热丝CVD法沉积固态扩散源制备晶硅太阳电池p+/n+发射极研究

为进一步提高晶硅太阳能电池发射极的性能,本文提出了一种新的发射极制备技术-低温CVD法沉积固态薄膜扩散源并进行高温扩散.采用热丝化学气相沉积法(HWCVD)在单晶硅片上沉积重掺杂硅基薄膜作为固态扩散源,然后在空气氛围下的管式炉中进行高温扩散,最后用稀HF溶液去除表面的BSG/PSG.通过掺磷薄膜扩散在P型单晶硅片上制备了方阻在50～250 Ω/□范围内可控的n+型发射极;通过掺硼薄膜扩散在N型硅片上制备了方阻在150 ～600Ω/□□范围内可控的p+型发射极.并且通过在源气体中加入CO2作为氧源,实现了扩散后硅片表面残留扩散源层的彻底去除.     

φ400mm直拉硅单晶生长过程中氧浓度对微缺陷影响的数值模拟

针对大直径直拉硅的微缺陷控制问题,模拟研究了初始氧浓度对于直径400 mm直拉硅单晶生长过程中原生点缺陷、空洞和氧沉淀演变规律.结果表明:晶体生长过程中氧沉淀和空洞的浓度及尺寸受晶体所经历的热历史和初始氧浓度的共同影响.当温度降低时,氧沉淀和空洞浓度降低,空洞尺寸增大,氧沉淀尺寸随初始氧浓度不同变化规律相异.在较低初始氧浓度时,随温度降低氧沉淀尺寸减小,在较高氧浓度时,氧沉淀尺寸增加.在相同热条件下,高温时,随初始氧浓度增加,空洞浓度先降低后升高,随后又继续降低;低温时,空洞浓度先不变后降低.     

Ф400mm直拉硅单晶生长过程中氧浓度对微缺陷影响的数值模拟

针对大直径直拉硅的微缺陷控制问题,模拟研究了初始氧浓度对于直径400 mm直拉硅单晶生长过程中原生点缺陷、空洞和氧沉淀演变规律。结果表明:晶体生长过程中氧沉淀和空洞的浓度及尺寸受晶体所经历的热历史和初始氧浓度的共同影响。当温度降低时,氧沉淀和空洞浓度降低,空洞尺寸增大,氧沉淀尺寸随初始氧浓度不同变化规律相异。在较低初始氧浓度时,随温度降低氧沉淀尺寸减小,在较高氧浓度时,氧沉淀尺寸增加。在相同热条件下,高温时,随初始氧浓度增加,空洞浓度先降低后升高,随后又继续降低;低温时,空洞浓度先不变后降低。     

快速退火对大直径CZSi单晶中原生微缺陷的影响

本文利用快速退火对 8″直拉硅单晶片中的流动图形缺陷(FPDs)进行了研究.首先用Secco腐蚀液腐蚀了大直径直拉硅片,利用光学显微镜观察了FPDs的宏观分布,并用原子力显微镜(AFM)对原生FPDs的微观形貌进行观察,证明了 FPDs是一种空位型原生缺陷,然后采用了高温快速热处理,分别在N2、N2/O2(3;)、Ar三种气氛中对原生直拉单晶硅片进行了处理.对比退火前后FPDs密度的变化,分析了高温快速热处理对直拉硅单晶片中FPDs的影响,实验表明1200℃快速热处理180s可以显著降低硅片表面的FPDs.     

