低活化马氏体钢热等静压焊接接头性能初步研究

研究了低活化马氏体钢(CLF-1)热等静压(HIP)焊接接头的性能,经980℃/1h/空冷+740℃/2h/空冷的性能热处理后,接头组织保持着CLF-1钢母材回火马氏体组织;常温拉伸性能与母材相当,断口为韧窝状且有第二相粒子产生,为塑性断裂且断于焊缝;常温冲击功最高为母材的26.2%。初步分析认为焊接表面制备状态、表面污染物、表面清洗状态、表面氧化膜都会影响基体原子充分扩散,导致界面扩散层不均匀,焊缝裂纹敏感性增强,冲击功低,且不稳定。     

聚变堆用CLF-1 钢与316L 钢TIG 焊接接头组织与性能初步研究

对用W19123L 为焊丝的聚变堆用低活化CLF-1 钢与316L 钢的钨极氩弧焊(TIG)焊接接头金相组织及性能进行了初步研究。结果表明：焊接接头成型良好、无缺陷;金相组织表明焊接接头由CLF-1 侧(母材区、热影响区、熔合区)、过渡层、焊缝区、316L 侧(母材区、热影响区、熔合区)组成;室温拉伸试验结果优于母材的最低要求值;弯曲试验后的焊接接头内外表面完好,无裂纹产生,变形均匀;焊接接头冲击值成凹型分布,焊缝区冲击值最低,焊缝两侧热影响区冲击值次之,母材冲击值最高,316L 侧冲击值略高于CLF-1 侧,均满足焊接接头设计值;焊接接头上表面1.6mm 硬度波动较大,略高于1/2T 和下表面1.6mm 处,焊接接头1/2T 和下表面1.6mm 硬度分布较均匀,从CLF-1 侧到316L 侧有下降趋势。整体焊接性能基本稳定,满足异种钢焊接性能匹配要求。     

钨/低活化钢钎焊用铁基非晶钎料与接头微结构

为了连接W和CLF-1 RAFM钢,设计出由低活化元素组成的Fe-B-Si、Fe-B-Si-Sn、Fe-B-Si-Cr-(Sn)、Fe-B-Si-P-(Cr,Sn)、Fe-B-Si-Mn-(Ga,Sn)和Fe-B-Si-(Cr,Mn,Ga,Ta,Sn)系列Fe基非晶钎料,结合熔体快淬技术制备出非晶合金箔带,并对W/CLF-1 RAFM钢接头微结构进行了对比研究。采用X-射线衍射仪对箔带样品与焊缝进行了相鉴定;通过差热分析测量了非晶箔带的熔化温度和液相线温度;利用光学金相和电子探针分析了焊缝组织形貌和元素分布。结果表明,利用Fe-B-Si、Fe-B-Si-Cr和Fe-B-Si-Mn-Sn非晶钎料可获得结构完整的W/CLF-1钢接头;前两种钎料得到的焊缝组织基体相为α-Fe固溶体,而含Mn钎料形成的焊缝基体为马氏体组织;在高温钎焊过程中,这些Fe基非晶钎料中的高B含量促使FeWB、FeW2B2和Fe3B型金属间化合物在焊缝中形成,并有效地阻止了W元素向低活化钢基体长程扩散。所设计的低活化Fe基非晶钎料可用于W和低活化钢的连接和接头性能研究。     

低活化铁素体/马氏体钢CLF-1激光焊接模式转变研究

为研究低活化铁素体/马氏体钢(RAFM) CLF-1激光焊接模式转变规律,对其焊缝横截面形貌及尺寸进行了宏观表征和定量分析。结果表明,在一定条件下,随着焊接功率的增大,焊接模式从热传导焊模式向小孔深熔焊模式转变,焊缝横截面表现为“圆弧形”、“V字形”和“钉头形”三种类型形貌。CLF-1钢激光焊接模式不受焊接速度、离焦量变化的影响。激光焊接模式转变的临界值为深熔焊阈值,CLF-1钢深熔焊阈值由材料自身特性决定,当焊接速度为10mm·s^-1时,CLF-1钢深熔焊阈值约为1.20kW·mm^-1。     

