2－乙基－4－甲基咪唑固化环氧树脂的固化反应机理、动力学及其反应活性

本文应用ＤＳＣ和ＦＴＩＲ对２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型环氧树脂体系的固化反应机理和２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型、缩水甘油酯与脂环型环氧树脂体系的固化反应特征、动力学及其反应活性进行了研究．结果表明，双酚Ａ二缩水甘油醚型环氧树脂／咪唑体系的固化反应是分两步独立进行的，第一步是加成反应，第二步是催化聚合反应．缩水甘油酯与脂环型环氧树脂（ＴＤＥ－８５）／咪唑体系的固化反应过程也分两步进行，第一阶段反应主要是缩水甘油酯型环氧基进行的加成反应和催化聚合反应，第二阶段主要是脂环型环氧基进行的加成反应．各体系第一阶段的表现反应活化能均低于第二阶段活化能．当ＴＤＥ－８５型环氧树脂中引入缩水甘油醚型环氧树脂后，固化反应速率均较ＴＤＥ－８５环氧树脂单独固化时快．     

2－乙基－4－甲基咪唑固化环氧树脂的固化反应机理、动力学及其反应活性

 本文应用ＤＳＣ和ＦＴＩＲ对２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型环氧树脂体系的固化反应机理和２－乙基－４－甲基咪唑固化双酚Ａ二缩水甘油醚型、缩水甘油酯与脂环型环氧树脂体系的固化反应特征、动力学及其反应活性进行了研究．结果表明，双酚Ａ二缩水甘油醚型环氧树脂／咪唑体系的固化反应是分两步独立进行的，第一步是加成反应，第二步是催化聚合反应．缩水甘油酯与脂环型环氧树脂（ＴＤＥ－８５）／咪唑体系的固化反应过程也分两步进行，第一阶段反应主要是缩水甘油酯型环氧基进行的加成反应和催化聚合反应，第二阶段主要是脂环型环氧基进行的加成反应．各体系第一阶段的表现反应活化能均低于第二阶段活化能．当ＴＤＥ－８５型环氧树脂中引入缩水甘油醚型环氧树脂后，固化反应速率均较ＴＤＥ－８５环氧树脂单独固化时快．     

4,5-环氧环己烷1,2-二甲酸二缩水甘油酯的固化行为

本文用动态力学扭辨分析法,研究4,5-环氧环己烷1,2-二甲酸二缩水甘油酯与间苯二胺的热固化动态力学行为。结果表明:固化过程分两个阶段进行,低于100℃时,交联反应主要在缩水甘油酯链的环氧基上进行;100—130℃时为酯链环氧基反应趋近完全和酯环环氧基反应速率逐步增大的过渡区;130℃以上固化时,酯环环氧基才明显地参与固化交联反应。从Arrhenius关系曲线求得本固化体系凝胶点前表现反应活化能为13.2kcal/mol。     

含苯并噁唑环氧树脂的合成、固化动力学及热性能

通过两步法制备了两种含苯并噁唑结构的环氧树脂双苯并二噁唑型环氧(DAROH-O)树脂与双酚A型苯并噁唑环氧(HOH-O)树脂,采用红外光谱和氢核磁共振波谱分析对树脂的结构进行了表征。结果表明:当以二氨基二苯基甲烷(DDM)为固化剂时,对于DAROH-O/DDM体系,采用Kissinger法和Ozawa法计算得到的表观反应活化能分别为176.92kJ/mol和175.36kJ/mol;对于HOH-O/DDM体系,采用Kissinger法和Ozawa法计算得到的表观反应活化能分别为198.45kJ/mol和196.15kJ/mol。热重分析结果表明这两种环氧树脂固化物的耐热性能均远高于普通双酚A环氧树脂/DDM固化物的耐热性能。固化物的失重过程包括两个阶段,第一阶段的分解出现在350～370℃,第二阶段的分解发生在600℃左右,属于苯并噁唑环的分解。     

