Atomic and Electronic Structures of Traps in Silicon Oxide and Silicon Oxynitride

Silicon oxide (SiO₂) and silicon oxynitride (SiO_xN_y) are two key dielectrics used in silicon devices. The excellent interface properties of these dielectrics with silicon have enabled the tremendous advancement of metal-oxide-semiconductor (MOS) technology. However, these dielectrics are still found to have pronounced amount of localized states which act as electron or hole traps and lead to the performance and reliability degradations of the MOS integrated circuits. A better understanding of the nature of these states will help to understand the constraints and lifetime performance of the MOS devices. Recently, due to the available of ab initio quantum-mechanical calculations and some synchrotron radiation experiments, substantial progress has been achieved in understanding the atomic and electronic nature of the defects in these dielectrics. In this review, the properties, formation and removal mechanisms of various defects in silicon oxide and silicon oxynitride films will be critically discussed. Some remarks on the thermal ionization energies in connection with the optical ionization energies of electron and hole traps, as well as some of the unsolved issues in these materials will be highlighted.     

Pulsed laser deposition of praseodymium oxide films on silicon(100)

In this study, pulsed laser deposition (PLD) was used to deposit thin films of high-k dielectric praseodymium oxide on silicon(100). Photoluminescence spectroscopy (PL) shows the possibility of activating crystal defects in the Si substrate during the PLD process. Capacitance-Voltage (C–V) measurements yield an average dielectric constant of k=33 for Pr_xO_y films of different thicknesses. The leakage current is orders of magnitude lower than for SiO₂. PACS 77.55; 81.15.Fg     

Heteroepitaxial GaN films on silicon substrates with porous buffer layers

New complex buffer layers based on a porous material have been developed for epitaxial growth of GaN films on Si substrates. The characteristics of gallium nitride heteroepitaxial layers grown on silicon substrates with new buffer layers by metal-organic vapor phase epitaxy are investigated. It is shown that the porous buffer layers improve the electric homogeneity and increase the photoluminescence intensity of epitaxial GaN films on Si substrates to the values comparable with those for reference GaN films on Al₂O₃ substrates. It is found that a fianite layer in a complex buffer is a barrier for silicon diffusion from the substrate into a GaN film.     

Comparative study of pulsed laser deposited HfO2 and Hf–aluminate films for high-k gate dielectric applications

The thermal stability and the electrical properties of HfO₂ and Hf–aluminate films prepared by the pulsed laser deposition technique have been investigated by X-ray diffraction, differential thermal analysis, capacitance–voltage correlation, leakage-current measurements and high-resolution transmission electron microscopy observation, respectively. A crystallization transformation from HfO₂ amorphous phase to polycrystalline monoclinic structure occurs at about 500 °C. In contrast, the amorphous structure of Hf–aluminate films remains stable at higher temperatures up to 900 °C. Rapid thermal annealing at 1000 °C for 3 min leads to a phase separation in Hf–aluminate films. Tetragonal HfO₂(111) is predominant, and Al₂O₃ separates from Hf–aluminate and is still in the amorphous state. The dielectric constant of amorphous HfO₂ and Hf–aluminate films was determined to be about 26 and 16.6, respectively, by measuring a Pt/dielectric film/Pt capacitor structure. A very small equivalent oxide thickness (EOT) value of 0.74 nm for a 3-nm physical thickness Hf–aluminate film on a n-Si substrate with a leakage current of 0.17 A/cm² at 1-V gate voltage was obtained. The interface at Hf–aluminate/Si is atomically sharp, while a thick interface layer exists between the HfO₂ film and the Si substrate, which makes it difficult to obtain an EOT of less than 1 nm. PACS 77.55.+f; 81.15.Fg; 73.40.Qv     

Some features of the electrical forming of MDM systems based on silicon oxynitride films

Results are given in this paper of a study of the electrical forming process in thin-film MDM systems based on films of silicon oxynitride of varying compositions. It was observed that the forming voltage and forming rate of a thin-film Al-Si_xN_yO_z-Al system depends essentially on the composition of the dielectric film while the characteristics of the formed structures depend weakly on the oxygen/nitrogen ratio in the film. The results obtained are in good agreement with Shnurov's model of forming.Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 5, pp. 71–74, May, 1976.     

