Interface crack problem in layered orthotropic materials under thermo-mechanical loading

In the present paper, the behavior of an interface crack for a homogeneous orthotropic strip sandwiched between two different functionally graded orthotropic materials subjected to thermal and mechanical loading is considered. It is assumed that interface crack is partly insulated, and the temperature drop across the crack surfaces is the result of the thermal resistance due to the heat conduction through the crack region. The elastic properties of the material are assumed to vary continuously along the thickness direction. The principal directions of orthotropy are parallel and perpendicular to the crack orientation. The complicated mixed boundary problems of equations of heat conduction and elasticity are converted analytically into singular integral equations, which are solved numerically. The main objective of the paper is to study the effects of material nonhomogeneity parameters and the dimensionless thermal resistance on the thermal stress intensity factors for the purpose of gaining better understanding of the thermal behavior of graded layer.     

A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply

In this paper, thermal response of an orthotropic functionally graded coating-substrate structure with a partially insulated interface crack under heat flux supply is considered. It is assumed that there exists thermal resistance to heat conduction through the crack region. The mixed boundary value problems are reduced to a system of singular integral equations and solved numerically. Higher order asymptotic terms for the singular integral kernels are considered to improve the accuracy and the convergence efficiency of the numerical integrals. Numerical results are presented to show the effects of the orthotropy parameters, thermo-elastic nonhomogeneity parameters, and dimensionless thermal resistance on the temperature distribution and the thermal stress intensity factors (SIFs).     

Thermal response of a partially insulated interface crack in a graded coating-substrate structure under thermo-mechanical disturbance: Energy release and density

Consider the thermal fracture problem of a functionally graded coating-substrate structure of finite thickness with a partially insulated interface crack subjected to thermal-mechanical supply. A new model is proposed that the heat conduction through the crack region occurs and the temperature drop across the crack surfaces is the result of the thermal resistance. For the first time, real fundamental solutions are derived for the fracture analysis of functionally graded materials. The complicated mixed boundary problems of equations of heat conduction and elasticity are converted analytically into singular integral equations, which are solved numerically. The asymptotic expressions with higher order terms for the singular integral kernels are considered to improve the accuracy and efficiency of the numerical integration. Explicit expressions of various failure modes including stress intensity factors, energy release rate and strain energy density, are provided. Numerical results are presented to illustrate the effects of non-homogeneity parameters and the dimensionless thermal resistance on the temperature distribution along the crack surfaces and extended crack line, the thermal stress intensity factors and minimum strain energy density.     

A solution to the thermo-elastic interface crack branching in dissimilar anisotropic bi-material media

An interface crack or delamination may often branch out of the interface in a laminated composite due to thermal stresses developing around the delamination/crack tip when the media is exposed to heat flow induced by environmental events such as a sudden short-duration fire. In this paper, the thermo-elastic problem of interface crack branching in dissimilar anisotropic bi-media is studied by using the theory of Stroh’s dislocation formalism, extended to thermo-elasticity in matrix notation. Based on the complex variable method and the analytical continuation principle, the thermo-elastic interface crack/delamination problem is examined and a general solution in compact form is derived for dissimilar anisotropic bi-media. A set of Green’s functions is proposed for the dislocations (conventional dislocation and thermal dislocation/heat vortex) in anisotropic bi-media. These functions may be more suitable than those which have appeared in the literature on addressing thermo-elastic interface crack branching in dissimilar anisotropic bi-materials. Using the contour integral method, a closed form solution to the interaction between the dislocations and the interface crack is obtained. Within the scope of linear fracture mechanics, the thermo-elastic problem of interface crack branching is then solved by modelling the branched portion as a continuous distribution of dislocations. The influence of thermal loading and thermal properties on the branching behavior is examined, and criteria for predicting interface crack branching are suggested, based on the extensive numerical results from the study of various cases.     

Thermal weight functions for bi-material interface crack system using energy principles

In this study, Betti’s reciprocal theorem and the principle of superposition are used to obtain weight functions in a two-dimensional bi-material interface crack system for any loading, in general and thermal loading, in particular. It is shown that the general expression of weight functions for bi-materials interface crack problems is of the same type as that found in a homogeneous mixed mode loading case. Furthermore, a computational approach has been developed for calculation of thermal stress intensity factors for bi-material interface cracks subjected to thermal loading under quasi-static uncoupled thermo-elasticity assumption. The thermal weight function (TWF) expression and computational scheme have been validated using three examples given in the available literature.     

Stress intensity factor for an edge crack in two bonded dissimilar materials under convective cooling

The transient thermal stress crack problem for two bonded dissimilar materials subjected to a convective cooling on the surface containing an edge crack perpendicular to the interface is considered. The problem is solved using the principle of superposition and the uncoupled quasi-static thermoelasticity. The crack problem is formulated by applying the transient thermal stresses obtained from the uncracked medium with opposite sign on the crack surfaces to be the only external loads. Fourier integral transform is used to solve the perturbation problem resulting in a singular integral equation of Cauchy type in which the derivative of the crack surface displacement is the unknown function. The numerical results of the stress intensity factors are calculated for both the edge crack and the crack terminating at the interface using two different composite materials and illustrated as a function of time, crack length, coefficient of heat transfer, and the thickness ratio.     