含羧基硅氧烷的制备及其固化动力学研究

通过氯丙基甲基硅氧烷与过量的对苯二甲酸的缩合反应制备了一种新型的含羧基硅氧烷(CCS),CCS可以同双酚A型环氧树脂固化,根据Kissinger和Crane方程,用差热分析(DSC)对CCS和环氧树脂组合物的固化性能进行了分析。分析结果表明组合物固化反应的表观活化能为71.41 kJ.mol-1,反应级数为0.911;还给出了加热速度为10℃.min-1时的固化反应方程。     

4,5-环氧环己烷1,2-二甲酸单丁酯单缩水甘油酯/m-PDA的热固化特征

本文叔述了4,5-环氧环己烷1,2-二甲酸单丁酯单缩水甘油酯(DME-47)/间-苯二胺(m-PDA)体系的热固化特征。结果表明,由于DME-47中羧酸缩水甘油酯型环氧基的反应活性远大于脂环环氧基。所以,DME-47/m-PDA体系固化反应明显地分两阶段进行。由TBA恒温固化动力学数据求得体系在100—160℃表观反应活化能E_α=13.9kcal/mol,在160—240℃E_α=16.6kcal/mol,根据实验数据按Arrhenius关系式推算,本体系在室温25℃下可以存放80天左右而不凝胶化,20℃下可存放120天左右。     

氢化双酚A型环氧树脂的固化动力学

将氢化双酚A与环氧氯丙烷反应合成了氢化双酚A型环氧树脂(HBPA-EP),产物分别用多元胺类或酸酐类固化剂固化,利用差示扫描量热分析(DSC)对固化反应特性进行了研究,得到了相应的固化条件、固化反应活化能和固化反应动力学方程等.结果表明,当分别采用1,3-环己二甲胺、液态聚酰胺、顺式六氢苯酐、甲基六氢苯酐固化HBPA-EP(环氧值为0.45)时,其固化条件分别为100℃、2h,145℃、4h,90℃、2h,120℃、4h,130℃、2h,150℃、4h,140℃、2h和160℃、4h,用这4种固化剂进行固化反应的表观活化能分别为50.62、56.88、74.56 kJ/mol和68.36 kJ/mol,其反应级数分别为0.886、0.901、0.915和0.905.     

液晶环氧树脂/蒙脱土纳米复合材料的制备和固化反应动力学研究

用带有介晶基元的联苯二酚二缩水甘油醚 (BP)、4 氨基苯基磺酰胺 (SAA)和有机化蒙脱土 (93A)采用浇铸成模固化成型的方法制备出液晶环氧树脂 蒙脱土纳米复合材料 .WRXD结果表明 93A含量是 2 %时可形成剥离型纳米材料 ,而当 10 %时形成插层型纳米材料 ,5 %时则形成剥离和插层混合型的纳米材料 ;POM结果表明蒙脱土的存在能够破坏原有的扇形近晶相液晶织构 .DSC研究表明体系的固化反应动力学 ,可用变形的Kissinger Akahira Sunose法 (VKAS)表征 ,从求出的反应活化能和转化率关系 ,发现反应初期 ,蒙脱土使反应活化能降低 ,能够促进液晶环氧树脂的固化 .     

环氧树脂/氧化石墨纳米复合物的等温固化行为研究

用示差扫描分析仪(DSC)研究了氧化石墨(GO)对N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯基甲烷环氧树脂(TGDDM)/4,4'-二氨基二苯基砜(DDS)体系的等温固化反应的影响,用X射线光电子能谱仪(XPS)和傅里叶变换红外光谱仪(FTIR)研究了GO上存在的官能团及其对TGDDM/DDS体系固化行为的影响,用热失重分析仪(TGA)研究了天然石墨和GO的热力学稳定性.XPS、FTIR和TGA结果表明,GO上存在的大量羟基、羧基、环氧基等官能团能够影响环氧树脂的固化行为.DSC研究发现,环氧树脂/氧化石墨纳米复合物的固化反应属于自催化类型,随着GO含量的增加,达到最大反应速率的时间不断减小,初始反应速率不断增大,这说明GO对环氧树脂的固化反应有促进作用.Kamal模型计算得到的结果表明,随着GO含量的增加自催化反应初期阶段表观活化能E1先减小再增大,而自催化反应结束后表观活化能E2略微减小.经Kamal模型扩散控制函数修正后,整个固化过程中拟合得到的结果与实验数据相当吻合.以上结果说明,少量的GO对TGDDM/DDS体系的固化反应起着催化作用.     

