Analysis of a mode-I crack perpendicular to an imperfect interface

The elastostatic problem of a mode-I crack embedded in a bimaterial with an imperfect interface is investigated. The crack is in proximity to and perpendicular to the imperfect interface, which is governed by linear spring-like relations. The Fourier transform is applied to reduce the associated mixed-boundary value problem to a singular integral equation with Cauchy kernel. By numerically solving the resulting equation, stress intensity factors near both crack tips are evaluated. Obtained results reveal that the stress intensity factors in the presence of the imperfect interface vary between that with a perfect interface and that with a completely debonding interface. Moreover, an increase in the interface parameters decreases the stress intensity factors. In particular, when crack approaches to the weakened interface closer, the stress intensity factors become larger for a sliding interface, and become larger or smaller for a Winkler interface, depending on the crack lying in a stiffer or softer material. The influences of the imperfection of the interface on the stress intensity factors for a bimaterial composed of aluminum and steel are presented graphically.     

The plane problem of an elliptically reinforced circular hole in an anisotropic plate or laminate

Summary  Within the scope of linear elasticity, the in-plane problem of an anisotropic plate or laminate with a circular hole and an elliptical hole reinforcement is considered. Arbitrary anisotropic elastic stiffnesses are allowed for the base plate and the reinforcement material, and for the reinforcement there is no restriction for its elliptical shape and size. The analysis of the problem is performed by the complex potential method with appropriately chosen series representations inside and outside the reinforcement region. The derived closed-form solution provides all resultant in-plane stresses and deformations within and around the hole reinforcement with little computational effort and at high accuracy. The determined solution allows a proper and effective assessment of hole reinforcements for many technical applications. Received 26 June 2000; accepted for publication 26 September 2000     

A Unified Two-Phase Potential Method for Elastic Bi-material: Planar Interfaces

This paper gives a unified approach to analyze two-dimensional elastic deformations of a composite body consisting of two dissimilar anisotropic or isotropic materials perfectly bonded along a planar interface. The Eshelby et al. formalism of anisotropic elasticity is linked with that of Kolosov-Muskhelishvili for isotropic elasticity by means of two complex matrix functions describing completely the arising elastic fields. These functions, whose elements are holomorphic functions, are defined as the two-phase potentials of the bimaterial. The present work is concerned with bi-materials whose constituent materials occupy the whole space and are connected by a planar interface. The elastic fields arising in such a bimaterial are given by universal relationships in terms of the two-phase potentials. Then, the general results obtained are implemented to study two interesting bimaterial problems: the problem of a uniformly stressed bimaterial with a perfect interfacial bonding, and the interface crack problem of a bimaterial with a general loading. For both problems, all combinations of the elastic properties of the constituent materials are considered. For the first problem, the constraints, which must be imposed between the components of the applied uniform stress fields, are established, so that they are admissible as elastic fields of the bimaterial. For the interface crack problem, the solution is obtained for a general loading applied in the body. Detailed results are given for the case of a remote uniform stress field applied to the bimaterial constituents.     

Interface crack with a contact zone in an isotropic bimaterial under thermomechanical loading

A plane problem for a thermally insulated interface crack with a contact zone in an isotropic bimaterial under tension–shear mechanical loading and a temperature flux is considered. The expressions for the stresses and the electrical flux as well as for the derivatives of the displacement and the temperature jumps at the material interfaces via sectionally holomorphic mechanical and thermal potential functions are given. After the solution of the thermal problem the inhomogeneous combined Dirichlet–Riemann boundary value problem is formulated and solved exactly. The stresses at the interface and the stress intensity factors at the singular points are presented in a clear analytical form. Special attention is devoted to the case of a small contact zone when the stress intensity factors can be presented in form similar to the associated presentation for an “open” crack model. A transcendental equation and an asymptotic analytic formula for the determination of the real contact zone length are derived. It is shown that for a certain bimaterial this length as well as the correspondent stress intensity factor are defined by a single parameter which depends on the normal-shear loading and the heat flux.     

Transient dynamic analysis of interface cracks in anisotropic bimaterials by the scaled boundary finite-element method

The transient response of finite bimaterial plates with interface cracks is analyzed directly in the time domain by using the scaled boundary finite-element method. A bimaterial plate is divided into a few subdomains. Only the boundaries of the subdomains are discretized with line elements leading to great flexibility in mesh generation. The displacement and stress fields are expressed as a series solution which separates the singular stress term from other high-order terms. The oscillatory stress singularity in the radial direction emanating from the scaling center is represented analytically. The complex dynamic stress intensity factors are evaluated directly from either the stresses or the crack opening displacements of the singular stress term. Numerical examples of cracked anisotropic bimaterial plates are presented to verify the accuracy of the present technique and to provide additions to the very limited number of reference solutions in the literature.     

