Longitudinal,transverse,density-of-states,and conductivity masses of electrons in（001）,（101） and（111） biaxiallystrained-Si and strained-Si1-xGex

In this study,the electron effective masses,including longitudinal,transverse,density-of-states and conductivity effective masses,have been systematically investigated in(001),(101) and(111) biaxially strained Si and Si1-xGex.It is found that the effect of strain on the longitudinal and transverse masses can be neglected,that the density-of-states masses in(001) and(110) biaxially strained Si and Si1-xGex materials decrease significantly with increasing Ge fraction(x),and that the conductivity masses along typical orientations in(001) and(110) strained Si and Si1-xGex.are obviously different from those in relaxed Si.The quantitative results obtained from this work may provide valuable theoretical references to understanding strained materials physics and studying conduction channel design related to stress and orientations in the strained devices.     

Electroluminescence from Si／SiO2 films deposited on p—Si substrates

The structure of Au/Si/SiO₂/p-Si has been fabricated using the magnetron sputtering technique. It has a very good rectifying behaviour. Visible electroluminescence (EL) has been observed from the Au/Si/SiO₂/p-Si structure at a forward bias of 5V or larger. A broad band with one peak around 650－660 nm appears in all the EL spectra of the structure. The effects of the thickness of the Si layer in the Si/SiO₂ films and of the input electrical power on EL spectra are studied systematically.     

Si/Gen/Si(001)异质结薄膜的掠入射荧光X射线吸收精细结构研究

利用掠入射荧光X射线吸收精细结构(XAFS)方法研究了在400℃的温度下分子束外延生长的Si/Gen/Si(001)异质结薄膜(n=1,2,4和8个原子层)中Ge原子的局域环境结构.结果表明,在1至2个Ge原子层(ML)生长厚度的异质结薄膜中,Ge原子的第一近邻配位主要是Si原子.随着Ge原子层厚度增加到4 ML,Ge原子的最近邻配位壳层中的Ge-Ge配位的平均配位数增加到1.3.当Ge原子层厚度增加到8 ML时,第一配位壳层中的Ge-Ge配位占的比例只有55%.这表明在400℃的生长条件下,Ge原子有很强的迁移到Si覆盖层的能力.随着Ge层厚度从1增加到2,4和8 ML,Ge原子迁移到Si覆盖层的量由0.5 ML分别增加到1.5,2.0和3.0 ML.认为在覆盖Si过程中Ge原子的迁移主要是通过产生Ge原子表面偏析来降低表面能和Ge层的应变能.     

Si1－xGex/Si量子阱发光材料的分子束外延生长及其结构研究

采用固源Si分子束外延,在较高的生长温度于Si(100)衬底上制备出Si1－xGex/Si量子阱发光材料。发光样品的质量和特性通过卢瑟福背散射、X射线双晶衍射及光致发光评估。背散射实验中观察到应变超晶格的反常沟道效应;X射线分析表明材料的生长是共度的、无应力释放的,结晶完整性好。低温光致发光主要是外延合金量子阱中带边激子的无声发射和横光学声子参与的激子复合。并讨论了生长温度对量于阱发光的影响。     

Si_（1－x）Ge_x／Si量子阱发光材料的分子束外延生长及其结构研究

采用固源Ｓｉ分子束外延，在较高的生长温度于Ｓｉ（１００）衬底上制备出Ｓｉ１－ｘＧｅｘ／Ｓｉ量子阱发光材料．发光样品的质量和特性通过卢瑟福背散射、Ｘ射线双晶衍射及光致发光评估．背散射实验中观察到应变超晶格的反常沟道效应；Ｘ射线分析表明材料的生长是共度的、无应力释放的，结晶完整性好．低温光致发光主要是外延合金量子阱中带边激子的无声发射和横光学声子参与的激子复合．并讨论了生长温度对量于阱发光的影响．     

GexSi1—x／Si和Ge／Si应变层超晶格

ＧｅｘＳｉ１－ｘ／Ｓｉ和Ｇｅ／Ｓｉ应变层超晶格是半导体超晶格中新发展起来的一种类型．本文简要地介绍了这类超晶格在生长和物理特性方面的一些基本问题，列举了它在器件应用方面的例子．给出了共度生长时超晶格的临界厚度值，超晶格中ＧｅｘＳｉ１－ｘ合金层能隙随成分的变化，以及界面处的能带失配值等．最后介绍了由Ｇｅ，Ｓｉ原子层有序排列而组成的新晶体．     

