石墨烯/柔性基底复合结构双向界面切应力传递问题的理论研究

界面力学性能是影响石墨烯/柔性基底复合结构整体力学性能的关键因素,因此对该结构界面切应力传递机理的研究十分必要.考虑了石墨烯和基底泊松效应的影响,本文提出了二维非线性剪滞模型.对于基底泊松比相比石墨烯较大的情况,利用该模型理论研究了受单轴拉伸石墨烯/柔性基底结构的双向界面切应力传递问题.在弹性粘结阶段,导出了石墨烯双向正应变和双向界面切应力的半解析表达式,分析了不同位置处石墨烯正应变和界面切应力的分布规律.导出了石墨烯/柔性基底结构发生界面滑移的临界应变,结果表明该临界应变低于利用经典一维非线性剪滞模型得到的滑移临界应变,并且明显受到石墨烯宽度尺寸以及基底泊松比大小的影响.基于二维非线性剪滞模型建立有限元模型(FEM),研究了界面滑移阶段石墨烯双向正应变和双向界面切应力的分布规律.与一维非线性剪滞模型的结果对比表明,当石墨烯宽度较大时,二维模型和一维模型对石墨烯正应变、界面切应力以及滑移临界应变的计算结果均存在较大差别,但石墨烯宽度很小时,二维模型可近似被一维模型代替.最后,通过与拉曼实验结果的对比,验证了二维非线性剪滞模型的可靠性,并得到了石墨烯/聚对苯二甲酸乙二醇酯(PET)基底结构的界面刚度(100 TPa/m)和界面剪切强度(0.295 MPa).     

基于PET基片的柔性石墨烯应变计加工方法

针对PET塑料耐温性能较差,与标准微纳加工工艺不兼容等问题,开发了面向PET塑料基底材料的光刻、镀膜等微纳加工工艺。通过CVD生长、转移等方式将单层石墨烯薄膜附着于0.5 mm厚PET基底,并采用微纳加工的方式制备了柔性石墨烯压阻应变计。工艺结果表明,本研究所提出的加工方法适用于以PET塑料作为衬底材料的柔性微纳器件的制作。通过对PET塑料衬底施加应变并测量石墨烯的电阻变化率,可计算出石墨烯的压阻应变系数约为1.3。     

PDMS梯度光栅结构制备技术研究

由于传统方法制作的梯度光栅,工艺条件苛刻,制作过程复杂,难以控制,制作成本高,周期较长,提出了一种成本低、工艺简单、可大量制备梯度光栅的工艺方法,采用基于刚性薄膜/柔性衬底的自组装工艺和氧等离子体(Plasma)的方法制备了微米尺度的梯度光栅,利用Plasma时间的可控性和聚二甲基硅氧烷(PDMS)优异的弹性制得所需要尺寸的光栅。首先在聚乙烯对苯二酸脂(PET)薄膜上旋涂一层PDMS薄膜,待PDMS薄膜固化后将双层薄膜弯曲并用Plasma处理,在其表面生成一层刚性氧化层,借助柔性的PET对刚性层施加均匀应力,当应力超过临界值时,在PDMS基底上自组装形成光栅褶皱结构。由于弯曲时预应力的变化,所以在PDMS薄膜上会形成周期和高度呈阶梯状的的光栅褶皱,也就是梯度光栅。采用可见光作为梯度光栅的性能测试光源,选用一级衍射光作为检测对象,从图谱中可以看出以PDMS为基底制备的光栅具有很好的衍射效应,并可实现很好的分光效果。实验表明：梯度光栅具有明显的衍射现象,并且衍射角变化显著,可广泛用于应力测量。这种方法制备的柔性梯度光栅也可以作为微型应变装置来检测应力的变化,未来有望用于微型光谱仪、扫描仪、光通讯等领域中。     

