磁场下化学镀Co-Ni-B-Ce合金层微观形貌和耐磨性

磁场下化学镀Co-Ni-B-Ce合金层微观形貌和耐磨性;化学镀钴-镍-硼合金;铈;表面形貌;磁场     

化学镀Ni—Co—P合金对Mm（NiCoAiMn）5贮氢合金电极动力学性能的影响

通过电化学方法,研究了化学镀Ni-Co-P合金对Mm(NiCoAlMn)5五元稀土贮氢合金电极动力学性能的影响,研究表明,引入很少量（1－2％）Co的Ni-Co-P合金镀层可有效地提高MH电极的交换电流密度io,极限电流密度iL及α相中氢的扩散系数Dα（H）,还研究了化学镀Ni-Co-P合金对稀土贮氢合金电极循环伏安（CV）曲线和阴,阳极极化曲线及对称因子β的影响,进而阐明了化学镀对MH电极过程动力学的影响。     

稀土对化学镀Co-B合金工艺和结构的影响

研究了稀土金属铈对化学镀Co-B合金工艺和结构的影响. 结果表明, 微量稀土加入镀液后, 能改善电化学催化和金属离子的还原, 能明显提高化学镀Co-B合金的沉积速度、静止电位和阴极过电位. 稀土还降低了镀层中类金属元素硼的含量, 提高了形核率, 降低了形核功, 使沉积层结晶细化, 并且使具有非晶态结构的化学镀Co-B合金转化成了微晶结构的化学镀Co-B-Ce合金.     

CH3OH—H2O体系化学镀铜Mgl．85Mm0．15Ni合金的抗腐蚀性能研究

采用稳态极化曲线法和交流阻抗法研究了在甲醇-水不同含量镀液中化学镀铜的Mg1.85Mm0.15Ni(Mm富铈混合稀土)储氢合金于强碱性溶液中的抗腐蚀性能.结果表明,对甲醇-水体系化学镀铜,合金的抗腐蚀性可进一步改善.其中以甲醇体积比含量为40%的镀液施镀的抗腐蚀效果最佳.稳态极化曲线测试给出,此时合金的腐蚀电流密度只有5.6 mA@cm-2,相应的电化学反应阻抗为22.25 Ω@cn2,而原粉的两者之值分别为11.7 mA@cm-2和1.99 Ω@cm2.     

1-甲基-1-丙基-3-丁烯基环戊二烯基稀土二氯化物的合成

丁烯基环戊二烯基稀土氯化物;1-甲基-1-丙基-3-丁烯基环戊二烯基稀土二氯化物的合成     

镍-磷-锌盐纳米复合化学镀层抗腐蚀性能的研究

镍-磷-锌盐纳米复合化学镀层抗腐蚀性能的研究     

高性能镁-稀土结构材料的研制、开发与应用

由于镁合金具有低的密度-质轻、高比刚度、卓越的机械性能、高的硬度及良好的铸造性能, 近几十年来镁合金的应用一直是自动化工业的目标之一. 然而, 高温特殊用途, 例如在发动机上的应用, 通常的镁合金就受到了限制, 因为在高温下它们的强度和抗蠕变性能都比较差. 由于镁-稀土合金增加了材料的抗拉强度、延展性及抗蠕变性能, 稀土加入后形成镁-稀土合金就可以满足高温应用的要求. 本文就我国丰富的镁和稀土资源评述了国内外镁-稀土合金的研制、开发与应用状况及发展趋势, 同时结合我国相关单位的研究进展, 对我国镁-稀土合金的发展提出了建议.     

丙烯腈-丁二烯-苯乙烯塑料化学镀的研究进展

介绍了丙烯腈-丁二烯-苯乙烯(ABS)塑料基体化学镀Ni、Cu、Ni-Cu-P、Ag、Pb、PbO2工艺以及化学复合镀工艺;指出了前处理中粗化工艺与活化工艺的新动向,并就ABS塑料基体化学镀的发展趋势进行了展望.     

5,5-二甲基乙内酰脲在化学镀铜中的作用

在以酒石酸钾钠和乙二胺四乙酸二钠为双配位剂、 甲醛为还原剂的化学镀铜液中, 研究了5,5-二甲基乙内酰脲(DMH)在化学镀铜中的作用. 化学镀铜实验结果表明, DMH提高了镀液的稳定性; 扫描电子显微镜(SEM)结果表明, DMH使镀层颗粒尺寸减小, 镀层光亮致密; 紫外-可见光谱结果表明, DMH在镀液中与Cu(II)不发生强配位作用; 线性伏安扫描结果表明, DMH在化学镀铜过程中能抑制Cu⁺的产生或促进Cu⁺快速还原, 降低甲醛的氧化速率; X射线衍射(XRD)结果表明, 在含和不含DMH化学镀铜液中, 得到的铜镀层均呈现面心立方混晶结构的特征, 且未出现Cu₂O夹杂衍射峰.     

