在Si衬底上用分子束外延低温生长Ge薄膜

本文报道了室温下淀积的薄层Ge在Si衬底表面上通过加热形成结晶的Ge岛,然后在此“带结构”的衬底表面上用分子束外延(MBE)方法生长Ge薄膜的反射式高能电子衍射(RHEED),俄歇电子能谱(AES)研究结果。X射线双晶衍射的测试结果表明,衬底表面的Ge岛有助于释放外延层的失配应力,提高外延层的晶体质量。 关键词：     

截止波长12μm的p型-InAs_(0.04)Sb_(0.96)材料的熔体外延生长

为了获得P型的长波长InAsSb材料并研究掺杂剂Ge对材料特性的影响,用熔体外延法生长了掺Ge的波长为12μm的P型-InAsSb外延层．用傅里叶红外光谱仪、VanderPauw法和电子探针微分析研究了材料的透射光谱、电学性质以及组分的分布．结果表明,两性杂质Ge在熔体外延生长的InAs0.01Sb0.96材料中起受主杂质作用．当外延层的组分相同时,材料的截止波长不随掺Ge浓度的变化而变化,但是随着外延层中掺Ge量的增加,外延层的透射率下降．掺杂原子Ge在外延层的表面及生长方向的分布都是相当均匀的．77K下测得,载流子浓度为9．18×10^16cm^-3的掺Ge的P型-InAS0.01Sb0.96样品,其空穴迁移率达到1120cm^2·Vs^-1.     

Si1-xGex/Si异质结构中热应力对临界厚度的影响

系统分析了Si_1-xGe_x/Si外延生长中热应力对外延生长的影响．假设Si Ge的线膨胀系数是随Ge的组分线性变化的，由此计算出热应变和应变能密度．根据能量平衡原理，当失配应变能密度加热应变能密度等于位错能密度时，外延层达到临界厚度，在People的基础上得出了改进的临界厚度计算公式．理论计算值与People的实验值更相近． 关键词：     

硅基低位错密度厚锗外延层的UHV/CVD法生长

利用超高真空化学气相淀积系统, 基于低温缓冲层和插入应变超晶格的方法, 在Si(100)衬底上外延出厚度约为880 nm的纯Ge层. 采用X射线双晶衍射、高分辨透射电镜、原子力显微镜和光致发光谱分别表征了其结构及光学性质. 测试结果显示外延Ge的X射线双晶衍射曲线半高宽为273", 表面均方根粗糙度为0.24 nm, 位错密度约为1.5×10⁶ cm². 在室温下观测到外延Ge的直接带跃迁光致发光, 发光峰值位于1540 nm. 表明生长的Si基Ge材料具有良好的结晶质量, 可望在Si基光电子器件中得到应用.     

纳米尺度下Si/Ge界面应力释放机制的分子动力学研究

采用分子动力学方法研究了纳米尺度下硅(Si)基锗(Ge)结构的Si/Ge界面应力分布特征,以及点缺陷层在应力释放过程中的作用机制.结果表明:在纳米尺度下, Si/Ge界面应力分布曲线与Ge尺寸密切相关,界面应力下降速度与Ge尺寸存在近似的线性递减关系;同时,在Si/Ge界面处增加一个富含空位缺陷的缓冲层,可显著改变Si/Ge界面应力分布,在此基础上对比分析了点缺陷在纯Ge结构内部引起应力变化与缺陷密度的关系,缺陷层的引入和缺陷密度的增加可加速界面应力的释放.参考对Si/Ge界面结构的研究结果,可在Si基纯Ge薄膜生长过程中引入缺陷层,并对其结构进行设计,降低界面应力水平,进而降低界面处产生位错缺陷的概率,提高Si基Ge薄膜质量,这一思想在研究报道的Si基Ge膜低温缓冲层生长方法中初步得到了证实.     

硅基锗薄膜选区外延生长研究

利用超高真空化学气相沉积系统, 基于低温Ge缓冲层和选区外延技术, 在Si/SiO₂图形衬底上选择性外延生长Ge薄膜. 采用X射线衍射、扫描电镜、原子力显微镜、拉曼散射光谱等表征了其晶体质量和应变等参数随图形尺寸的变化规律. 测试结果显示, 位错密度随着图形衬底外延窗口的尺寸减小而减少, Ge层中的张应变随窗口尺寸的增大先增大而后趋于稳定. 其原因是选区外延Ge在图形边界形成了(113)面, 减小了材料系统的应变能, 而单位体积应变能随窗口尺寸的增加而减少; 选区外延厚度为380 nm的Ge薄膜X射线衍射曲线半高宽为678", 表面粗糙度为0.2 nm, 表明选区生长的Ge材料具有良好的晶体质量, 有望应用于Si基光电集成.     

