Current transport mechanism in Al/Si3N4/p-Si (MIS) Schottky barrier diodes at low temperatures

The current-voltage (I-V) and capacitance-voltage (C-V) characteristics of metal-insulator-semiconductor (Al/Si₃N₄/p-Si) Schottky barrier diodes (SBDs) were measured in the temperature range of 80-300 K. By using the thermionic emission (TE) theory, the zero-bias barrier height Φ_B0 calculated from I-V characteristics was found to increase with increasing temperature. Such temperature dependence is an obvious disagreement with the negative temperature coefficient of the barrier height calculated from C-V characteristics. Also, the ideality factor decreases with increasing temperature, and especially the activation energy plot is nonlinear at low temperatures. Such behaviour is attributed to Schottky barrier inhomogeneties by assuming a Gaussian distribution of barrier heights (BHs) at interface. We attempted to draw a Φ_B0 versus q/2kT plot to obtain evidence of a Gaussian distribution of the BHs, and the values of Φ_Bo = 0.826 eV and α_o = 0.091 V for the mean barrier height and standard deviation at zero-bias, respectively, have been obtained from this plot. Thus, a modified ln(I_o/T²) − q²σ_o²/2(kT)² versus q/kT plot gives Φ_B0 and Richardson constant A^* as 0.820 eV and 30.273 A/cm² K², respectively, without using the temperature coefficient of the barrier height. This value of the Richardson constant 30.273 A/cm² K² is very close to the theoretical value of 32 A/cm² K² for p-type Si. Hence, it has been concluded that the temperature dependence of the forward I-V characteristics of the Al/Si₃N₄/p-Si Schottky barrier diodes can be successfully explained on the basis of TE mechanism with a Gaussian distribution of the barrier heights. In addition, the temperature dependence of energy distribution of interface state density (N_SS) profiles was determined from the forward I-V measurements by taking into account the bias dependence of the effective barrier height and ideality factor.     

The barrier height inhomogeneity in Al/p-Si Schottky barrier diodes with native insulator layer

The current-voltage (I-V) characteristics of Al/p-Si Schottky barrier diodes (SBDs) with native insulator layer were measured in the temperature range of 150-375 K. The estimated zero-bias barrier height Φ_B0 and the ideality factor n assuming thermionic emission (TE) theory show strong temperature dependence. Evaluation of the forward I-V data reveals an increase of zero-bias barrier height Φ_B0 but decrease of ideality factor n with increase in temperature. The conventional Richardson plot exhibits non-linearity below 250 K with the linear portion corresponding to activation energy of 0.41 eV and Richardson constant (A^*) value of 1.3 × 10⁻⁴ A cm⁻² K⁻² is determined from intercept at the ordinate of this experimental plot, which is much lower than the known value of 32 A cm² K² for holes in p-type Si. Such behavior is attributed to Schottky barrier inhomogene ties by assuming a Gaussian distribution of barrier heights (BHs) due to barrier height inhomogeneities that prevail at interface. Also, Φ_B0 versus q/2kT plot was drawn to obtain evidence of a Gaussian distribution of the BHs, and values of Φ_B0 = 1.055 eV and σ₀ = 0.13 V for the mean BH and zero-bias standard deviation have been obtained from this plot, respectively. Thus, the modified versus q/kT plot gives Φ_B0 and A^* as 1.050 eV and 40.08 A cm⁻² K⁻², respectively, without using the temperature coefficient of the barrier height. This value of the Richardson constant 40.03 A cm⁻² K⁻² is very close to the theoretical value of 32 A K⁻² cm⁻² for p-type Si. Hence, it has been concluded that the temperature dependence of the forward I-V characteristics of the Al/p-Si Schottky barrier diodes with native insulator layer can be successfully explained on the basis of TE mechanism with a Gaussian distribution of the barrier heights.     