Interfacial transient thermal fracture of adhesively bonded dissimilar materials

The effect of a transient thermal load on an interface crack in adhesively bonded dissimilar materials was experimentally studied by using photothermoelasticity. It is determined that the effect of the thermal load is to cause mostly shearing deformations at the crack tip. For two configurations, a horizontal crack (normal to the heat flow direction) and a vertical crack (parallel to the heat flow direction), it is shown that increasing the adhesive thickness results in steady-state and maximum transient strain-energy release rates and stress-intensity factors of smaller magnitudes. It is also found that the ratio of mode I to mode II stressintensity factors for the vertical crack is larger than the one for the horizontal crack.     

Thermal fracture of a functionally graded/homogeneous bimaterial with system of cracks

The thermal fracture of a bimaterial consisting of a homogeneous material and a functionally graded material (FGM) with a system of internal cracks and an interface crack is investigated. The bimaterial is subjected to a heat flux. The thermal properties of FGM are assumed to be continues functions of the thickness coordinate, while the elastic properties are constants. The method of the solution is based on the singular integral equations. For a special case where the interface crack is much larger than the internal cracks in the FGM the asymptotic analytical solution of the problem is obtained as series in a small parameter (the ratio between sizes of the internal and interface crack) and the thermal stress intensity factors (TSIFs) are derived as functions of geometry of the problem and material characteristics. A parametric analysis of the effects of the location and orientation of the cracks and of the inhomogeneity parameter of FGM’s thermal conductivity on the TSIFs is performed. The results are applicable to such kinds FGMs as ceramic/ceramic FGMs, e.g., TiC/SiC, MoSi₂/Al₂O₃ and MoSi₂/SiC, and also some ceramic/metal FGMs.     

Fatigue crack propagation life analysis of solder joints under thermal cyclic loading

Fatigue crack propagation life analysis of solder joints under thermal cyclic loadings was investigated by the strain energy release rate method using finite element analysis. A relationship between the crack-growth rate and the strain energy release rate was derived. Finite element simulations were carried out to investigate the effect of crack growth along the interface of solder and lead in a solder joint assembly. The crack propagation life of the solder joint with an interface crack was predicted from the derived relationship between crack growth rate and values of the strain energy release rate. It was found that crack propagation life is much higher than the crack initiation life.     

Transient thermal elastic fracture of a piezoelectric cylinder specimen

A finite piezoelectric cylinder with an embedded penny-shaped crack is investigated for a thermal shock load on the outer surface of the cylinder. The theory of linear electro-elasticity is applied to solve the transient temperature field and the associated thermal stresses and electrical displacements without crack. These thermal stresses and electrical displacements are added to the surfaces of the crack to form an electromechanical coupling and mixed mode boundary-value problem. The electrically permeable crack face boundary condition assumption is used, and the thermal stress intensity factor and electrical displacement intensity factor at the crack border are evaluated. The thermal shock resistance of the piezoelectric cylinder is evaluated for the analysis of piezoelectric material failure in practical engineering applications.     

应用通用权函数法计算热机载荷作用下三维界面裂纹的应力强度因子

热机载荷共同作用下双材料、复合材料中的裂纹扩展往往发生在界面处,并且工程中实际遇到的裂纹大多数是三维裂纹,传统的求解热冲击及机械载荷共同作用下界面裂纹应力强度因子的数值方法如有限元、边界元法计算量大,计算效率低。由于通用权函数仅仅与裂纹体的几何形状有关,与载荷、时间无关,求解应力强度因子时避免了反复的应力分析,计算效率大大提高, 通用权函数法非常适合计算复杂冲击载荷下应力强度因子分布的过渡过程。根据Betti互易原理,本文推导出了三维界面裂纹问题通用权函数法的普遍表达式,并给出了热机载荷共同作用下三维界面I型、Ⅱ型和Ⅲ型裂纹问题通用权函数法的有限元格式. 通过实例计算比较,表明此方法得到的结果可以达到满意的工程应用精度。     

A closed crack tip model for interface cracks inthermopiezoelectric materials

The interface crack problem of a bimaterial thermopiezoelectric solid was treated byapplying the extended version of Strohs formalism and singular integral equation approach. Theinterface crack considered is subjected to combined thermal, mechanical and electric loads.Under the applied loading, the interface crack is assumed to be partially opened. Formulation ofthe problem results in a set of singular integral equations which are solved numerically. Thestudy shows that the contact zone is extremely small in comparison with the crack length. Basedon the formulation, some physically meaningful quantities of interest such as stress intensityfactors and size of contact zone for a particular material group are analyzed.     