密排纳米团簇薄膜应变传感器的响应特性及其与团簇覆盖率的相关性

本文通过在PET薄膜上的叉指电极间沉积Pd纳米团簇制备了柔性应变传感器件.传感器通过测量纳米团簇薄膜的电导随PET薄膜形变的变化而产生对应变的响应,不仅具有高的仪表因子,而且具有宽的量程.实验发现,由于密排纳米团簇阵列的电子输运具有渗流特征,造成应变传感器的响应特性与纳米团簇的覆盖率紧密相关.通过控制纳米团簇的沉积过程,制备了由覆盖率接近有效渗流阈值的纳米团簇点阵构成的应变传感器.从最低应变探测限到0.3%应变之间,传感器件具有线性响应且仪表因子高达55.在更高的应变时,仪表因子进一步达到200.纳米团簇薄膜甚至还可以对达到8%应变的巨大形变产生响应,对应的应变因子达到惊人的3500.     

密排纳米团簇薄膜应变传感器的响应特性及共与团簇覆盖率的相关性（英文）

本文通过在PET薄膜上的叉指电极间沉积Pd纳米团簇制备了柔性应变传感器件.传感器通过测量纳米团簇薄膜的电导随PET薄膜形变的变化而产生对应变的响应,不仅具有高的仪表因子,而且具有宽的量程.实验发现,由于密排纳米团簇阵列的电子输运具有渗流特征,造成应变传感器的响应特性与纳米团簇的覆盖率紧密相关.通过控制纳米团簇的沉积过程,制备了由覆盖率接近有效渗流阈值的纳米团簇点阵构成的应变传感器.从最低应变探测限到0.3%应变之间,传感器件具有线性响应且仪表因子高达55.在更高的应变时,仪表因子进一步达到200.纳米团簇薄膜甚至还可以对达到8%应变的巨大形变产生响应,对应的应变因子达到惊人的3500.     

含缺陷的石墨烯对增强树脂基复合材料力学性能的影响

基于分子结构力学和多尺度方法,采用有限元商业软件ABAQUS,针对石墨烯存在的几种缺陷,构建了含有不同数量的双原子空缺缺陷和Stone-Wales(S-W)缺陷的石墨烯增强环氧树脂复合材料的有限元模型,研究了石墨烯的缺陷在不同石墨烯体积分数下对复合材料弹性模量以及界面层应力传递的影响。数值模拟结果表明,随着石墨烯体积分数的增加,完美石墨烯和缺陷石墨烯增强环氧树脂复合材料弹性模量均呈现线性上升。其次,缺陷种类和数量之间的结果对比表明,空缺缺陷会明显降低复合材料的弹性模量,且随着缺陷数量的增加,变化更明显。而S-W缺陷在一定程度上增加了复合材料的杨氏模量,对于剪切模量,则出现下降趋势。另外,界面层的应力传递一定程度上反映了缺陷对复合材料的影响。     

基于拉曼散射的石墨烯/氧化硅界面传热研究

本文提出了一种"拉曼热测量两步法",成功测量了单层石墨烯与二氧化硅基底之间的界面热阻和石墨烯在基底作用下的导热系数。第一步利用稳态电流加热石墨烯,利用拉曼响应测量其与基底的温差,继而测得石墨烯与基底之间的界面热阻。第二步通过激光加热,由拉曼散射信号获得不同加热功率下的石墨烯的局部温度,根据点热源热扩散模型推导出石墨烯的导热系数。研究发现非约束状态下的石墨烯在加热状态下由于具有明显的形貌变化(褶皱,局部脱离基底等),导致产生较大的接触热阻;同时实验发现由于界面处的声子散射和泄漏,基底状态下的石墨烯导热系数较低。本文利用拉曼热测量技术同时实现了石墨烯界面热阻和石墨烯导热系数的无损化和非接触式测量。     

基于石墨烯/石墨烯卷轴复合薄膜高灵敏度柔性压力传感器（英文）

一维导电材料例如纳米线,大量应用于柔性压力传感器中.但是一维材料和基底之间接触时相互作用力较弱,使得传感器灵敏度、响应时间、和循环寿命等性能指标有待进一步提高.针对这些问题,设计了石墨烯/石墨烯卷轴多分子层复合薄膜作为传感器导电层.石墨烯卷轴具有一维结构,而石墨烯的二维结构可以牢固地固定卷轴,以确保高导电性复合薄膜与基底之间的粘附性,同时整体结构的导电通道得到了增加.由于一维和二维结构的协同效应,实现了应变灵敏度系数3.5 kPa~(-1)、响应时间小于50 ms、能够稳定工作1000次以上的压阻传感器.     

