of the polycrystal is governed by crystallographic slips in the grains, but when the slope is negative it is governed by the grain boundaries. During the transition both grains and grain boundaries contribute competitively.  相似文献   

3.
Superelastic deformation of thin Ni-Ti wires containing various nanograined microstructures was investigated by tensile cyclic loading with in situ evaluation of electric resistivity. Defects created by the superelastic cycling in these wires were analyzed by transmission electron microscopy. The role of dislocation slip in superelastic deformation is discussed. Ni-Ti wires having finest microstructures (grain diameter <100 nm) are highly resistant against dislocation slip, while those with fully recrystallized microstructure and grain size exceeding 200 nm are prone to dislocation slip. The density of the observed dislocation defects increases significantly with increasing grain size. The upper plateau stress of the superelastic stress-strain curves is largely grain size independent from 10 up to 1000 nm. It is hence claimed that the Hall-Petch relationship fails for the stress-induced martensitic transformation in this grain size range. It is proposed that dislocation slip taking place during superelastic cycling is responsible for the accumulated irreversible strains, cyclic instability and degradation of functional properties. No residual martensite phase was found in the microstructures of superelastically cycled wires by TEM and results of the in situ electric resistance measurements during straining also indirectly suggest that none or very little martensite phase remains in the studied cycled superelastic wires after unloading. The accumulation of dislocation defects, however, does not prevent the superelasticity. It only affects the shape of the stress-strain response, makes it unstable upon cycling and changes the deformation mode from localized to homogeneous. The activity of dislocation slip during superelastic deformation of Ni-Ti increases with increasing test temperature and ultimately destroys the superelasticity as the plateau stress approaches the yield stress for slip. Deformation twins in the austenite phase ({1 1 4} compound twins) were frequently found in cycled wires having largest grain size. It is proposed that they formed in the highly deformed B19′ martensite phase during forward loading and are retained in austenite after unloading. Such twinning would represent an additional deformation mechanism of Ni-Ti yielding residual irrecoverable strains.  相似文献   

4.
Size effects on the martensitic phase transformation of NiTi nanograins   总被引:1,自引:0,他引:1  
The analysis of nanocrystalline NiTi by transmission electron microscopy (TEM) shows that the martensitic transformation proceeds by the formation of atomic-scale twins. Grains of a size less than about 50 nm do not transform to martensite even upon large undercooling. A systematic investigation of these phenomena was carried out elucidating the influence of the grain size on the energy barrier of the transformation. Based on the experiment, nanograins were modeled as spherical inclusions containing (0 0 1) compound twinned martensite. Decomposition of the transformation strains of the inclusions into a shear eigenstrain and a normal eigenstrain facilitates the analytical calculation of shear and normal strain energies in dependence of grain size, twin layer width and elastic properties. Stresses were computed analytically for special cases, otherwise numerically. The shear stresses that alternate from twin layer to twin layer are concentrated at the grain boundaries causing a contribution to the strain energy scaling with the surface area of the inclusion, whereas the strain energy induced by the normal components of the transformation strain and the temperature dependent chemical free energy scale with the volume of the inclusion. In the nanograins these different energy contributions were calculated which allow to predict a critical grain size below which the martensitic transformation becomes unlikely. Finally, the experimental result of the atomic-scale twinning can be explained by analytical calculations that account for the transformation-opposing contributions of the shear strain and the twin boundary energy of the twin-banded morphology of martensitic nanograins.  相似文献   

