Photoconductivity of Ge/Si quantum dot photodetectors

Various structures of self-assembled Ge/Si quantum dot infrared photodetectors were implemented and investigated. The electronic structure of the QDIPs was studied by electrical and optical techniques including I–V characteristics, dark current, photoconductivity, photoluminescence, and photo-induced infrared absorption. The photoconductive spectra consist of a broad multi-peak, composed of peaks ranging from 70 to 220 meV. Their relative intensity changes with bias. Comparative dark current measurements were performed. Dark current limits the performance of this first generation of Ge/Si QDIPs. It is plausible that direct doping in the dot layer is a viable way of reducing the dark current.     

The effects of the ageing on the characteristic parameters of polyaniline/p-type Si/Al structure

A detailed study of the effects of the ageing on the characteristic parameters of polyaniline/p-type Si/Al structure has been presented. The polyaniline film has been formed on a p-type Si substrate by means of an anodization process. The polyaniline/p-Si/Al structure has demonstrated clearly rectifying behavior by the current–voltage (I–V) curves studied at room temperature. The current–voltage curves of the structure have been measured immediately, 15, 30, 60, 90 and 120 days after fabrication of the polyaniline/p-Si/Al structure. It has been seen that the characteristic parameters, such as barrier height (BH), ideality factor and series resistance of polyaniline/p-type Si/Al structure have slowly changed with increasing ageing time. The diode shows non-ideal I–V behavior with an ideality factor greater than unity that can be ascribed to the interfacial layer, the interface states and the series resistance.     

Effect of composition modulation on the structural and optical properties of Si/Ge bilayers

We report structural as well as optical studies on Si/Ge bilayer structures having different individual layer thicknesses. The Raman spectrum of [Ge (5 nm)/Si (5 nm)] bilayer structure shows amorphous nature, while the [Si (5 nm)/Ge (5 nm)] bilayer structure shows a mixed nanocrystalline/amorphous behaviour of the layers. As the thickness of the individual layers increases to 10 nm, the introduction of large number of Si atoms at the interface results in reduction of Ge crystallization as well as higher intensity of interfacial SiGe alloy formation. This may be regarded as a consequence of the island growth induced surface roughening in the later case (i.e. in [Si (10 nm)/Ge (10 nm)] bilayer) as also revealed by corresponding atomic force microscopy (AFM) images. These results are also supported by Photoluminescence (PL) spectra recorded using two different photon energies of 300 and 488 nm along with the optical absorption measurements giving higher values of band gap as compared to their corresponding bulks, revealing the effect of quantum confinement in the deposited layers.     

Fixed charge and interface traps at heterovalent interfaces between Si(1 0 0) and non-crystalline Al2O3–Ta2O5 alloys

Characterization by Auger electron spectroscopy (AES) and Fourier transformation infrared spectroscopy (FTIR) confirms (Ta₂O₅)_x(Al₂O₃)_1−x alloys are homogeneous pseudo-binary alloys with increased thermal stability with respect to end member oxides, Ta₂O₅ and Al₂O₃. Capacitance–voltage (C–V) and current density–voltage (J–V) data as a function of temperate show that the Ta d-states of the alloys act as localized electron traps, and are at an energy approximately equal to the conduction band offset of Ta₂O₅ with respect to Si.     

Ti/Al p-GaN Schottky barrier height determined by C–V measurements

Data are presented on the rigorous method of capacitance–voltage (C–V) measurements to the barrier height of Ti/Al p-GaN Schottky junction. For a sample with Hall concentration of 5.5 × 10¹⁶/cm³ the upper limit of the modulation frequency leading the full response of the activated carriers is defined as 1.5 kHz from the capacitance versus modulation frequency (C–f) plot. The activation energy of the Mg acceptors determined from the temperature-dependent C–f plot is 0.12 eV. The barrier height estimated with this activation energy and the intercept voltage of the 1/C²–V plot drawn with the 1.5 kHz C–V data is 1.43 eV at 300 K and 1.41 eV at 500 K. This is the most reliable barrier height ever reported. A reliable room temperature C–V doping profile is demonstrated using the 1.5 KHz modulation, which is sensitive enough to resolve the presence of a 15 nm thin highly doped (8 × 10¹⁸/cm³) layer formed near the surface.     