基于石墨烯/石墨烯卷轴复合薄膜高灵敏度柔性压力传感器

一维导电材料例如纳米线，大量应用于柔性压力传感器中. 但是一维材料和基底之间接触时相互作用力较弱，使得传感器灵敏度、响应时间、和循环寿命等性能指标有待进一步提高. 针对这些问题，设计了石墨烯/石墨烯卷轴多分子层复合薄膜作为传感器导电层. 石墨烯卷轴具有一维结构，而石墨烯的二维结构可以牢固地固定卷轴，以确保高导电性复合薄膜与基底之间的粘附性，同时整体结构的导电通道得到了增加. 由于一维和二维结构的协同效应，实现了应变灵敏度系数3.5 kPa^-1、 响应时间小于50 ms、能够稳定工作1000次以上的压阻传感器.     

不同加载条件下位错和溶质原子交互作用的数值模拟

动态应变时效,即位错和溶质原子的动态交互作用,对合金材料的力学性质产生重要影响. 本文基于蒙特卡罗方法,建立了“多位错-溶质原子” 二维动力学模型,分别模拟了单位错-恒定应力率、多位错-无应力、多位错-恒定应力和多位错-恒定应力率四种条件下位错和溶质原子的演化过程. 单位错-恒定应力率情况下,低应力率时位错被溶质原子钉扎而无法脱钉,高应力率时位错未被钉扎而一直运动,只有在适当应力率范围内,位错才呈现出反复的钉扎和脱钉;多位错-无应力时,溶质原子向正/负位错的下/上方偏聚;多位错-恒定应力时,位错运动受溶质原子钉扎的影响随应力增大而减小;多位错-恒定应力率时,集群化的钉扎和脱钉过程导致了位错总位移呈现阶梯状的演化. 模拟结果表明：“位错-溶质原子”尺度上呈现了动态应变时效微观过程,与其理论描述相一致. 关键词： 动态应变时效 动力学模型 位错运动     

高质量大面积石墨烯的化学气相沉积制备方法研究

石墨烯因其奇特的能带结构和优异的物理性能而成为近年来大家研究的热点, 但是目前单层石墨烯的质量与尺寸制约了其实际应用的发展. 本文采用常压化学气相沉积(CVD)方法, 基于铜箔衬底, 利用甲烷作为碳源制备了高质量大面积的单层与多层石墨烯. 研究发现: 高温度、稀薄的甲烷浓度、较短的生长时间以及合适的气体流速是制备高质量、大面积石墨烯的关键. Raman光谱, 扫描电子显微镜、透射电子显微镜等表征结果表明: 制备的石墨烯主要为单层, 仅铜箔晶界处有少量多层石墨烯. 电学测试表明CVD制备的石墨烯在低温时呈现出较明显的类半导体特性; 薄膜电阻随外界磁场的增大而减小.     

Deposition and characterization of diamond epitaxial thin films on silicon substrates

Heteroepitaxial diamond growth has been attempted on mirror-polished monocrystalline (001), (111), and (110) silicon substrates by microwave plasma CVD. The surface morphology and the crystallographic properties of the films were characterized by means of Scanning Electron Microscopy (SEM), Raman spectroscopy, X-ray diffraction, and X-ray and Raman pole-figure analysis. The results demonstrate epitaxial growth of diamond on both (001) and (111) oriented silicon substrates. Preliminary results give strong evidence for substrate-induced orientation of the diamond crystallites also on (110) oriented silicon substrate. The heteroepitaxy can be assigned to the oriented covalent bonding across the interface between diamond and silicon.     