环氧树脂潜伏性固化促进剂的研究

对环氧树脂/桐油酸酐/乙酰丙酮钕体系的热固化反应进行了研究。用DSC、TBA和固化仪等手段测定了凝胶化时间和表观反应活化能,计算了反应动力学参数。结果表明,乙酰丙酮钕对体系的固化具有潜伏性促进作用。     

Synthesis and Properties of Silphenylene-containing Epoxy Resins with High UV-stability

Two novel silphenylene-containing cycloaliphatic epoxy resins, 1,4-di [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (DEDSB) and 1,3,5-tri [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (TEDSB) were synthesized through in situ Grignard reaction and hydrosilylation, and characterized by FT-IR and ¹H-NMR. They were colorless transparent viscous liquids. Methyhexahydrophthalic anhydride (MeHHPA) was used to cure the epoxy resins to give glassy solids with high optical clarity. Differential scanning calorimetry (DSC) results indicated that DEDSB and TEDSB showed similar curing reactivity. The cured TEDSB had a higher glass transition temperature, a higher storage modulus and a lower coefficient of linear thermal expansion than the cured DEDSB due to a higher crosslink density. The cured silphenylene-containing epoxy resins exhibited a much higher resistance to discoloration under UV irradiation than the commonly used epoxy resins diglycidyl ether of bisphenol-A (DGEBA). XPS analysis revealed that they were much less susceptible to photo-oxidation than DGEBA.     

Guide for Authors

The effects of epoxidized natural rubber (ENR) on the curing behaviors and adhesive strengths of an epoxy (diglycidyl ether of bisphenol-A) and dicyandiamide/2-methyl imidazole system are studied with differential thermal calorimetry (DSC), scanning electron microscopy (SEM), and Instron tensile testing instrument. From DSC analyses of specimens prepared with unsealed aluminum pans, it is obtained that the reaction exotherm, the time to maximal curing rate, the glass transition temperature, the rate constant, and the reaction order of the epoxy system change with respect to the content of ENR added because of the reaction of ENR with the epoxy system. The results obtained from SEM micrographs indicate that the particle size of the rubber phase increases with increasing the curing temperature and the ENR content. The volume fraction of the separated rubber phase also follows the similar trend except at the high curing temperature which implying that the dissolution of epoxy resin in the ENR phase also depends on the curing temperature and the amount of ENR present. The lap shear strengths of specimens prepared with etched aluminum substrates increase with increasing the curing temperature because of a better cure at a higher temperature, but decrease with increasing the ENR content resulting from an adverse effect of ENR on the mechanical properties of the cured resins.     

Cure kinetics of epoxy-amine resins used in the restoration of works of art from glass or ceramic

The cure kinetics of two epoxy/amine resins, Araldite 2020 and AY103-HY956 widely used as adhesives in the restoration of works of art from glass or ceramic was investigated using FTIR spectroscopy. These resins are two-part adhesives, consisting of a resin - A, based on a diglycidyl ether of bisphenol A, and a hardener - B which is either a cycloaliphatic amine (isophorone diamine) for Araldite 2020, or a mixture of three aliphatic amines in HY956. The study was based on the collection of IR spectra, in the middle range (4000-600 cm⁻¹), of mixtures of resin and hardener at different proportions and isothermal temperatures (22-70 °C) as a function of curing time. A kinetic model was employed to simulate the experimental data using two kinetic rate constants. Diffusion control was incorporated to describe the cure behaviour at high degrees of conversion. From fitting to experimental data the kinetic and diffusional parameters were estimated, together with the activation energies of the kinetic and autocatalytic rate constants. It was found that higher degrees of curing are obtained at higher temperatures and increased amounts of hardener. Differences in the performance of the two adhesives are explained based on the type of the amines used as hardener.     

