Oligomeric aliphatic–aromatic ether containing phthalonitrile resins

A versatile synthetic method has been developed for oligomeric aliphatic–aromatic ether containing phthalonitrile (PN) resins and applied to the preparation of three unique resin systems. The oligomeric PN monomers were prepared from the reaction of an excess amount of bisphenol A with a dihalo‐aliphatic containing compound in the presence of K₂CO₃ in dimethylsulfoxide, followed by end‐capping with 4‐nitrophthalonitrile in a two‐step, one‐pot reaction. These PN resin systems exhibited excellent viscosities for molding various shaped articles after thermal curing to yield crosslinked polymers. These polymers offered more mechanical flexibility, when compared with an all aromatic backbone, while still maintaining good thermal stability, dielectric properties, and low water absorption. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 2186–2191     

Kinetic Study of Curing Bisphenol A Dicyanate Ester with Ionic Liquid Additive

A kinetic study of the trimerization reaction of bisphenol A dicyanate ester with an aromatic imidazolium‐based ionic liquid (IL) as additive is performed using dynamic and isothermal differential scanning calorimetry. The reaction follows second‐order autocatalytic kinetics, and a slight acceleration effect is observed in the presence of the aromatic IL relative to the neat resin. The activation energy also increases with the IL additive, whereas the glass transition temperature (T_g) is depressed, consistent with the Fox equation and a homogeneous one‐phase material. A model incorporating diffusion effects is able to describe the dynamic and isothermal curing data for both the neat resin system and that containing aromatic IL. A comparison with aliphatic‐based IL additive indicates that the reaction is more accelerated with aliphatic IL than with the aromatic IL in spite of the fact that the aliphatic additive phase separates during cure. © 2019 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2019 , 57, 1315–1324     

Oligomeric bisphenol A‐based PEEK‐like phthalonitrile‐cure and polymer properties

The cure behavior and properties of oligomeric bisphenol A‐based PEEK‐like phthalonitrile (PN) are thoroughly examined in this article. The resin is easily processed from the melt at a relatively low temperature (150–200 °C) and the monomer cure occurs in a controlled manner as a function of the amine content and processing thermal conditions. Dynamic mechanical measurements and thermogravimetric analysis show that the polymer properties improve as the maximum PN postcure temperature is increased to 415 °C. The effects of the amine and polymer postcure conditions on the flexural and tensile properties of the PN polymer are investigated. The mechanical properties of the polymer are maximized after postcuring to moderate temperatures (330–350 °C). The polymer exhibits an average flexural strength and tensile strength at break of 117 and 71 MPa, respectively. After oxidative aging at 302 °C for 100 h, the polymer retains excellent mechanical properties. The average flexural and tensile strength retention of the polymers are 81 and 75%, respectively. Microscale calorimetric measurements reveal that the flammability parameters of the oligomeric PN are low compared to other thermosets. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3769–3777     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Curing kinetics of epoxy resins with hyperbranched polyesters as toughening agents

The effects of hyperbranched polyesters on the cure kinetics of diglycidyl ether of bisphenol A (DGEBA) in the presence of m‐phenylene diamine were investigated with nonisothermal differential scanning calorimetry. The results showed that the addition of hyperbranched polyesters enhanced the cure reaction of DGEBA with m‐phenylene diamine, and this resulted in a reduction of the peak temperature of the curing curve and the activation energy because of the low viscosity and large number of terminal hydroxyl groups. However, when linear poly(ethylene glycol) was added, the activation energy of the blends also slightly decreased, whereas the peak temperature of the curing curve increased. The curing kinetics of the blends were calculated by the isoconversional method of Málek. The two‐parameter autocatalytic model (i.e., the ?esták–Berggren equation) was found to be the most adequate for describing the cure kinetics of the studied systems. The obtained nonisothermal differential scanning calorimetry curves showed results in agreement with those theoretically calculated. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2649–2656, 2004     