Kinetics of crack formation and growth on the material interface

A model of thermal fluctuation crack formation in aweakened bond region on amaterial interface is proposed. The weakened bond region is modeled by a bridged crack whose properties vary in time according to the thermal fluctuation mechanism. It is assumed that at least one of the materials is a polymer and the crack part occupied by bridges (the end region) is not small compared with the crack length. The stresses in the bridges and the kinetic dependence of the bond density in the crack end region are determined by solving a system of singular integrodifferential equations. The condition for the crack-defect nucleation is the decrease to the critical value of the average bond density on the corresponding part of the weakened bond region. Numerical results permitting one to estimate the crack nucleation time and the typical levels of external loads for the chosen material parameters are presented.     

Crack deflection at an interface between dissimilar elastic materials: Role of residual stresses

A crack intersecting an interface between two dissimilar materials may advance by either penetrating through the interface or deflecting into the interface. The competition between deflection and penetration can be assessed by comparison of two ratios: (i) the ratio of the energy release rates for interface cracking and crack penetration; and (ii) the ratio of interface to material fracture energies. Residual stresses caused by thermal expansion misfit can influence the energy release rates of both the deflected and penetrating crack. This paper analyses the role of residual stresses. The results reveal that expansion misfit can be profoundly important in systems with planar interfaces (such as layered materials, thin film structures, etc.), but generally can be expected to be of little significance in fiber composites. This paper corrects an earlier result for the ratio of the energy release rate for the doubly deflected crack to that for the penetrating crack in the absence of residual stress.     

高温下钢管自密实混凝土界面接触热阻试验研究

钢管混凝土结构的火灾性能研究通常要考虑钢管和混凝土的界面接触热阻问题,本文对钢管自密实混凝土柱的界面接触热阻进行了试验研究。制作了8个钢管自密实混凝土柱,依据Fourier定律和Newton冷却定律得到了钢管混凝土界面接触热阻的求解方法。利用有限元和多项式拟合外推得到界面温度,得出钢管混凝土接触热阻随着钢管界面温度的变化规律。试验结果表明,未受载的钢管自密实混凝土界面接触热阻平均值范围在0.002~0.01m2·K/W,与其他文献结果相比有一定可靠性。     

基于内聚力模型法PBGA封装焊点/IMC界面的分层开裂研究

塑料球栅阵列封装PBGA的可靠性分析中,考虑封装过程中SnAgCu焊料与铜焊盘界面间产生的金属间化合物（Intermetallic compound,IMC）的影响,并引入内聚力模型（Cohesive zone model, CZM）,利用ANSYS对热循环作用下焊点/IMC界面的脱层开裂情况进行研究。结果表明：热循环作用下,在封装器件中焊点承受较大的应力应变,且远离中心的外侧焊点具有比内侧焊点更大的应力应变。IMC的存在极大的降低了焊点的可靠性。界面分层最先发生在最外侧的IMC/焊点界面的两端,随着热循环次数的增加,分层逐渐沿着界面两端向里扩展。在热循环的前几个阶段,各个界面的最大损伤值增大较快,随着热循环的继续加载,界面最大损伤值逐渐趋于稳定。整个过程中四号焊点界面的损伤值始终最大。     

Experimental investigation of high temperature thermal contact resistance with interface material

Thermal contact resistance plays a very important role in heat transfer efficiency and thermomechanical coupling response between two materials, and a common method to reduce the thermal contact resistance is to fill a soft interface material between these two materials. A testing system of high temperature thermal contact resistance based on INSTRON 8874 is established in the present paper, which can achieve 600°C at the interface. Based on this system, the thermal contact resistance between superalloy GH600 material and three-dimensional braid C/C composite material is experimentally investigated, under different interface pressures, interface roughnesses and temperatures, respectively. At the same time, the mechanism of reducing the thermal contact resistance with carbon fiber sheet as interface material is experimentally investigated. Results show that the present testing system is feasible in the experimental research of high temperature thermal contact resistance.     

FRACTURE ASSESSMENT OF AN INTERFACE CRACK BETWEEN TWO DISSIMILAR MAGNETOELECTROELASTIC MATERIALS UNDER HEAT FLOW AND MAGNETOELECTROMECHANICAL LOADINGS

A magnetoelectrically permeable interface crack between two semi-infinite magnetoelectroelastic planes under the action of a heat flow and remote magnetoelectromechanical loadings is considered, where the assumption of frictionless contact between two dissimilar halfplanes is adopted. Not only the solutions of the interface crack problem are presented in an explicit form, but also the general condition for the transition from a perfect thermal contact of two magnetoelectroelastic bodies to their separation is given.     

含半椭圆型表面缺陷陶瓷材料的热冲击阻力分析

本文研究一个有半椭圆型表面缺陷的陶瓷材料板的热冲击阻力问题.通过多项式形式的应力和几何形状因子得到半椭圆型表面裂纹尖端的热应力强度因子.以蓝宝石陶瓷板为例,基于最大应力准则和断裂韧性准则分析其热冲击阻力行为,并由这两个准则得到其强度计算中真实的热冲击阻力曲线.