硅中缺陷对Cu杂质的吸杂

本文采用快速热处理的方式引入Cu杂质,利用择优腐蚀以及光学显微镜研究了p型硅和n型硅中多种类型缺陷对Cu杂质沉淀行为的影响。研究发现,在p型硅中,当Cu杂质的浓度比较低时,硅体内的Cu杂质主要聚集和沉淀在位错或者晶界上,而当Cu杂质浓度较高时,Cu杂质可以在硅片内部无缺陷处形核沉淀,然而,晶界对Cu杂质的吸杂仍然表现比较明显,在晶界附近存在一个Cu沉淀很少的"洁净区"。在n型硅中,缺陷对Cu杂质的吸杂不明显。Cu杂质可以在缺陷处以及无缺陷处沉淀。但氧沉淀在n型硅中对Cu杂质的吸杂非常明显,并且氧沉淀还会阻碍Cu杂质在硅中的扩散。     

纳米SiO2浆料中半导体硅片的电化学腐蚀研究

采用电化学直流极化和交流阻抗技术,研究了n型(111)半导体硅片在不同条件纳米SiO2浆料中的电化学腐蚀性能.结果表明,浆料的pH值、温度、磨粒固含量以及金属杂质离子等因素都不同程度地影响硅片的腐蚀行为.随pH值增加、温度提高和磨粒固含量降低,其腐蚀电流增大,交流阻抗减小,硅片腐蚀较易进行;微量金属杂质离子的存在也会加速硅片的腐蚀.     

大直径直拉硅单晶炉热场的改造及数值模拟

为了降低大直径硅单晶生长过程中氧的引入,对常规的406mm(16英寸)热场进行了改造.设计了以矮加热器为核心的复合式加热器系统,使晶体生长过程中熔体热对流减小.通过对热场的数值模拟计算,分析了热场的温度分布,发现熔体的纵向温度梯度下降,熔体热对流减小,硅单晶中氧含量降低.     

区熔(FZ)硅单晶气相掺杂电阻率的理论计算

气相掺杂法因其简易灵活、生产周期短、成本较低的优点成为生产区熔硅单晶重要的辅助方法.本文根据区熔(FZ)硅单晶气相掺杂原理,结合单晶生长速度、单晶直径、气体流量、气体浓度、掺杂物的分凝、单晶对掺杂气体吸收率等一系列生长条件,进行理论计算并与实际生产相结合,进一步推算出掺杂量与电阻率关系的公式.通过该公式,可以更加准确控制气相掺杂硅单晶的电阻率,使理论计算与实际电阻率误差从20;降低到10;,从而降低生产成本.     

掺杂对磷酸钛氧钾单晶拉曼光谱的影响

本文研究了掺金属元素Ce和Nb的磷酸钛氧钾(KTiOPO4,简称KTP)晶体在不同几何配置下的拉曼光散射.讨论了掺杂对KTP拉曼光谱的影响.拉曼光谱大的散射强度说明晶体有大的非线性光学特性.从掺铈和掺铌KTP中氧八面体和氧四面体相对于KTP的频率位移可知,稀土金属离子Ce比Nb离子对KTP拉曼光谱的影响更大.     

显微激光拉曼光谱法鉴别SiC晶体的多型体结构

利用显微激光拉曼光谱法对掺氮6H-SiC单晶中的寄生多型体进行了鉴别,结果表明其中有4H-SiC和15R-SiC两种寄生多型体.不同SiC多型体的纵光学声子与等离子体激元的耦合模(LOPC模)表明:在掺氮6H-SiC单晶的生长条件下,6H-SiC的掺氮效应与4H-SiC存在明显差别,而与15R-SiC的掺氮效应相似.     

Intrinsic gettering in germanium-doped Czochralski crystal silicon crystals

The intrinsic gettering (IG) of germanium-doped Czochralski (GCZ) silicon with different concentrations of germanium has been investigated in this paper. The conventional Czochralski (CZ) and the GCZ silicon samples were annealed using a one-step high temperature process followed by a sequence of low–high temperature annealing cycles. It was found that the good defect-free denude zones in the near surface of the GCZ silicon could be achieved using simply a one-step high temperature annealing process. Furthermore, the density of bulk microdefects as IG sites was higher than that in the CZ silicon, as a result of germanium enhancing oxygen precipitation during three-step annealing. Meanwhile, the experimental results showed that germanium also enhanced the out-diffusion of oxygen. Furthermore, it is believed that germanium doping can increase the ability of IG in CZ silicon wafers.     