Raman fingerprint of doping due to metal adsorbates on graphene

The properties of single-layer graphene are strongly affected by metal adsorbates and clusters on graphene. Here, we study the effect of a thin layer of chromium (Cr) and titanium (Ti) metals on chemical vapor deposition (CVD)-grown graphene by using Raman spectroscopy and transport measurements. The Raman spectra and transport measurements show that both Cr and Ti metals affect the structure as well as the electronic properties of the CVD-grown graphene. The shift of peak frequencies, intensities and widths of the Raman bands are analyzed after the deposition of metal films of different thickness on CVD-grown graphene. The shifts in G and 2D peak positions indicate the doping effect of graphene by Cr and Ti metals. While p-type doping was observed for Cr-coated graphene, n-type doping was observed for Ti-coated graphene. The doping effect is also confirmed by measuring the gate voltage dependent resistivity of graphene. We have also found that annealing in Ar atmosphere induces a p-type doping effect on Cr- or Ti-coated CVD-grown graphene.     

Interfacial electronic structure at a metal–phthalocyanine/graphene interface:Copper–phthalocyanine versus iron–phthalocyanine

The energy level alignment of CuPc and FePc on single-layer graphene/Ni(111)(SLG/Ni)substrate was investigated by using ultraviolet and X-ray photoelectron spectroscopy(UPS and XPS).The highest occupied molecular orbitals(HOMOs)in a thick layer of CuPc and FePc lie at 1.04 eV and 0.90 eV,respectively,below the Fermi level of the SLG/Ni substrate.Weak adsorbate–substrate interaction leads to negligible interfacial dipole at the CuPc/SLG/Ni interface,while a large interfacial dipole(0.20 eV)was observed in the case of FePc/SLG/Ni interface,due to strong adsorbate–substrate coupling.In addition,a new interfacial electronic feature was observed for the first time in the case of FePc on SLG/Ni substrate.This interfacial state can be attributed to a charge transfer from the SLG/Ni substrate to unoccupied orbitals of FePc.     

偶极分子在CVD石墨烯表面的拉曼增强

选用CVD制备的石墨烯作为拉曼增强的基底,以激光器波长λ=532 nm的显微拉曼光谱仪对偶极分子DREP分子的石墨烯拉曼增强效应进行了探究。通过对石墨烯上与SiO₂片上DREP分子的拉曼强度的对照,发现单纯DREP/SiO₂分子浓度很低时,拉曼峰基本不存在,直到达到一定浓度1×10-5mol·L-1时,其拉曼峰才出现;随着浓度的增加,DREP分子的拉曼信号和荧光信号都增加;而DREP/Graphene/SiO₂在1×10-7mol·L-1时即出现了拉曼信号,随着浓度的增加,拉曼信号增加很快而荧光信号增加并不明显。结果表明石墨烯可实现DREP分子的拉曼增强,并能猝灭荧光背底,提高拉曼信号与荧光信号之比。对比了不同偶极矩的DREP和DR1P分子,表明偶极矩越大,其增强因子越大,增强程度越强。分析了DREP分子在石墨烯上的拉曼增强的机制。DREP分子是尾端接芘的经过改性的偶氮苯分子,其尾端的芘与石墨烯于界面处通过π—π相互作用进行电子转移,改变石墨烯的能级结构使得其发生P型掺杂,发生拉曼增强的机制是化学机制。DREP分子的石墨烯拉曼增强效应有助于我们研究石墨烯以及石墨烯表面拉曼增强机制,比如石墨烯的载流子转移,化学增强机制的原理,以及如何从电磁机制效应分离出化学机制。     