Analysis of frequency-dependent series resistance and interface states of In/SiO2/p-Si (MIS) structures

In this work, the investigation of the interface state density and series resistance from capacitance–voltage (C–V) and conductance–voltage (G/ω−V) characteristics in In/SiO₂/p-Si metal–insulator–semiconductor (MIS) structures with thin interfacial insulator layer have been reported. The thickness of SiO₂ film obtained from the measurement of the oxide capacitance corrected for series resistance in the strong accumulation region is 220 Å. The forward and reverse bias C–V and G/ω−V characteristics of MIS structures have been studied at the frequency range 30 kHz–1 MHz at room temperature. The frequency dispersion in capacitance and conductance can be interpreted in terms of the series resistance (R_s) and interface state density (D_it) values. Both the series resistance R_s and density of interface states D_it are strongly frequency-dependent and decrease with increasing frequency. The distribution profile of R_s–V gives a peak at low frequencies in the depletion region and disappears with increasing frequency. Experimental results show that the interfacial polarization contributes to the improvement of the dielectric properties of In/SiO₂/p-Si MIS structures. The interface state density value of In/SiO₂/p-Si MIS diode calculated at strong accumulation region is 1.11×10¹² eV⁻¹ cm⁻² at 1 MHz. It is found that the calculated value of D_it (≈10¹² eV⁻¹ cm⁻²) is not high enough to pin the Fermi level of the Si substrate disrupting the device operation.     

Growth and characterization of MOMBE grown HfO2

HfO₂ dielectric layers were grown directly on the p-type Si (1 0 0) by metalorganic molecular beam epitaxy (MOMBE). Hafnium tetra-butoxide was used as a Hf precursor and pure oxygen was introduced to form an oxide layer. The properties of the layers with different thicknesses were evaluated by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), high-resolution transmission electron microscopy (HRTEM), and capacitance–voltage (C–V) and current–voltage (I–V) analyses. XRD and HRTEM results showed that the HfO₂ films thinner than 12 nm were amorphous while the films thicker than 12 nm began to crystallize in the tetragonal and the monoclinic phases. The XPS spectra of O 1s show that the O---Si binding energies shifted to the lower binding energy with increasing the HfO₂ layer thickness. Moreover, the snap back phenomenon is observed in accumulation capacitance. These changes are believed to be linked with the decomposition of SiO and the crystallization of HfO₂ layer during the film growth.     

镶嵌型纳米锗的制备新方法及其光致发光研究

报道了通过热氧化氢化非晶锗硅薄膜和氢化非晶硅／氢化非晶锗多层膜以制备镶嵌于二氧化硅中纳米锗材料的新方法。研究结果表明：在经过氧化处理后,薄腊在的Ｓｉ与Ｏ结合形成氧化硅同时单晶Ｇｅ被析出形成了镶嵌型的纳米Ｇｅ颗粒;在Ａｒ＾＋激光（４８８ｎｍ）的激发下,观察到了室温下的光致民光现象。发光峰中心位于２．２ｅＶ。由多层腊制备出的样吕其发光强度相对加强,且半高宽也显著变窄,表明利用多层膜可较好地控制尺寸分布     

High-speed waveguide-integrated Ge/Si avalanche photodetector

Waveguide-integrated Ge/Si heterostructure avalanche photodetectors(APDs) were designed and fabricated using a CMOS-compatible process on 8-inch SOI substrate. The structure of the APD was designed as separate-absorption-chargemultiplication(SACM) using germanium and silicon as absorption region and multiplication region, respectively. The breakdown voltage(V_b) of such a device is 19 V at reverse bias and dark current appears to be 0.71 μA at 90% of the V_b. The device with a 10-μm length and 7-μm width of Ge layer shows a maximum 3-dB bandwidth of 17.8 GHz at the wavelength of 1550 nm. For the device with a 30-μm-length Ge region, gain-bandwidth product achieves 325 GHz.     

Determination of localized states in porous silicon

We determined the density of state distribution near the Fermi level in porous silicon from the analysis of the current–voltage (J–V) and the current–thickness (J–T) characteristics in the space-charge-limited-current (SCLC) regime. The distribution exhibits a minimum density at the Fermi level, which is similar to the U-shape-trap-distribution observed in crystalline Si–SiO₂ interface or in amorphous Si. Theoretical analysis well explains both the J–V and the J–L characteristics, which implies that the current flow is entirely controlled by localized states situated at the quasi-Fermi level.     

