高能氮离子轰击对四面体非晶碳膜的表面改性和摩擦系数影响的研究

利用过滤阴极真空电弧技术制备了sp³键含量不小于80%的四面体非晶碳(ta-C)膜.利用冷阴极潘宁离子源产生不同能量的氮离子对制备的ta-C薄膜进行轰击,通过X射线光电子能谱和原子力显微镜对薄膜表面结构与形貌进行分析研究.研究表明,随着氮离子的轰击能量的增大,薄膜中的CN键结构略有增大,形成了轻N掺杂;同时,在薄膜表层发生了sp³键结构向sp²键结构的转化;薄膜的表面粗糙度在经过氮离子轰击后从0.2 nm减小至0.18 nm,然后随着轰击能 关键词： 四面体非晶碳 X射线光电子能谱 摩擦系数     

磁过滤器电流对非晶碳薄膜摩擦学特性影响的研究

研究了过滤阴极真空电弧技术中,不同的磁过滤器电流下(5—13 A),制备的四面体非晶碳(ta-C)薄膜对摩擦学特性的影响.通过对薄膜厚度,薄膜结构以及薄膜表面粗糙度随磁过滤电流的变化结果进行了测试,结果表明,随着磁过滤器电流的增大,薄膜的sp³键含量逐渐减少,表面粗糙度从0.13增大到0.38.磁过滤器电流在5 A时,薄膜的摩擦系数最小约为0.08,当电流增大到7 A时,摩擦系数显著增大,磁过滤器电流从7 A增大到13 A时,薄膜的摩擦系数再次减小约为0.1. 关键词： 四面体非晶碳 过滤阴极真空电弧 磁过滤器电流 摩擦系数     

非晶碳结构建模和电子结构的第一性原理研究

基于密度泛函理论,采用了一种更为精确的交换相关泛函OLYP(OPTX+LYP),对密度范围从2.0到3.2 g/cm³的非晶碳进行结构建模. 模拟得到的5个碳网络结构无论从径向分布函数还是sp³含量都与实验符合得很好. 对非晶碳电子结构的研究表明费米能级附近的电子态密度主要是sp²碳原子的贡献. 随着密度的增加,sp³碳原子增加,费米能级附近的态密度越来越小. 小环结构增加了费米能级附近的电子态密度,缺陷态在费米能级形 关键词： 非晶碳 密度泛函理论 电子结构     

基底表面纳米织构对非晶四面体碳膜结构和摩擦特性的影响研究

本文利用离子束表面改性技术对基底表面进行不同时间的轰击, 形成不同规则的纳米织构, 对不同织构的变化规律进行了研究, 同时, 利用磁过滤真空阴极电弧技术, 在具有不同纳米织构的各基底上沉积相同时间的四面体非晶碳薄膜. 采用原子力显微镜对各基底的织构进行形貌分析, 结果表明, 高能粒子束的轰击对基底表面形貌有较大的影响, 根据离子束轰击时间的不同, 可以在基底表面形成各种不同规则的纳米织构, 轰击15 min后发现基底表面形成点阵纳米织构, 之后随着时间的增加, 基本维持点阵结构. 通过X射线光电子能谱仪和摩擦磨损试验仪对沉积在具有不同织构的基底上的ta-C薄膜进行测试, 研究表明, 基底表面纳米织构的非晶层结构引起薄膜内部sp³键的含量降低, 释放了薄膜的内应力, 同时发现基底表面纳米织构将ta-C薄膜磨损时间从不足10 min提高到约70 min, 有效提高了薄膜的耐磨性.     

