GaN nanotweezers

A new form of GaN nanomaterial (nanotweezers) has been obtained by chemical vapor deposition on an etched cubic MgO (100) plane. The nanotweezers consist of a bottom rod and two arms. The bottom rods have diameters of about 100–150 nm and lengths of about 200–500 nm, on which two arms grow out. The bottoms of the arms are about 40–70 nm and the tops are about 15–30 nm in diameter, and 0.8–1.5 μm in length. X-ray and electron diffractions indicate the nanotweezers are zinc blende gallium nitride. We infer that the fabrication of the GaN nanotweezers is associated with small convex hillocks on the surface of the etched cubic MgO (100) single-crystal substrates and that the nanotweezers grow by a growth mechanism that is similar to vapor-phase heteroepitaxy. Received: 23 April 2002 / Accepted: 25 April 2002 / Published online: 10 September 2002 RID="*" ID="*"Corresponding author. Fax: +86-10/8264-9531, E-mail: xlchen@aphy.iphy.ac.cn     

Properties of Si-doped GaN and AlGaN/GaN heterostructures grown by RF-MBE on high resistivity Fe-doped GaN

Silicon-doped GaN epilayers and AlGaN/GaN heterostructures were developed by nitrogen plasma-assisted molecular beam epitaxy on high resistivity iron-doped GaN (0001) templates and their properties were investigated by atomic force microscopy, x-ray diffraction and Hall effect measurements. In the case of high electron mobility transistors heterostructures, the AlN mole fraction and the thickness of the AlGaN barrier employed were in the range of from 0.17 to 0.36 and from 7.5 to 30 nm, respectively. All structures were capped with a 2 nm GaN layer.Despite the absence of Ga droplets formation on the surface, growth of both GaN and AlGaN by RF-MBE on the GaN (0001) surfaces followed a step-flow growth mode resulting in low surface roughness and very abrupt heterointerfaces, as revealed by XRD. Reciprocal space maps around the reciprocal space point reveal that the AlGaN barriers are fully coherent with the GaN layer.GaN layers, n-doped with silicon in the range from 10¹⁵ to 10¹⁹ cm⁻³ exhibited state of the art electrical properties, consistent with a low unintentional background doping level and low compensation ratio. The carrier concentration versus silicon cell temperatures followed an Arhenius behaviour in the whole investigated doping range. The degenerate 2DEG, at the AlGaN/GaN heteroiterfaces, exhibited high Hall mobilities reaching 1860 cm²/V s at 300 K and 10 220 cm²/V s at 77 K for a sheet carrier density of 9.6E12 cm⁻².The two dimensional degenerate electron gas concentration in the GaN capped AlGaN/GaN structures was also calculated by self-consistent solving the Schrödinger–Poisson equations. Comparison with the experimental measured values reveals a Fermi level pinning of the GaN (0001) surface at about 0.8 eV below the GaN conduction band.     

Groove-type channel enhancement-mode Al GaN/GaN MIS HEMT with combined polar and nonpolar AlGaN/GaN heterostructures

A novel groove-type channel enhancement-mode AlGaN/GaN MIS high electron mobility transistor(GTCE-HEMT)with a combined polar and nonpolar AlGaN/GaN heterostucture is presented. The device simulation shows a threshold voltage of 1.24 V, peak transconductance of 182 m S/mm, and subthreshold slope of 85 m V/dec, which are obtained by adjusting the device parameters. Interestingly, it is possible to control the threshold voltage accurately without precisely controlling the etching depth in fabrication by adopting this structure. Besides, the breakdown voltage(VB) is significantly increased by 78% in comparison with the value of the conventional MIS-HEMT. Moreover, the fabrication process of the novel device is entirely compatible with that of the conventional depletion-mode(D-mode) polar AlGaN/GaN HEMT. It presents a promising way to realize the switch application and the E/D-mode logic circuits.     