Au诱导形成有序Si纳米孔阵列及其应用

以自组装聚苯乙烯小球(PS)单层膜为掩膜,利用Au对Si表面的催化氧化作用以及KOH溶液对单晶Si的各向异性腐蚀特性,在Si(100)面上制备了一系列尺寸小于100 nm有序可控的Si纳米孔阵列.扫描电镜(SEM)和原子力显微镜(AFM)等的测试结果显示:当PS小球溶液与甲醇溶液的体积比为9:11时,可形成大面积无缺陷的单层膜;但当体积比过大时,会导致类似双层膜结构的形成;而当体积比过小时,会诱导形成点缺陷和线缺陷.对PS小球及溅射Au处理过的Si晶片进行KOH溶液腐蚀,随着腐蚀时间变长,纳米孔的横向尺寸和深度增大,其形貌由圆形逐渐变为倒金字塔型,当腐蚀时间超过10 min,纳米孔阵列的有序性遭到破坏.采用离子束溅射技术在倒金字塔型纳米孔衬底上获得了有序Ge/Si纳米岛,而在圆形纳米孔衬底上获得了有序Ge/Si纳米环.进一步对有序Ge/Si纳米岛及纳米环的形成机理进行了解释.     

Si/Gen/Si(001)异质结薄膜的掠入射荧光X射线吸收精细结构研究

利用掠入射荧光X射线吸收精细结构(XAFS)方法研究了在400℃的温度下分子束外延生长的Si/Ge_n/Si(001)异质结薄膜(n=1，2，4和8个原子层)中Ge原子的局域环境结构.结果表明，在1至2个Ge原子层(ML)生长厚度的异质结薄膜中，Ge原子的第一近邻配位主要是Si原子.随着Ge原子层厚度增加到4ML，Ge原子的最近邻配位壳层中的Ge-Ge配位的平均配位数增加到1.3.当Ge原子层厚度增加到8ML时，第一配位壳层中的Ge-Ge配位占的比例只有55%.这表明在400℃的生长条件下，Ge原子有很强的迁移到Si覆盖层的能力.随着Ge层厚度从1 增加到2，4和8ML，Ge原子迁移到Si覆盖层的量由0.5ML分别增加到1.5，2.0和3.0ML.认为在覆盖Si过程中Ge原子的迁移主要是通过产生Ge原子表面偏析来降低表面能和Ge层的应变能. 关键词： XAFS n/Si(001)异质膜')" href="#">Si/Ge_n/Si(001)异质膜 迁移效应     

单轴、双轴应变Si拉曼谱应力模型

本文依据拉曼光谱原理, 基于Secular方程及拉曼选择定则分别获得了单轴、 双轴(001), (101), (111)应变Si材料应变张量与拉曼谱线移动的定量关系, 并在此基础上, 基于广义胡克定律最终建立了单轴、双轴(001), (101), (111)应变Si材料拉曼谱峰与应力的理论关系模型. 该模型建立过程详细、系统, 所得结果全面、量化, 可为应变Si材料应力的测试分析提供重要理论参考.     

Si80笼状分子的结构研究

采用基于密度泛函的第一性原理计算方法,构建了Si₈₀笼状分子的模型,并对其结构和电学特性进行了考察. 研究发现,经过结构优化计算,Si₈₀分子从I_h高对称性下降为T_h,但仍然保持较好的笼状结构. 对Si₈₀笼状分子的稳定性、轨道分布和电荷分布等性质进行了分析和讨论. 关键词： 80')" href="#">Si₈₀ 富勒烯 结构     

Stark broadening parameters of Si I,Si II and Si III lines

Spectral lines emited by first three ionisation species of silicon were studyed in a wide range of plasma parameters. The silicon was present as an impurity in the argon plasma created in an electromagneticT tube. Four various condenser bank energies give the plasma in a range of temperatures 8700 to 16400°K and electron concentrations 2.95·10¹⁷ cm^?3to 5.6·10¹⁷ cm^?3. Measured line widths and shifts were compared with theories of Griem [1, 2] and Sahal Brechet [3, 10]. The agreement is reasonably good, the measured values are in general smaller than calculated ones.     

Thin-film formation of Si clathrates on Si wafers

In this study, we prepared Si clathrate films (Na₈Si₄₆ and Na_xSi₁₃₆) using a single-crystalline Si substrate. Highly oriented film growth of Zintl-phase sodium silicide, which is a precursor of Si clathrate, was achieved by exposing Na vapour to Si substrates under an Ar atmosphere. Subsequent heat treatment of the NaSi film at 400 °C (3 h) under vacuum (<10⁻² Pa) resulted in a film of Si clathrates having a thickness of several micrometres. Furthermore, this technique enabled the selective growth of Na₈Si₄₆ and Na_xSi₁₃₆ using the appropriate crystalline orientation of Si substrates.     

