Beam transport

Abstract

Dopant distribution, electrical activity and damage annealing of high-dose (～5 × 10¹⁵ cm²) Ga-implanted silicon samples annealed by conventional thermal annealing have been studied by alpha particle back-scattering, differential Hall effect and ellipsometry measurements. Back-scattering spectra show that there is no long tail of Ga atoms in the as-implanted samples. Upon annealing these samples the damaged amorphous layer recrystallizes at about 570°C by solid phase epitaxy. During the epitaxial regrowth the dopant atom distribution seems to be modified. Further, very high levels of electrical activaton of Ga-atoms (～3 × 10²⁰ cm^?3), much higher than the maximum solubility limit of Ga in Si (4.5 × 10¹⁹ cm^?3), is achieved by thermal annealing of the sample at ～570°C. This is comparable to the doping achieved by laser annealing of the Ga implanted Si. All the above three measurements show that there is residual damage in the high dose (?10¹⁵cm^?2) implanted samples after the recrystallization at about 570°C. This may be related to strain in the lattice at the high concentrations of metastable substitutional Ga atoms. Annealing at higher temperature reduces the electrical activity of Ga atoms, possibly by driving out the metastably high substitutional concentrations of Ga-atoms into electrically inactive clusters or precipitates.     

Effet elastique en volume dans le nickel irradie aux electrons a tres basse temperature

Abstract

Experiments designed to determine the damage distribution produced by energetic heavy ions in Si are described. For low ion doses (10¹¹ to 10¹³ cm^?2), the location of the damage peak was determined by changes, which were produced by ion damage, in the electrical properties of thin (0.6 μ), uniformly doped Si layers as a function of depth. The ratio of the peak position in the damage distribution to the peak position in the ion distribution was determined to be approximately 0.6 ± 0.1 for Si²⁹ (150 keV), P³¹ (70, 140, 200 keV), B¹¹ (60 keV), and As⁷⁵ (280 keV). A comparison of carrier removal rates and the number of displaced lattice atoms previously reported from back-scattering experiments with He ions indicates that the nature of damage produced by Si²⁹ and B¹¹ are different. In the former case, cluster damage (amorphous disordered regions) appears to be an important form of radiation damage, while in the latter case, isolated defects are the dominant form of radiation damage for room temperature implantations. Isochronal annealing studies of Si²⁹ and B¹¹ ion damage provide further support for the different nature of radiation defects produced by these species. For high doses (10¹⁴ to 10¹⁶ cm^?2), the growth of a continuous amorphous Si layer was studied with ESR, optical transmission, and visual observation and stripping studies. The ratio of the location of the damage peak to that of the peak ion concentration was determined to be approximately 0.7 for P³¹ (140, 280 keV) and 0.8 for As⁷⁵ (280 keV). From the ESR studies, the number of displaced atoms in amorphous clusters was estimated to be 2800 per 280 keV P³¹ ion.     

Behavior of antimony above solid solubility in silicon produced by implantation and laser annealing

Abstract

Antimony implantation into <111> silicon was carried out at RT with a dose of 4.5 × 10¹⁵ cm^?2, energy 75 keV. For the annealing of the sample pulses of a Q-switched ruby laser were used with energy density of ～ 1.5 Joule/cm² and duration of 15–20 nsec. Hall effect measurement was applied to determine the electrical activity of the layers. Lattice location and the depth profile of Sb was studied by RBS and channeling technique. Measurements show that after laser annealing Sb occupies mostly substitutional sites in Si with 84% electrical activity. It has been shown that after laser annealing the concentration of Sb in lattice sites is almost an order of magnitude higher than the limit of solid solubility. Isochron and isothermal annealing of these samples up to 1150°C was carried out to study the kinetics of reverse annealing of antimony.     

磷离子注入速率对4H-SiC(0001)晶格恢复与电阻率降低的影响

高剂量的磷离子注入4H-SiC(0001)晶面，注入速率从1.0×1012到4.0×1012 P+ cm-2s-1变化，而注入剂量固定为2.0×1015 P+ cm-2。室温注入，1500oC的高温下退火。利用光荧光和拉曼谱分析注入产生的晶格损伤以及退火后的残余缺陷。通过霍耳测试来分析注入层的电学性质。基于上述测试结果，发现通过减小磷离子的注入速率，极大地减少了注入层的损伤及缺陷。考虑到室温注入以及相对较低的退火温度(1500 oC)，在注入速率为1.0×1012 P+ cm-2s-1及施主浓度下为4.4×1019 cm-3的条件下，获得了非常低的方块电阻106 Ω/sq。     

Low energy boron and phosphorus implants in silicon (a) electrical sheet measurements

Silicon wafers were implanted in 〈111〉-direction with boron and phosphorus ions of 7 keV at room temperature. Doses between 10¹² and 10¹⁸ ions/cm² were applied. After successive annealing steps the electrical properties of the implanted layers have been determined by Hall effect and sheet resistivity measurements. The annealing characteristics of the implants depend on ion dose and species. Three annealing stages can be distinguished: (I) the temperature range below 500°C, (II) 500—700°C, (III) 700—900°C.

