激光诱导应力波测量薄膜界面强度研究进展

薄膜界面强度是影响多层薄膜装置性能的重要参数.激光诱导应力波技术是在可控制和非接触条件下定量测量薄膜界面强度最有效的技术之一.在采用高强度应力波短脉冲加载实现界面层裂的同时,通过光学测量薄膜自由面瞬态位移,并利用应力波理论计算得到临界界面强度.通过精确控制试样几何形状及尺寸,包括拉伸、剪切和复合型在内的各种界面加载模式都可以实现.本文对激光诱导应力波测量薄膜界面强度研究进展进行了综述,并特别强调了不同加载模式的实现方法,高强度超薄薄膜的界面测量技术,以及如何通过辨别薄膜自由面瞬态位移光学干涉信号中的某些特殊性征来实时判断和测量界面的层裂.     

混凝土一维应力层裂实验的全场DIC分析

基于74mm直径分离式Hopkinson杆(SHPB)实验平台进行了混凝土杆的一维应力层裂实验.采用超高速相机(采样频率:2 $\mu$s/frame)结合数字图像相关法(DIC),记录混凝土试件中的动态位移场实时变化情况,探讨了混凝土在拉伸断裂过程中的表面位移场及速度场演化规律.针对实验中出现的多重层裂现象,基于一维应力波传播理论,指出各个位置在发生层裂时,其最大拉应力均由透射压缩波与反射拉伸波叠加而成,各处层裂发生时均处于一维应力状态.并提出了根据层裂位置左右两点速度趋势变化判断层裂发生时刻的判据.该判据可以给出所有层裂的起裂时间,结合DIC分析直接给出了混凝土多重层裂应变.结果显示混凝土的拉伸强度具有明显的应变率效应,在30 s$^{-1}$的应变率下,其拉伸强度的动态增强因子(DIF)可以达到5.与传统的波叠加法和自由面速度回跳法相比,DIC全场分析法不受加载波形限制,可以精确给出每个层裂的位置和起裂时间,从而得到试件在高应变率加载下不同位置处的断裂应变、拉伸强度及相应应变率,提高了测量效率.      

混凝土一维应力层裂实验的全场DIC分析

基于74 mm直径分离式Hopkinson杆(SHPB)实验平台进行了混凝土杆的一维应力层裂实验.采用超高速相机(采样频率:2μs/frame)结合数字图像相关法(DIC),记录混凝土试件中的动态位移场实时变化情况,探讨了混凝土在拉伸断裂过程中的表面位移场及速度场演化规律.针对实验中出现的多重层裂现象,基于一维应力波传播理论,指出各个位置在发生层裂时,其最大拉应力均由透射压缩波与反射拉伸波叠加而成,各处层裂发生时均处于一维应力状态.并提出了根据层裂位置左右两点速度趋势变化判断层裂发生时刻的判据.该判据可以给出所有层裂的起裂时间,结合DIC分析直接给出了混凝土多重层裂应变.结果显示混凝土的拉伸强度具有明显的应变率效应,在30 s~(-1)的应变率下,其拉伸强度的动态增强因子(DIF)可以达到5.与传统的波叠加法和自由面速度回跳法相比,DIC全场分析法不受加载波形限制,可以精确给出每个层裂的位置和起裂时间,从而得到试件在高应变率加载下不同位置处的断裂应变、拉伸强度及相应应变率,提高了测量效率.     

爆轰加载下金属锡层裂破碎数值模拟

对爆轰加载下低熔点金属锡的层裂破碎问题开展了数值模拟。在利用实验数据对所采用数值方法和材料模型开展对比验证的基础上，通过对样品内部物理量时间及空间分布演化对比分析，剖析了冲击加-卸载中样品内部应力波与材料相互作用过程。此外，通过对比分析不同厚度锡样品在爆轰加载下的动态行为特征，进一步认识了自由面反射稀疏波、边侧稀疏波和入射稀疏波共同作用下层裂破碎演化机制。结果表明，当样品较薄时，层裂破碎行为由反射稀疏波主导；随着样品厚度的增大，反射稀疏波主导区缩小，入射稀疏波和边侧稀疏波主导区逐渐增大。     

平板撞击下梯度镍的层裂损伤研究

为研究高应变率下梯度镍的层裂损伤行为,对均匀镍材进行准静态扭转,制备出硬度和晶粒尺寸沿径向规则变化的圆柱形梯度镍.运用一级轻气炮对梯度镍进行平板撞击加载,利用多通道激光多普勒测速仪测量梯度镍的自由面粒子速度,计算层裂强度,并结合金相显微镜观察梯度镍回收试样的层裂损伤形貌.实验结果表明:平板撞击加载下,梯度镍的层裂损伤以...     

