液态铝基合金微观结构及其性质的分子动力学模拟研究

利用分子动力学研究了液态铝基合金Al80Fe20和Al80Cu20在 800~2200K温度范围内的微观结构和性质的变化。扩散系数的计算结果显示两合金有着不同的动力学行为。温度大约1400K以下液态Al80Cu20的扩散系数随温度的变化比Arrhenius关系所预期的要慢些,所得结果与Brillo研究小组的实验结果基本一致。当液态铝基合金的动力学发生异常变化时,其微观二十面体短程序的含量和作用也发生相应的变化。因此,熔体的奇特动力学行为可能由于其微观局域结构短程序随着温度的变化而异常地改变而引起的。     

纯铝熔体的微观动力学行为

利用反映原子多体相互作用的紧束缚模型及分子动力学计算机模拟技术,研究了液态金属Al的熔体结构与微观动力学行为。计算了纯金属熔体Al在不同温度下的双体分布函数,平均平方位移及速度自相关函数。模拟结果与实验结果吻合得很好,表明紧束缚模型能够描述纯铝熔体中原子间的相互作用     

Cu3Au熔体快速冷却过程微观结构演化的分子动力学模拟

利用分子动力学模拟技术研究了金属间化合物Cu3Au熔体的双体分布函数g(r)在快速凝固条件下随温度的变化情况,结果表明,Cu3Au降温至700K时第二峰已发生劈裂,液态金属中已经产生了非晶态;用键对分析技术详细考察了Cu3Au中微观组团随温度的演化特点,液体中的键对数及多面体数与温度的关系都表明,Cu3Au在向非晶转变的过程中,的确发生了微观结构组态的变化,其中以液体中的缺陷多面体随温度变化最为剧烈.非晶不是过冷液态的"冻结".     

Ti75Al25合金微观结构演变的分子动力学模拟

本文利用分子动力学模拟方法, 研究了液态Ti75Al25合金在不同冷却条件下形成晶体及非晶的过程(Q1:1.0×1013 Ks-1, Q2: 1.0×1011 Ks-1). 利用平均原子体积、双体分布函数、键角分布函数、键对分析和Voronoi多面体方法研究了微观局域结构随温度的变化关系. 研究发现：在Q1冷却过程中,液态Ti75Al25合金在1000 K发生玻璃化转变,形成非晶结构; 而在Q2冷却过程中,液态Ti75Al25合金发生结晶,并最终形成hcp晶体结构。     

Cu3Au熔体快速冷却过程微观结构演化的分子动力学模拟

利用分子动力学模拟技术研究了金属间化合物Cu3Au熔体的双体分布函数g(r)在快速凝固条件下随温度的变化情况，结果表明，Cu3Au降温至700K时第二峰已发生劈裂，液态金属中已经产生了非晶态；用键对分析技术详细考察了Cu3Au中微观组团随温度的演化特点，液体中的键对数及多面体数与温度的关系都表明，Cu3Au在向非晶转变的过程中，的确发生了微观结构组态的变化，其中以液体中的缺陷多面体随温度变化最为剧烈。非晶不是过冷液态的“冻结”。     

铝基非晶合金微观结构的特点与演变

选择Al90Fe5Ce5和Al83Zn7Ce10非晶合金来研究铝基非晶合金的微观结构的特点和微观结构的演变.在Al90Fe5Ce5非晶合金中,发现亚稳Al6Fe相与被铝相包裹的二十面体准晶相共存.在Al83Zn7Ce10非晶合金中,金属间化合物Al2ZnCe2为凝固过程中的初生相.金属间化合物Al2ZnCe2可以伴随纳米晶粒铝的晶化而析出.抑制在冷却过程中所形成的各种晶核的成长是铝基合金具有很强的非晶形成能力的主要原因.多种相的竞争形核和有限生长导致了铝基合金具有复杂的结构特点 关键词： 铝基非晶合金 二十面体准晶 预峰 化学短程序     

