环氧树脂与氰酸酯共固化反应的研究

应用DSC、FT IR对乙酰丙酮过渡金属络合物催化促进的环氧树酯与氰酸酯共固化反应行为、历程以及固化物的结构特征进行了研究探讨 .结果表明 ,促进剂能够明显的降低固化反应温度 ,缩短固化反应时间 .反应历程首先是氰酸酯发生自聚反应形成二聚体或三聚体 (三嗪环 ) ,然后二聚体可进一步共聚形成三嗪环 ,此过程伴随着环氧基的聚醚反应 ,最后是三嗪环与剩余的环氧基反应形成唑烷酮 .在氰酸酯欠量的条件下 ,固化树脂中主要是唑烷酮和聚醚结构 ,三嗪环结构很少 ;在氰酸脂适量或过量条件下 ,固化树脂主要是三嗪环和唑烷酮结构 ,聚醚结构很少 .     

Cure behavior and thermal degradation mechanisms of epoxy and epoxy–cyanate resins

The cure reactions of tetraglycidyl methylene diamine (TGMDA) epoxy cured with tetrasubstituted aromatic diamine on one hand and diglycidyl ether of bisphenol A and diglycicyl ether tetrabromobisphenol A epoxies cured with methylene bis (phenyl‐4‐cyanate) on the other hand are reported. Systematic Fourier transform infrared (FTIR) spectroscopy studies of the cure reaction of epoxy and epoxy–cyanate during thermal cycles are presented. FTIR studies indicate that the reaction of TGMDA monomer is total but the network contains a large amount of primary amine. The cyanate monomer reacts rapidly to form triazine structures. Then the epoxy monomers homopolymerize and crosslink with free cyanate groups. The gas chromatography/mass spectrometry study of volatile products evolved during the polymer thermal degradation shows the dehydration of the epoxy network and the decomposition of the amine structure. The FTIR and solid‐phase ¹³C nuclear magnetic resonance analysis revealed that the ether functions and the amine groups are temperature sensitive but the triazine structure is not. Copyright © 1999 John Wiley & Sons, Ltd.     

环氧树脂与氰酸酯共聚反应研究

研究了催化剂对环氧树脂与氰酸酯树脂的共聚固化反应行为的影响,并初步探索氰酸酯／环氧固化的反应历程．研究表明,催化剂能明显地促进其固化反应,降低固化温度,缩短固化时间;氰酸酯与环氧共聚反应历程是首先氰酸酯三聚反应生成三嗪环结构,然后三嗪环开环与环氧共聚反应,最后是未能参与共聚反应的环氧官能团在唑啉结构和三嗪环的催化下发生聚醚化反应;在氰酸酯官能团欠量的条件下,固化树脂中主要是唑啉和聚醚结构,而三嗪环结构的含量很少．     

Studies on thermal and morphological properties of 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane-epoxy-bismaleimide matrices

A new cyanate ester monomer, 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane has been synthesized and characterized. Epoxy modified with 4, 8 and 12% (by weight) of cyanate ester were made using epoxy resin and 1,1-bis(3-methyl-4-cyanatophenyl)cyclohexane and cured by using diaminodiphenylmethane. The cyanate ester modified epoxy matrix systems were further modified with 4, 8 and 12% (by weight) of bismaleimide (N,N′-bismaleimido-4,4′-diphenylmethane). The formation of oxazolidinone and isocyanurate during cure reaction of epoxy and cyanate ester blend was confirmed by IR spectral studies. Bismaleimide-cyanate ester-epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. Thermal studies indicate that the introduction of cyanate ester into epoxy resin improves the thermal degradation studies at the expense of glass transition temperature. Whereas the incorporation of bismaleimide into epoxy resin enhances the thermal properties according to its percentage content. However, the introduction of both cyanate ester and bismaleimide influences the thermal properties according to their percentage content. DSC thermogram of cyanate ester modified epoxy and bismaleimide modified epoxy show unimodel reaction exotherms. The thermal degradation temperature and heat distortion temperature of the cured bismaleimide modified epoxy and cyanate ester-epoxy systems increased with increasing bismaleimide content. The morphology of the bismaleimide modified epoxy and cyanate ester-epoxy systems were also studied by scanning electron microscopy. Copyright © 2003 John Wiley & Sons, Ltd.     