Interfacial debonding behavior of a rigid particle-filled polymer composite

Glass beads, non-modified and modified with coupling agent, were filled separately into high density polyethylene to obtain composite materials with different interfacial adhesion strengths. In situtensile tests reveal the damage mechanisms, which are mainly induced by the interfacial debonding. The interfacial debonding process is observed and studied. The debonding stress is found to be linearly related to the opening angle formed at two poles of the particles. Initial and final opening angles, in addition to the corresponding debonding stresses, are measured. The interfacial fracture energy obtained by using the Griffith fracture theory is found to be 0.028 J m^-2 and 0.058 J m^-2 for mechanical anchorage and physical entanglement across the interface, respectively. The stronger the interfacial adhesion, the smaller is the maximum opening angle and greater the debonding stress.     

Mechanical properties of flat braided composite with flexible interphase

Textile composites have been used extensively as industrial materials because of the excellent mechanical properties resulting from the continuously oriented fiber bundle. In a study of the mechanical properties, it is important to consider the fiber/matrix interface property as for other composite materials. In a recent study, the fiber/matrix interface is regarded as an interphase that has its own material constants and thickness; consequently, the mechanical properties of a composite can be controlled by specifically designing the interphase. In this study, we applied this concept to braided composites with flexible resin as interphase for the purpose of designing the interphase. In a static tensile test, though there were no improvements in Noncut specimens (normal braided composites), but a Cut specimen (each side of the Noncut specimen was cut) with flexible interphase was improved in fracture load and displacement. The observation of the specimen edge was carried out and it was confirmed that the progress of debonding at the fiber bundle intersection was interrupted by a flexible interphase, and a matrix crack did not occur in the Cut specimen with flexible interphase. In a fiber bundle pull-out test, it was confirmed that debonding progressed not into the fiber/resin interface but into the flexible interphase in the specimen with flexible interphase, and the interfacial property at the fiber bundle intersection was improved.     

Graphene sensing an inhomogeneous strain due to the surface relief in FeNiCoTi shape memory alloy

In this paper, we present a novel method of using graphene for sensing the inhomogeneous strain due to the surface relief in FeNiCoTi shape memory alloy. In the experiment, a large sheet of graphene fabricated by chemical vapor deposition was transferred onto the FeNiCoTi substrate. The flat surface of the substrate would become wrinkled due to the surface relief formed during the FeNiCoTi substrate phase transformation, meanwhile loading a tensile strain on the surface graphene. It is found that the 2D Raman peak of graphene demonstrates a significant red shift due to the tensile strain. The different colors exhibited in the Raman mapping image of the graphene directly displayed the strain distribution information across the surface. In the future, we may alter to quantitatively analyze the surface relief by using Raman spectroscopy instead of the atomic force microscopy. Copyright © 2013 John Wiley & Sons, Ltd.     

Effect of interfacial debonding and matrix cracking on mechanical properties of multidirectional composites

In composites, debonding at the fiber–matrix interface and matrix cracking due to loading or residual stresses can effect the mechanical properties. Here three different architectures — 3-directional orthogonal, 3-directional 8-harness satin weave and 4-directional in-plane multidirectional composites — are investigated and their effective properties are determined for different volume fractions using unit cell modeling with appropriate periodic boundary conditions. A cohesive zone model (CZM) has been used to simulate the interfacial debonding, and an octahedral shear stress failure criterion is used for the matrix cracking. The debonding and matrix cracking have significant effect on the mechanical properties of the composite. As strain increases, debonding increases, which produces a significant reduction in all the moduli of the composite. In the presence of residual stresses, debonding and resulting deterioration in properties occurs at much lower strains. Debonding accompanied with matrix cracking leads to further deterioration in the properties. The interfacial strength has a significant effect on debonding initiation and mechanical properties in the absence of residual stresses, whereas, in the presence of residual stresses, there is no effect on mechanical properties. A comparison of predicted results with experimental results shows that, while the tensile moduli E ₁₁, E ₃₃and shear modulus G ₁₂ match well, the predicted shear modulus G ₁₃ is much lower.