The effects of GaN capping layer thickness on two-dimensional electron mobility in GaN/AlGaN/GaN heterostructures

In this paper we present a study of the effect of GaN capping layer thickness on the two-dimensional (2D)-electron mobility and the two-dimensional electron gas (2DEG) sheet density which is formed near the AlGaN barrier/buffer GaN layer. This study is undertaken using a fully numerical calculation for GaN/Al_xGa_1−xN/GaN heterostructures with different Al mole fraction in the Al_xGa_1−xN barrier, and for various values of barrier layer thickness. The results of our analysis clearly indicate that increasing the GaN capping layer thickness leads to a decrease in the 2DEG density. Furthermore, it is found that the room-temperature 2D-electron mobility reaches a maximum value of approximately 1.8×10³ cm² /Vs⁻¹ for GaN capping layer thickness grater than 100 Å with an Al_0.32Ga_0.68N barrier layer of 200 Å thick. In contrast, for same structure, the 2DEG density decreases monotonically with GaN capping layer thickness, and eventually saturates at approximately 6×10¹² cm⁻² for capping layer thickness greater than 500 Å. A comparison between our calculated results with published experimental data is shown to be in good agreement for GaN capping layers up to 500 Å thickness.     

GaN紫外光探测器

评述了近年来在ＧａＮ紫外光探测器方面的研究进展。介绍了ＧａＮ光电导探测器、ｐ－ｎ结二极管探测器、肖特基势垒探测器以及ＭＳＭ结构探测器的制备方法、光电参数及研究现状。     

MOCVD生长的GaN和GaN:Mg薄膜的拉曼散射

通过显微拉曼散射对用金属有机化学气相沉积(MOCVD)法在Al2O3衬底上生长的六方相CaN和掺Mg的P型GaN薄膜进行了研究。在两个样品的拉曼散射谱中同时观察到位于640,660cm^-1附近的两个峰。640cm^-1的峰归因于布里渊区边界(L点)最高声学声子的二倍频,而660cm^-1的峰为布里渊区边界的光学声子支或缺陷诱导的局域振动模。掺Mg的GaN在该处的峰型变宽是Mg诱导的缺陷引起的加宽或Mg的局域模与上述两峰叠加的结果。在掺Mg的样品中还观察到276,376cm^-1几个局域模并给予了解释。同时掺Mg的GaN中出现了应力弛豫的现象,掺Mg引起的失配位错和电子-声子相互作用都有可能对E2模的频率产生影响。     

Parameters-dependent nonlinear absorptions in InGaN/GaN MQW and GaN film

The optical nonlinearities of an InGaN/GaN multiple quantum well (MQW) and a GaN film were experimentally investigated by using femtosecond Z-scan method in this paper. It was observed that the InGaN/GaN MQW displays a nonlinear saturable absorption (SA) effect and the nonlinear absorption coefficient β was determined to be ; and the GaN film shows a reverse saturable absorption (RSA) effect and the β is . It is also found that the absorption cross sections and quantum confinement effect (QCE) give an influence on the SA of the InGaN/GaN MQW structure.     

GaN substrate and GaN homo-epitaxy for LEDs:Progress and challenges

After a brief review on the progresses in GaN substrates by ammonothermal method and Na-flux method and hydride vapor phase epitaxy(HVPE) technology,our research results of growing GaN thick layer by a gas flow-modulated HVPE,removing the GaN layer through an efficient self-separation process from sapphire substrate,and modifying the uniformity of multiple wafer growth are presented.The effects of surface morphology and defect behaviors on the GaN homo-epitaxial growth on free standing substrate are also discussed,and followed by the advances of LEDs on GaN substrates and prospects of their applications in solid state lighting.     

DLTS study of n-type GaN grown by MOCVD on GaN substrates

Electron traps in n-type GaN layers grown homoepitaxially by MOCVD on free-standing GaN substrates have been characterized using DLTS for vertical Schottky diodes. Two free-standing HVPE GaN substrates (A and B), obtained from two different sources, are used. The Si-doped GaN layers with the thickness of 5 μm are grown on an area of 0.9×0.9 cm² of substrate A and on an area of 1×1 cm² of substrate B. Two traps labeled B1 and B2 are observed with trap B2 dominant in GaN on both substrates. There exist no dislocation-related traps which have been previously observed in MOCVD GaN on sapphire. This might be correlated to the reduction in dislocation density due to the homoepitaxial growth. However, it is found that there is a large variation, more than an order of magnitude, in trap B2 concentration and that the B2 spatial distributions are different between the two substrates used.     