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利用单轴热扩散焊设备对中国固态包层模块结构材料CLF-1钢进行了初步的实验研究。实验结果表明,在焊缝界面结合率达到一定程度时,焊件接头的拉伸强度与塑性性能可以达到母材的水平;但焊件接头的冲击韧性则很敏感,其中最好的实验测试值只达到了母材相应值的48%,这与焊缝界面上残留污染物所导致的接头空隙缺陷有关。     

液态锡对低活化马氏体/铁素体钢CLF-1的腐蚀行为研究

采用背散射电子扫描显微镜、电子衍射能谱和X射线衍射等分析方法，研究了浸泡在300~700℃的液态锡(Sn)中24h后的低活化马氏体/铁素体钢CLF-1的腐蚀行为。研究结果表明，在所有测试温度下液态锡对CLF-1钢表面均有不同程度的腐蚀，主要腐蚀机制为化合溶解腐蚀。铬(Cr)以单质形式溶解沉淀，液态锡与铁在CLF-1钢表面反应生成由铁锡化合物构成的腐蚀层。当温度低于500℃时，腐蚀层厚度近似为一常量，约8μm，化学成分为FeSn₂。当温度高于500℃时，腐蚀层厚度随温度线性增加，腐蚀层呈双层结构，分别为CLF-1边界处的FeSn层和覆盖在其表面的FeSn₂层。     

聚变堆用结构材料CLF-1研究进展

本文报道了我院近半年来低活性铁素体／马氏体钢CLF-1的研究进展。通过微观组织观察和室温拉伸性能测试，证明该钢已具有优于Eurofer97的室温拉伸性能，而且得到了全马氏体的微观组织。     

焊后热处理对核聚变用316LN焊接接头的影响

采用了TIG对核聚变用316LN奥氏体不锈钢进行焊接,并对焊接接头进行了焊后热处理,利用光学显微镜、扫描电镜分析手段研究了焊后热处理对焊接接头微观组织和力学性能的变化。试验结果表明,焊缝中为奥氏体组织,并未发现第二相析出物存在。焊后热处理对接头的拉伸性能影响不大,均断裂在母材位置,但显著提高了接头的延伸率。接头低温冲击试验也展现了良好的抗低温冲击性能。断口分析发现,接头呈韧性断裂。     

P92钢焊接接头蠕变损伤的非线性超声检测研究

为解决P92钢焊接接头蠕变损伤的无损检测问题,该文选用温度为650℃、施加应力为95 MPa的加速试验方法,制作不同蠕变时间的试样,对P92钢焊接接头进行蠕变性能试验。采用非线性超声波技术和金相检测对蠕变试样焊接接头各区域进行研究。结果表明:P92钢焊接接头母材、热影响区以及焊缝区域的非线性超声二次谐波幅值在蠕变试验后都呈上升趋势,在热影响区中的增加速率要快于其在母材和焊缝中,P92钢焊接接头热影响区非线性二次谐波参数的变化与蠕变损伤严重程度存在对应关系。该文为开展P92钢焊接接头蠕变损伤的无损检测工程应用打下了坚实的基础。     

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采用了TIG对核聚变用316LN奥氏体不锈钢进行焊接,并对焊接接头进行了焊后热处理,利用光学显微镜、扫描电镜分析手段研究了焊后热处理对焊接接头微观组织和力学性能的变化.试验结果表明,焊缝中为奥氏体组织,并未发现第二相析出物存在.焊后热处理对接头的拉伸性能影响不大,均断裂在母材位置,但显著提高了接头的延伸率.接头低温冲击试验也展现了良好的抗低温冲击性能.断口分析发现,接头呈韧性断裂.     