截止波长12 μm的p型-InAs0.04Sb0.96材料的熔体外延生长

为了获得p-型的长波长InAsSb材料并研究掺杂剂Ge对材料特性的影响,用熔体外延法生长了掺Ge的波长为12 μm的p型-InAsSb 外延层.用傅里叶红外光谱仪、Van der Pauw 法和电子探针微分析研究了材料的透射光谱、电学性质以及组分的分布.结果表明,两性杂质Ge在熔体外延生长的InAs0.04Sb0.96材料中起受主杂质作用.当外延层的组分相同时,材料的截止波长不随掺Ge浓度的变化而变化,但是随着外延层中掺Ge量的增加,外延层的透射率下降.掺杂原子Ge在外延层的表面及生长方向的分布都是相当均匀的.77 K下测得,载流子浓度为9.18×1016 cm－3的掺Ge的p型-InAs0.04Sb0.96样品,其空穴迁移率达到1 120 cm2·Vs－1.     

Si衬底上分子束外延Ge,Si时的反射式高能电子衍射强度振荡观察

本文观察了在Si(100)和Si(111)衬底上分子束外延Si,Ge时的反射式高能电子衍射(RHEED)强度振荡现象。其振荡特性表明,外延一定厚度的缓冲层可以改善表面的平整性,较慢的生长速率或中断生长一段时间有利于外延膜晶体质量的提高。Si(100)上外延Si或Ge时,沿[100]和[110]方位观测到的振荡特性均为单原子模式,起因于表面存在双畴(2×1)再构;而Si(111)上外延Ge时,[112]方位观测到的振荡为双原子层模式,但在[110]方位观察到不均匀周期的强度振荡行为。两种衬底上保持RHEED     

截止波长12 μm的p型-InAs0.04Sb0.96材料的熔体外延生长

为了获得p-型的长波长InAsSb材料并研究掺杂剂Ge对材料特性的影响,用熔体外延法生长了掺Ge的波长为12 μm的p型-InAsSb 外延层.用傅里叶红外光谱仪、Van der Pauw 法和电子探针微分析研究了材料的透射光谱、电学性质以及组分的分布.结果表明,两性杂质Ge在熔体外延生长的InAs0.04Sb0.96材料中起受主杂质作用.当外延层的组分相同时,材料的截止波长不随掺Ge浓度的变化而变化,但是随着外延层中掺Ge量的增加,外延层的透射率下降.掺杂原子Ge在外延层的表面及生长方向的分布都是相当均匀的.77 K下测得,载流子浓度为9.18×1016 cm-3的掺Ge的p型-InAs0.04Sb0.96样品,其空穴迁移率达到1 120 cm2·Vs-1.     

掺杂对多层Ge/Si(001)量子点光致发光的影响

利用超高真空化学气相沉积设备, 在Si (001) 衬底上外延生长了多个四层Ge/Si量子点样品. 通过原位掺杂的方法, 对不同样品中的Ge/Si量子点分别进行了未掺杂、磷掺杂和硼掺杂. 相比未掺杂的样品, 磷掺杂不影响Ge/Si量子点的表面形貌, 但可以有效增强其室温光致发光; 而硼掺杂会增强Ge/Si量子点的合并, 降低小尺寸Ge/Si量子点的密度, 但其光致发光会减弱. 磷掺杂增强Ge/Si量子点光致发光的原因是, 磷掺杂为Ge/Si量子点提供了更多参与辐射复合的电子. 关键词： Ge/Si量子点 磷掺杂 光致发光     

Interplay of surface morphology, strain relief, and surface stress during surfactant mediated epitaxy of Ge on Si

Lattice-mismatch-induced surface or film stress has significant influence on the morphology of heteroepitaxial films. This is demonstrated using Sb surfactant-mediated epitaxy of Ge on Si(111). The surfactant forces a two-dimensional growth of a continous Ge film instead of islanding. Two qualitatively different growth regimes are observed. Elastic relaxation: Prior to the generation of strain-relieving defects the Ge film grows pseudomorphically with the Si lattice constant and is under strong compressive stress. The Ge film relieves strain by forming a rough surface on a nm scale which allows partial elastic relaxation towards the Ge bulk lattice constant. The unfavorable increase of surface area is outbalanced by the large decrease of strain energy. The change of film stress and surface morphology is monitored in situ during deposition at elevated temperature with surface stress-induced optical deflection and high-resolution spot profile analysis low-energy electron diffraction. Plastic relaxation: After a critical thickness the generation of dislocations is initiated. The rough phase acts as a nucleation center for dislocations. On Si(111) those misfit dislocations are arranged in a threefold quasi periodic array at the interface that accommodate exactly the different lattice constants of Ge and Si. Received: 1 April 1999 / Accepted: 17 August 1999 / Published online: 6 October 1999     