Vertical electron transport study in GaN/AlN/GaN heterostructures

In this work, we investigate the electronic structure and vertical electron transport through GaN/AlN/GaN single-barrier structures with different AlN thickness, grown by plasma-assisted molecular beam epitaxy. Conductive and capacitive characterization has been performed, and the experimental results are interpreted by comparison with 1D self-consistent simulations. Capacitive measurements reveal a complete depletion of the top GaN layer, and the formation of a two-dimensional electron gas at the bottom interface of the AlN barrier, even for barrier thicknesses of 0.5 nm (2 monolayers of AlN). Conductive atomic force microscopy reveals discrete leakage current locations with a density of 10⁷ cm⁻², more than one order of magnitude lower than the dislocation density in these samples. These results are promising for the fabrication of resonant tunnelling diodes using the GaN/AlN material system.     

基于GaN同质衬底的高迁移率AlGaN/GaNHEMT材料

研究了表面预处理对GaN同质外延的影响,获得了高电子迁移率AlGaN/GaN异质结材料.通过NH_3/H_2混合气体与H_2交替通入反应室的方法对GaN模板和GaN半绝缘衬底进行高温预处理.研究结果表明,NH_3/H_2能够抑制GaN的分解,避免粗糙表面,但不利于去除表面的杂质,黄光带峰相对强度较高;H_2促进GaN分解,随时间延长GaN分解加剧,导致模板表面粗糙不平,AlGaN/GaN HEMT材料二维电子气迁移率降低.采用NH_3/H_2混合气体与H_2交替气氛模式处理模板或衬底表面,能够清洁表面,去除表面杂质,获得平滑的生长表面和外延材料表面,有利于提高AlGaN/GaN HEMT材料电学性能.在GaN衬底上外延AlGaN/GaN HEMT材料,2DEG迁移率达到2113 cm~2/V·s,电学性能良好.     

Analysis of GaN epilayers on sapphire substrates with GaN and AlN sublayers

The features and results of X-ray diffraction analysis of GaN films are presented. The films are grown by metalorganic vapor-phase epitaxy on c-plane sapphire substrates using GaN or AlN nucleation layers deposited at a low temperature. Measurements of the twist angle and concentrations of Al _x Ga_1-x N solid solutions are discussed in detail.     

GaN及其Ga空位的电子结构

用团簇埋入自洽计算法对宽禁带半导体GaN的电子结构进行了自旋极化的、全电子、全势场的从头计算,得到了与实验值符合的GaN晶体禁带宽度以及价带中N2p带、N2s带和Ga3d带之间的相对位置.在此基础上Ga空位计算(无晶格畸变)显示,Ga空位周围的费米面显著高于正常GaN晶格的费米面.因此Ga空位周围N原子的处于费米面上的2p电子很易被激发成正常晶格处的传导电子 关键词： GaN 电子结构 团簇埋入自洽计算     