拉伸应力区的声速测量、层裂强度和断裂密度

1 引言 在层裂的实验研究中,目前尚无法直接测量发生在材料内部的动态断裂过程。通常采用测量自由面速度剖面,推演出材料层裂特性的方法。在计算材料发生断裂时的拉伸应力即层裂强度时,需要知道拉伸应力即负压下的声速。测量负压下的声速比测量冲击压缩下的声速要困难得多。仅仅从自由面速度剖面并不能计算出负压声速,因为通常无法确定材料中应力由压应力转变为拉伸应力的“位置”、发生层裂的位置以及时间。能否通过特别的实验设计,确定发生这些过程的时一空位置,进而获得负压声速,一直是实验研究者企求解决的问题。下面介绍两种测量负压声速的实验装置设计和计算负压声速、层裂强度和断裂密度的方法,是这方面研究工作的尝试。     

基于“钉床型”飞片的斜波加载技术及应用

为了实现斜波加载,设计了一种“钉床型”广义波阻抗梯度飞片,即在基座上密排叠加许多小圆锥,简称“钉床型”飞片。该飞片采用激光选区熔化金属增材制造技术进行制备。利用一级轻气炮加载装置和全光纤激光位移干涉测试系统,开展不同工况下“钉床型”飞片高速击靶压缩实验和层裂实验,重点讨论小圆锥高度和撞击速度对斜波压缩加载波形的影响规律,以及斜波加载对不锈钢靶板层裂特性的影响。实验结果显示:（1）“钉床型”飞片对靶板产生的压缩是逐步的,从自由面速度剖面上观察到压缩波上升前沿时间被显著延长,形成了斜波波阵面,明显不同于冲击压缩的陡峭波阵面;（2）在飞片击靶速度近似恒定条件下,斜波波阵面的上升沿时间、平台速度峰值都明显依赖于“钉床型”飞片上的小圆锥高度,随着小圆锥高度增大,上升沿时间呈线性增大,而平台速度峰值呈线性减小;（3）在“钉床型”飞片的几何尺寸保持不变的条件下,斜波波阵面的上升沿时间随着飞片击靶速度的增大而线性减小,平台速度峰值则线性增大;（4）与冲击加载相比,“钉床型”飞片产生的斜波加载不会对材料的层裂强度产生明显影响,但对材料内部损伤演化速率有一定的影响。     

材料动态强度直接测量的磁压剪实验技术及应用

提出一种用于直接测量动载荷下材料强度的新方法,即磁驱动压剪联合加载实验技术。从理论和数值计算上分析了压/剪联合作用下材料的应力偏量与屈服强度关系,计算斜波加载下压/剪联合作用时应力偏量与屈服强度的时空演化特性,给出材料强度数值的计算方法。并基于自行研制的强脉冲电流装置和10 T准静态磁场发生器,利用多点双光源外差位移干涉仪(dual laser heterodyne velocimetry, DLHV),开展磁压剪实验对2种铝样品的动态强度进行测量,得到不同加载压力下铝样品的强度。结果表明:磁驱动压/剪联合加载技术为材料的高压强度直接测量提供了一种新途径,是可靠的实验技术。     

预制缺陷的K9玻璃层裂特性研究

层裂问题的核心内容是内部微细观损伤成核及演化规律研究. 利用激光内刻方法, 在K9玻璃样品内部预制相互贯通的初始损伤, 结合火炮加载平板实验和多点DPS测试获得样品自由面粒子速度, 以研究材料内部损伤的动态实时演化过程. 通过所获得的样品自由面粒子速度图像, 分析了层裂振荡周期、未层裂信号和层裂强度等实验现象, 为材料的动态损伤演化过程提供了一些新的认识.      

内爆和柱壳条件下无氧铜的层裂特性

利用任意反射面位移干涉系统(DISAR)激光测速技术,成功地获得了滑移内爆加载和柱壳结构条件下无氧铜的内表面（自由面）速度剖面,并对其层裂特性进行了初步分析。结果表明:(1)在固定炸药和改变无氧铜圆管壁厚条件下,层裂片厚度随着圆管壁厚h的减小而增加;以圆管壁厚h为参照进行归一化,则相对层裂片厚度(/h)随相对装药厚度(he/h)的增大而增加,这种规律与以往对20钢的研究结果一致,但圆管发生层裂的临界条件,却显示出明显的材料相关性。(2)初步来看,无氧铜的层裂强度对结构的依赖性不明显,而与加载脉冲的幅值和宽度相关。(3)受无氧铜粘性和Taylor波衰减的影响,无氧铜的层裂强度随管壁厚度的增加而略有降低;同时,材料分散性也对此有一定影响。     