非晶金刚石薄膜的场致电子发射性能研究

利用真空磁过滤弧沉积技术制备出一种高sp³含量的非晶碳膜———非晶金刚石薄膜，并对这种非晶金刚石薄膜的场电子发射特性及其发射机理进行了研究．实验结果表明，在阈值电场低于20V/μm情况下，得到的场发射电流达20—40μA，薄膜的电子发射行为符合Fowler-Nordheim场发射理论．研究表明，这种非晶金刚石薄膜具有负的电子亲合势和较小的有效功函数以及相对较低的禁带宽度 关键词：     

硼掺杂对四面体非晶碳膜电导性能的影响

以单质硼和高纯石墨的混合粉末压制成型的靶材作为靶源,采用过滤阴极真空电弧技术制备不同硼含量的掺硼四面体非晶碳膜.分别采用四探针法、阻抗分析仪和电化学界面对薄膜的变温电导率、I-V特性和C-V特性进行了测试和研究.实验结果表明,当B含量由0增加至6.04 at%时,薄膜的室温电导率先逐渐增大而后逐渐减小,相应薄膜的电导激活能先逐渐减小而后逐渐增大,并在2.13 at%时分别出现最大和最小值1.42×10^-7S/cm和0.1eV.此外,掺硼四面体非晶碳/n型硅异质结的I-V曲线表现出典型的整流特性,表明p-n结二极管已经形成,且结两端的掺杂能级在空间上连续统一. 关键词： 四面体非晶碳 电导率 I-V曲线')" href="#">I-V曲线 C-V曲线')" href="#">C-V曲线     

掺氮四面体非晶碳的第一性原理研究

采用基于第一性原理的分子动力学方法对掺氮四面体非晶碳进行结构建模,并对其显微结构和电子结构进行了研究. 氮在非晶碳网络中的配位形态与密度没有明显关系,主要是以三配位形态存在,其次是两配位,四配位氮的比例很小. 掺氮后碳网络结构sp²含量大大增加,随着氮含量的增加,费米能级附近态密度增加. 氮掺入后并未使费米能级发生明显移动. 关键词： 掺氮四面体非晶碳 第一性原理 密度泛函理论 电子结构     

斜入射离子束辅助沉积对类金刚石薄膜结构影响的分子动力学模拟

采用分子动力学（MD）模拟方法,从原子尺度上研究了离子束辅助沉积（IBAD）类金刚石（DLC）薄膜过程中离子束入射角对薄膜结构的影响.重点讨论了不同的离子束入射角所对应的薄膜表面模型,平均密度和sp³键含量.结果表明,离子束斜入射加强了入射原子的水平动能,从而加强了原子水平迁移;Ar离子斜入射时C原子迁移率均比垂直入射大,薄膜密度和sp³键含量都比垂直入射小.不同的离子束入射角随着到达比和入射能的变化,对薄膜结构的影响不同.离子束斜入射时可以得到不同结构的膜. 关键词： 类金刚石薄膜 入射角 离子束辅助沉积 分子动力学模拟     

类金刚石薄膜在硅基底上的沉积及其热导率

采用分子动力学方法模拟了碳在晶体硅基底上的沉积过程, 并分析计算了所沉积的类金刚石薄膜的面向及法向热导率. 对沉积过程的模拟表明, 薄膜密度及sp³杂化类型的碳原子所占比例均随沉积高度的增加而减小, 在碳原子以1 eV能量垂直入射的情况下, 在硅基底上沉积的薄膜密度约为2.8 g/cm³, sp³杂化类型的碳原子所占比例约为22%, 均低于碳在金刚石基底上沉积的情况. 采用Green-Kubo方法, 计算了所沉积类金刚石薄膜的热导率, 其面向热导率可以达到相同尺寸规则金刚石晶体的50%左右, 并且随着薄膜密度与sp³杂化类型碳原子所占比例的升高而升高.     