High-Power GaN Electronic Devices

Gallium Nitride (GaN) and related materials (especially AlGaN) recently have attracted a lot of interest for applications in high-power electronics capable of operation at elevated temperatures and high frequencies. The AlGaInN system offers numerous advantages. These include wide bandgaps, good transport properties, the availability of heterostructures (particularly AlGaN/GaN), the experience base gained by the commercialization of GaN-based laser and light-emitting diodes and the existence of a high growth rate epitaxial method (hydride vapor phase epitaxy, HVPE) for producing very thick layers or even quasisubstrates. These attributes have led to rapid progress in the realization of a broad range of GaN electronic devices. Al_xGa_1-xN (x=0 ～.25) Schottky rectifiers were fabricated in a lateral geometry employing p⁺-implanted guard rings and rectifying contact overlap onto an SiO₂ passivation layer. The reverse breakdown voltage (V_B) increased with the spacing between Schottky and ohmic metal contacts, reaching 9700 V for Al_0.25Ga_0.75N and 6350 V for GaN, respectively, for 100-µm gap spacing. Assuming lateral depletion, these values correspond to breakdown field strengths of <9.67×10⁵ Vcm^?2, which is roughly a factor of 5 lower than the theoretical maximum in bulk GaN. The figure of merit (V_B)²/R_ON, where RON is the on-state resistance, was in the range 94 to 268 MWcm^?2 for all the devices. Edge-terminated Schottky rectifiers were also fabricated on quasibulk GaN substrates grown by HVPE. For small-diameter (75?µm) Schottky contacts, Vs measured in the vertical geometry was ～700?V, with an on-state resistance (RON) of 3?mΩcm², producing a figure-of-merit V_B ²/R_ON of 162.8?MW-cm^?2. GaN p-i-n diodes were also fabricated. A direct comparison of GaN p-i-n and Schottky rectifiers fabricated on the same GaN wafer showed higher reverse breakdown voltage for the former (490?V vs. 347?V for the Schottky diodes), but lower forward turn-on voltages for the latter (～3.5?V vs. ～5?V for the p-i-n diodes). The forward I-V characteristics of the p-i-n rectifiers show behavior consistent with a multiple recombination center model. The reverse current in both types of rectifiers was dominated by surface perimeter leakage at moderate bias. Finally, all of the devices we fabricated showed negative temperature coefficients for reverse breakdown voltage, which is a clear disadvantage for elevated temperature operation. Bipolar devices are particularly interesting for high current applications such as microwave power amplifiers for radar, satellite, and communication in the l～5?GHz range, powers >l00?W, and operating temperatures >425°C. pnp Bipolar Junction Transistors and pnp Heterojunction Bipolar Transistors were demonstrated for the first time. For power microwave applications, small area self-aligned npn GaN/AlGaN HBTs were attempted. The devices showed very promising direct current characteristics.     

GaN yellow-light emitting diodes

We have previously described the performance of green [1] and of blue [2] electroluminescent diodes using insulating to n-type (i-n) transitions in GaN. Here, we shall report the observation of yellow CW emission at room temperature from GaN i-n structures.     

Comparison study of GaN films grown on porous and planar GaN templates

The GaN thick films have been grown on porous GaN template and planar metal-organic chemical vapor deposition(MOCVD)-GaN template by halide vapor phase epitaxy(HVPE). The analysis results indicated that the GaN films grown on porous and planar GaN templates under the same growth conditions have similar structural, optical, and electrical properties. But the porous GaN templates could significantly reduce the stress in the HVPE-GaN epilayer and enhance the photoluminescence(PL) intensity. The voids in the porous template were critical for the strain relaxation in the GaN films and the increase of the PL intensity. Thus, the porous GaN converted from β-Ga2O3 film as a novel promising template is suitable for the growth of stress-free GaN films.     

Effects of GaN cap layer thickness on an AlN/GaN heterostructure

In this study, we investigate the effects of GaN cap layer thickness on the two-dimensional electron gas (2DEG) electron density and 2DEG electron mobility of AlN/GaN heterostructures by using the temperature-dependent Hall measurement and theoretical fitting method. The results of our analysis clearly indicate that the GaN cap layer thickness of an AlN/GaN heterostructure has influences on the 2DEG electron density and the electron mobility. For the AlN/GaN heterostructures with a 3-nm AlN barrier layer, the optimized thickness of the GaN cap layer is around 4 nm and the strained a-axis lattice constant of the AlN barrier layer is less than that of GaN.     

SiC衬底上外延GaN:Mg材料特性研究

利用扫描电子显微镜、拉曼散射光谱和光致发光谱对在SiC衬底上采用MOCVD异质外延的GaN:Mg薄膜特性进行研究发现：除了一部分Mg原子替代Ga原子呈现受主性外，大部分Mg原子以间隙原子状态（Mg_i）存在，并且在缺陷或者位错处大量聚集引起薄膜张力应力减小，薄膜在降温过程中由于应力不均匀会在部分区域内出现大量的裂纹；Mg的掺杂会加剧GaN无序化程度，致使薄膜质量变差；而室温下的PL谱测量表明蓝带发光由DAP（深施主—浅受主）复合引起，其中D为Mg_GaV_{N 关键词： GaN∶Mg 异质外延 扫描电子显微镜 拉曼散射 光致发光谱}