5.
纳米晶铜单向拉伸变形的分子动力学模拟   总被引:13,自引:0,他引:13  
纳米材料是由尺度在1-100nm的微小颗粒组成的体系,由于它具有独特的性能而备受关注。本文简要地回顾了分子动力学在纳米材料研究中的应用,并运用它模拟了平均晶粒尺寸从1.79-5.38nm的纳米晶体的力学性质。模拟结果显示:随着晶粒尺寸的减小,系统与晶粒内部的原子平均能量升高,而晶界上则有所下降;纳米晶体的弹性模量要小于普通多晶体,并随着晶粒尺寸的减小而减小;纳米晶铜的强度随着晶粒的减小而减小,显示了反常的Hall-Petch效应;纳米晶体的塑性变形主要是通过晶界滑移与运动,以及晶粒的转动来实现的;位错运动起着次要的、有限的作用;在较大的应变下(约大于5%),位错运动开始起作用;这种作用随着晶粒尺寸的增加而愈加明显。  相似文献   

6.
Atomistic simulations were used to investigate dislocation nucleation from Σ3 asymmetric (inclined) tilt grain boundaries under uniaxial tension applied perpendicular to the boundary. Molecular dynamics was employed based on embedded atom method potentials for Cu and Al at 10 K and 300 K. Results include the grain boundary structure and energy, along with mechanical properties and mechanisms associated with dislocation nucleation from these Σ3 boundaries. The stress and work required for dislocation nucleation were calculated along with elastic stiffness of the bicrystal configurations, exploring the change in response as a function of inclination angle. Analyses of dislocation nucleation mechanisms for asymmetric Σ3 boundaries in Cu show that dislocation nucleation is preceded by dislocation dissociation from the boundary. Then, dislocations preferentially nucleate in only one crystal on the maximum Schmid factor slip plane(s) for that crystal. However, this crystal is not simply predicted based on either the Schmid or non-Schmid factors. The synthesis of these results provides a better understanding of the dislocation nucleation process in these faceted, dissociated grain boundaries.  相似文献   

7.
Dependence of activation volume with flow stress is examined for metals with grain size lower than 0.3 μm and larger than few tens of nanometers, where plastic deformation is most likely to be governed by a combination of grain boundary sliding and dislocations activity. The experimentally observed deviation from the classic linear behavior given by Cottrell–Stokes law [Basinski, Z.S., 1974. Forest hardening in face centered cubic metals. Scripta Metallurgica 8, 1301–1308] is analyzed, thanks to a modified Orowan equation taking into account of the grain boundaries sliding coupled to dislocations activity. These results are compared to experimental measurements of the activation volume, between room temperature and 120 °C, for a copper nanostructure with a grain size of 100 nm. A constant activation volume is observed at low stress (or high temperature) followed by an increase of activation volume with stress (inverse Cottrell–Stokes behavior). This analysis follows our initial experiments on this fine grained metal prepared by powder metallurgy, which exhibits ductility at near constant stress and strain rate [Champion, Y., Langlois, C., Guérin-Mailly, S., Langlois, P., Bonnentien, J.-L., Hÿtch, M.J., 2003. Near-perfect elastoplasticity in pure nanocrystalline copper. Science 300, 310–311].  相似文献   

8.
The microstructure of the nanocrystalline can be divided generally into two parts: grain and interface. When the grain size is about or less than 10 nm, the interface can be divided into grain boundary and triple junctions. The mechanical performance of nanocrystalline materials with complicated microstructures is greatly different from that of the coarse grain materials. In this paper, the nanocrystalline material is considered as a composite with three phases: the grain core, the grain boundaries, and the triple junction. The model analysis for nanocrystalline material deformation is established and the relationship between yield strength and grain size is obtained. The obtained result explains the inverse Hall–Petch relation.  相似文献   

9.
The indentation response of Ni thin films of thicknesses in the nanoscale was studied using molecular dynamics simulations with embedded atom method (EAM) interatomic potentials. A series of simulations were performed in films in the [1 1 1] orientation with thicknesses varying from 4 to 12.8 nm. The study included both single crystal films and films containing low angle grain boundaries perpendicular to the film surface. The simulation results for single crystal films show that as film thickness decreases larger forces are required for similar indentation depths but the contact stress necessary to emit the first dislocation under the indenter is nearly independent of film thickness. The low angle grain boundaries can act as dislocation sources under indentation. The mechanism of preferred dislocation emission from these boundaries operates at stresses that are lower as the film thickness increases and is not active for the thinnest films tested. These results are interpreted in terms of a simple model.  相似文献   