Resorcinol‐based benzoxazine with low polymerization temperature

The industrial applications of benzoxazines are limited due to their high curing temperatures. This drawback can be overcome by more reactive precursor compared to conventional benzoxazines or by application of efficient initiators. We report the synthesis of a new resorcinol‐based benzoxazine and its cationic polymerization with thermolatent super acids, namely organic sulfonium hexafluoroantimonates. This combination of a reactive precursor and an efficient initiator results in a curing temperature below 100 °C (differential scanning calorimetry onset) which is up to now one of the lowest polymerization temperatures for benzoxazine systems. Furthermore, the thermal stability of the formed polybenzoxazine has not been influenced by the applied initiators. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 1693–1699     

Cure kinetics modeling and thermomechanical properties of cycloaliphatic epoxy‐anhydride thermosets modified with hyperstar polymers

Hyperstar polymers (HSPs) with hyperbranched aromatic polyester core and arms consisting of block copolymers of poly(methyl methacrylate) and poly(hydroxyethyl methacrylate) have been used as polymeric modifiers in cycloaliphatic epoxy‐anhydride formulations catalyzed with tertiary amines, with the purpose of enhancing the impact strength of the resulting materials without compromising other thermal and mechanical properties.> In this work, the effect of these polymeric modifiers on the curing kinetics, processing, thermal‐mechanical properties and thermal stability has been studied using thermal analysis techniques such as DSC, TMA, DMA, and TGA. The morphology of the cured materials has been analyzed with SEM. The curing kinetics has been analyzed by isoconversional procedures and phenomenological kinetic models taking into account the vitrification during curing, and the degradation kinetics has been analyzed by means of isoconversional procedures, summarizing the results in a time‐temperature‐transformation (TTT) diagram. The results show that HSPs participate in the crosslinking process due to the presence of reactive groups, without compromising significantly their thermal‐mechanical properties. The modified materials show a potential toughness enhancement produced by the formation of a nano‐grained morphology. The TTT diagram is shown to be a useful tool for the optimization of the curing schedule in terms of curing completion and safe processing window, as well as for defining storage stability conditions. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014 , 52, 1227–1242     

Synthesis of bisphenol A‐free oligomeric phthalonitrile resins with sulfone and sulfone‐ketone containing backbones

Two new oligomeric sulfone and sulfone‐ketone containing phthalonitrile (PN) resins with excellent processability have been developed. The PN monomers were prepared from the reaction of an excess amount of bisphenol S with 4‐(chlorophenyl)sulfone or 4,4‐dichlorobenzophenone in the presence of a base in a solvent mixture (dimethylsulfoxide/toluene), followed by end‐capping with 4‐nitro‐PN in a two‐step, one‐pot reaction. These PN resins exhibited good viscosities and cure times for molding into various shapes. After being thermally cured to yield crosslinked polymers, these polymers demonstrated superb mechanical properties, thermo‐oxidative stability, and maintained good dielectric properties. Published 2016. 1 J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 1639–1646     

Rheological study on structural transition in polyethersulfone‐modified bismaleimide resin during isothermal curing

The structural transition in the polyethersulfone (PES)‐modified bismaleimide resin, 4,4′‐bismaleimidodiphenylmethane (BDM), during isothermal curing was studied by using rheological technique, different scanning calorimetry (DSC), and time resolved light scattering (TRLS). Comparing with the cure of neat bismaleimide, two separate tan δ crossover points were observed because of the phase separation during curing the blends of PES/BDM. These two structural transitions stemmed from the fixing of phase structure of the system and the chemical crosslinking of bismaleimide, respectively. The effect of curing temperature and the PES content on structural transition was discussed and found that the occurrence of two structural transition exhibited the different dependency of curing temperature and PES content. The relaxation exponent n and gel strength S were also found to be temperature‐dependent and composition‐dependent. Moreover, the relaxation exponent n of the second structural transition is much lower than that of the first structural transition in the PES/bismaleimide blends. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3102–3108, 2006     