Effects of oxygen flow rate on the properties of HfO2 layers grown by metalorganic molecular beam epitaxy

The investigations on the properties of HfO₂ dielectric layers grown by metalorganic molecular beam epitaxy were performed. Hafnium-tetra-tert-butoxide, Hf(C₄H₉O)₄ was used as a Hf precursor and pure oxygen was introduced to form an oxide layer. The grown film was characterized by X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), high-resolution transmission electron microscopy (HRTEM), and capacitance–voltage (C–V) and current–voltage (I–V) analyses. As an experimental variable, the O₂ flow rate was changed from 2 to 8 sccm while the other experimental conditions were fixed. The XPS spectra of Hf 4f and O 1s shifted to the higher binding energy due to the charge transfer effect and the density of trapped charges in the interfacial layer was increased as the oxygen flow rate increased. The observed microstructure indicated the HfO₂ layer was polycrystalline, and the monoclinic phases are the dominant crystal structure. From the C–V analyses, k = 14–16 and EOT = 44–52 were obtained, and the current densities of (3.2–3.3) × 10⁻³ A/cm² were measured at −1.5 V gate voltage from the I–V analyses.     

Photocurrent spectroscopy of indirect transitions in Ge/Si multilayer quantum dots at room temperature

Lateral photoconductivity spectra of multilayer Ge/Si heterostructures with Ge quantum dots were studied in the work proposed at room temperature. The photocurrent with minimal energy 0.48-0.56 eV that is smaller than Ge band gap was observed from such structures at the geometry of waveguide excitation. Generation of the photocurrent with the limit energy 0.48-0.56 eV was explained by spatially indirect electron transitions from heavy hole states of SiGe valence band into Δ₂-valley of the conduction band of Si surrounding. It was found out that the limit energy of such transitions decreased, as the number of SiGe quantum dot layers increased.     

Self-patterned Si surfaces as templates for Ge islands ordering

We propose a two-step process, which is based on substrate nano-patterning by means of growth instabilities in a first step and self-assembling of Ge dots on the top of surface instabilities in a second step. We used the instabilities that develop during the growth of Si(Ge) layers on both nominal and vicinal Si (1 1 1) or (0 0 1) surfaces. Depending on the growth conditions (Ge concentration, growth temperature, thickness), various growth instability regimes were observed: pure kinetic regime, kinetically activated strain-induced regime and pure strain-driven regime. In the case of Si/Si growth, kinetic instabilities developed at different growth temperatures depending on the surface orientation. The critical exponents describing evolution with time have been determined: amplitude At^β and wavelength Lt^α. Experimental results show that each instability regime appears for a given growth temperature range that critically depends on the concentration of Ge. Evolution with time also depends on the Ge concentration. But in all cases, we evidence discrepancies between the experimental critical exponents and those predicted by classical modelling. We also give some examples of Ge dots self-organization on substrates nano-patterned (periodically undulated) by means of the different growth instabilities described above. In all cases, we observe Ge dots ordering along the substrate undulations due to step and/or strain effects. On kinetic instabilities (Si/Si(0 0 1) vicinal), Ge islands preferentially nucleate on step bunches. On SiGe(0 0 1) template layers, Ge dots nucleate on top of the SiGe undulations. In that case, strain gradients improved island ordering. The best ordering was achieved using SiGe(0 0 1) 10° off misoriented template layers as a result of almost perfect anisotropic morphology.     

Ge/Si photodetectors and group IV alloy based photodetector materials

Photodetectors using Si, Ge and their alloys with other group IV elements are of current interest for application in telecommunication as well as in optical interconnects. We have presented in this paper our work on resonant cavity enhanced Si/SiGe multiple Quantum Well and Ge Schottky photodetectors. Calculated values of external quantum efficiency for GeSiC based photodetectors are also reported. Tensile strained Ge layers grown with suitable barriers show direct gap type I band alignment. Predicted performance of photodetectors using strong Quantum Confined Stark Effect and Franz-Keldysh Effect in these structures and properties related to photodetection using these new materials are also described.     