Plasma treatment studies of MIS devices

Silicon nitride films have emerged as the possible future dielectrics for ultra large scale integration (ULSI). Because the interface state density of silicon nitride/silicon interface in metal insulator semiconductor (MIS) configuration is more than an order of magnitude larger than that of silicon dioxide/silicon interface, plasma treatment studies on silicon nitride films have been undertaken for the possible improvement. Accordingly, silicon nitride films of various composition have been prepared by plasma enhanced chemical vapor deposition (PECVD) system using silane(SiH₄) and ammonia(NH₃) with nitrogen(N₂) as the diluent and MIS devices have been fabricated with as well as without plasma treated silicon nitride as the insulator. A considerable improvement in the silicon nitride/silicon interface is observed on ammonia plasma treatment while nitrous oxide(N₂O) plasma treatment studies have resulted in the establishment of a novel plasma oxidation process.     

Charge transport in dielectrics by tunneling between traps

The theory of charge transport in dielectrics by tunneling between traps is developed. In contrast to the Frenkel model, traps in silicon nitride are characterized by two energies, optical and thermal ones, and ionization occurs by the multiphonon mechanism. The theory predicts that tunneling between such traps is thermally stimulated: the half-difference of the optical and thermal energies plays the role of the activation energy. This theory successfully explains the experimental current-voltage characteristics of silicon-enriched silicon nitride. Such silicon nitride contains a large number of traps whose nature is associated with excess silicon. Charge transport in this material occurs by tunneling between adjacent traps.     

Growth behavior of high k LaAlO3 films on Si by metalorganic chemical vapor deposition for alternative gate dielectric application

LaAlO₃ (LAO) is explored in this work to replace SiO₂ as the gate dielectric material in metal–oxide–semiconductor field effect transistor. Amorphous LAO gate dielectric films were deposited on Si (0 0 1) substrates by low pressure metalorganic chemical vapor deposition using La(dpm)₃ and Al(acac)₃ sources. The effect of processing parameters such as deposition temperature and precursor vapor flux on growth, structure, morphology, and composition of LAO films has been investigated by various analytical methods deeply. The film growth mechanism on Si is reaction limiting instead of mass transport control. The reaction is thermally activated with activation energy of 37 kJ/mol. In the initial growth stage, Al element is deficient due to higher nucleation barrier on Si. The LAO films show a smooth surface and good thermal stability and remain amorphous up to a high temperature of 850 °C. The electrical properties of amorphous LAO ultrathin films on Si have also been evaluated, indicating LAO is suitable for high k gate dielectric applications.     

Characteristics and growth mechanisms of TixSi(1-x)Oy films by liquid phase deposition

Using a solution of hexafluorotitanic acid and boric acid, high-refractive-index and high-dielectric-constant films can be deposited on silicon substrates. The constituents of the films were Ti, Si and O analyzed by secondary-ion mass spectroscopy, which indicates that the structure of the films is Ti_xSi_(1-x)O_y. The Ti/Si ratio can be modulated by the mole concentration of boric acid. The leakage current density and dielectric constant of the deposited films can be improved by thermal annealing in N₂ ambience. Received: 16 November 2000 / Accepted: 2 March 2001 / Published online: 23 May 2001     

XAFS analysis of indium oxynitride thin films grown on silicon substrates

Local structure of indium oxynitride thin films grown on silicon substrates was investigated by X‐ray absorption fine structure technique incorporated with first principle calculations. The thin films were grown by using reactive gas timing radio frequency (RF) magnetron sputtering technique with nitrogen (N₂) and oxygen (O₂) as reactive gasses. The reactive gasses were interchangeably fed into sputtering system at five different time intervals. The gas feeding time intervals of N₂:O₂ are 30 : 0, 30 : 5, 30 : 10, 30 : 20 and 10 : 30 s, respectively. The analysis results can be divided into three main categories. Firstly, the films grown with 30 : 0 and 30 : 5 s gas feeding time intervals are wurtzite structure indium nitride with 25 and 43% oxygen contaminations, respectively. Secondary, the film grown with 10 : 30 s gas feeding time intervals is bixbyite structure indium oxide. Finally, the films are alloying between indium nitride and indium oxide for other growth condition. The fitted radial distribution spectra, the structural parameters and the combination ratios of the alloys are discussed. Copyright © 2012 John Wiley & Sons, Ltd.     