液态结构与性质关系Ⅱ——Mg-9Al熔体的运动黏度及与熔体微观结构的关系

采用坩埚扭摆振动法测量Mg-9Al熔体的运动黏度,得到890—1190 K温区内高精度的黏度-温度关系曲线ν(T),发现升温过程中黏度随温度升高发生异常变化,当温度升高至1000—1075 K时,黏度由快速增大转变为逐渐减小,即发生转折变化;在随后的降温和第二次升温过程中,黏度随温度变化呈指数规律单调递增(减),符合Arrhenius方程式.在实验研究基础上,采用剩余键结构模型和"平均原子集团"演变行为的计算模型讨论Mg-9Al熔体的黏度与微观结构之间的相关性,结果表明:类关键词： 合金熔体 结构与黏度相关性 剩余键结构 平均原子集团模型     

热镀铜层冷凝过程的分子动力学模拟

采用常温、常压分子动力学模拟方法和FS(Finnis Sinclair)势 ,研究了在周期性边界条件下由 5 0 0个原子构成的液态Cu模型系统的凝固过程 ,考察了不同降温速率下Cu的凝固行为 ,得到了不同温度、不同冷却速率下Cu的双体分布函数 ;采用HA键型指数法统计了各种小原子团在不同温度下所占比例 ,采用键取向序分析了体系降温全过程的局域取向对称性 ,得到原子体系微观结构组态变化的重要信息 ;最后 ,利用能量分析的方法对体系微观结构的变化进行了说明 ,给出了液态Cu冷凝过程中微观结构转变的重要信息 .     

退火诱导亚稳态Fe80Cu20合金固溶体的结构相变

利用扩展x射线吸收精细结构和x射线衍射研究了机械合金化制备的体心立方(bcc)的亚稳态Fe80Cu20合金固溶体的结构随退火温度的变化特点.结果表明,在300-873 K温度范围内,随着退火温度的升高,bcc结构物相的晶格常数近于线性降低,这主要是由于Cu原子从bcc结构Fe80Cu20合金固溶体中逐渐偏析出来,生成面心立方(fcc)结构的Cu物相所致.经603 K退火后,Cu原子的平均键长RCu-Cu增加了0.003 nm左右,大约有50%的Cu原子从bcc结构的Fe80Cu20合金固溶体中偏析出来.在773 K退火后,bcc结构Fe80Cu20合金固溶体近于完全相分离,生成了bcc结构的α-Fe与fcc结构的Cu物相.     

液态氧化铝结构的分子动力学模拟

利用分子动力学模拟液态氧化铝从2663 K到过冷温度2223 K的结构变化,通过总双体分布函数得到的液态氧化铝的原子第一、第二近邻距离与Ansell研究小组的实验结果基本一致.通过配位数和偏角分布函数的分析,液态氧化铝的局域结构主要是由氧的三重铝原子配位和铝原子四重(AlO₄)和五重(AlO₅)氧原子配位组成.没有观察到可能因铝原子高、低配位数氧原子的团簇分离而出现的液-液相变.     

Band structure,Fermi surface,elastic,thermodynamic,and optical properties of AlZr_3,AlCu_3,and AlCu_2Zr:First-principles study

The electronic properties(Fermi surface,band structure,and density of states(DOS)) of Al-based alloys AlM_3(M=Zr and Cu) and AlCu_2Zr are investigated using the first-principles pseudopotential plane wave method within the generalized gradient approximation(GGA).The structural parameters and elastic constants are evaluated and compared with other available data.Also,the pressure dependences of mechanical properties of the compounds are studied.The temperature dependence of adiabatic bulk modulus,Debye temperature,specific heat,thermal expansion coefficient,entropy,and internal energy are all obtained for the first time through quasi-harmonic Debye model with phononic effects for T = 0 K-100 K.The parameters of optical properties(dielectric functions,refractive index,extinction coefficient,absorption spectrum,conductivity,energy-loss spectrum,and reflectivity) of the compounds are calculated and discussed for the first time.The reflectivities of the materials are quite high in the IR-visible-UV region up to ~ 15 eV,showing that they promise to be good coating materials to avoid solar heating.Some of the properties are also compared with those of the Al-based Ni_3 Al compound.     