小尺寸Si/Ge量子点内应变和组分的拉曼光谱表征

本文详细地研究了原始生长和退火处理后的Si/Ge量子点的拉曼光谱。我们观测到了Si/Ge量子点的一系列本征的拉曼振动模以及Ge-Ge模的LO和TO声子峰间4.2cm-1的频率劈裂。通过这些参数,我们自洽地确定了原始生长的平面直径为20nm和高为2nm的Si/Ge量子点内Ge的平均组分为80%,平均应变为-3.4%。分析清楚地表明了这种小尺寸的Si/Ge量子点内的应变仍遵从双轴应变,并且应变的释放主要由量子点和Si隔离层间Si-Ge原子互扩散决定。     

Si基Ge异质结构发光器件的研究进展

近年来,与Si的CMOS工艺相兼容的Ge/Si异质结构发光器件取得很多重要的进展。本文概述了Si基Ge异质结构发光器件的最新成果,如Ge/Si量子点发光二极管、Si衬底上的Ge发光二极管及激光器和Ge/SiGe多量子阱发光二极管,分别描述了这些器件的特点和增强其发光特性的途径。最后展望了Si基Ge异质结构发光器件的发展趋势,指出尽管Si基Ge异质结构发光器件获得了很大的发展,但是器件的发光效率仍然很低,离实用还有一定距离,还需要在材料和器件的结构方面有更多的创新。     

Intraband photoresponse of SiGe quantum dot/quantum well multilayers

In this contribution we study the intravalence band photoexcitation of holes from self-assembled Ge quantum dots (QDs) in Si followed by spatial carrier transfer into SiGe quantum well (QW) channels located close to the Ge dot layers. The structures show maximum response in the important wavelength range 3–5 μm. The influence of the SiGe hole channel on photo- and dark current is studied depending on temperature and the spatial separation of QWs and dot layers. Introduction of the SiGe channel in the active region of the structure increases the photoresponsivity by up to about two orders of magnitude to values of 90 mA/W at T=20 K. The highest response values are obtained for structures with small layer separation (10 nm) that enable efficient transfer of photoexcited holes from QD to QW layers. The results indicate that Si/Ge QD structures with lateral photodetection promise very sensitive large area mid-infrared photodetectors with integrated readout microelectronics in Si technology.     

Photoconductivity of Si/Ge/Si structures with 1.5 and 2 ML of Ge layer

A photoconductivity (PC) of Si/Ge/Si structures with narrow Ge layer [thickness's 1.5 and 2 monolayers (ML)] on interband light intensity has been investigated for the different values of lateral voltage U, and temperature T. In contrast to the Si/Ge structure with 2 ML, where only monotonous PC growth was registered, for the 1.5 ML structure a stepped and a fluctuated PC were observed. These PC features are explained by a percolation of photoexcited carriers via the localized states induced by one monolayer scale Si/Ge interface roughnesses.     

Electrical characterization of low temperature deposited TiO2 films on strained-SiGe layers

Thin films of titanium dioxide have been deposited on strained Si_0.82Ge_0.18 epitaxial layers using titanium tetrakis-isopropoxide [TTIP, Ti(O-i-C₃H₇)₄] and oxygen by microwave plasma enhanced chemical vapor deposition (PECVD). The films have been characterized by X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FTIR). Dielectric constant, equivalent oxide thickness (EOT), interface state density (D_it), fixed oxide charge density (Q_f/q) and flat-band voltage (V_FB) of as-deposited films were found to be 13.2, 40.6 Å, 6×10¹¹ eV⁻¹ cm⁻², 3.1×10¹¹ cm⁻² and −1.4 V, respectively. The capacitance–voltage (C–V), current–voltage (I–V) characteristics and charge trapping behavior of the films under constant current stressing exhibit an excellent interface quality and high dielectric reliability making the films suitable for microelectronic applications.     

Solid-phase epitaxy of CaSi2 on Si(1 1 1) and the Schottky-barrier height of CaSi2/Si(1 1 1)

Thin Ca films were evaporated on Si(1 1 1) under UHV conditions and subsequently annealed in the temperature range 200–650 °C. The interdiffusion of Ca and Si was examined by ex situ Auger depth profiling. In situ monitoring of the Si 2p core-level shift by X-ray photoemission spectroscopy (XPS) was employed to study the silicide formation process. The formation temperature of CaSi₂ films on Si(1 1 1) was found to be about 350 °C. Epitaxial growth takes place at T≥400 °C. The morphology of the films, measured by atomic force microscopy (AFM), was correlated with their crystallinity as analyzed by X-ray diffraction (XRD). According to measurements of temperature-dependent I–V characteristics and internal photoemission the Schottky-barrier height of CaSi₂ on Si(1 1 1) amounts to qΦ_Bn=0.25 eV on n-type and to qΦ_Bp=0.82 eV on p-type silicon.