反复加载情况下低温固体界面间接触导热的研究

文中从固体界面间接触热阻形成机理出发,提出了一种强化接触导热的方法,给出了低温真空环境下,两种金属界面间在反复加载情况下的接触热阻值,对卸载过程接触热导率大于同次加载过程接触热导的实验现象产生机理进行了分析,并指出了下一步的研究方向     

用分形理论研究低温条件下Al-Al界面间的接触导热现象

界面形貌是固体界面间接触导热的最主要影响因素 ,传统的形貌表征参数与仪器的分辨率和取样长度密切相关 ,因而基于这些参数的常规接触导热模型显然是尺度相关的。分形网络模型利用粗糙表面处处连续却不可微的分形特征 ,采用与尺度无关的分形参数 ,揭示了接触导热的本质 ,为准确预测接触热导开辟了一条新的途径。实验测定了粗糙表面的分形参数和低温条件下 Al50 52 - Al50 52界面间的接触热导 ,将接触热导的实验值与分形网络模型的预测结果进行了比较 ,并就接触热导与压力、分形参数和温度之间的关系进行了分析 ,指出分形网络模型的预测精度与分形参数相关联。     

低温下粗糙表面接触间隙气体热导的研究

对低温非真空环境下粗糙接触界面间隙中介质气体的传热进行了理论分析．依据克努森数的大小,建立了不同传热区域的间隙气体热导理论模型．并对影响接触界面间隙热导的克努森数、普朗特数、热导率、适应系数、压力等参数进行了分析,为实际情况下接触界面的传热提供了理论基础．而且通过实验证明了在界面接触压力较小的情况下,即使对于硬度较小导热性能好的接触固体,间隙气体的导热量仍大于通过实际接触点的导热量．     

高温超导直接冷却的氮化铝与无氧铜接触界面热阻的实验研究

氮化铝(AlN)具有高热导性、高电绝缘性,是超导二元电流引线热截流结构中常用的材料之一。根据稳态导热法建立低温真空实验装置,实验研究了超导冷却系统热截流结构中,界面温度和接触压力对AlN块材与无氧铜(OFHC-Cu)块材间接触界面热阻的影响。在实验温度(90K-210K)和压力(0.273MPa-0.985MPa)条件下,AlN/OFHC-Cu接触界面热阻随接触压力的提高而降低,而当界面温度上升时界面热阻由于热载子热运动的强化而降低,温度较高时,接触界面热阻随压力变化的速率趋缓。低温下AlN/OFHC-Cu间的接触界面热阻是直接冷却超导系统的设计和超导系统的热稳定性方面必需解决的问题。     

基于CMY模型改进的界面热阻模型及其应用

导热膏填充的接触界面热阻由接触热阻和间隙热阻两部分组成。本文采用截锥体接触的单热流通道模型代替CMY模型中的圆盘接触的单热流通道模型,推导出了改进的接触热阻计算公式。本文还结合间隙热阻的计算公式,得到了一种改进的导热膏填充的接触界面热阻模型。通过分析得出了如下结论:对于使用导热膏填充的接触界面的热阻而言,其主要影响因素为接触表面的粗糙度和导热膏的导热系数,而接触界面间压力对其的影响则相对较小。     

填料导热胶粘剂的性能研究

以石墨、铜粉、铝粉三种导热填料填充到环氧树脂中制备导热胶粘剂,采用SEM和金相显微镜对材料进行形貌表征,采用TPS 2500导热系数测定仪测试样品的导热系数。研究了这三种类型导热填料在不同填充量时的热导性能的变化规律,并对比讨论了三种填料在最大填充比例时胶粘剂的导热系数。     

低温真空下固体界面间接触热导实验分析

主要叙述了低温真空下接触热导实验装置的设计 ,通过改进实验装置来扩展研究的温度范围。在 10 0 K～ 30 0 K范围内 ,对铝、不锈钢和铜三种金属材料进行了大量的接触热导的实验研究 ,并分析了接触热导与界面载荷和温度之间的关系     

导热优化:热耗散与最优导热系数场

本文讨论了通过重新布置场内的导热系数分布来强化热传导的导热优化问题。针对边界上传热量一定的任意几何区域的稳态导热,在全场的导热系数积分为定值的条件下,以最小热耗散作为目标,利用变分方法导出了导热优化的基本准则;导热系数与局部热流密度成正比。该准则指导下的导热优化过程可获得热耗散最小的导热系数分布。实例证明了该方法是有效且合理的。     

4~20 K 温区固体界面导热填料接触热阻实验研究

超导量子干涉仪、 超导光子探测器等深空探测器需要液氦温区制冷技术提供极低温温度, 固体界面接触热阻的存在会增大耦合界面温度差, 进而增加制冷机系统冷损. 为定量探究4~20 K 深低温区固体接触热阻, 采用GM 作为冷源, 设计了一台可同时调节压力和低温温度的固体界面接触热阻测试实验台. 利用感压纸进行接触界面压力校核, 并对温度重复性进行验证. 实验测试了不同导热介质填充情况下, 温度和压力变化时固体接触热阻的变化规律. 基于最小二乘法对实验数据进行半经验公式拟合, 获得4 ~20 K 温区不同压力加载条件下的接触热阻的定量参考.     

热质的运动与传递-微尺度导热中的热质动能效应

基于热质(热量的当量动质量)的概念,通过建立和分析热质的运动方程得到了反映热质动能变化的稳态导热微分方程,表明Fourier导热定律只有在热质的动能变化相对热质势能变化很小而可以忽略时才成立;在高热流密度和低温的情况下热质的动能变化不可忽略,这种动能效应表现为热流密度和温度梯度不再成线性关系.动能效应也导致Fourier导热定律不能通过热流和温度梯度准确地获得物体的导热系数,本文基于热质运动方程给出了导热系数动能效应的修正式.最后针对高热流密度和低温一维稳态导热进行了分子动力学模拟验证.     