10.
Molecular dynamics simulations are used to evaluate the primary interface dislocation sources and to estimate both the free enthalpy of activation and the critical emission stress associated with the interfacial dislocation emission mechanism. Simulations are performed on copper to study tensile failure of a planar Σ5 {2 1 0} 53.1° interface and an interface with the same misorientation that contains a ledge. Simulations reveal that grain boundary ledges are more favorable as dislocation sources than planar regions of the interface and that their role is not limited to that of simple dislocation donors. The parameters extracted from the simulations are utilized in a two-phase composite mesoscopic model for nanocrystalline deformation that includes the effects of both dislocation emission and dislocation absorption mechanisms. A self-consistent approach based on the Eshelby solution for grains as ellipsoidal inclusions is augmented by introduction of stress concentration in the constitutive law of the matrix phase to account for more realistic grain boundary effects. Model simulations suggest that stress concentration is required in the standard continuum theory to activate the coupled grain boundary dislocation emission and absorption mechanisms when activation energy of the dislocation source is determined from atomistic calculation on grain boundaries without consideration of impurities or other extrinsic defects.  相似文献   

11.
We report results of uniaxial compression tests on Zr35Ti30Co6Be29 metallic glass nano-pillars with diameters ranging from ∼1.6 μm to ∼100 nm. The tested pillars have nearly vertical sidewalls, with the tapering angle lower than ∼1° (diameter >200 nm) or ∼2° (diameter ∼100 nm), and with a flat pillar top to minimize the artifacts due to imperfect geometry. We report that highly-localized-to-homogeneous deformation mode change occurs at 100 nm diameter, without any change in the yield strength. We also find that yield strength depends on size only down to 800 nm, below which it remains at its maximum value of 2.6 GPa. Quantitative Weibull analysis suggests that the increase in strength cannot be solely attributed to the lower probability of having weak flaws in small samples - most likely there is an additional influence of the sample size on the plastic deformation mechanism.  相似文献   

12.
Microstructure evolution in thin Cu films during room temperature self-annealing is investigated by means of a mesoscale level set model. The model is formulated such that the relative, or collective, influence of anisotropic grain boundary energy, mobility and heterogeneously distributed stored energy can be investigated. Density functional theory (DFT) calculations are performed in the present work to provide the variation of grain boundary energy for different grain boundary configurations. The stability of the predominant (111) fiber texture in the as-deposited state is studied as well as the stability of some special low-Σ grain boundaries. Further, the numerical model allows tracing of the grain size distribution and occurrence of abnormal grain growth during self-annealing. It is found that abnormal grain growth depends mainly on the presence of stored energy variations, whereas anisotropic grain boundary energy or mobility is insufficient to trigger any abnormal growth in the model. However, texture dependent grain boundary properties, mobility in particular, contribute to an increased content of low-Σ boundaries in the annealed microstructure. The increased presence of such boundaries is also promoted by stored energy variations. In addition, if the stored energy variations are sufficient the coexisting (111) and (001) texture components in the as-deposited state will evolve into a (001) dominated texture during annealing. Further, it is found that whereas stored energy variations promote the stability of the (001) texture component, anisotropic grain boundary energy and mobility tend to work the other way and stabilize the (111) component at the expense of (001) grains.  相似文献   

13.
There is much interest recently in the possibility of combining two strengthening effects, namely the reduction of grain size (Hall-Petch effect) and the transformation-induced plasticity effect (strengthening due to a martensitic transformation). The present work is concerned with the analysis of the combination of these two effects using a discrete dislocation-transformation model. The transformation-induced plasticity mechanism is studied for aggregates of grains of ferrite and austenite of different sizes. The discrete model allows to simulate the behavior at sub-grain length scales, capturing the complex interaction between pile-ups at grain boundaries and the evolution of the microstructure due to transformation. The simulations indicate that, as the average grain size decreases, the relative strengthening due to the formation of martensite is significantly reduced and that the overall strengthening is mostly due to a Hall-Petch effect. This finding suggests that strengthening by the transformation-induced plasticity mechanism is ineffective in the presence of fine-grained microstructures.  相似文献   