氮离子轰击能量对ta-C:N薄膜结构的影响

利用磁过滤真空阴极电弧技术制备了sp³键含量不小于80%的四面体非晶碳薄膜(ta-C), 然后通过氮离子束改性技术制备了氮掺杂的四面体非晶碳(ta-C:N)薄膜. 利用Raman光谱和X射线光电子能谱对薄膜结构的分析,研究了氮离子轰击能量对ta-C:N薄膜结构的影响. 氮离子对ta-C薄膜的轰击,形成了氮掺杂的ta-C:N薄膜. 氮离子轰击诱导了薄膜中sp³键向sp²键转化, 以及CN键的形成.在ta-C:N薄膜中,氮掺杂的深度和浓度随着氮离子能量的增大而增大. ta-C:N薄膜中sp²键的含量和sp²键团簇的尺寸随着氮离子轰击能量的增大而增加; 在ta-C:N薄膜中, CN键主要由C-N键和C＝N键构成, C-N 键的含量随着氮离子轰击能量的增大而减小,但是C＝N 键含量随着氮离子轰击能量的增大而增大.在ta-C:N薄膜中不含有C≡N键结构.     

Correlation between substrate bias, growth process and structural properties of phosphorus incorporated tetrahedral amorphous carbon films

We investigate the growth process and structural properties of phosphorus incorporated tetrahedral amorphous carbon (ta-C:P) films which are deposited at different substrate biases by filtered cathodic vacuum arc technique with PH₃ as the dopant source. The films are characterized by X-ray photoelectron spectroscopy (XPS), atomic force microscopy, Raman spectroscopy, residual stress measurement, UV/VIS/NIR absorption spectroscopy and temperature-dependent conductivity measurement. The atomic fraction of phosphorus in the films as a function of substrate bias is obtained by XPS analysis. The optimum bias for phosphorus incorporation is about −80 V. Raman spectra show that the amorphous structures of all samples with atomic-scaled smooth surface are not remarkably changed when PH₃ is implanted, but some small graphitic crystallites are formed. Moreover, phosphorus impurities and higher-energetic impinging ions are favorable for the clustering of sp² sites dispersed in sp³ skeleton and increase the level of structural ordering for ta-C:P films, which further releases the compressive stress and enhances the conductivity of the films. Our analysis establishes an interrelationship between microstructure, stress state, electrical properties, and substrate bias, which helps to understand the deposition mechanism of ta-C:P films.     

Influence of sp 3 fraction on the field emission properties of tetrahedral amorphous carbon films formed by magnetic filtered plasma stream

Electron field emission properties of tetrahedral amorphous carbon films (ta-C) with various sp³ fractions, [sp³]/([sp²]+[sp³]), prepared by magnetic filtered plasma deposition system, were investigated. The ta-C films were deposited on (100) n-Si wafer with a resistivity of 0.01–0.02 cm in a substrate bias voltage V_b range from +20 V to -80 V. The relative fraction of sp³-bonded carbon in these films was qualitatively and quantitatively estimated by a fitting of the Raman and XPS spectra, respectively. Results show that ta-C films of high sp³ fraction, more than 80%, can be formed with a substrate bias voltage V_b in the range from -10 to -50 V. A remarkably low turn-on field of about 1.7 V/m was observed for these samples. For V_b outside this range, the sp³ fraction is lower. The surface of such ta-C films was found to be smooth and uniform from the images of atomic force microscopy. The sp³ fraction of the sample is believed to be the main factor affecting field emission properties of ta-C films. PACS 79.70; 78.30; 73.90.+f     

Stress, microstructure and mechanical properties of graded multilayer tetrahedral amorphous carbon films

Tetrahedral amorphous carbon (ta-C) films deposited using a filtered cathodic vacuum arc (FCVA) system, have high intrinsic stress which limits their application as protective coatings. To reduce the film stress and to improve the adhesion, a multilayer structure is deposited at a gradient substrate negative bias from 1500 V to 80 V. This paper investigates the stress, microstructure and nano-mechanical properties of graded multilayer ta-C film on Si substrates. Compared with that of single-layer films deposited at optimised bias, the graded multilayer film has low stress without a decline in hardness and Young’s modulus. Microstructural evaluation of the multilayer film using visible Raman spectra shows that the average content of the sp³ bonds of the multilayer film remain at a high level. Nanoscratch testing illustrates favorable scratch resistance and good adhesion of the multilayer film. Scanning electron microscope (SEM) observation confirms the collapse of the film surface along the scratching trace. Finally, deposition on single crystal germanium substrates of a durable coating ∼ 1100 nm thick, and composed of three graded multilayer films is demonstrated. PACS 81.05.Uw; 81.15.Jj; 68.65.Ac; 68.55.Nq; 68.60.Bs     