Investigation of current transport parameters of Ti/4H-SiC MPS diode with inhomogeneous barrier

The current transport parameters of 4H-SiC merged PiN Schottky(MPS) diode are investigated in a temperature range of 300-520 K.Evaluation of the experimental current-voltage(I-V) data reveals the decrease in Schottky barrier height Φ b but an increase in ideality factor n,with temperature decreasing,which suggests the presence of an inhomogeneous Schottky barrier.The current transport behaviours are analysed in detail using the Tung’s model and the effective area of the low barrier patches is extracted.It is found that small low barrier patches,making only 4.3% of the total contact,may significantly influence the device electrical characteristics due to the fact that a barrier height of 0.968 eV is much lower than the average barrier height 1.39 eV.This shows that ion implantation in the Schottky contact region of MPS structure may result in a poor Ti/4H-SiC interface quality.In addition,the temperature dependence of the specific on-resistance(R on sp),T 2.14,is determined between 300 K and 520 K,which is similar to that predicted by a reduction in electron mobility.     

Micro-structural and temperature dependent electrical characterization of Ni/GaN Schottky barrier diodes

Micro-structural investigation of Ni/GaN Schottky barrier diodes has been carried out using high-resolution transmission electron microscopy and electron diffraction spectrum in order to emphasize the role of Ni/GaN interface in controlling the Schottky diode behavior. Variable temperature Hall effect measurement of GaN samples along with the current–voltage (I–V) characteristics of Ni/n-GaN Schottky barrier diodes have been measured in 100–380 K temperature range. Results are analyzed in terms of thermionic emission theory by incorporating the concept of barrier inhomogeneity at the metal/semiconductor interface. The observed anomaly of temperature dependence of Schottky barrier height and ideality factor are explained by invoking two sets of Gaussian distribution of SBH in the temperature ranges of 100–180 K and 220–380 K, respectively. The value of A** (effective Richardson constant) as determined from the modified Richardson plot is 29.2 A/(cm² K²), which shows an excellent agreement with the theoretical value (26.4 A/(cm² K²)) in the temperature range of 220–380 K.     

Current transport in Pd2Si/n-Si(100) Schottky barrier diodes at low temperatures

The forward current-voltage (I–V) characteristics of Pd₂Si/n-Si(100) Schottky barrier diodes are shown to follow the Thermionic Emission-Diffusion (TED) mechanism in the temperature range of 52-295 K. The evaluation of the experimentalI–V data reveals a decrease of the zero-bias barrier height ( _b0) and an increase of the ideality factor () with decreasing temperature. Further, the changes in _b0 and become quite significant below 148 K. It is demonstrated that the findings cannot be explained on the basis of tunneling, generation-recombination and/or image force lowering. Also, the concepts of flat band barrier height and T ₀-effect fail to account for the temperature dependence of the barrier parameters. The 1n(I _s /T ²) vs 1/T plot exhibits nonlinearity below 185 K with the linear portion corresponding to an activat ion energy of 0.64 eV, a value smaller than the zero-bias barrier height energy (0.735 eV) of Pd₂Si/n-Si Schottky diodes. Similarly, the value of the effective Richardson constant A** turns out to be 1.17 × 10⁴ A m^–2 K^–2 against the theoretical value of 1.12 × 10⁶ A m^–2 K^–2. Finally, it is demonstrated that the observed trends result due to barrier height inhomogeneities prevailing at the interface which, in turn, cause extra current such that theI–V characteristics continue to remain consistent with the TED process even at low temperatures. The inhomogeneities are believed to have a Gaussian distribution with a mean barrier height of 0.80 V and a standard deviation of 0.05 V at zero-bias. Also, the effect of bias is shown to homogenize barrier heights at a slightly higher mean value.     

The effect of temperature on the electrical characteristics of Ti/n-GaAs Schottky diodes

Schottky diodes still attract researchers as they are used in various device applications. This study provides I–V characteristics of Ti/n-GaAs (80–300 K). Higher barrier height (Φ_B0) values were obtained for higher temperatures, whereas the ideality factor exhibited the opposite behavior. This was associated with a barrier inhomogeneity at the Ti/GaAs interface, which has a Gaussian distribution (GD). The mean barrier height values calculated from the modified Richardson and Φ_B0 - q/2 kT plots were found to be 0.584 eV and 0.575 eV in the temperature range of 80–160 K. They were found as 1.041 eV and 1.033 eV between 180 K and 300 K, respectively. The modified Richardson constant value, on the other hand, was calculated as 22.06 A cm⁻² K⁻² (80–160 K) and 13.167 A cm⁻² K⁻² (180–300 K). These values are higher than the theoretical value for n-GaAs, which is 8.16 A cm⁻² K⁻². This difference may stem from intense inhomogeneity at the Ti/n-GaAs interface.     