14.
A new constitutive law is introduced to quantify the macroscopic effect of grain boundary dislocation emission on the behavior of pure face center cubic nanocrystalline materials. It is postulated that an emitted dislocation ends its trajectory in the grain boundary opposite to the source causing mass transfer. Dislocation emission by grain boundary ledges, considered here as the primary grain-boundary sources, is modeled as a thermally activated mechanism and the penetration of an emitted dislocation is assimilated as a soft collision. The macroscopic behavior of the material is retrieved via the use of a secant self-consistent scheme. The material is seen as a two-phase composite where the inclusion phase represents grain cores, their behavior is driven by dislocation glide, and where the matrix phase, governed by the newly introduced dislocation emission and penetration mechanism, represents both grain boundaries and triple junctions. The long range stress field arising from the presence of grain boundaries is taken into account in the critical glide resistance stress at 0 K in the inclusion phase. The model is applied to polycrystal copper and results in pure tension and creep are compared to experiments. Good agreements between the experimental measurements and the model predictions are observed.  相似文献   

15.
The brittle versus ductile transition for conventional metals is dictated by the competition between dislocation emission and cleavage. For nanocrystalline metals with grain size below 25 nm, however, dislocation activities are suppressed and the classic theory fails to apply. In this paper, one of the competing mechanisms that control the brittle versus ductile transition of nanocrystalline metals is found to be the grain boundary dominated creep deformation versus the grain boundary decohesion. A model is proposed to quantify the crack propagation in nanocrystalline metals. The effects of material properties, initial configuration and applied loads on the property of crack propagation are addressed. It is concluded that either the increases in the initial crack length, the applied load and the grain boundary damage, or the deterrence in creep deformation, accelerate the crack propagation, and vice versa.  相似文献   

16.
Nanotwinned polycrystals exhibit an excellent strength-ductility combination due to nanoscale twins and grains. However, nanotwin-assisted grain coarsening under mechanical loading reported in recent experiments may result in strength drop based on the Hall-Petch law. In this paper, a phase-field model is developed to investigate the effect of coupled evolutions of twin and grain boundaries on nanotwin-assisted grain growth. The simulation result demonstrates that there are three pathways for coupled motions of twin and grain boundaries in a bicrystal under the applied loading, dependent on the amplitude of applied loading and misorientation of the bicrystal. It reveals that a large misorientation angle and a large applied stress promote the twinning-driven grain boundary migration. The resultant twin-assisted grain coarsening is confirmed in the simulations for the microstructural evolutions in twinned and un-twinned polycrystals under a high applied stress.  相似文献   

17.
The equilibrated grain boundary groove shapes for solid Zn solution (Zn-3.0 at.% Al-0.3 at.% Bi) in equilibrium with the Zn-Al-Bi eutectic liquid (Zn-12.7 at.% Al-1.6 at.% Bi) have been observed from quenched sample with a radial heat flow apparatus. Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy for solid Zn solution in equilibrium with Al-Bi-Zn eutectic liquid have been determined to be (5.1 ± 0.4) × 10−8 K m, (80.1 ± 9.6) × 10−3 and (158.6 ± 20.6) × 10−3 J m−2 from the observed grain boundary groove shapes, respectively. The thermal conductivity variation with temperature for solid Zn solution has been measure with radial heat flow apparatus and the value of thermal conductivity for solid Zn solution has been determined to be 135.68 W/km at the eutectic melting temperature. The thermal conductivity ratio of equilibrated eutectic liquid to solid Zn solution, R = KL(Zn)/KS(Zn) has also been measured to be 0.85 with Bridgman type solidification apparatus.  相似文献   