Analysis of excimer laser annealing of amorphous SiGe on La2O3//Si structures

The reduction of complementary metal oxide semiconductor dimensions through transistor scaling is in part limited by the SiO₂ dielectric layer thickness. Among the materials evaluated as alternative gate dielectrics one of the leading candidate is La₂O₃ due to its high permittivity and thermodynamic stability. However, during device processing, thermal annealing can promote deleterious interactions between the silicon substrate and the high-k dielectric degrading the desired oxide insulating properties.The possibility to grow poly-SiGe on top of La₂O₃//Si by laser assisted techniques therefore seems to be very attractive. Low thermal budget techniques such as pulsed laser deposition and crystallization can be a good choice to reduce possible interface modifications due to their localized and limited thermal effect.In this work the laser annealing by ArF excimer laser irradiation of amorphous SiGe grown on La₂O₃//Si has been analysed theoretically by a numerical model based on the heat conduction differential equation with the aim to control possible modifications at the La₂O₃//Si interface. Simulations have been carried out using different laser energy densities (0.26-0.58 J/cm²), different La₂O₃ film thickness (5-20 nm) and a 50 nm, 30 nm thick amorphous SiGe layer. The temperature distributions have been studied in both the two films and substrate, the melting depth and interfaces temperature have been evaluated. The fluences ranges for which the interfaces start to melt have been calculated for the different configurations.Thermal profiles and interfaces melting point have shown to be sensitive to the thickness of the La₂O₃ film, the thicker the film the lower the temperature at Si interface.Good agreement between theoretical and preliminary experimental data has been found.According to our results the oxide degradation is not expected during the laser crystallization of amorphous Si_0.7Ge_0.3 for the examined ranges of film thickness and fluences.     

Structural analysis of silicon dioxide and silicon oxynitride filmsproduced using an oxygen plasma

Plasma grown silicon dioxide and oxynitride layers are shown to represent, for microelectronic applications, a good alternative method to conventional thermally grown layers. Fast growth rates, together with good electrical properties are demonstrated, at low process temperatures. Growth kinetics of SiO₂ layers synthesized both in RF and microwave plasma anodization systems are presented for a wide range of substrate temperatures in the range (90-560°C). Structural properties of the films can be affected during preparation, due to radiation from the plasma and particle bombardment. For the SiO₂ layers obtained by RF anodization at 300°C, these surface structural features were investigated by scanning electron microscopy; bulk and interface dielectric properties of the layers were analyzed by spectroellipsometry. The results were correlated with electrical properties and data coming from the growth kinetics. It was found that the properties of the layers, both structural and electrical, are strongly dependent on the growth regime (linear or parabolic). Silicon oxynitride films produced by plasma anodization of silicon nitride layers are investigated by spectroellipsometry and Auger electron spectroscopy. These results are correlated with electrical measurements and used to explain the changes in film properties     

Pulsed laser deposition of aluminate YAlO3 and LaAlO3 thin films for alternative gate dielectric applications

Amorphous aluminate YAlO₃ (YAO) thin films on n-type silicon wafers as gate dielectric layers of metal–oxide–semiconductor devices are prepared by pulsed laser deposition. As a comparison, amorphous aluminate LaAlO₃ (LAO) thin films are also prepared. The structural and electrical characterization shows that the as-prepared YAO films remain amorphous until 900 °C and the dielectric constant is ∼14. The measured leakage current of less than 10^-3 A/cm² at a bias of V_G=1.0 V for ∼40-nm-thick YAO and LAO films obeys the Fowler–Nordheim tunneling mechanism. It is revealed that the electrical property can be significantly affected by the oxygen pressure during deposition and post rapid thermal annealing, which may change the fixed negative charge density at the gate interface. PACS 77.55.+f; 81.15.Fg; 81.40.Ef     

Effects of S incorporation on Ag substitutional acceptors in ZnO:(Ag, S) thin films