Pure-shear Failure of Thin Films by Laser-induced Shear Waves

The measurement of mode-dependent thin film interfacial properties is important in evaluating the quality of the interfaces between thin films and substrates. Previous work has proved that tensile and mixed-mode strength of a thin film/substrate interface can be evaluated using a laser-induced thin film spallation technique. To further examine the application regime of this technique and identify the individual roles of the tensile and shear stress in the resulting interfacial failure, a special sample design is adopted in the current work to realize pure-shear loading at the thin film/substrate interface. Our result demonstrates that for sufficiently high stress amplitude, interfacial failure can be induced solely by the in-plane shear stress and the stress can be quantitatively determined from optical interferometric measurements. Together with the previous tensile and mixed-mode studies, a complete picture of the mode-dependent thin film interfacial strength can now be reliably determined using the laser-induced thin film spallation techniques.     

Acoustoelastic determination of residual stress with laser doppler velocimetry

The main object of this study is to develop a new technique for stress nondestructive measurement. A noncontact measurement technique of ultrasonic wave velocity is proposed. In the measurement system, a laser Doppler velocimeter, which is noncontact, is used to detect wave motions due to Rayleigh waves instead of a piezoelectric transducer. The noncontact measurement technique is applied to determine the stress-acoustic coefficient of Rayleigh waves for aluminum 5052 and a structural steel, and the results are in good agreement with those obtained using knife-edge piezoelectric transducers. The technique is also used to evaluate residual stress existing in an H-section rolled beam of the structural steel. The distribution of residual stress is reasonable.     

Tensile and mixed-mode strength of a thin film-substrate interface under laser induced pulse loading

Laser induced stress waves are used to characterize intrinsic interfacial strength of thin films under both tensile and mixed-mode conditions. A short-duration compressive pulse induced by pulsed-laser ablation of a sacrificial layer on one side of a substrate is allowed to impinge upon a thin test film on the opposite surface. Laser-interferometric measurements of test film displacement enable calculation of the stresses generated at the interface. The tensile stress at the onset of failure is taken to be the intrinsic tensile strength of the interface. Fused-silica substrates, with their negative nonlinear elasticity, cause the compressive stress wave generated by the pulse laser to evolve a decompression shock, critical for generation of the fast fall times needed for significant loading of surface film interfaces. By allowing the stress pulse to mode convert as it reflects from an oblique surface, a high amplitude shear wave with rapid fall time is generated and used to realize mixed-mode loading of thin film interfaces. We report intrinsic strengths of an aluminum/fused silica interface under both tensile and mixed-mode conditions. The failure mechanism under mixed-mode loading differs significantly from that observed under pure tensile loading, resulting in a higher interfacial strength for the mixed-mode case. Inferred strengths are found to be independent, as they should be, of experimental parameters.     

多晶薄膜X-射线衍射

作者在普通X-射线衍射仪上实施了样品倾斜X-射线衍射(STD)技术,不需要专用薄膜附件(TFA)也能很好地进行薄膜结构的测定,并且给出其衍射能量方程和方位角方程,从而使理论、实验和结构解析结合为一体。目前,应用该技术已经成功地解决了一些其它简便方法所无法解决的诸如物相纵向分布变化测量等问题。本文还通过几种摩擦学用膜的测定结果阐明了该技术的应用及功能。     

Mixed-mode failure of thin films using laser-generated shear waves

A new test method is developed for studying mixed-mode interfacial failure of thin films using laser generated stress waves. Guided by recent parametric studies of laser-induced tensile spallation, we successfully extend this technique to achieve mixed-mode loading conditions. By allowing an initial longitudinal wave to mode convert at an oblique surface, a high amplitude shear wave is generated in a fused silica substrate and propagated toward the thin-film surface. A shear wave is obtained with amplitude large enough to fail an Al film/fused silica interface and the corresponding shear stress calculated from high-speed interferometric displacement measurements. Examination of the interfaces failed under mixed-mode conditions reveals significant wrinkling and tearing of the film, in great contrast to blister patterns observed in similar Al films failed under tensile loading.     