The preparation and evaluation of graded multilayer ta-C films deposited by FCVA method

In this study, a series of graded multilayer ta-C films were investigated by varying their sublayer thickness ratios, in which each film sublayer was prepared at different substrate bias by filtered cathode vacuum arc (FCVA) method. The experimental results show that the graded multilayer film structure can effectively decrease the internal stress level of deposited ta-C film, and meanwhile the graded multilayer ta-C films still have high sp³ fractions. The applied substrate bias voltage and sublayer thickness ratio can apparently influence the microstructure characteristics and internal stress of the graded multilayer ta-C films. The graded multilayer ta-C film has larger sp³ fraction when applying a larger negative substrate bias voltage and having a thicker outer sublayer during the film deposition process. However, the internal stress in the as-deposited film also increases with larger thickness of the outer sublayer, and the optimal ratio of sublayer thicknesses is 1:1:1:1 for graded ta-C film with four sublayers.     

氩离子轰击对四面体非晶碳膜内应力和摩擦系数影响的研究

利用磁过滤真空阴极电弧技术制备了sp³键大于80%的四面体非晶碳(ta-C)薄膜, 通过冷阴极离子源产生keV能量的氩离子轰击ta-C薄膜,研究了氩离子轰击能量对ta-C薄膜结构, 内应力以及耐磨性的影响.通过X射线光电子能谱和原子力显微镜研究了氩离子轰击对薄膜结构 与表面形貌的改性,研究表明,氩离子轰击诱导了ta-C薄膜中sp³键向sp²键的转化, 并且随着氩离子轰击能量的增大,薄膜中sp²键的含量逐渐增多, 薄膜内应力随着氩离子轰击能量的增大逐渐减小.氩离子轰击对薄膜的表面形貌有较大影响, 在薄膜表面形成刻蚀坑,并且改变了薄膜的表面粗糙度,随着氩离子轰击能量的增大, 薄膜的表面粗糙度也会逐渐增大.通过摩擦磨损仪的测试结果,氩离子轰击对薄膜的初始摩擦系数影响较大, 但是对薄膜的稳定摩擦系数影响较小,经过氩离子轰击前后的ta-C薄膜的摩擦系数为0.1左右, 并且具有优异的耐磨性.     

Synthesis and structure of nitrogenated tetrahedral amorphous carbon films prepared by nitrogen ion bombardment

The tetrahedral amorphous carbon (ta-C) films with more than 80% sp³ fraction firstly were deposited by filtered cathode vacuum arc (FCVA) technique. Then the energetic nitrogen (N) ion was used to bombard the ta-C films to fabricate nitrogenated tetrahedral amorphous carbon (ta-C:N) films. The composition and structure of the films were analyzed by visible Raman spectrum and X-ray photoelectron spectroscopy (XPS). The result shows that the bombardment of energetic nitrogen ions can induce the formation of CN bonds, the conversion of C-C bonds to CC bonds, and the increase of size of sp² cluster. The CN bonds are made of CN bonds and C-N bonds. The content of CN bonds increases with the increment of N ion bombardment energy, but the content of C-N bonds is inversely proportional to the increment of nitrogen ion energy. In addition, C≡N bonds are not existed in the films. By the investigation of AFM (atom force microscopy), the RMS (root mean square) of surface roughness of the ta-C film is about 0.21 nm. When the bombarding energy of N ion is 1000 eV, the RMS of surface roughness of the ta-C:N film decreases from 0.21 to 0.18 nm. But along with the increment of the N ion energy ranging from 1400 to 2200 eV again, the RMS of surface roughness of the ta-C:N film increases from 0.19 to 0.33 nm.     