Prediction of lateral barrier height in identically prepared Ni/n-type GaAs Schottky barrier diodes

We have identically prepared Ni/n-GaAs/In Schottky barrier diodes (SBDs) with doping density of 7.3 × 10¹⁵ cm⁻³. The barrier height for the Ni/n-GaAs/In SBDs from the current-voltage characteristics have varied from 0.835 to 0.856 eV, and ideality factor n from 1.02 to 1.08. We have determined a lateral homogeneous barrier height value of 0.862 eV for the Ni/n-GaAs/In SBD from the experimental linear relationship between barrier heights and ideality factors.     

Improved device performance in nonpolar a ‐plane GaN LEDs using a Ni/Al/Ni/Au n‐type ohmic contact

The authors report upon the increased light‐output power (P_out) via a reduction in the forward voltage (V_f) for nonpolar a ‐plane GaN LEDs using Ni/Al/Ni/Au n‐type ohmic contacts. The specific contact resistivity of the Ni/Al/Ni/Au contact is found to be as low as 5.6 × 10^–5 whereas that of a typical Ti/Al/Ni/Au contact is 6.8 × 10^–4 Ω cm², after annealing at 700 °C. The X‐ray photoelectron spectroscopy results show that the upward surface band bending is less pronounced for the Ni/Al contact compared to the Ti/Al contact, leading to a decrease in the effective Schottky barrier height (SBH). The V_f of the nonpolar LEDs decreases by 10% and P_out increases by 15% when the Ni/Al/Ni/Au scheme is used instead of the typical Ti/Al/Ni/Au metal scheme. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Schottky barrier properties of various metal (Zr, Ti, Cr, Pt) contact on p-GaN revealed from I-V-T measurement

Schottky barrier contact using three different metal (Zr, Ti, Cr and Pt) and Ohmic contact using Ni were made on same epitaxial growth layer of p-GaN. Measurements were carried out using current-voltage-temperature (I-V-T) in the range of 27-100°C. Under forward bias and room-temperature (RT), the ideality factors (η) were determined to be 2.38, 1.82, 1.51 and 2.63, respectively, for Zr, Ti, Cr and Pt. The Schottky barrier height (SBH) and effective Richardson coefficient A^** were measured through modified Norde plot as one of the analysis tools. Barrier heights of 0.84, 0.82, 0.77 and 0.41 eV for Zr, Ti, Cr and Pt, respectively, were obtained from the modified Norde plot. Schottky barrier heights of Zr, Ti, or Cr/p-GaN were also measured through activation energy plot, and determined to be in the same range (∼0.87 eV) and Pt at 0.49 eV. These results indicate that the Fermi level seems to be pinned due to the value of slope parameter (S) was very low (S = −0.25).     

Fabrication and characteristics of lateral Ti/4H-SiC Schottky barrier diodes

This paper describes the fabrication and characteristics of the lateral Ti/4H-SiC Schottky barrier diodes (SBDs). SBDs are fabricated by nitrogen ion implantation into p-type 4H-SiC epitaxial layer. The implant depth profile is simulated using the Monte Carlo simulator TRIM. Measurements of the reverse I－V characteristics demonstrate a low reverse current, that is good enough for many SiC-based devices such as SiC metal-semiconductor field-effect transistors, and SiC static induction transistors. The parameters of the diodes are extracted from the forward I－V characteristics. The barrier height φ_b of Ti/4H-SiC is 0.95 eV.     