Phosphorus gettering of precipitated Cu in single crystalline silicon based on rapid thermal process

In this paper, we have investigated the effect of phosphorus diffusion gettering on the precipitated Cu in silicon via rapid thermal process (RTP). It is found that, for dot-like or star-like precipitates, the RTP-based phosphorus diffusion technique is efficient for gettering out the precipitated Cu. A two-step RTP gettering process is much more effective than a single-step RTP process. Furthermore, the choice of oxygen ambient can enhance the Cu gettering efficiency due to the involvement of considerable self-interstitial silicon atoms. The minority carrier lifetime of the sample subjected to RTP-based phosphorus gettering has also been verified to be significantly enhanced. These results are of interest for the gettering engineering of high-efficiency silicon solar cells.     

Enhancement effect of nitrogen co-doping on oxygen precipitation in heavily phosphorus-doped Czochralski silicon during high-temperature annealing

Oxygen precipitation in conventional and nitrogen co-doped heavily phosphorus (P)-doped Czochralski silicon (CZ-Si) crystal subjected to various high-temperature annealing in the range of 1000–1150 °C was comparatively investigated. It was revealed that oxygen precipitates hardly generated in conventional heavily P-doped CZ-Si; while they remarkably generated in the nitrogen co-doped one. Moreover, nitrogen doping could enhance oxygen precipitation during the prolonged annealing with a rapid thermal process (RTP) pre-treatment, but it has neglectable influence on oxygen precipitation for short-time annealing. It was believed that nitrogen co-doped heavily P-doped CZ-Si possesses nitrogen-related complexes that act as heterogeneous nuclei for super-saturated interstitial oxygen and then enhanced oxygen precipitation. Finally, it was found that nitrogen doping could hardly enhance oxygen precipitation in heavily P-doped CZ-Si at 1200 °C.     

Characterization of a Czochralski grown silicon crystal doped with 1020 cm‐3 germanium

A dislocation‐free silicon single crystal doped with 10²⁰ cm^‐3 germanium (Ge) has been grown using the Czochralski (CZ) growth technique. The Ge concentration in the seed‐end and tang‐end of the crystal was 8×10¹⁹cm^‐3and 1.6×10²⁰ cm^‐3, respectively. The effective segregation coefficient of Ge, the distribution of flow pattern defects (FPDs) and the wafer warpage have been characterized. Both the effective segregation coefficient and the equilibrium segregation coefficient of Ge in silicon were evaluated. Then, the density of FPDs was traced from seed‐end to tang‐end of the ingot, a suppression of FPDs by Ge doping was shown. That is probably because the Ge atoms consume free vacancies and thus a higher density of smaller voids is formed. Furthermore, the mechanical strength of wafers has also been characterized by batch warpage analysis. The warpage in the seed‐end was larger than that in the tang‐end of the ingot, showing that the mechanical strength of wafers is enhanced by Ge doping. Such improvement is interpreted by an enhanced dislocation pinning effect associated with the enhanced nucleation of grown‐in oxygen precipitates in the Ge‐doped silicon wafers. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Study on the oxygen concentration reduction in heavily Sb-doped silicon

It was determined that oxygen concentration in heavily Sb-doped silicon was about 40% lower than that in the lightly doped Czochralski grown silicon and decreased with increasing content of Sb by means of coincident elastic recoil detection analysis. Through thermodynamic calculation, the oxygen loss by evaporation from the free surface of melt is only due to the formation of SiO, and Sb₂O₃ evaporation can be neglected. The basic reason for oxygen concentration reduction in heavily Sb-doped CZSi was that oxygen solubility decreased when element Sb with larger radius doped degenerately into silicon crystal.     