非晶金刚石薄膜的X射线反射研究

利用过滤阴极真空电弧系统制备了不同衬底偏压下非晶金刚石薄膜,分别采用X射线反射法测定了相应的非晶金刚石膜密度,分析了薄膜密度与沉积能量之间的变化规律．建立了薄膜密度随衬底偏压的变化曲线。研究发现在-80V时非晶金刚石膜密度存在最大值3．26g／cm^2,随着偏压的增大和减小,薄膜的密度都相应的下降;当衬底偏压加到-2000V时,密度减小到2．63g／cm^2,相对于密度的最大值变化较小。通过薄膜sp^3能态杂化含量与密度的简单比例关系,近似推算出非晶金刚石膜中sp^3能态的含量最高可达80％以上。     

X-ray photoelectron spectroscopic study of nitrogen incorporated amorphous carbon films embedded with nanoparticles

The effect of substrate bias on X-ray photoelectron spectroscopy (XPS) study of nitrogen incorporated amorphous carbon (a-C:N) films embedded with nanoparticles deposited by filtered cathodic jet carbon arc technique is discussed. High resolution transmission electron microscope exhibited initially the amorphous structure but on closer examination the film was constituted of amorphous phase with the nanoparticle embedded in the amorphous matrix. X-ray diffraction study reveals dominantly an amorphous nature of the film. A straight forward method of deconvolution of XPS spectra has been used to evaluate the sp³ and sp² contents present in these a-C:N films. The carbon (C 1s) peaks have been deconvoluted into four different peaks and nitrogen (N 1s) peaks have been deconvoluted into three different peaks which attribute to different bonding state between C, N and O. The full width at half maxima (FWHM) of C 1s peak, sp³ content and sp³/sp² ratio of a-C:N films increase up to −150 V substrate bias and beyond −150 V substrate bias these parameters are found to decrease. Thus, the parameters evaluated are found to be dependent on the substrate bias which peaks at −150 V substrate bias.     

Effect of ECR-assisted microwave plasma nitriding treatment on the microstructure characteristics of FCVA deposited ultra-thin ta-C films for high-density magnetic storage applications

There are higher technical requirements for protecting layer of magnetic heads and disks used in future high-density storage fields. In this paper, ultra-thin (2 nm thickness) tetrahedral amorphous carbon (ta-C) films were firstly prepared by filtered cathodic vacuum arc (FCVA) method, then a series of nitriding treatments were performed with nitrogen plasma generated using electron cyclotron resonance (ECR) microwave source. Here it highlighted the influence of nitrogen flow and applied substrate bias voltage on the structural characteristics of ta-C films during the plasma nitriding process. The chemical compositions, element depth distribution profiles, physical structures and bonding configurations of plasma-nitrided ta-C films were investigated by X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES) and UV-vis Raman spectroscopy. The experimental results show that the carbon nitride compounds (CN_x) are formed in nitrogenated ta-C films in which the N content and its depth distribution depends on bias voltage to large extent rather than N₂ flow. The N content of nitrogenated ta-C films can reach 16 at.% for a substrate bias of −300 V and a N₂ flow of 90 sccm. With increasing nitrogen content, there is less G peak dispersion and more ordering of structure. Furthermore, appropriate nitriding treatment (substrate bias: −100 V, N₂ flow: 150 sccm) can greatly increase the fraction of sp³ and sp³C-N bonds, but the values begin to fall when the N content is above 9.8 at.%. All these indicate that suitable ECR-assisted microwave plasma nitriding is a potential modification method to obtain ultra-thin ta-C films with higher sp³ and sp³C-N fractions for high-density magnetic storage applications.