Stress intensity factor for a kinked interfacial crack in dissimilar anisotropic materials under antiplane deformation

The asymptotic problem of a kinked interfacial crack in dissimilar anisotropic materials under antiplane deformation is investigated. The linear transformation method for the problem of the anisotropic bimaterial with a straight interface is proposed. The stress intensity factor for the kinked interfacial crack in the anisotropic composite is obtained from the solution of the transformed problem of the kinked interfacial crack in the isotropic bimaterial based on the linear transformation method. The effects of the material parameters as well as the kink angle on the stress intensity factor are discussed from numerical results of the stress intensity factor. The finite element analysis is carried out to verify the stress intensity factor obtained by using the linear transformation. The influence of the material orientations on the stress intensity factor is investigated for the kinked crack in the bimaterial consisting of dissimilar inclined orthotropic materials.     

Photoelastic analysis of a thick plate with an elliptical hole subjected to simple out-of-plane bending

A three-dimensional photoelastic analysis using the stress freezing and slicing techniques was employed to study the stress distribution and the stress-concentration factors around an elliptical hole in a plate of finite thickness. The plate was subjected to simple out-of-plane bending. A special bending device was designed to produce uniform bending moment at the two opposite free edges of the plate. Six plates with various elliptical holes were studied. The stress variation across the plate thickness at the periphery of the elliptical hole was also investigated. The experimental results were correlated with the existing theoretical solutions.     

平行于异材界面的三维椭圆平片裂纹分析

讨论了拉伸载荷作用下平行于两相材料界面的椭圆平片裂纹问题．首先,使用有限部积分概念和两相材料界面完全接合时的点力基本解导出了一组以裂纹表面位移差为未知函数的超奇异积分方程组．该组方程表明,此时三种裂纹模型同时存在;其次,在数值求解该组方程的过程中,未知函数裂纹表面位移差被近似为位移差的基本密度函数与多项式之积．基本密度函数反映了裂纹前沿应力奇性性态;最后,以拉伸载荷为例,讨论了椭圆平片裂纹与界面的距离、裂纹形状比和不同材料组合对应力强度因子的影响,并以图表形式给出。     

Interaction of a conductive crack and of an electrode at a piezoelectric bimaterial interface

The interaction of a conductive crack and an electrode at a piezoelectric bi-material interface is studied. The bimaterial is subjected to an in-plane electrical field parallel to the interface and an anti-plane mechanical loading. The problem is formulated and reduced, via the application of sectionally analytic vector functions, to a combined Dirichlet–Riemann boundary value problem. Simple analytical expressions for the stress, the electric field, and their intensity factors as well as for the crack faces' displacement jump are derived. Our numerical results illustrate the proposed approach and permit to draw some conclusions on the crack–electrode interaction.     

Debonding of FRP-plated reinforced concrete beam,a bond-slip analysis. I. Theoretical formulation

External bonding of FRP plates or sheets has emerged as a popular method for strengthening reinforced concrete. Debonding along the FRP–concrete interface can lead to premature failure of the structure. In this study, a bond-slip model is established to study the interface debonding induced by a flexural crack in a FRP-plated concrete beam. The reinforced concrete beam and FRP plate are modeled as two linearly elastic Euler–Bernoulli beams bonded together through a thin layer of FRP–concrete interface. The interface layer is essentially modeled as a large fracture processing zone of which the stress–deformation relationship is described by a nonlinear bond-slip model. Three different bond-slip models (bi-linear, triangular and linear-damaging) are used. By dividing the debonding process into several stages, governing equations of interfacial shear and normal stresses are obtained. Closed-form solutions are then obtained for the interfacial shear and normal stresses and the deflection of the beam in each stage of debonding. In such a way, the proposed model unifies the whole debonding process, including elastic deformation, debonding initiation and growth, into one model. With such a superior feature, the proposed model provides an efficient and effective analytical tool to study FRP–concrete interface debonding.     

An analytically-numerical approach for the analysis of an interface crack with a contact zone in a piezoelectric bimaterial compound

An interface crack with an artificial contact zone at the right-hand side crack tip between two dissimilar finite-sized piezoelectric materials is considered under remote mixed-mode loading. To find the singular electromechanical field at the crack tip, an asymptotic solution is derived in connection with the conventional finite element method. For mechanical loads, the stress intensity factors at the singular points are obtained. As a particular case of this solution, the contact zone model (in Comninou’s sense) is derived. A simple transcendental equation and an asymptotic formula for the determination of the real contact zone length are derived. The dependencies of the contact zone lengths on external load coefficients are illustrated in graphical form. For a particular case of a short crack with respect to the dimensions of the bimaterial compound, the numerical results are compared to the exact analytical solutions, obtained for a piezoelectric bimaterial plane with an interface crack.     

Elasto-plastic buckling analysis for perforated steel plates subject to uniform compression

This study investigates the elasto-plastic buckling behaviour of simply supported square and rectangular thin steel plates having elliptic cut-outs by means of finite element method. Plates with simply supported in the out-of-plane direction are applied uniform compression in long-edge direction. A50 steel was used in the analysis and the focus was on the effect of plate aspect ratio, elliptical hole size, elliptical hole angle, elliptical hole location and slenderness ratio on buckling behaviour. It was found in the study that as the plate slenderness ratio increases, the critical buckling stress decreases for all the perforated plates.     