THERMAL CONTACT CONDUCTANCE OF SILICON NITRIDE-COATED OFHC COPPER CONTACTS

An experimental investigation was conducted to study the degree to which the thermal contact conductance at the interface of OFHC copper contacts could be reduced through the use of sputtered silicon nitride films. The experimental results are presented graphically to illustrate the dimensionless thermal contact conductance of both coated and uncoated OFHC copper contacts as a function of contact pressure. Silicon nitride coating on OFHC copper reduces the contact conductance by almost four times.     

Modelling of thermal conductance during microthermal machining with scanning thermal microscope using an inverse methodology

In this study, a general methodology for determining the thermal conductance between the probe tip and the workpiece during microthermal machining using Scanning Thermal Microscopy (SThM) has been proposed. The processing system was considered as an inverse heat conduction problem with an unknown thermal conductance. Temperature dependence for the material properties and thermal conductance in the analysis of heat conduction is taken into account. The conjugate gradient method is used to solve the inverse problem. Furthermore, this methodology can also be applied to estimate the thermal contact conductance in other transient heat conduction problems, like metal casting process, injection molding process, and electronic circuit systems.     

A review on the effects of different parameters on contact heat transfer

In this paper, a complete literature review for thermal contact between fixed and periodic contacting surfaces and also thermal contact between exhaust valve and its seat in internal combustion engines is presented. Furthermore, the effects of some parameters such as contact pressure, contact frequency, the contacting surfaces topography and roughness, curvature radius of surfaces, loading–unloading cycles, gas gap conductance and properties, interface interstitial material properties, surfaces coatings and surfaces temperature on thermal contact conductance are investigated according to the papers presented in this field. The reviewed papers and studies included theoretical/ analytical/experimental and numerical studies on thermal contact conductance. In studying the thermal contact between exhaust valve and its seat, most of the experimental studies include two axial rods as the exhaust valve, and seat and the one ends of both rods are considered at constant and different temperatures. In the experimental methods, the temperatures of multi-points on rods are measured in different conditions, and thermal contact conductance is estimated using them.     

Thermal conductance in quantum wire with two obstacles

Based on the scattering-matrix method, the influence of obstacles on the thermal conductance in quantum wire was investigated. Three types of obstacles are employed in our calculation. We present a detailed study of the thermal conductance as a function of distance between two obstacles and temperature. The results show that there is qualitative difference in the dependence of the thermal conductance versus width between two obstacles for different temperatures. We also find that the calculated thermal conductance increases with the width W of quantum wire in all cases.     

ESTIMATION OF THERMAL CONTACT CONDUCTANCE DURING RESISTANCE SPOT WELDING

This article describes an experimental procedure conducted to estimate and investigate the transient thermal contact conductance (or thermal contact resistance) between the electrodes and workpieces during resistance spot welding. A fine thermal metrology was developed to collect thermal histories near the welding region. Indeed, the electrode tip was instrumented with several interior microthermocouples for measuring the transient temperature response during the welding process. A simple mathematical model, using an inverse heat transfer method, was built for the estimation of the transient heat transfer coefficient from interior transient temperature measurements. A simple resistance welding case of two steel sheets was investigated. The initial transient values of thermal contact conductance were found to be in agreement with those observed in the dry copper–steel solid contact case. At the end of the process, the transient heat transfer coefficient reaches a high value corresponding to the best heat transfer phenomenon at the interface during the welding process. When the metal is melted, the contact quality increases due to the high-applied electrode force. Higher electrode force and heating temperatures produce lower thermal contact resistance. The results obtained show the capabilities and the power of the coupled thermal metrology and transient inverse technique developed to investigate thermal history of resistance spot welding.     

Solid-gas interface thermal conductance for the thermal barrier coating with surface roughness: The confinement effect

The yttria-stabilized zirconia (YSZ) is a famous thermal barrier coating material to protect hot-end components of an engine. As a characteristic feature of the YSZ, the surface roughness shall play an important role in the interface thermal conductance between the YSZ and gas, considering that the gas is typically at an extremely high temperature. We investigate the effect of the surface roughness on the thermal conductance of the YSZ-gas interface with surface roughness described by nanoscale pores on the surface of the YSZ. We reveal two competitive mechanisms related to the microstructure of the pore, i.e., the actual contact area effect and the confinement effect. The increase of the pore depth will enlarge the actual contact area between the YSZ and gas, leading to enhancement of the solid-gas interface thermal conductance. In contrast to the positive actual contact area effect, the geometry-induced confinement effect greatly reduces the interface thermal conductance. These findings shall offer some fundamental understandings for the microscopic mechanisms of the YSZ-gas interface thermal conductance.     

Investigation of thermal effects in through-silicon vias using scanning thermal microscopy

Results of quantitative investigations of copper through-silicon vias (TSVs) are presented. The experiments were performed using scanning thermal microscopy (SThM), enabling highly localized imaging of thermal contrast between the copper TSVs and the surrounding material. Both dc and ac active-mode SThM was used and differences between these variants are shown. SThM investigations of TSVs may provide information on copper quality in TSV, as well as may lead to quantitative investigation of thermal boundaries in micro- and nanoelectronic structures. A proposal for heat flow analysis in a TSV, which includes the influence of the boundary region between the TSV and the silicon substrate, is presented; estimation of contact resistance and boundary thermal conductance is also given.