Novel sb induced reconstruction of the (113) surface of ge

Sb induces on Ge(113) a c(2 x 2) reconstruction in which Sb breaks one Ge-Ge bond and occupies an interstitial site, in contrast to Sb adsorption on other Si or Ge surfaces. Sb saturates the three dangling bonds per unit cell of the (113) surface inducing a large strain which is released by occupation of the interstitial site. Two neighboring Sb at interstitial sites form a dimer. The structure has been determined by x-ray diffraction, applying direct methods, and ab initio density-functional-theory calculations. The adsorption geometry and the high binding energy lead one to expect that Sb cannot be used as a surfactant for the growth of Si/Ge layers on the (113) surface.     

Strain relaxation in nano-patterned strained-Si/SiGe heterostructure on insulator

In order to evaluate the strain stability, arrays of strained Si/SiGe nano-stripes and nano-pillars were fabricated by Electron-Beam Lithography (EBL) and Reactive-Ion Etching (RIE). The strain relaxation in the patterned strained Si on SiGe-on-insulator (SGOI) was investigated by high-resolution UV micro-Raman spectroscopy. The Raman measurements before and after patterning indicate that most of the strain in the top strained Si is maintained until scaling down to 300 nm, and relaxation of <15% is observed in pillars with a dimension of 150 nm × 150 nm. In the nano-patterned heterostructure strained Si/SiGe, the observed relaxation is small, which is mainly attributed to the fully relaxed and dislocation-free SiGe virtual substrate fabricated by modified Ge condensation.     

Role of Ge interlayer in the growth of high-quality strain relaxed SiGe layer with low dislocation density

High-quality strain relaxed SiGe layer has been fabricated on Si using a thin Ge interlayer grown at 330 °C. The properties of SiGe layers with and without the low-temperature Ge interlayer are compared. The results indicate that the Ge interlayer plays an important role in the preparation of SiGe layer. The strain relaxed low-temperature Ge interlayer with coalesced island surface, acting as a stable and compliant template, could remove the cross-hatch misfit dislocation lines on surface and promote the strain relaxation in the SiGe layer homogeneously.     

Structural ripple formation in Ge/Sb multilayers induced by laser irradiation

Thin multilayer films (Ge/Sb/Ge/Sb/Si substrate) have been irradiated with single nanosecond laser pulses (=193 nm). Real-Time Reflectivity (RTR) measurements have been used to follow the transformation in situ and cross-sectional transmission electron microscope analysis was used to study both the microstructure and the composition profile before and after irradiation. Melting and mixing are both found to nucleate at preferential sites in the upper Ge/Sb interface. During this process the film surface topography changes in a way not previously seen, and rippling of the film is observed due to lateral mass flow induced in the Sb layer underneath the surface, most probably arising from volume changes upon melting. For the highest irradiation energy densities, melting of the whole multilayer configuration takes place, the ripples are no longer observed, and following cooling and solidification, a mixed amorphous GeSb film is formed.     

Simulation of Surfactant Effects on Growth of Semiconductor Hetero-Epitaxial Sb-Ge/Si(111)

A kinetic Monte Carlo simulation is performed in order to study the effect of Sb as a surfactant on the growth of Ge/Si(111). In our model the exchange mechanism between Ge and Sb atoms and the re-exchange mechanism in which the exchanged Ge adatom re-exchange with the lifted Sb atom to return to the surfactant layer, are considered. Our simulation shows the re-exchange process plays an important role on the growth mode transition in Ge/Sb/Si(111)
system. The influences of the substrate temperature and the deposition rate on the growth of Ge/Sb/Si(111) system is discussed.     

Ge self-diffusion in epitaxial Si(1)-(x)Ge(x) layers

Diffusion coefficients and activation energies have been determined for Ge diffusion in strain-relaxed Si(1)-(x)Ge(x) with x = 0.00, 0.10, 0.20, 0.30, 0.40, and 0.50. The activation energy drops from 4.7 eV in Si and Si(0.90)Ge(0.10) to 3.2 eV at x = 0.50. This value compares with the literature value for Ge self-diffusion in Ge, suggesting Ge-like diffusion already at x approximately equal to 0.5. The effect of strain on the diffusion was also studied showing a decrease in diffusion coefficient and an increase in activation energy upon going from compressive over relaxed to tensile strain.