Dynamic self-similar debonding of interface at very high velocity: Anti-plane case

This paper analyzes the anti-plane problem of dynamic self-similar debonding of interface at very high velocity. The debonding is modeled as an interface crack propagating self-similarly from zero-length. The extending speed is assumed to be transonic or supersonic. We first consider the dynamic debonding under moving concentrated loads. The moving dislocation model of self-similar propagation of an interface crack is used to formulate the problem to a singular integral equation which is solved analytically. The singularity of stresses near the crack tip is discussed and the dynamic stress intensity factors are presented. Finally the solution of dynamic debonding underx ²-type loads is obtained by using the superposition method.     

Finite element analysis of a bimaterial interface crack

In this investigation, the enriched element method developed by Benzley was extended to treat the stress analysis problem involving a bimaterial interface crack. Unlike crack problems in isotropic elasticity, where the stress singularity at the crack tip is of the inverse square root type, the interface crack contains an additional oscillatory singularity. Although the effect of this oscillatory characteristic is confined to a region very close to the crak tip, it nevertheless requires proper treatment in order to obtain accurate predictions on the stress intensity factors. Using appropriate crack tip stress and displacement expressions, the enriched element method can model the stress singularity for an interface crack exactly. The finite element implementation of this method has been made on the code APES. Stress intensity factor results predicted by the modified APES program compare favorably with those available in the literature. This indicates tha the enriched element technique provides an accurate and efficient numerical tool for the analysis of bimaterial interface crack problems.     

双材料基本解弹塑性边界元法

提出并研究采用双材料基本解的弹塑性边界元法,得到了内点应力公式中有关奇点塑性应变自由项的完整表达式,并利用非连续边界单元和非连续区域单元解决了当奇点位于界面上时该自由项难于确定,以及计算区域Cauchy主值积分的常塑性应变场法在与界面相连的奇异区域单元上无法实施的困难．采用双材料基本解的弹塑性边界无法针对双材料的结构特点,特别适于分析有关弹塑性双材料界面及界面裂纹问题．     

Fracture-mechanical assessment of electrically permeable interface cracks in piezoelectric bimaterials by consideration of various contact zone models

Summary An interface crack with an artificial contact zone at the right-hand side crack tip between two piezoelectric semi-infinite half-planes is considered under remote mixed-mode loading. Assuming the stresses, strains and displacements are independent of the coordinate x ₂, the expression for the displacement jumps and stresses along the interface are found via a sectionally holomorphic vector function. For piezoceramics of the symmetry class 6 mm and for electrically permeable crack faces, the problem is reduced to a combined Dirichlet-Riemann boundary value problem which can be solved analytically. Further, analytical expressions for the stresses, electrical displacements, derivatives of elastic displacement jumps, stress and electrical intensity factors are found at the interface. Real contact zone lengths and the well-known oscillating solution are derived from the obtained solution as well. Analytical relationships between the fracture-mechanical parameters of various models are found, and recommendations are suggested concerning the application of numerical methods to the problem of an interface crack in the discontinuity area of a piezoelectric bimaterial. Received 16 March 1999; accepted for publication 31 May 1999     

Asymptotic fields in the finite element analysis of electrically permeable interface cracks in piezoelectric bimaterials

Summary The interface crack problem for a piezoelectric bimaterial based on permeable conditions is studied numerically. To find the singular electromechanical field at the crack tip, an asymptotic solution is derived in connection with the conventional finite element method. For mechanical and electrical loads, the complex stress intensity factor for an interface crack is obtained. The influence of the applied loads on the electromechanical fields near the crack tip is also studied. For a particular case of a short crack with respect to the bimaterial size, the numerical results are compared with the exact analytical solutions, obtained for a piezoelectric bimaterial plane with an interface crack.One author (V.G.) gratefully acknowledges the support provided by the Alexander von Humboldt Foundation of Germany.accepted for publication 7 June 2004     

Stress concentration factor expression for tension strip with eccentric elliptical hole

Two explicit expressions of the stress concentration factor for a tension finite-width strip with a central elliptical hole and an eccentric elliptical hole, respectively, are formulated by using a semi-analytical and semi-empirical method. Accuracy of the results obtained from these expressions is better, and application scope is wider, than the results of Durelli’s photo-elastic experiment and Isida’s formula. When eccentricity of the elliptical hole is within a certain range, the error is less than 8%. Based on the relation between the stress concentration factor and the stress intensity factor, a stress intensity factor expression for tension strips with a center or an eccentric crack is derived with the obtained stress concentration factor expressions. Compared with the existing formulae and the finite element analysis, this stress intensity factor expression also has sufficient accuracy.     

Thin plate bending problem of dissimilar strips with two bond lines

Summary A solution to the thin plate bending problem of partially bonded dissimilar strips with two bond lines is presented. The two strips are symmetrically bonded with respect to the interface which is on theX-axis. The complex stress functions approach together with the rational mapping function technique are used in the analysis. A concentrated bending moment applied at each strip is considered. Distributions of bending and torsional moments, as well as the stress intensity of debonding (SID) at the debonding tips are obtained, and the debonding extension is investigated.