After annealing at 90°C the apparent electrical yield is proportional to dose for all implants and amounts to approx. 80 per cent for boron and 40 per cent for phosphorus.

Sheet resistivity vs. dose curves were derived for the annealing temperature of 400°C and used for the fabrication of position sensitive detectors. The position characteristics were found to be linear within ～1 per cent for resistive layers as long as 20 cm.     

离子注入Si损伤分布的光谱法多层分析

应用多层模型和最优化方法,由实验测得的离子注入Si的椭偏光谱以及单晶Si和离子注入非晶Si的光学常数,能分析离子注入Si的损伤分布。我们测量了2.1—4.6eV能量范围的椭偏光谱和光学常数,建立了多层计算模型和最优化方法。在模拟分析的基础上,计算了能量为40keV,剂量分别为4×10¹³和1.4×10¹⁴cm^-2的As⁺注入Si的损伤分布,并与背散射测量的结果比较。用多层模型和最优化方法也能从光谱分析其它物理量的分布,只要这些物理量对光学性质有显著的影响,并且在测量过程中不随光子能量而改变。 关键词：     

Spatial distribution of defects produced by boron ion implantation of silicon

A simple technique for the study of the spatial distribution of the damage produced by ion implantation of silicon has been developed. The damage depth distribution for 40 keV boron ions in silicon has been studied at irradiation doses from 7 × 10¹¹ to 3.9 × 10¹⁴ ions/cm² and the relative defect peak depth R _d/R _p = 0.85 determined. An increase of layer conductivity as the surface part of the implanted layer is removed has been revealed. This effect is caused by the presence of radiation defects in the surface region of the layer. The “electrical” cluster diameter is about 28 A and the overlapping cluster dose is close to 1 × 10¹³ ions/cm².     

A cems study of119Sn ion-implanted into Ni

Conversion electron Mössbauer spectroscopy (CEMS) was applied to study the behaviour of¹¹⁹Sn atoms implanted into Ni at the accelerating energy of 100–400KeV and doses of 5×10¹⁵–5×10¹⁶ ions/cm² at room temperature. All CEMS spectra were measured at room temperature and successfully analyzed by two components. The energy and dose dependence of CEMS spectra were well explained by the depth distribution of¹¹⁹Sn atoms.     

Metallic alloy precipitates in high dose indium implanted MgO

Abstract

MgO implanted at room temperature with 150keV In⁺ ions and doses ranging from 10¹⁵ to 10¹⁷ ions cm^?2 was studied by optical absorption and transmission electron microscopy (TEM). Creation of defects in the anionic sublattice (F-, F⁺-, F₂-centers) and in the cationic sublattice (V^?-centers) are observed. Subsequent annealings of the implanted crystals have shown different behaviours depending on the implanted dose. For medium dose (2 × 10¹⁶ ions cm^?2), the formation of In³⁺ species seems to be the preponderant phenomenon. At higher dose (8 × 10¹⁶ ions cm^?2), metallic precipitates are formed between 400 and 700°C. The identification of these precipitates has been achieved using TEM: they are formed of a metallic alloy Mg₃In with a hexagonal structure and their orientation relationship with respect to the MgO matrix is: (0001)Mg₃In//(111)Mgo and [1120]_Mg3In// [l10]MgO.     

Application of mechanical scanning to ion implantation

Abstract

Atomic depth profiles from Be-implanted Si have been examined as a function of implant fluence and annealing, and the results have been correlated with theoretically calculated implantation induced damage profiles. The Be atomic depth profiles were obtained by secondary ion mass spectrometry (SIMS) techniques from samples implanted at 300 keV to fluences ranging from 2 × 10¹² to 10¹⁵ cm^?2. Subsequent to annealing at 600°C for 30 min, the Be SIMS profiles exhibited anomalous redistribution effects. The Be profiles obtained from the annealed samples had the same general features as the depth distribution of implant energy deposited into damage, based on Brice's¹ calculations. The correlation of the SIMS atomic profiles and the theoretical damage profiles indicated that Be “decorates” the implantation induced damage regions while redistributing during the annealing process.     