Effect of ion-beam assisted deposition on the film stresses of TiO2 and SiO2 and stress control

Based on Hartmann-Shack sensor technique, an online thin film stress measuring system was introduced to measure the film stresses of TiO₂ and SiO₂, and comparison was made between the film stresses prepared respectively by the conventional process and the ion-beam assisted deposition. The effect of ion-beam assisted deposition on the film stresses of TiO₂ and SiO₂ was investigated in details, and the stress control methodologies using on-line adjustment and film doping were put forward. The results show that the film stress value of TiO₂ prepared by ion-beam assisted deposition is 40 MPa lower than that prepared by conventional process, and the stress of TiO₂ film changes gradually from tensile stress into compressive stress with increasing ion energy; while the film stress of SiO₂ is a tensile stress under ion-beam assisted deposition because of the ion-beam sputtering effect, and the film refractive index decreases with increasing ion energy. A dynamic film stress control can be achieved through in-situ adjustment of the processing parameters based on the online film stress measuring technique, and the intrinsic stress of film can be effectively changed through film doping.     

Mixed-mode interfacial adhesive strength of a thin film on an anisotropic substrate

The mixed-mode interfacial adhesion strength between a gold (Au) thin film and an anisotropic passivated silicon (Si) substrate is measured using laser-induced stress wave loading. Test specimens are prepared by bonding a fused silica (FS) prism to the back side of a 〈1 0 0〉 Si substrate with a thin silicon nitride (Si_xN_y) passivation layer deposited on the top surface. A high-amplitude stress wave is developed by pulsed laser ablation of a sacrificial absorbing layer on one of the lateral surfaces of the FS prism. Due to the negative non-linear elastic properties of the FS, the compressive stress wave evolves into a decompression shock with fast fall time. Careful selection of the incident angle between the pulse and the FS/Si interface generates a mode-converted shear wave in refraction, subjecting the Si_xN_y/Au thin film interface to dynamic mixed-mode loading, sufficient to cause interfacial fracture. A detailed analysis of the anisotropic wave propagation combined with interferometric measurements of surface displacements enables calculation of the interfacial stresses developed under mixed-mode loading. The mixed-mode interfacial strength is compared to the interfacial strength measured under purely tensile loading.     

Glass-modified stress waves for adhesion measurement of ultra thin films for device applications

Laser-generated stress wave profiles with rarefaction shocks (almost zero post-peak decay times) have been uncovered in different types of glasses and presented in this communication. The rise time of the pulses was found to increase with their amplitude, with values reaching as high as . This is in contrast to measurements in other brittle crystalline solids where pulses with rise times of and post-peak decay times of were recorded. The formation of rarefaction shock is attributed to the increased compressibility of glasses with increasing pressures. This was demonstrated using a one-dimensional nonlinear elastic wave propagation model in which the wave speed was taken as a function of particle velocity. The technological importance of these pulses in measuring the tensile strength of very thin film interfaces is demonstrated by using a previously developed laser spallation experiment in which a laser-generated compressive stress pulse in the substrate reflects into a tensile wave from the free surface of the film and pries off its interface at a threshold amplitude. Because of the rarefaction shock, glass-modified waves allow generation of substantially higher interfacial tensile stress amplitudes compared with those with finite post-peak decay profiles. Thus, for the first time, tensile strengths of very strong and ultra thin film interfaces can be measured. Results presented here indicate that interfaces of 185-nm-thick films, and with strengths as high as , can be measured. Thus, an important advance has been made that should allow material optimization of ultra thin layer systems that may form the basis of future MEMS-based microelectronic, mechanical and clinical devices.     

含孔von Karman板中非线性波散射与边值问题

基于ｖｏｎ Ｋａｒｍａｎ板大挠度弯曲理论,利用小参数摄动法,分析研究了含孔ｖｏｎＫａｒｍａｎ板的非线性波散射与动应力集中问题,其中一类可看成是薄板弯曲波动问题的控制方程。当有单频波入射时,由于弯曲应力与膜应力状态的非线性耦合,孔洞会产生高次谐波散射现象。建立了求解本问题的边界积分方程法,利用积分方程法交替求求这两类问题,最终可获得问题的近似分析解。     

基于激光干涉测试技术的分离式Hopkinson压杆实验测试系统

分离式Hopkinson压杆（SHPB）实验的传统测试技术是基于应变片的电测技术,测试结果的可靠性强烈依赖于应变片与杆之间粘贴质量,受到人为因素的影响较大。本文中采用基于多普勒频移原理的双探头全光纤激光干涉测速技术,以粒子速度为监测目标,借助应力波传播理论,换算成试件的应变和应力,从而建立了SHPB实验的非接触光学测试系统。针对韧性和脆性两类材料,分别提出了激光正入射和激光斜入射两种测试技术。再以铝合金和PZT陶瓷为例,通过与传统的应变片测试结果以及DIC测量结果的对比分析,验证了两种测试技术的有效性。与传统的应变片测试技术相比,新的激光干涉测试技术具有免标定、抗干扰、可靠性高等许多优点,有助于实现SHPB实验测试系统标准化。