18.
Interactions between dislocations and grain boundaries play an important role in the plastic deformation of polycrystalline metals. Capturing accurately the behaviour of these internal interfaces is particularly important for applications where the relative grain boundary fraction is significant, such as ultra fine-grained metals, thin films and micro-devices. Incorporating these micro-scale interactions (which are sensitive to a number of dislocation, interface and crystallographic parameters) within a macro-scale crystal plasticity model poses a challenge. The innovative features in the present paper include (i) the formulation of a thermodynamically consistent grain boundary interface model within a microstructurally motivated strain gradient crystal plasticity framework, (ii) the presence of intra-grain slip system coupling through a microstructurally derived internal stress, (iii) the incorporation of inter-grain slip system coupling via an interface energy accounting for both the magnitude and direction of contributions to the residual defect from all slip systems in the two neighbouring grains, and (iv) the numerical implementation of the grain boundary model to directly investigate the influence of the interface constitutive parameters on plastic deformation. The model problem of a bicrystal deforming in plane strain is analysed. The influence of dissipative and energetic interface hardening, grain misorientation, asymmetry in the grain orientations and the grain size are systematically investigated. In each case, the crystal response is compared with reference calculations with grain boundaries that are either ‘microhard’ (impenetrable to dislocations) or ‘microfree’ (an infinite dislocation sink).  相似文献   

19.
A traction-displacement relationship that may be embedded into a cohesive zone model for microscale problems of intergranular fracture is extracted from atomistic molecular-dynamics (MD) simulations. An MD model for crack propagation under steady-state conditions is developed to analyze intergranular fracture along a flat Σ99 [1 1 0] symmetric tilt grain boundary in aluminum. Under hydrostatic tensile load, the simulation reveals asymmetric crack propagation in the two opposite directions along the grain boundary. In one direction, the crack propagates in a brittle manner by cleavage with very little or no dislocation emission, and in the other direction, the propagation is ductile through the mechanism of deformation twinning. This behavior is consistent with the Rice criterion for cleavage vs. dislocation blunting transition at the crack tip. The preference for twinning to dislocation slip is in agreement with the predictions of the Tadmor and Hai criterion. A comparison with finite element calculations shows that while the stress field around the brittle crack tip follows the expected elastic solution for the given boundary conditions of the model, the stress field around the twinning crack tip has a strong plastic contribution. Through the definition of a Cohesive-Zone-Volume-Element—an atomistic analog to a continuum cohesive zone model element—the results from the MD simulation are recast to obtain an average continuum traction-displacement relationship to represent cohesive zone interaction along a characteristic length of the grain boundary interface for the cases of ductile and brittle decohesion.  相似文献   

20.
A strain gradient dependent crystal plasticity approach is used to model the constitutive behaviour of polycrystal FCC metals under large plastic deformation. Material points are considered as aggregates of grains, subdivided into several fictitious grain fractions: a single crystal volume element stands for the grain interior whereas grain boundaries are represented by bi-crystal volume elements, each having the crystallographic lattice orientations of its adjacent crystals. A relaxed Taylor-like interaction law is used for the transition from the local to the global scale. It is relaxed with respect to the bi-crystals, providing compatibility and stress equilibrium at their internal interface. During loading, the bi-crystal boundaries deform dissimilar to the associated grain interior. Arising from this heterogeneity, a geometrically necessary dislocation (GND) density can be computed, which is required to restore compatibility of the crystallographic lattice. This effect provides a physically based method to account for the additional hardening as introduced by the GNDs, the magnitude of which is related to the grain size. Hence, a scale-dependent response is obtained, for which the numerical simulations predict a mechanical behaviour corresponding to the Hall-Petch effect. Compared to a full-scale finite element model reported in the literature, the present polycrystalline crystal plasticity model is of equal quality yet much more efficient from a computational point of view for simulating uniaxial tension experiments with various grain sizes.  相似文献   

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