Polycrystalline silicon with large disk-shaped grains by Ni-mediated crystallization of doped amorphous silicon

Silicide mediated crystallization (SMC) of p-doped amorphous silicon (a-Si) has been studied. There are the different grain-shapes of crystallization of doped and non-doped a-Si. Non-doped a-Si is crystallized with needle-shaped grains, while it is observed the disk-shaped grains are formed in crystallized doped a-Si. The crystallization of slightly doped a-Si exhibits larger grain size compared with non-doped and heavily doped films. The p-dopant in a-Si suppresses the formation of the NiSi₂ precipitate which act as a crystallization nucleus, causing continuous grain growth and the formation of disk-shaped grains.     

Analysis of waveguide silica glasses using Raman microscopy

A spectroscopic method to determine dopant concentrations in silicas used in silica on silicon planar waveguides has been developed. Raman spectroscopic measurements in the range 740 cm⁻¹–1370 cm⁻¹ of cross-sections of the glass layers identified correlations between simple, rapidly calculated, spectral features related separately to each of the three dopants, boron, phosphorous and germanium, and the wt% analyses results for these dopants from inductively coupled plasma mass spectrometry (ICP-MS) measurements on fragments from the respective wafers. The calibration wafers comprised a set of monitor wafers with dopant concentrations spanning the ranges used in devices. The Raman-based analyses were able to determine boron and phosphorous wt% s in boro-phosphosilicate cladding glasses with accuracies of ≈0.1 wt% and germanium wt% s in core glasses with an accuracy of at least ≈0.3 wt% (small batch size). The method, which performed successfully in blind tests, provides a spatially resolving and rapid alternative to ICP-MS analyses of monitor wafers. Exploratory face-on measurements were performed on device wafers. Spectra of the cladding, core and underlayer were obtained from AWG samples. The effects of the confocal volume’s finite size and refractive index differences were observed. Exploratory measurements using UV Raman excitation showed potential advantages for cladding glass analyses.     

Raman characterization of semiconducting materials and related structures

Raman spectroscopy is discussed as a versatile tool for the characterization of semiconductors and related materials. Raman scattering by intrinsic phonon modes is shown to provide information on the crystallinity and composition of bulk materials as well as on the periodicity of artificial superlattices. Inelastic light scattering gives further insight into the properties of electron or hole gases present in doped materials. Raman scattering by electronic or vibronic excitations of impurities is discussed as a quantitative technique for the assessment of, e.g., residual impurities in substrate materials as well as for the analysis of the dopant incorporation in heavily doped semiconductors.     

Beryllium doping and silicon amphotericity in (1 1 0) GaAs-based heterostructures: structural and optical properties

The use of beryllium as an acceptor at high doping levels in (1 1 0)GaAs-based heterostructures is found to be deleterious to the structural and optical properties of these epi-layers. This may limit the use of beryllium as a p-type dopant on the (1 1 0) surface. Because silicon is amphoteric on the (1 1 0), it can be used as an alternative p-type dopant, in addition to its traditional role as an n-type dopant. Transmission electron microscopy, optical absorption, and luminescence data indicate that high quality multiple quantum well structures with p-type GaAs buffer layers doped with silicon, rather than beryllium, can be grown.     

Effect of ammonium malate on growth rate,crystalline perfection,structural, optical,thermal, mechanical,dielectric and NLO behaviour of ammonium dihydrogen phosphate crystals

The effect of ammonium malate on the growth rate, structural, optical, thermal, mechanical, dielectric properties, crystalline perfection and second harmonic generation (SHG) efficiency of ammonium dihydrogen phosphate single crystals grown by the slow cooling method has been investigated. The lattice parameters of the grown crystals were obtained by the single-crystal X-ray diffraction analysis. Fourier transform infrared studies confirm the functional groups of the crystals. UV–vis study shows that the transparency is increased much by the dopant. Thermal analysis was performed to study the thermal stability of the grown crystals. Vickers hardness measurements reveal the higher hardness of the doped crystals. Low dielectric losses were observed from the dielectric measurements for the doped ADP crystals. The high-resolution X-ray diffraction studies show that the crystalline perfection of the crystals is good. The relative SHG efficiency measurements revealed that the dopant has enhanced the efficiency.