Ag–S codoped ZnO thin films have been fabricated on Si substrates by radio frequency (RF) magnetron sputtering using a thermal oxidation method. XRD and SEM measurements showed that the sample has hexagonal wurtzite structure with a preferential (002) orientation and the surface is composed of compact and uniform grains. Ag_Zn–nS_O defect complexes were observed in the Ag–S codoped ZnO films by XPS analysis. Low temperature PL spectra showed neutral acceptor bound exciton emission related to Ag_Zn–nS_O. The corresponding acceptor ionization energy of 150 meV is much lower than that of monodoped Ag (246 meV), which is favorable for p-type doping of ZnO.     

Pulsed laser deposited ZrAlON films for high-k gate dielectric applications

ZrAlON films were fabricated using the reactive ablation of a ceramic ZrAlO target in N₂ ambient by pulsed laser deposition (PLD) technique. ZrAlON films were deposited directly on n-Si(100) substrates and Pt coated silicon substrates, respectively, at 500 °C in a 20 Pa N₂ ambient, and rapid thermal annealed (RTA) in N₂ ambient at 1000 °C for 1 min. Cross sectional high-resolution transmission electron microscopy (HRTEM) images clearly show that the ZrAlON/Si interface is atomically sharp without an interfacial layer, and the films are completely amorphous. The electron diffraction pattern of TEM also indicates the amorphous structure of the RTA ZrAlON film. X-ray photoelectron spectroscopy (XPS) measurement was performed to confirm the effective incorporation of nitrogen with a content of about 6 at. %, and to reveal the N–O bonding in ZrAlON films. The dielectric constant of amorphous ZrAlON was determined to be about 18.2 which is more than 16.8 for ZrAlO by measuring the Pt/films/Pt capacitors. Capacitance–voltage (C–V) measurements show that a small equivalent oxide thickness (EOT) of 1.03 nm for 4 nm ZrAlON film on the n-Si substrate with a leakage current of 28.7 mA/cm² at 1 V gate voltage was obtained. PACS 77.55.+f; 81.15.Fg; 73.40.Qv     

Effective surface passivation of crystalline silicon using ultrathin Al2O3 films and Al2O3/SiNx stacks

We measure surface recombination velocities (SRVs) below 10 cm/s on p‐type crystalline silicon wafers passivated by atomic–layer–deposited (ALD) aluminium oxide (Al₂O₃) films of thickness ≥10 nm. For films thinner than 10 nm the SRV increases with decreasing Al₂O₃ thickness. For ultrathin Al₂O₃ layers of 3.6 nm we still attain a SRV < 22 cm/s on 1.5 Ω cm p‐Si and an exceptionally low SRV of 1.8 cm/s on high‐resistivity (200 Ω cm) p‐Si. Ultrathin Al₂O₃ films are particularly relevant for the implementation into solar cells, as the deposition rate of the ALD process is extremely low compared to the frequently used plasma‐enhanced chemical vapour deposition of silicon nitride (SiN_x). Our experiments on silicon wafers passivated with stacks composed of ultrathin Al₂O₃ and SiN_x show that a substantially improved thermal stability during high‐temperature firing at 830 °C is obtained for the Al₂O₃/SiN_x stacks compared to the single‐layer Al₂O₃ passivation. Al₂O₃/SiN_x stacks are hence ideally suited for the implementation into industrial‐type silicon solar cells where the metal contacts are made by screen‐printing and high‐temperature firing of metal pastes. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Room-temperature pulsed laser deposition and dielectric properties of amorphous Bi3.95Er0.05Ti3O12 thin films on conductive substrates

Bi_3.95Er_0.05Ti₃O₁₂ (BErT) thin films were prepared on Pt/Ti/SiO₂/Si and indium-tin-oxide (ITO)-coated glass substrates at room temperature by pulsed laser deposition. These thin films were amorphous with uniform thickness. Excellent dielectric characteristics have been confirmed. The amorphous BErT thin films deposited on the Pt/Ti/SiO₂/Si and ITO-coated glass substrates exhibited almost the same dielectric constant of 52 with a low dielectric loss of less than 0.02 at 1 kHz. Meanwhile, the dielectric properties of the thin films had an excellent bias voltage stability and thermal stability. The amorphous BErT thin films might have potential applications in microelectronic and optoelectronic devices.     