Phthalonitrile cure reaction with aromatic diamines

Phthalonitrile monomers can be polymerized thermally in the presence of small amounts of curing agents into thermosetting polymers. The thermosets exhibit outstanding thermo-oxidative stability, display good mechanical properties, and offer promise as matrices for composite applications. The phthalonitrile cure reaction is typically accomplished with an aromatic diamine, 1,3-bis(3-aminophenoxy)benzene (m-APB), added in the range of 1.5–2% by weight of the monomer in the melt phase. This article addresses the cure reaction with a sulfone-containing diamine, bis[4-(4-aminophenoxy)phenyl] sulfone (p-BAPS), which shows lower volatility as determined from thermogravimetric studies (TGA) compared to m-APB at the processing temperatures typically employed for phthalonitrile cures. Rheometric studies conducted to monitor the viscosity increase during a cure reaction suggest that the cure reaction with m-APB is faster compared to the reaction with p-BAPS. Even though differences are seen in the initial cure rates, the final cured products are similar in terms of the glass transition temperatures and thermal and oxidative stabilities. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1885–1890, 1998     

Cationic cure of epoxy resin initiated by methylanilinium salts as a latent thermal initiator

The effect of the novel N‐crotyl‐N,N‐dimethyl‐4‐methylanilinium hexafluroantimonate (CMH) initiator on cure kinetics and rheological properties of diglycidylether of bisphenol A (DGEBA) epoxy cationic system was investigated. From DSC measurements of the DGEBA/CMH system, it was found that this system exhibited excellent thermal latent characteristics at a given temperature and revealed complex cure behavior as indicated by multiple exotherms. The conversion and conversion rate of the DGEBA/CMH system increased with increasing the concentration of initiator, attributed to the high activity of CMH. Viscoelastic properties during gel formation of DGEBA initiated by CMH were investigated by rheological techniques under isothermal conditions. The gel time obtained from the modulus crossover point t(G′) = G″ was affected by a high curing temperature and the concentration of CMH, resulting in a high degree of network formation in cationic polymerization. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 2397–2406, 2001     

In situ FTIR and DSC investigation on cure reaction of liquid aromatic dicyanate ester with different types of epoxy resin

Cure reactions of a liquid aromatic dicyanate ester [1,1′‐bis(4‐cyanatophenyl) ethane, DiCy] associated with a liquid cycloaliphatic epoxy ester (3,4‐epoxycyclohexylmethyl‐3,4‐epoxycyclohexane‐carboxylate, EPC) and with liquid bisphenol A epoxide [2,2‐bis(4‐glycidyloxyphenyl)propane, EPA] were studied through a cross‐reference between in situ FTIR and DSC dynamic scanning. DiCy can act here as a latent catalyst to cure EPC and EPA resins. Reaction mechanisms were found to be different for both curing systems (EPC/DiCy and EPA/DiCy). Two significantly separated exotherms were observed in the DSC thermograms in each system. The reaction mechanism of the EPA/DiCy system was found to follow mainly Bauer pathways. We postulate a new sequence of the mechanism in this system due to the presence of an oxazoline structure during the progression of the curing process. In the curing system of EPC/DiCy, however, another five principle reaction paths, rather than Bauer pathways, are suggested: (1) polycyclotrimerization of DiCy, (2) formation of oxazoline, (3) insertion of EPC into cyanurate, (4) formation of tetrahydro–oxazolo–oxazole, and (5) ring cleavage and reformation of oxazoline to form the insertion structure of cyanurate. The lower temperature peak in the DSC thermogram is primarily contributed by the former three reaction paths, whereas the higher temperature peak can mainly be attributed to the reaction paths 4 and 5. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2934–2944, 2000     