Photoluminescence of Si from Si nanocrystal-doped SiO2/Si multilayered sample

A multilayered Si nanocrystal-doped SiO₂/Si (or Si-nc:SiO₂/Si) sample structure is studied to acquire strong photoluminescence (PL) emission of Si via modulating excess Si concentration. The Si-nc:SiO₂ results from SiO thin film after thermal annealing. The total thickness of SiO layer remains 150 nm, and is partitioned equally into a number of sublayers (N = 3, 5, 10, or 30) by Si interlayers. For each N-layered sample, a maximal PL intensity of Si can be obtained via optimizing the thickness of Si interlayer (or d_Si). This maximal PL intensity varies with N, but the ratio of Si to O is nearly a constant. The brightest sample is found to be that of N = 10 and d_Si = 1 nm, whose PL intensity is ∼5 times that of N = 1 without additional Si doping, and ∼2.5 times that of Si-nc:SiO₂ prepared by co-evaporating of SiO and Si at the same optimized ratio of Si to O. Discussions are made based on PL, TEM, EDX and reflectance measurements.     

硅基超晶格Si1-xSnx/Si的能带结构

由于Si基发光材料能与现有的Si微电子工艺兼容,其应用前景被广泛看好. 设计具有直接带隙的Si基材料,备受实验和理论研究者的关注. 本文根据芯态效应、电负性差效应和对称性效应设计了Si基超晶格Si_1－xSn_x/Si. 其中Si_0.875Sn_0.125/Si为直接带隙材料. 在密度泛函框架内,采用平面波赝势法计算表明,Si_0.875Sn_{0.125相似文献}   

用硅离子注入方法制备的纳米硅的拉曼散射研究

在直角散射配置下测量了纳米硅样品的拉曼散射谱及其退火温度的关系。结果表明,在８００℃以下退火的样品只观察到单晶硅衬底的光学声子模,在９００℃以上退火,才观察到纳米硅的特征拉曼散射峰。在１２００℃下退火后,纳米硅的特征拉曼散射峰消失,观察到类似于非晶硅的光学声子特征峰,可能表示纳米硅不能承受这样的高温热退火。这些结果进一步证实了光致发光谱的结果。     

Study and applications of plasma-modified Si and porous Si surfaces

In this work we have studied the electrical, chemical and physical properties of CH_x/silicon and CH_x/porous silicon (PS). The hydrocarbon (CH_x) layer has been deposited by plasma of methane under argon atmosphere. Scanning Electron Microscopy (SEM), Fourier Transform Infrared (FTIR) Spectroscopy and photoluminescence have been used to characterize the CH_x/p-Si, CH_x/PS interfaces and, electrolyte/(CH_x/p-Si) and CH_x/PS/p-Si structures. The results show that in the case of bare silicon, the CH_x layers act as a resistant film to HF electrolyte and can be used as a potential tool for ultra-low thickness for masking and patterning. The deposition of CH_x layer on PS shows that CH_x/PS/p-Si structure presents a rectifying behaviour and can be used for detecting low concentration of large variety of gases. In addition CH_x coated PS samples exhibit more intense luminescence than that observed from an uncoated PS surface where red luminescence is shown .In conclusion, the results clearly demonstrate the interest and applications of Si and PS electrodes coated with hydrocarbon groups.     

硅纳米结构中硅空位缺陷引发的双峰蓝光发射

报道了在硅纳米结构中417nm和436nm双峰结构的蓝光发射的实验和理论研究结果．制备了四种包含和没有包含β-SiC纳米晶粒的硅纳米结构，观察到了417nm和436nm的双峰蓝光发射．光致发光谱的分析和微结构的观察揭示了蓝光发射与硅纳米结构中过剩硅缺陷中心的存在有关．计算了由过剩硅原子形成的含有硅空位缺陷的纳米晶粒的电子能级，发现计算所得的态密度的特征与观察到的双峰发射吻合．这项工作提出了在许多硅纳米结构中存在417nm和436nm蓝光发射的一种可能的机制．     

Solid-phase crystallization of amorphous Si films on glass and Si wafer

When amorphous silicon films deposited on glass by physical or chemical vapor deposition are annealed, they undergo crystallization by nucleation and growth. The growth rate of Si crystallites is the highest in their 〈111〉 directions along or nearly along the film surface. The directed crystallization is likely to develop the 〈110〉//ND or 〈111〉//ND oriented Si crystallites. As the annealing temperature increases, the equiaxed crystallization increases, which in turn increases the random orientation. When amorphous Si is under a stress of the order of 0.1 GPa at about 540 °C, the tensile stress increases the growth rate of Si grains, whereas the compressive stress decreases the growth rate. However, the crystal growth rate increases with the increasing hydrostatic pressure, when the pressure is of the order of GPa at 530–540 °C. These phenomena have been discussed based on the directed crystallization model advanced before, which has been further elaborated.