Temperature dependence of current-voltage characteristics of Sn/p-Si Schottky contacts

The current-voltage (I-V) characteristics of Sn/p-Si Schottky barrier diode have been measured over a wide range of temperature (80-300 K) and interpreted on the basis of thermionic emission mechanism by merging the concept of barrier inhomogeneities through a Gaussian distribution function. The analysis has revealed an anomalous decrease of apparent barrier height Φ_b0, increase of ideality factor n, and nonlinearity of the activation energy plot at lower temperatures. A Φ_b0 versus 1/T plot has been drawn to obtain evidence of a Gaussian distribution of barrier heights, and values of 0.97 eV and 0.084 V for the mean barrier height and standard deviation σ₀ have been obtained, respectively, from this plot. A modified ln(I₀/T²)−(q²σ₀²/2k²T²) versus 1/T plot gives and Richardson constant A** as 0.95 eV and 15.6 A cm⁻² K⁻², respectively. It can be concluded that the temperature dependent I-V characteristics of the Sn/p-Si Schottky barrier diode can be successfully explained on the basis of a thermionic emission mechanism with Gaussian distribution of the barrier heights. We have also discussed whether or not the junction current has been connected with thermionic field-emission mechanism.     

Iodine as a donor in CdS

Iodine doped single crystals of CdS were grown from the vapor phase. High temperature Hall effect measurements for the crystals equilibrated with Cd and S₂ vapors at temperatures between 700 and 1000°C gave the free electron concentration as a function of p_Cd or p_S2 and temperature. The results can be explained on the basis of a model in which the CdS is saturated with iodine at low p_Cd (=high p_S2) but unsaturated at high p_Cd.The solubility of iodine in CdS is given by c_t=1·73×10²²p_S2^?1/8 exp (?1·045 eV/kT) cm^?3 atm^?1/8=4·62×10¹⁹p_Cd^1/4 exp (?0·195 eV/kT) cm^?3 atm^1/4The formation of pairs (I_SV_Cd)′ from I_S^· and V_Cd″ is governed by the equilibrium constant K_{P(I, V)}=4 exp (≤1·1 eV/kT)If Cd diffusion occurs primarily by free vacancies, the Cd^* tracer self diffusion leads to a vacancy mobility of (1·2±0·5)×10^?5 cm² sec^?1 at 900°C, in agreement with results reported by Woodbury [12], but (7±3) times larger than reported by Kumar and Kroger [10].     

Anomalous current transport in Au/low-doped n-GaAs Schottky barrier diodes at low temperatures

0 effect, the zero-bias barrier height was found to exhibit two different trends in the temperature ranges of 77–160 K and 160–300 K. The variation in the flat-band barrier height with temperature was found to be -(4.7±0.2)×10⁴ eVK^-1, approximately equal to that of the energy band gap. The value of the Richardson constant, A^**, was found to be 0.27 A cm^-2K^-2 after considering the temperature dependence of the barrier height. The estimated value of this constant suggested the possibility of an interfacial oxide between the metal and the semiconductor. Investigations suggested the possibility of a thermionic field-emission-dominated current transport with a higher characteristic energy than that predicted by the theory. The observed variation in the zero-bias barrier height and the ideality factor could be explained in terms of barrier height inhomogenities in the Schottky diode. Received: 4 December 1997/Accepted: 28 July 1998     

Current–voltage temperature characteristics of Au/n-Ge (1 0 0) Schottky diodes

The variation in electrical characteristics of Au/n-Ge (1 0 0) Schottky contacts have been systematically investigated as a function of temperature using current–voltage (I−V) measurements in the temperature range 140–300 K. The I–V characteristics of the diodes indicate very strong temperature dependence. While the ideality factor n decreases, the zero-bias Schottky barrier height (SBH) (Φ_B) increases with the increasing temperature. The I–V characteristics are analyzed using the thermionic emission (TE) model and the assumption of a Gaussian distribution of the barrier heights due to barrier inhomogeneities at the metal–semiconductor interface. The zero-bias barrier height Φ_B vs. 1/2 kT plot has been used to show the evidence of a Gaussian distribution of barrier heights and values of Φ_B=0.615 eV and standard deviation σ_s0=0.0858 eV for the mean barrier height and zero-bias standard deviation have been obtained from this plot, respectively. The Richardson constant and the mean barrier height from the modified Richardson plot were obtained as 1.37 A cm⁻² K⁻² and 0.639 eV, respectively. This Richardson constant is much smaller than the reported of 50 A cm⁻² K⁻². This may be due to greater inhomogeneities at the interface.     