Phosphorus based epoxy terminated structural adhesive 2. Curing, adhesive strength and thermal stability

The curing behavior of phosphorus based epoxy terminated polymers was studied using diaminodiphenyl ether, diaminodiphenyl sulfone, benzophenone tetracarboxylic dianhydride and the commercial hardener of Ciba-Geigy's two-pack araldite, as curing agent. The adhesive strength of these adhesives was measured by various ASTM methods like lap-shear, peel, and cohesive tests on metal-metal, wood-wood and wood-metal interfaces. All these results were compared with the synthesized epoxy resins prepared from bisphenol-A and epichlorohydrin having the epoxy equivalent value of 0.519. The thermal stability of both the virgin resin and its cured form was also studied by thermogravimetric analysis.     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.     

Factors influencing EB curing of epoxy matrix

The effectiveness of electron beam (EB) curing of epoxy resins was found to be influenced by catalyst. In the presence of iodonium salt (diaryl iodonium hexafluoroantimonate, C3), the EB curing of epoxy resin is easier than in the presence of triaryl sulfonium hexafluoroantimonate (C1), or triaryl sulfonium hexafluorophosphate (C2), or iron arene containing cationic catalyst (Irgacure 261). The epoxy 616 (diglycidyl ether of bisphenol A) and 648 (diglycidyl ether of phenolic novolacs) can be cured by the above onium salts catalysts C1–C3. The epoxy with glycidyl amino epoxide group (such as AG 80; AFG 90) could not be cured by onium salts catalyst. The influence of irradiation dose, temperature and the effect of impurities on curing reaction were investigated.     

Thermal and physical properties of flame-retardant epoxy resins containing 2-(6-oxido-6H-dibenz〈c,e〉〈1,2〉oxaphosphorin-6-yl)-1,4-naphthalenediol and cured with dicyanate ester

2-(6-oxido-6H-dibenz(c,e)(1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol (DOPONQ) was prepared by the addition reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) with 1,4-naphthoquinone. The phosphorus-containing diol (DOPONQ) was used as a reactive flame retardant by an advancement reaction with the diglycidyl ether of bisphenol-A epoxy (DGEBA) resin at various stoichiometric ratios. DOPONQ-containing advanced epoxy was separately cured with various dicyanate esters to form flame-retardant epoxy/cyanate ester systems. The effect of the phosphorus content and dicyanate ester structure on the curing characteristic, glass transition temperature, dimensional stability, thermal stability, flame retardancy, and dielectric property was studied and compared with that of the control advanced bisphenol-A epoxy system. The DOPONQ-containing epoxy/cyanate ester systems exhibited higher glass transition temperatures as well as better thermal dimensional and thermal degradation stabilities. The flame retardancy of the phosphorus-containing epoxy/dicyanate ester system increased with the phosphorus content, and a UL-94 V-0 rating could be achieved with a phosphorus content as low as 2.1%.     

Curing studies of epoxy resin with nadic endcapped phosphorylated amines

Polyimides have aromatic moieties in the backbone structure which are responsible for their increased thermal stability. If phosphorus is introduced in the main chain structure of polyimides, there is further improvement in the thermal stability. This has been proved by the work carried out in our group. The polyimide having amine termination can be used for crosslinking of epoxy resins.In the present study amine terminated phosphorus containing nadicimide were taken as curing agent for DGEBA resins. The curing characteristics of DGEBA resin were studied by DSC using different amounts of nadic endcapped phosphorylated amines. DSC thermogram showed the heat of polymerization was lower as compared to system cured with aromatic amines.     