The electrical behaviour of abrupt ion implanted and diffused P+N junctions

Abstract

Results are reported of measurements of the properties of diodes formed by ion implantation, and for comparison boron diffused P⁺N diodes of similar area close by on the same chip. The four group III acceptor impurities were implanted separately to a dose of 5 × 10¹⁵ ions/cm² at room temperature into similar samples of suitably masked silicon. Boron ions were also implanted at liquid nitrogen temperature and 450°C. Annealing was limited to a maximum temperatare of 550 °C.

Measurements have been made of sheet resistance, forward and reverse I-V characteristics (from 10^?9 amps/cm²), reverse breakdown voltage, noise, minority carrier storage time and junction series resistance.

The bulk properties of boron implanted diodes were found to be reproducible. The introduction of recombination centres by implantation is the major factor influencing variation in these properties between one implantation condition and another. Changes in surface oxide conditions probably affect reverse leakage currents and breakdown voltages.

The properties of boron implanted diodes are considered suitable for applications such as the MOSFET, and are superior to those of the AI, Ga and In implanted diodes.     

钴离子注入对二氧化钛晶体的结构和光学性能的影响

采用离子注入法制备了钴离子掺杂的金红石相TiO₂样品;离子注入能量、注量分别为40 keV(1×10¹⁶cm^-2),80 keV(5×10¹⁵,1×10¹⁶,5×10¹⁶,1×10¹⁷cm^-2),120 keV(1×10¹⁶cm^-2). 通过XRD,XPS和UV-Vis等手段对掺杂前后样品的结构和光学性能进行了表征,分析了掺杂元素在金红石TiO₂中的存在形式. XRD测试表明随着注入能量的增加晶体的损伤程度增加. UV-Vis测试表明掺杂后所有样品在可见光区的吸收增强; 并且随着注量的增加,注量为5×10¹⁵cm^-2到5×10¹⁶cm^-2范围内注入样品的光学带隙逐渐变小. 关键词： 钴 二氧化钛 离子注入 掺杂     

Crystalline to amorphous transformations in ion implanted GaP

Abstract

The amorphization process of GaP by ion implantation is studied. The samples of 〈111〉 oriented GaP were implanted at 130 K with various doses 5 × 10¹³-2 × 10¹⁶ cm^?2 of 150 keV N⁺ ions and with the doses of 6 × 10¹²-1.5 × 10¹⁵ cm^?2 of 150 keV Cd⁺ ions. Room temperature implantations were also performed to see the influence of temperature on defect production. Rutherford backscattering and channelling techniques were used to determine damage in crystals. The damage distributions calculated from the RBS spectra have been compared with the results of Monte-Carlo simulation of the defect creation.

The estimated threshold damage density appeared to be independent on ion mass and is equal 6.5 × 10²⁰ keV/cm³. It is suggested that amorphization of GaP is well explained on the basis of a homogenous model.     

P2+和P+注入硅固相外延过程时间分辨的反射率研究

本文以时间分辨的反射率测量结合背散射和沟道分析、透射电子显微镜分析,比较和研究了在77K温度下180keV,1×10¹⁴/cm²P₂⁺和90KeV,2×10¹⁴/cm²P⁺注入硅于550℃退火时的固相外延过程。发现了P₂⁺,P⁺注入硅样品的固相外延过程具有不同的特征。这种差异是由于P₂⁺和P⁺在硅中引入不同的损伤造成的。P⁺注入的硅样品测量得到的时间分辨的反射谱是反常的。这种反常谱可用样品退火时从表面层到非晶硅层与从衬底到非晶硅层的双向外延的过程给出满意的解释。 关键词：     

Electron microscopy studies of void swelling and annealing of voids in aluminium irradiated with aluminium ions

Abstract

MgO single crystals implanted with Au⁺ ions (180 keV, 6 10¹⁶-10¹⁷ ions cm^?2) and annealed at temperatures between 25°C and 1100°C, have been analysed—by optical spectrophotometry—by Rutherford back-scattering (to confirm the effective presence and to study the distribution profile of Au atoms), and by TEM and X-ray diffraction (to identify the phases precipitated by thermal treatment).

Thermal annealing between 550°C and 1100°C produced an optical absorption band located between 565 nm and 600 nm. This band can be attributed to a fee Au precipitate with diameter varying from 50 to 200 Å. Larger metallic colloids 1000 Å are in simple orientation with the matrix.

Annealing at temperatures higher than 500°C produces a supplementary optical absorption located at 425 nm. This band can be attributed to Au plasma resonance.

After annealing for 15 min at 1100°C, a new phase is detected by X-ray diffraction and TEM and identified as Au₃Mg alloy with hexagonal structure.     