Isoconversional method to explore the cure reaction mechanisms and curing kinetics of DGEBA/EMI‐2,4/nano‐SiC system

The curing kinetics of the diglycidyl ether of bisphenol‐A (DGEBA)/2‐ethyl‐4‐methylimidazole (EMI‐2,4)/nano‐sized carborundum (nano‐SiC) system was studied by means of nonisothermal differential scanning calorimetry (DSC). An isoconversional method of kinetic analysis yields a dependence of the effective activation energy E on the extent of conversion that decreases initially, and then increases as the cure reaction proceeds. The variations of E were used to study the cure reaction mechanisms, and the Shrinking Core Model was used to study the resin–particle reaction. The results show that the presence of nano‐SiC particles prevents the occurrence of vitrification, as well as inhibits the cure reaction. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 371–379, 2006     

A versatile A2 + B3 approach to hyperbranched polyacenaphthenequinones

A series of hyperbranched polyacenaphthenequinones has been prepared by superelectrophilic aromatic substitution of (substituted) acenaphthenequinone and 1,3,5‐tris‐(4‐phenoxybenzoyl)benzene via a facile A₂ + B₃ approach. Because of the strongly increased reactivity of the second A functionality, gelation was efficiently avoided during the polymerization. The structure of the resulting polymer was characterized by NMR spectroscopy and gel permeation chromatography. Further modification of the hyperbranched polyacenaphthenequinone was explored both on the acenaphthenequinone and aromatic moieties. Moreover, the polymer modified through sulfonation was investigated as a water‐soluble acid catalyst for the degradation of biomass resources. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 2596‐2603     

Surface promoted redox cationic polymerization of epoxy monomers catalyzed by silver salts

The first example of a one‐component room temperature curing redox cationic polymerization for metal surfaces is described. A weak Lewis acid (Ag⁺) is used as a latent catalyst to likely generate a much stronger one (Fe²⁺/Fe³⁺ or Cu²⁺) at the bond line interface. Such a process has been demonstrated for 3,4‐epoxycyclohexylmethyl‐3,4‐epoxycyclohexane carboxylate using [Ag(1,5‐cyclooctadiene)₂]SbF₆ with the polymerization monitored most conveniently by fourier transform infrared spectroscopy (FTIR). This system, however, demonstrates a relatively low adhesive strength even following curing for 24 h. Higher bond strengths were achieved using mixtures with other cationically polymerizable monomers (vinyl ethers, tetrahydrofuran (THF), oxetanes). Factors considered for optimization of the rates and extent of reaction were the concentrations of a vinyl ether comonomer and [AgL_n]X, the nature of the counterion (X), and of the ligand (L). The performance of the Ag(I) system was compared to that of Cu(I) and various organic cations and the activity of the redox cationic polymerizations on a range of metallic (iron, copper, and aluminium) and nonmetallic (glass and various plastics) substrates was studied. A relatively high glass transition temperature was recorded for the optimized model system and the bonding strength at elevated temperature (150–200 °C) following a room temperature cure was found to be attractive compared to selected model anaerobic acrylate compositions. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

N,N‐dimethylaminopyridine as initiator in the copolymerization of diglycidylether of bisphenol A with six‐membered cyclic carbonates

N,N‐Dimethylaminopyridine (DMAP) was used as initiator to cure mixtures of diglycidylether of bisphenol A (DGEBA) and 1,3‐dioxan‐2‐one (TMC) or 5,5‐dimethyl‐1,3‐dioxan‐2‐one (DMTMC). The curing was studied by differential scanning calorimetry (DSC) and Fourier transform infrared in the attenuated‐total‐reflection mode (FTIR/ATR). FTIR/ATR was used to monitor the competitive reactive processes and to quantify the evolution of the groups involved in the curing. We observed the formation of five‐membered cyclic carbonates and anionic carbonate groups that remain unreacted at the chain ends. The formation of these groups was explained by the attack of the anionic propagation species on the methylene carbon of the carbonate group, which leads to an alkyl‐oxygen rupture. By performing the cure in the thermobalance we could evaluate the loss of CO₂ produced in the samples containing carbonates. The kinetics were studied by DSC and analyzed with isoconversional procedures. The addition of carbonates slows down the curing rate. Thermogravimetric analysis (TGA) and dynamic mechanical thermal analysis (DMTA) experiments were used to evaluate the properties of the materials obtained. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2873–2882, 2006     