Preparation and characterization of bismaleimide/1,3-dicyanatobenzene modified epoxy intercrosslinked matrices

An intercrosslinked network of cyanate ester (CE)-bismaleimide (BMI) modified epoxy matrix system was made by using epoxy resin, 1,3-dicyanatobenzene and bismaleimide (N,N^′-bismaleimido-4,4^′-diphenyl methane) with diaminodiphenylmethane as curing agent. BMI-CE-epoxy matrices were characterised using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and heat deflection temperature (HDT) analysis. The matrices, in the form of castings, were characterised for their mechanical properties such as tensile strength, flexural strength and unnotched Izod impact test as per ASTM methods. Mechanical studies indicated that the introduction of cyanate ester into epoxy resin improves the toughness and flexural strength with reduction in tensile strength and glass transition temperature, whereas the incorporation of bismaleimide into epoxy resin influences the mechanical and thermal properties according to its percentage content. DSC thermograms of cyanate ester as well as BMI modified epoxy resin show an unimodal reaction exotherm. Electrical properties were studied as per ASTM method and the morphology of the BMI modified epoxy and CE-epoxy systems were studied by scanning electron microscope.     

Synthesis and effect of hyperbranched (3-hydroxyphenyl) phosphate as a curing agent on the thermal and combustion behaviours of novolac epoxy resin

A novel type of hyperbranched (3-hydroxyphenyl) phosphate (HHPP) with high functionality as a curing agent of epoxy resins was synthesized and characterized by FTIR, ¹H NMR and vapor phase osmometry (VPO). The cured epoxy resin with HHPP possessed improved glass transition temperature. The thermostability and flame retardancy of O-cresol novolac epoxy resin cured with different contents of HHPP were investigated by thermogravimetric analysis (TGA), limiting oxygen index (LOI) and cone calorimetry. The obtained results show that the samples containing a higher percentage of HHPP exhibit relatively lower thermostability at lower temperature while higher thermostability at elevated temperature and more char was formed compared with those containing a lower percentage of HHPP. The LOI value increased from 22.0 to 30.0 when HHPP, instead of 1,3-dihydroxybenzene, was used as a curing agent. The 25 wt% addition of HHPP in the curing agent complex effectively decreased the heat release rate and improved the char yield to the content nearly similar as those of the epoxy resin cured with pure HHPP.     

Synthesis and characterization of itaconic‐based epoxy resins

A trifunctional epoxy resin from itaconic acid (TEIA) was synthesized from a renewable resource‐based itaconic acid by allylation of itaconic acid to form diallyl itaconate by using m‐chloroperoxybenzoic acid as oxidizing agents followed by epoxidation of allylic C═C bond of diallyl itaconate methylhexahydropthalic anhydride as curing agent in the presence of 2‐methyl imidazole as a catalyst. The chemical structure of the synthesized resins was confirmed by Fourier transform infrared and nuclear magnetic resonance (¹H‐NMR and ¹³C‐NMR) spectroscopy analysis. The mechanical, thermal, and rheological performances of the TEIA were also investigated and compared with diglycidyl ether of bisphenol A and a plant‐based epoxidized soybean oil bioresin cured with the same curing agent. The higher epoxy value of 1.02, lower viscosity (0.96 Pa s at 25°C), higher mechanical, and higher curing reactivity toward methylhexahydropthalic anhydride of TEIA as compared with epoxidized soybean oil and comparable with diglycidyl ether of bisphenol A demonstrated significant evidence to design and develop a novel bio‐based epoxy resin with high performance to substitute the petroleum‐based epoxy resin.     