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A preliminary study of microstructure and properties of the welded joint of low activation CLF-1 steel used for fusion reactor and 316L dissimilar metal by tungsten inert gas (TIG) welding using W19123L as filler material, has been performed. The welded joint forming is proved well and without defect. The welded joint consists of CLF-1 zone [base metal (BM), heat affected zone (HAZ), fusion zone (FZ)], inside layer (IL), weld zone (WZ), and 316L zone (BM, HAZ, FZ). Tensile strength of the joint is better than the base metal minimum value in room temperature. Both surfaces of welded joint are without crack and with deformation uniformity under the bending test. The distribution of impact value of the joint is concave-like and satisfies the designed values for the welded joint, the WZ’s value is the lowest, the HAZ’s of both WZ zones is the second, the BM’s was the best, and the 316L steel zone’s is slightly larger than the CLF-1 zone’s. The hardness values of the point under the 1.6mm top surface of welded joint have a larger fluctuation range, and is slightly higher than those of 1/2T and above down surface 1.6mm position. The hardness distribution of 1/2T and above the down surface 1.6mm position is roughly uniform, and has a downward trend from the CLF-1 zone to 316L zone. Welding properties generally has remained stable and satisfy the requirement of dissimilar steel welding performance matching.     

退火对钛/铜热等静压扩散连接界面的影响

钛/铜(Ti/Cu)作为ITER 第一壁Be/CuCrZr 热等静压连接中间过渡层,形成了多层中间金属相结构,容易在Ti/Cu 金属相之间产生裂纹等缺陷。采用CuCrZr 代替Be,经过与Be/CuCrZr 相同的热等静压工艺,制作了多个CuCrZr/Ti/Cu/CuCrZr 连接件,对Ti/Cu 连接接头进行深入分析。对连接件分别进行未退火、400℃和500℃ 退火处理,去应力退火后对接头强度和缺陷分布的影响进行了研究。研究结果表明,中间钛层的两侧都形成了三层Ti/Cu 扩散层,分别为Cu₄Ti、CuTi 和CuTi₂。纯铜侧的Cu₄Ti 厚度比CuCrZr 侧的厚,使得裂纹几乎全部分布于铜侧的Cu₄Ti 与CuTi 交界处,拉伸样品极易在此处发生脆性断裂。随着退火温度升高,裂纹的产生和扩展减少。     

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As the ITER first wall Be/CuCrZr hot isostatic pressing (HIP) bonding intermediate transition layer, Ti/Cu layer can form a multi-layer intermediate metal phase, and defects such as cracks occur between the Ti/Cu metal phases. CuCrZr was used instead of Be, and a number of CuCrZr/Ti/Cu/CuCrZr joints were fabricated by the same HIP process as Be/CuCrZr to analyze the Ti/Cu joints. The effects of stress relief annealing on joint strength and defect distribution of the joints unannealed, annealed at 400°C and 500°C respectively were studied. The results show that three layers of Ti/Cu diffusion layers are formed on both sides of the intermediate titanium layer, namely Cu₄Ti, CuTi and CuTi₂. The thickness of Cu₄Ti on the pure copper side is thicker than that on the CuCrZr side, so that the crack is almost entirely distributed at the junction of Cu₄Ti and CuTi on the pure copper side where brittle fracture is easy to occur in the tensile samples. As the annealing temperature increases, the generation and propagation of cracks decreases.     