Forward and reverse bias current-voltage characteristics of Au/n-Si Schottky barrier diodes with and without SnO2 insulator layer

The effects of interfacial insulator layer, interface states (N_ss) and series resistance (R_s) on the electrical characteristics of Au/n-Si structures have been investigated using forward and reverse bias current-voltage (I-V) characteristics at room temperature. Therefore, Au/n-Si Schottky barrier diodes (SBDs) were fabricated as SBDs with and without insulator SnO₂ layer to explain the effect of insulator layer on main electrical parameters. The values of ideality factor (n), R_s and barrier height (Φ_Bo) were calculated from ln(I) vs. V plots and Cheung methods. The energy density distribution profile of the interface states was obtained from the forward bias I-V data by taking bias dependence of ideality factor, effective barrier height (Φ_e) and R_s into account for MS and MIS SBDs. It was found that N_ss values increase from at about mid-gap energy of Si to bottom of conductance band edge of both SBDs and the MIS SBD’s N_ss values are 5-10 times lower than those of MS SBD’s. An apparent exponential increase from the mid-gap towards the bottom of conductance band is observed for both SBDs’ (MS and MIS) interface states obtained without taking R_s into account.     

Emission Spectroscopic Investigation of the Decomposition of CCl4 in Plasma Etching Processes

The CCl₄ plasma decomposition and the etching of SiO₂ and Al by the CCl₄ plasma is investigated with the aid of emission intensity Iλ of such species as Cl₂, CCl, Cl and CO, which are influenced systematically by the etching process. A time independent electron density (n_e ≈ 2 · 10⁸ ?1 · 10¹⁰ cm^?3, dependent on plasma conditions) is measured by microwave diagnostics. The ratio Iλ/n_e and Iλ/I_reference' resp. (I_reference = I_Helium) is a relative measure of concentrations. The ratio I_cl2/I_ccl is very sensitive against CCl₄-decomposition and etching processes of SiO₂ and Al. Its changes during the etching process of SiO₂ and Al in a CCl₄ plasma are investigated.     

Electrical and structural properties of the swift heavy ion irradiated Au/n-GaAs schottky barrier diodes

Abstract

Au/n-GaAs Schottky Barrier Diodes (SBDs) have been fabricated on LEC grown silicon doped (100) GaAs single crystals. The SBDs were irradiated using high energy (120 MeV) silicon ion with fluences of 1 × 10 ¹¹ and 1 × 10¹² ions/cm². Current-Voltage (I-V) characteristics of unirradiated and irradiated diodes were analyzed. The change in the reverse leakage current increases with increasing ion fluence. This is due to the irradiation induced defects at the interface and its increase with the fluence. The diodes were annealed at 573 and 673 K. to study the effect of annealing. The rectifying behavior of the irradiated (fluence of 1 × 10¹² ions/cm¹²) SBDs improves upon as the annealing temperature increases and is attributed to the in situ self-annealing during irradiation. Scanning Electron Microscopic analysis was carried out on the irradiated samples to delineate the projected range and to observe defects.     

Photovoltaic characteristics of Au/PVA (Bi-doped)/n-Si Schottky barrier diodes (SBDs) at various temperatures

The charge conduction properties of the Au/PVA (Bi-doped)/n-Si Schottky barrier diodes (SBDs) were investigated using current–voltage–temperature (I–V–T) measurements in dark and under various illumination levels. For this purpose, the main diode parameters such as reverse-saturation current (I_o), zero-bias barrier height (Φ_Bo), ideality factor (n), series resistance (R_s) and shunt resistance (R_sh) of diode were obtained as function of temperature and illumination level. Experimental results show that all of these electrical parameters are strong functions of illumination and temperature. The change in all electrical parameters becomes more important at low temperatures and illumination levels. While the n value decreases with increasing temperature and illumination level, Φ_Bo value increases. The fill factor (FF = V_m·I_m/V_oc·I_sc) values were obtained as 0.34 at 80 K and 0.40 at 320 K under 50 W and these values are near to a photodiode. Therefore, the fabricated diode can be used as a photodiode in optoelectronic applications. The forward bias I–V characteristics of the diode have also been explained by the space charge limited current (SCLC) model.