在Bu_2SnO-Bu_3PO_4缩合物的存在下以端羟基聚醚增韧环氧树脂

工业中大量生产的端羟基聚醚 ,由于羟基的反应活性不够 ,不能直接用于增韧胺类固化的环氧树脂 .Bu2 SnO Bu3PO4 缩合物能催化羟基对环氧基的加成反应 .本文研究在Bu2 SnO Bu3PO4 缩合物Sn P6 70 0的存在下以端羟基聚四氢呋喃 (PTMG)增韧芳香胺 4,4′ 二氨基二苯砜 (DDS)固化的环氧树脂 .PTMG首先与环氧树脂反应生成嵌段共聚物 ,在固化时发生微相分离 .分散相的尺寸在有利于增韧的范围内 .PTMG在分子量与浓度适当时 ,能使树脂的断裂韧性大大提高 ;抗弯强度也有显著提高 ,而Tg 和模量略有降低 .     

Investigations on the cure chemistry and polymer properties of benzoxazine-cyanate ester blends

Thermosetting polymer blends composed of bisphenol A based benzoxazine (BA-a) and cyanate ester (BACY) were prepared via co-curing of benzoxazine with cyanate ester. DSC results manifested a multiple curing pattern with associated heat of reaction implying a co-reaction between oxazine moiety and cyanate group. The catalysis during the co-curing of blend was ascribed to the cycloaddition reaction between the two groups followed by the ring-opening of benzoxazine and cyclotrimerisation of cyanate ester. The spectral and analytical data supported the possibilities of further polymerization through the insertion of the phenolic OH of polybenzoxazine to cyanate group to form the intermediate iminocarbonate, which further induce curing of cyanate ester to form polycyanurate. A co-reacted network composed of triazine ring as a part of polybenzoxazine matrix is postulated. The co-reaction temperature diminished with increase in cyanate ester content in the blend. A single T_g was observed in DMTA of the cured matrix that implied a linked homogeneous matrix containing both triazine and polybenzoxazine. This was substantiated by the TGA, DTA and SEM behavior of the cured polymer. The modulus of the cured blend was higher than those of the component resins of the blend. The co-reaction with cyanate ester enhanced the high temperature stability of polybenzoxazine.     

Preparation of phosphorus‐containing phenolic resin and its application in epoxy resin as a curing agent and flame retardant

For the sake of improving the flame retardancy of epoxy resin (EP), a novel phosphorus‐containing phenolic resin (PPR) synthesized in our group instead of conventional phenolic resin (PR) was used to cure EP in the present research. The curing processes and the corresponding crosslinking structure and mechanical performance were investigated by differential scanning calorimeter and dynamic mechanical thermal analysis. Because of the introduction of flame‐retarding elements including P and Si, PPR exhibited higher charring capacity in the condensed phase, which is helpful to construct a char layer of higher quality. Correspondingly, PPR‐cured EP displayed remarkably improved flame retardance as compared to conventional PR‐cured EP through the related evaluations including limiting oxygen index, vertical burning test, and microscale combustion colorimeter. As a multifunction agent, it is believable that PPR possesses potential commercial value to prepare flame‐retardant EP with high performance.     

环氧树脂与氰酸酯共固化产物性能的研究

环氧树脂是一类综合性能优良并获广泛应用的热固性树脂基体 .但是通常的环氧树脂基体中含有大量反应生成的羟基等极性基团 ,吸湿率高 ,使其复合材料在湿热环境下力学性能和介电性能显著下降 .应用氰酸酯改性固化的环氧树脂等热固性树脂 ,将赋予以其为基体的复合材料以优异的耐热性能、力学性能和介电性能[1 ,2 ] .这类复合材料的研究开发对特种电子电气绝缘材料和先进复合材料的发展具有重要意义 .作者曾应用ＦＴ ＩＲ、ＤＳＣ等分析技术对氰酸酯与环氧树脂 (氰酸酯在欠量、适量和过量条件下 )的共固化反应机理和固化物结构特征等进行过深入…     