Viscosity and diffusivity in melts: from unary to multicomponent systems

Viscosity and diffusivity, two important transport coefficients, are systematically investigated from unary melt to binary to multicomponent melts in the present work. By coupling with Kaptay’s viscosity equation of pure liquid metals and effective radii of diffusion species, the Sutherland equation is modified by taking the size effect into account, and further derived into an Arrhenius formula for the convenient usage. Its reliability for predicting self-diffusivity and impurity diffusivity in unary liquids is then validated by comparing the calculated self-diffusivities and impurity diffusivities in liquid Al- and Fe-based alloys with the experimental and the assessed data. Moreover, the Kozlov model was chosen among various viscosity models as the most reliable one to reproduce the experimental viscosities in binary and multicomponent melts. Based on the reliable viscosities calculated from the Kozlov model, the modified Sutherland equation is utilized to predict the tracer diffusivities in binary and multicomponent melts, and validated in Al–Cu, Al–Ni and Al–Ce–Ni melts. Comprehensive comparisons between the calculated results and the literature data indicate that the experimental tracer diffusivities and the theoretical ones can be well reproduced by the present calculations. In addition, the vacancy-wind factor in binary liquid Al–Ni alloys with the increasing temperature is also discussed. What’s more, the calculated inter-diffusivities in liquid Al–Cu, Al–Ni and Al–Ag–Cu alloys are also in excellent agreement with the measured and theoretical data. Comparisons between the simulated concentration profiles and the measured ones in Al–Cu, Al–Ce–Ni and Al–Ag–Cu melts are further used to validate the present calculation method.     

Thermo-physical properties of ternary Al–Cu–Fe alloy in liquid state

ABSTRACT

The thermodynamic and surface properties of the ternary Al–Cu–Fe alloy in the liquid state have been computed using different models. The thermodynamic properties, such as activity and excess free energy of mixing and the surface properties, such as surface tension have been calculated. The temperature dependence of activity and surface concentration of the components of the ternary Al–Cu–Fe alloy in fixed proportion of any two components have also been calculated. The surface tension of the alloy with respect to the change in temperature in the range 1823–2073?K has also been studied.     

Microstructure and magnetic properties of NdFeB alloys by co-doping alnico elements

Elements of alnico 8 are added into Nd-Fe-B alloys fabricated by rapid solidification method. It is observed that the magnetic properties at high temperature improved by small addition of alnico elements. The Curie temperature of the alloys increased from 580 K for standard alloy to 639 K by 20% addition of alnico 8 elements. The spin reorientation temperature decreased from 133 K to 104 K. The TEM analysis showed that elements of alnico 8 refine the microstructure of Nd-Fe-B ribbons. The STEM analysis confirmed the heterogeneous distribution of Nd, Fe, Cu, Al, Ni and homogeneous distribution of Ti, Nb and Co. The boundaries of nano grains contain more than 70% ferromagnetic elements, ensuring strong inter-grain coupling among the grains.     

Undercooling and Unidirectional Solidification of CuNi Alloy Melts

Cylinder-shaped CusoNi20 alloy melt is undercooled and solidified by the combination of the electromagnetic levitation technique and the flux treatment method. Nearly constant temperature gradient of 8-10 K/cm is realized for the cylindrical melts with differen~ undercooling levels at the bottom ends. The experimental results reveal that with the increase of the undercoo]ing of the melts from 35 to 220 K, the microstructures undergo transition from coarse dendrites to granular grains, unidirectional dendrites, and finally to equiaxed grains.     