基于镍-63硅基辐伏能量转换结构初探

针对辐射伏特效应同位素微电池研究中所面临的主要问题——辐伏转换效率提高与辐射损伤 这一相互制约的矛盾体,利用单晶硅低能电子辐照感生缺陷行为研究,结合两种PIN结构的 电学性能测试,提出I区掺杂浓度为2×10¹² cm^-3的P⁺I (N^-) N⁺器件符合 P, N型硅辐射损伤效应预测结果.并以此为原型器件进行⁶³Ni辐照在线输出特性测试, 通过与Wisconsin大学实验数据比较,对影响能量转换效率低下的主要因素进行了分析, 考虑主要从器件采用三维PIN结结构;增大耗尽层能量沉积比重; I (N^-)区宽度与沉积深度匹配; 控制漏电流在皮安量级等方面提高能量转换效率,据此对硅基能量转换结构进行设计, 最终确定PIN多孔结构、辐射源厚度、掺杂浓度、耗尽层宽度等结构参数,完成换能结构优化.     

Peculiarities of heavy ion channeling

Abstract

Depth distributions of implanted Mg⁺- and Ca⁺-ions and the corresponding radiation damage were studied for different channeling orientations of silicon crystals. The shape of the implantation profiles is discussed by using simple models for dechanneling and energy loss processes. A correlation between dechanneling, damage production and depth distributions of the channeled ions could be observed. This correlation is seen by the maxima shifts in damage and implanted ion distributions between channel and random incidence.     

Formation of bubbles and blisters in hydrogen ion implanted polycrystalline tungsten

ABSTRACT

Tungsten (W) has been regarded as one of the most promising plasma facing materials (PFMs) in fusion reactors. The formation of bubbles and blisters during hydrogen (H) irradiation will affect the properties of W. The dependence of implantation conditions, such as fluence and energy, is therefore of great interest. In this work, polycrystalline tungsten samples were separated into two groups for study. The thick samples were implanted by 18?keV H₃⁺ ions to fluences of 1?×?10¹⁸, 1?×?10¹⁹ and 1?×?10²⁰ H⁺/cm², respectively. Another thick sample was also implanted by 80?keV H₂⁺ ions to a fluence of 2?×?10¹⁷ H⁺/cm² for comparison. Moreover, the thin samples were implanted by 18?keV H₃⁺ ions to fluences of 9.38?×?10¹⁶, 1.88?×?10¹⁷ and 5.63?×?10¹⁷ H⁺/cm², respectively. Focused ion beam (FIB) combined with scanning electron microscopy (SEM) and transmission electron microscopy (TEM) were used for micro-structure analysis, while time-of-flight ion mass spectrometry (ToF-SIMS) was used to characterize the H depth profile. It is indicated that bubbles and blisters could form successively with increasing H⁺ fluence. H bubbles are formed at a fluence of ～5.63?×?10¹⁷ H⁺/cm², and H blisters are formed at ～1?×?10¹⁹ H⁺/cm² for 18?keV H₃⁺ implantation. On the other hand, 80?keV H₂⁺ ions can create more trapping sites in a shallow projected range, and thus enhancing the blisters formation with a relatively lower fluence of 2?×?10^17?H⁺/cm². The crack-like microstructures beneath the blisters are also observed and prefer to form on the deep side of the implanted range.     

Characterization of ion implanted n+ layers on tetrahedrically textured silicon surfaces

Ion implantation of 2 × 10^{15 31}P⁺/cm² at 10 keV and furnace annealing at 750° C, 1/2 h, have been used to obtain n⁺ -p junctions on (100) silicon samples having tetrahedrically textured surfaces. This texture was obtained by an anisotropic etching in a hot hydra-zine-water mixture. Morphological properties of the surface (dimension, homogeneity and characteristic of the tetrahedrons) have been analyzed and electrical properties of the implanted layers (sheet resistivity, carrier concentration profile) have been measured. The electrical characteristics of the textured samples are similar to those obtained using samples with flat polished surface; the tetrahe-dral structures are not damaged by the implantation process and they keep their antireflecting properties unaltered.     

Some studies of BF2 and B+F implanted Silicon

Ion-implanted shallow junctions have been investigated using BE₂ (molecular ions) by the anodic oxidation method coupled with a four-point probe technique. BF₂ ions were implanted through screen oxide at doses of 3–5 × 10¹⁵ ions/cm² and energies of 25 and 45 keV which is equivalent to 5.6 keV and 10 keV of boron ions. The effect of energy, dose and annealing temperature on shallow junctions is presented in this paper. The shallow junctions in the range of 0.19 μm to 0.47 μm were fabricated.

The effect of fluorine on sheet resistivity of boron implanted silicon at various doses, treated with two-step and three-step annealing, is also presented for comparison in the paper.