一种液晶环氧增韧环氧树脂的研究

环氧树脂具有优异的机械性能 ,耐高温以及良好的加工工艺性 .被广泛用于机械、航天、船舶等领域 .由于环氧树脂固化后断裂延伸率小 ,脆性大 ,使其应用受到了一定的限制 .为此 ,国内外学者对环氧树脂进行了大量的改性研究工作 .用含有“柔性链段”的固化剂固化环氧 ,在交联网络中引入柔性链段[1] ;在环氧基体中加入橡胶弹性体[2 ] 、热塑性树脂[3 ,4] 、液晶聚合物[5,6] 等分散相或用热固性树脂连续贯穿于环氧树脂网络中形成互穿、半互穿网络结构[7] ,以改善环氧树脂的韧性 .本文采用液晶环氧化合物原位复合增韧环氧树脂 ,考察了液晶环氧对环…     

电子束固化环氧树脂的物理特征及其分析

分析了环氧树脂电子束辐射固化的物理特征 ,电子束辐射固化过程受活性中心扩散控制 ,整个固化区域由片层状结构组成 .与电子能量沉积分布相对应 ,环氧树脂辐射固化度的最高值是在一定深度而不是在辐射表面出现 .对电子束辐射环氧树脂体系的固化过程进行了模型解释 ,固化区域大小主要由电子的能量传递范围和浓度决定 ,反应活性中心的扩散作用影响较弱     

NMR investigations of the possible cross reactions between cyanate and epoxy resins

The possible cross reactions indicated by solid-state NMR between cyanate functionalized resin and epoxy functionalized resin have been investigated by using both natural abundance and labeled monofunctional model compounds. These soluble products were isolated and purified by silica gel adsorption chromatography and gel permeation chromatography. They were fully characterized by high resolution ¹H-, ¹³C-, ¹⁵N-NMR spectroscopy and by mass spectrometry. The major cross-reaction product is a racemic mixture of enantiomers, which contain an oxazolidinone ring formed by one cyanate molecule and two epoxy molecules. However, epoxy consumption lags cyanate consumption in the overall reaction as triazine formation from the cyanate is much faster than the two competing reactions, the cross reaction between cyanate and epoxy, and the self-polymerization of epoxy, under the conditions investigated. The cross reaction between cyanate and epoxy is limited. Approximately 12% of cross reaction between cyanate and epoxy was found in the overall reaction. In addition to the cross reactions of epoxy and cyanate, the reactions of epoxy and the carbamate, which is the major side product for the curing reaction of cyanate resin in solution, have also been investigated, and the mechanism of these reactions discussed. From the reactions of epoxy and carbamate, several products related to cross reaction between epoxy and cyanate have been isolated and identified. It is suggested that the reaction of epoxy and carbamate is one of the pathways in the overall cross reaction between epoxy and cranate resins. Finally, the mechanism of the overall cross-curing reaction between the diepoxy and dicyanate mixed resins is discussed. © 1994 John Wiley & Sons, Inc.     

Curing kinetics of bio-based epoxy resin-toughened DGEBA epoxy resin blend

In the present study, TEIA bioresin was blended with the diglycidyl ether bisphenol A (DGEBA) epoxy resin in different ratios (i.e. 10, 20, 30, 40 mass%), cured with methylhexahydrophthalic anhydride curing agent in the presence of 2-methylimidazole catalyst. The optimized composition of DGEBA and TEIA bioresin blends system was employed as an adhesive strength. The adhesive strength of the TEIA-modified DGEBA epoxy resin blend system was increased from 4.14 to 6.31 MPa on an aluminium substrate compared to the DGEBA epoxy resin. The curing kinetics of non-isothermal, DGEBA epoxy resin and its bio-based blend systems were investigated employing differential scanning calorimetry. An increase in the peak temperature and reduction in a heat of curing as well as activation energy in DGEBA epoxy resin were observed with the addition of TEIA bioresin content. The activation energy (E_a) of the DGEBA resin and their bio-based blend system were obtained from Kissinger and Flynn–Wall–Ozawa methods.