退火诱导亚稳态Fe80Cu20合金固溶体的结构相变

利用扩展x射线吸收精细结构和x射线衍射研究了机械合金化制备的体心立方(bcc)的亚稳态Fe₈₀Cu₂₀合金固溶体的结构随退火温度的变化特点.结果表明，在300—873 K温度范围内，随着退火温度的升高，bcc结构物相的晶格常数近于线性降低，这主要是由于Cu原子从bcc结构Fe₈₀Cu₂₀合金固溶体中逐渐偏析出来，生成面心立方(fcc)结构的Cu物相所致.经603K退火后，Cu原子的平均键长R_Cu—Cu增加了0.003 nm左右，大约有50%的Cu原子从bcc结构的Fe₈₀Cu₂₀合金固溶体中偏析出来.在773 K退火后，bcc结构Fe_８０Cu₂₀合金固溶体近于完全相分离，生成了bcc结构的α-Fe与fcc结构的Cu物相. 关键词： 扩展x射线吸收精细结构 x射线衍射 ８０Cu₂₀合金')" href="#">Fe_８０Cu₂₀合金 机械合金化     

溅射Al对AlN的“润湿”与钎焊

由于润湿性不佳, 难以实现金属钎料对陶瓷的无过渡层直接钎焊, 本文在研究了溅射Al薄膜对AlN的“润湿”作用的基础上, 通过磁控溅射的方法在AlN表面沉积Al基薄膜作为钎料, 在真空条件下对AlN陶瓷进行了直接钎焊. 采用高景深光学显微镜、扫描电子显微镜和X射线能量分散谱表征了钎焊接头和剪切断口的组织及形貌. 结果表明, 高能量溅射Al粒子对AlN的撞击可以形成只有850 ℃以上高温才可获得的Al-N化学键, 实现Al对AlN的“润湿”, 使Al基薄膜钎料能够在较低的温度(≥ 510 ℃)对AlN直接钎焊. 此方法获得的Al/AlN接头的剪切强度达到104 MPa, 含3.8 at.% Cu的Al合金钎料接头强度可进一步提高到165 MPa, 它们的剪切断裂都产生于钎缝金属之中; 增加钎料中的Cu含量至9.1 at.%后, Cu在钎缝与陶瓷界面的偏聚使接头的剪切强度降低为95 MPa. Al-20 at.% Ge合金可以将钎焊温度降低至510 ℃, 但Ge在钎缝与陶瓷界面的偏聚使接头在48 MPa发生断裂.     

Structural stability and electrical conductivity of amorphous Ge-metal alloy films

Stable homogeneous amorphous alloy¹ films of Ge with different concentrations of Al, Cu and Fe have been prepared by the simultaneous vapor deposition technique. Ge-Metal films are amorphous up to a concentration of ～ 40 at.% Al, ～ 20 at.% Cu and ～ 20 at.% Fe. The cyclic annealing and crystallization temperature of these films show that whereas Al increases the stability of the amorphous phase, the addition of Cu and Fe decreases it. The electrical resistivity decreases gradually with increasing Al content. In contrast, a rapid decrease in the electrical resistivity is observed for the Ge-Cu and Ge-Fe systems. The thermoelectric power (TEP) of Ge-Cu and Ge-Fe system assumes small values ～ few μV/deg for concentrations greater than few atomic percent. Ge-Al system exhibits large positive thermoelectric power at all compositions. The temperature dependence of the electrical resistivity of these alloy films show that the addition of Cu and Fe to Ge results in a drastic decrease in the activation energy of conduction whereas the addition of Al increases the activation energy. Ge-Al films exhibit intrinsic like conduction in the temperature range 100–300 K. The Ge-Cu and Ge-Fe films exhibit hopping conduction from 100–300 K and the related density of states is up to 100 times larger than in pure a-Ge films.     

Thermokraft von amorphen SnCu-Legierungen

By means of a new method the thermopower of amorphous and polycrystalline SnCu films and a SnAu film is measured in the temperature range from 3 K to 300 K. The Cu concentration extends from 16 at % to 80 at %, the Au concentration of the SnAu film amounts to 20 at %. The thermopower of the amorphous SnCu alloys varies (similarly as in the case of liquid SnCu) monotonously with Cu concentration from small negative values at the Sn rich side to large positive values at the Cu rich side. The change of sign occurs at 72 at % Cu. The result is discussed within the frame of the free electron model.

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Diese Arbeit ist Teil der Dissertation von W. Mürer