温度对AZO薄膜红外辐射性能的影响

随着全球资源的减少和环境的恶化,节能减排已成为人们关注的焦点,具有保温隔热功能的低辐射玻璃成为研究的热点。提高玻璃保温隔热性能最有效的方法就是在其表面涂覆低辐射率层。原材料丰富、导电性能好、可见光透过率高等优势使得Al掺杂ZnO (AZO)薄膜成为最具潜力的低辐射率层。系统研究了温度对AZO薄膜红外辐射性能的影响,分析了变化机理。首先研究了在一定的温度下持续一段时间后,AZO薄膜的红外比辐射率的变化情况。然后研究了在变温环境中红外比辐射率的变化情况。采用直流磁控溅射法在室温下玻璃基片上沉积500 nm厚的AZO薄膜,将薄膜放到马弗炉中进行热处理,在100～400 ℃空气气氛下保温1 h,随炉冷却。采用X射线衍射仪对AZO薄膜进行物相分析,采用扫描电子显微镜观察薄膜表面形貌变化。利用四探针测试法测量AZO薄膜的电阻率,采用红外比辐射率测试仪测试薄膜红外比辐射率, 可见分光光度计测量可见光谱。测试的结果表明,薄膜热处理前后均为六角纤锌矿结构,(002)择优取向。300 ℃及以下热处理1 h后,(002)衍射峰增强,半高宽变窄,晶粒尺寸长大。随着热处理温度的升高,薄膜的电阻率先减小后增大,200 ℃热处理后的薄膜具有最小的电阻率(0.9×10-3 Ω·cm)。热处理温度升高,晶粒长大使得薄膜电阻率降低。热处理温度过高,薄膜会从空气中吸收氧,电阻率下降。薄膜的红外比辐射率变化趋势和电阻率的一致,在200 ℃热处理后获得最小值(0.48)。自由电子对红外光子有较强的反射作用,当电阻率低,自由电子浓度高的时候,更多的红外光子被反射,红外辐射作用弱,红外比辐射率小。薄膜的可见光透过率随着热处理温度的升高先减小后增大,200 ℃热处理后的薄膜的可见光透过率最小,但仍高达82%。这种变化是由于自由电子浓度变化引起的,自由电子对可见光有很强的反射作用。选取未热处理和200 ℃热处理后的样品进行变温红外比辐射率的测量,将样品放在可加热的样品台上,位置固定,在室温到350 ℃的升温和降温过程中每隔25 ℃测量一次红外比辐射率,结果表明,在室温到350 ℃的温度范围内,AZO薄膜的红外比辐射率在升温过程中随着温度的上升而增大,在降温过程中减小,经过整个升、降温过程后,薄膜的红外比辐射率增大。     

Comparison of microstructure and mechanical properties of ultra-narrow gap laser and gas-metal-arc welded S960 high strength steel

The microstructural characteristics and mechanical properties, including micro-hardness, tensile properties, three-point bending properties and Charpy impact toughness at different test temperatures of 8 mm thick S960 high strength steel plates were investigated following their joining by multi-pass ultra-narrow gap laser welding (NGLW) and gas metal arc welding (GMAW) techniques. It was found that the microstructure in the fusion zone (FZ) for the ultra-NGLW joint was predominantly martensite mixed with some tempered martensite, while the FZ for the GMAW joint was mainly consisted of ferrite with some martensite. The strength of the ultra-NGLW specimens was comparable to that of the base material (BM), with all welded specimens failed in the BM in the tensile tests. The tensile strength of the GMAW specimens was reduced approximately by 100 MPa when compared with the base material by a broad and soft heat affected zone (HAZ) with failure located in the soft HAZ. Both the ultra-NGLW and GMAW specimens performed well in three-point bending tests. The GMAW joints exhibited better impact toughness than the ultra-NGLW joints.     

Surface behaviour and undercooling in the liquid Ga—Bi binary system detected by optical second harmonic generation

We employ an optical second harmonic generation(SHG) technique to investigate the surface behaviours at the liquid(solid)/vapour interface of the Ga-Bi binary metallic system. In a heating and cooling cycle between 280℃ and room temperature, there is no change of the SH-intensity in the heating process, whereas there exists an abrupt and abnormal change of the SH-intensity in the cooling process. It is interesting to find that a macroscopic Bi-rich solid layer is floating on the surface of the Ga-rich liquid phase just below the monotectic temperature (222℃±2℃) in the cooling process, in spite of the Bi-rich phase being heavier than the Ga-rich phase. On the other hand, different undercooling behaviours are observed at the surface and in the bulk. The behaviours of surface solidification and surface melting are different from those in the bulk.