Influence of oxygen on the growth of cubic boron nitride thin films by plasma-enhanced chemical vapour deposition

Cubic boron nitride thin films were deposited on silicon substrates by low-pressure inductively coupled plasma-enhanced chemical vapour deposition. It was found that the introduction of O₂ into the deposition system suppresses both nucleation and growth of cubic boron nitride. At a B₂H₆ concentration of 2.5\% during film deposition, the critical O₂ concentration allowed for the nucleation of cubic boron nitride was found to be less than 1.4\%, while that for the growth of cubic boron nitride was higher than 2.1\%. Moreover, the infrared absorption peak observed at around 1230--1280~cm^-1, frequently detected for cubic boron nitride films prepared using non-ultrahigh vacuum systems, appears to be due to the absorption of boron oxide, a contaminant formed as a result of the oxygen impurity. Therefore, the existence of trace oxygen contamination in boron nitride films can be evaluated qualitatively by this infrared absorption peak.     

Silicon oxynitride thin films synthesised by the reactive gas pulsing process using rectangular pulses

Silicon oxynitride thin films were synthesised by the reactive gas pulsing process using an argon, oxygen and nitrogen gas mixture from a semiconductor Si target. Argon and nitrogen were introduced at a constant mass flow rate, whereas oxygen gas was periodically supplied using a rectangular pulsed flow rate. The O₂ injection time T_ON (or duty cycle α) was the only varied parameter. The influences of this parameter on the discharge behaviour, on the Si target voltage, and on the resulting chemical composition of the films were investigated. The temporal evolution of the total pressure exhibits exponential shape differing from the rectangular oxygen pulse shape, due to the response time of the gas flowmeter and to the progressive oxidation of the target and the chamber walls. During the T_ON time, the preferential adsorption of the introduced O₂ induces a decay in Si target voltage. Reversion to the nitrided mode is still possible as soon as the O₂ injection is stopped. The elemental analyses assessed by secondary neutral mass spectrometry (SNMS) showed that the O/N ratio within silicon oxynitride films linearly depends on the T_ON time. Increasing the duty cycle α over a certain value results in an oxidised steady state formation during the T_ON time. This formation was observed by real time measurements of the emission lines ratio I(O^*)/I(Ar^*) indicative of the O₂ partial pressure and confirmed by the time derivative of the target voltage. During the T_OFF time, the alternation with the nitrided mode becomes impossible, leading to the specific synthesis of stoichiometric SiO₂ films.     

Growth of thin, crystalline oxide, nitride and oxynitride films on metal and metal alloy surfaces

This paper reviews the current knowledge of the properties of ultrathin, well-ordered oxide, nitride and oxynitride films grown on metal and metal alloy surfaces. Different modes of preparation are discussed and the vibrational and structural properties are summarized. The focus will be put onto Al-oxides grown on surfaces of the intermetallic alloys NiAl, Ni₃Al and FeAl. The properties of Ga₂O₃ grown on surfaces of the intermetallic alloy CoGa are also described. In these cases Al- and Ga-atoms, respectively, segregate from the substrate and react with adsorbed oxygen. The grown Al- and Ga-oxide films, respectively, order at elevated temperatures. Systems are also discussed where Al-oxide is grown by oxidation of Al-atoms which are evaporated on surfaces of the transition metals Re and Ru. The growth of transition metal oxides CoO (1 1 1)/Co (0 0 0 1), CoO (1 0 0)/Co (1 1 2 0), NiO (1 0 0)/Ni (1 0 0), NiO/Ni (1 1 1) and Cr₂O₃/Cr (1 1 0) are also presented. Thin films of Al- and Ga-nitride, respectively, can be grown on the base of the intermetallic alloy NiAl and CoGa by low-temperature adsorption of ammonia. These nitride films order at elevated temperatures. Al- and Ga-oxynitride, respectively, can be grown on surfaces of NiAl and CoGa substrates by adsorption on nitric oxide. An ordering of these ultrathin oxynitride layers is observed at elevated temperatures.