Functional off‐stoichiometry thiol‐ene‐epoxy thermosets featuring temporally controlled curing stages via an UV/UV dual cure process

We present a facile two‐stage UV/UV activation method for the polymerization of off‐stoichiometry thiol‐ene‐epoxy, OSTE+, networks. We show that the handling and processing of these epoxy‐based resins is made easier by introducing a material with a controlled curing technique based on two steps, where the first step offers excellent processing capabilities, and the second step yields a polymer with suitable end‐properties. We investigate the sequential thiol‐ene and thiol‐epoxy reactions during these steps by studying the mechanical properties, functional group conversion, water absorption, hydrolytic stability, and thermal stability in several different thiol‐ene‐epoxy formulations. Finally, we conclude that the curing stages can be separated for up to 24 h, which is promising for the usefulness of this technique in industrial applications. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 2604‐2615     

Curing kinetics and mechanism of bisphenol S epoxy resin with 4,4′‐Diaminodiphenyl ether or phathlic anhydride

The kinetics of the cure reaction for systems of bisphenol‐S epoxy resin with 4,4′‐diaminodiphenyl ether or phthalic anhydride as a curing agent were investigated with a differential scanning calorimetry. Autocatalytic behavior was shown in the first stages of the cure for the systems, which could be well described by the model proposed by Kamal [Polym Eng Sci 1973, 13, 59–64] that includes two rate constants k₁ and k₂ and two reaction orders, m and n. k₁ and k₂ values are observed to increase with the increasing temperature. With the proceeding of the cure reaction, the cross‐linking structure appears, and the reaction is mainly controlled by diffusion in the latter stages. The molecular mechanism of the curing system was discussed. © 2001 John Wiley & Sons, Inc. Int J Chem Kinet 33: 558–563, 2001     

Synthesis and thermal behavior of phenylethynyl‐terminated linear and hyperbranched polyphenylquinoxalines

A phenylquinoxaline (PQ) AB monomer mixture was treated with monofunctional and difunctional end‐capping agents and with and without a coupling agent to afford phenylethynyl‐terminated linear PQ oligomers. The resulting PQ oligomers were soluble in common organic solvents and had intrinsic viscosities (IVs) of 0.21–0.30 dL/g. The glass‐transition temperature (T_g) of the diphenylethynyl‐end‐capped PQ oligomer on both sides increased the most, from 215 °C (before curing) to 251 °C (after curing). The PQ AB₂ monomer, which acted as both a coupling agent and a monomer for the hyperbranched polymer, was treated with an AB monomer and end‐capping agents to afford phenylethynyl‐terminated hyperbranched polyphenylquinoxalines (PPQs). They were also soluble in common organic solvents, had IVs of 1.00–1.65 dL/g and T_g's of 251–253 °C, and underwent exothermic cure with maxima around 412–442 °C. The T_g's of the cured hyperbranched PPQs ranged from 258 to 261 °C, depending on the number of phenylethynyl groups on the surface. After further curing, they displayed a T_g of 316 °C in one sample and turned into a fully crosslinked network. The dynamic melt viscosities of a linear oligomer (IV = 0.21 dL/g), a hyperbranched sample (IV = 1.00 dL/g), and a linear reference PPQ (IV = 1.29 dL/g) were compared with respect to the processing temperature. The PQ oligomer and hyperbranched PPQ had low melt viscosities. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 6318–6330, 2004