Oligo-fluoropolymer Modified Cycloaliphatic Epoxy Resins with Excellent Compatibility,Waterproof and Mechanical Properties for LED Encapsulation

An oligo-fluoropolymer(PFM) with functional cycloaliphatic epoxy and fluorinated groups was obtained via free radical polymerization and applied to the modification of cycloaliphatic epoxy resins(CE). The chemical structure of PFM was characterized by Fourier transform infrared(FTIR) spectroscopy, gel permeation chromatography(GPC) and nuclear magnetic resonance(NMR) spectroscopy, and the effects of different PFM concentrations(0.5%—6%, mass fraction) on the thermal resistance, mechanical properties, surface dewettability, light transmission, refractive index and various cured polymer properties were studied in detail. The DSC and TGA results demonstrate that the modified epoxy resins possess a higher thermal resistance than the neat epoxy resin. The improvements in the surface dewettability and water resistance are caused by the high crosslinking density and the enrichment of the oligo-fluorinated random copolymers dispersed in the matrix. The fracture surface morphologies of the thermosets were investigated by scanning electron microscopy(SEM) and transmission electron microscopy(TEM). It was observed that the optical transmittance of the composites was maintained even though microphase separation occurred during the curing process. With respect to the corresponding properties of the neat epoxy resins, the 2 phr(parts per hundreds of resin) PFM thermoset exhibited relatively better comprehensive properties, making the cured material a good candidate for light-emitting diode(LED) encapsulation.     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Synthesis and characterization of itaconic‐based epoxy resins

A trifunctional epoxy resin from itaconic acid (TEIA) was synthesized from a renewable resource‐based itaconic acid by allylation of itaconic acid to form diallyl itaconate by using m‐chloroperoxybenzoic acid as oxidizing agents followed by epoxidation of allylic C═C bond of diallyl itaconate methylhexahydropthalic anhydride as curing agent in the presence of 2‐methyl imidazole as a catalyst. The chemical structure of the synthesized resins was confirmed by Fourier transform infrared and nuclear magnetic resonance (¹H‐NMR and ¹³C‐NMR) spectroscopy analysis. The mechanical, thermal, and rheological performances of the TEIA were also investigated and compared with diglycidyl ether of bisphenol A and a plant‐based epoxidized soybean oil bioresin cured with the same curing agent. The higher epoxy value of 1.02, lower viscosity (0.96 Pa s at 25°C), higher mechanical, and higher curing reactivity toward methylhexahydropthalic anhydride of TEIA as compared with epoxidized soybean oil and comparable with diglycidyl ether of bisphenol A demonstrated significant evidence to design and develop a novel bio‐based epoxy resin with high performance to substitute the petroleum‐based epoxy resin.     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.     

Kinetics of curing and thermal degradation of hyperbranched epoxy (HTDE)/diglycidyl ether of bisphenol-A epoxy hybrid resin

Hyperbranched epoxy resin (HTDE) has relatively low viscosity and high molecular mass and holds great promise as a functional additive for enhancing the strength and toughness of thermosetting resins. In this work, the curing and thermal degradation kinetics of HTDE/diglycidyl ether of bisphenol-A epoxy (DGEBA) hybrid resin were studied in detail using differential scanning calorimetry (DSC) and thermogravimetric analysis (TG) techniques by Coats–Redfern model. The effect of molecular mass or generation and content of HTME on the activation energy, reaction order, and curing time were discussed; the results indicated that HTDE could accelerate the curing speed and reduce the activation energy and reaction order of the curing reaction.     

Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.