粘结NdFeB永磁体化学镀Ni-Cu-P防护层工艺过程研究

研究了粘结NdFeB永磁体化学镀Ni Cu P合金防护层的工艺过程。研究表明:粘结磁体经碱性去油、缓蚀酸洗、镀前隔离与活化处理后再进行化学镀Ni Cu P,可获得镀层光亮平整,结合力好,孔隙率为每平方厘米0.5个,腐蚀速率为0.07mg·cm-2·h-1的耐蚀性镀层,该镀层对磁体磁性能无不良影响。     

Using electroless deposition for the preparation of micron sized polymer/metal core/shell particles and hollow metal spheres

Uniform and stable core-shell microspheres composed of a poly(methyl methacrylate) (PMMA) core and a thin metallic shell of nickel-phosphorus, cobalt-phosphorus, or mixed metal alloys (CoNiP, NiFeP, CoFeP) were prepared by dispersion polymerization of methyl methacrylate followed by electroless plating. The presence of the metallic shell around the particles was confirmed by scanning electron microscopy, energy-dispersive X-ray spectroscopy, and photoelectron spectroscopy. Transmission electron microscopy images of the cross-section of individual particles show that the thickness of the metal/alloy can be precisely tuned by adjusting the immersion time of the microspheres in the electroless bath. Depending on the deposited metallic material, various magnetic properties, from paramagnetic to ferromagnetic, are achieved. Finally, uniform hollow metallic spheres composed of nickel, cobalt, or nickel-cobalt alloy are obtained by dissolving the polymer core.     

镍钴磷包覆的碳纳米管与成分关联的磁性能

用化学镀方法在碳纳米管表面沉积了具有不同镍／钴成分配比的镍钴磷合金层．讨论了Co^2＋与Ni^2＋的浓度比、镀液温度、pH值对沉积速率的影响．并利用场发射扫描电镜、透射电镜、X射线衍射仪、能谱仪和磁性测疑仪对镍钴磷包覆碳纳米管进行了系统的结构和性能表征．结果表明：当镀液中Co^2＋与Ni^2＋的浓度比为1,pH值为9时沉积速率最大;镀液温度的升高会使沉积速率增大．磁性测试结果显示碳纳米管表面镀覆Ni—Co—P镀层后,其磁性能对镀层中的Ni、Co相对含量有强烈的依赖性．当Co^2＋：Ni^2＋=2：1时,饱和磁化强度最大．矫顽力分别在Co^2＋：Ni^2＋=1：2和Co^2＋：Ni^＋2＋=4：1时有2个峰值;而磁导率分别在Co^2＋：Ni^2＋=1：4和Co^2＋：Ni^2＋=4：1时有2个峰值．     

On the formation of the interlayer between Ni-P coating and AZ33 magnesium alloy substrate by means of in situ SEM observation

Pre-treatment process is the key step for electroless plating. Once a suitable pre-treatment film is in place, the desired metals can be plated. In this paper, Ni-P coating was successfully prepared on AZ33 magnesium alloy with Mg（OH）2 pre-treatment film by electroless plating. To investigate the role of MgF2 in Ni-P coating, the deposition procedures between Mg（OH）2 pre-treatment film and Mg（OH）2-MgF2 pre-treatment film （a traditional process） were compared. The surface morphology variations of coatings were observed with scanning electron microscopy and the compositions were analyzed by energy dispersive spectrometry. The results showed that during the plating, both MgF2 and Ni-P deposited at the initial stage, and MgF2 distributed in the bottom of the coating, forming a transitional interlayer with Ni- P. According to the heat quench test, a poor adhesion of the coating mainly occurred between the MgF2 and Ni-P coating.     

2,2′-联吡啶在化学镀铜中的作用研究

研究了以次磷酸钠作还原剂的化学镀铜体系,添加剂2,2′-联吡啶对化学镀铜沉积速率、次磷酸钠阳极氧化和铜离子阴极还原、以及镀层形貌、结构和组分存在状态的影响.结果表明,2,2′-联吡啶对化学沉积起阻化作用.电化学线性伏安扫描实验显示,镀液中加入2,2′-联吡啶,次磷酸钠的氧化峰电势有所负移,但峰电流减小;铜离子的还原峰电势负移,但峰电流逐渐增大.扫描电子显微镜(SEM)、能量色散谱(EDS)、X射线衍射(XRD)及X射线光电子能谱(XPS)等实验分别表明,添加剂使镀层致密和光亮、镍含量降低;镀层为Cu-Ni合金,呈面心立方结构,无明显晶面择优取向现象;镀层中铜和镍以金属态存在,磷的质量含量小于0.05%.     

双光子微纳加工技术结合化学镀工艺制备三维金属微弹簧结构

利用飞秒激光双光子微纳加工技术与化学镀工艺制备了三维金属微弹簧结构.采用扫描电子显微镜(SEM)及选区电子能谱(EDS)对镀层进行了表征,当化学镀时间为15 min时,所得到的镀层厚度约为130 nm.对不同电镀时间下获得的镀层电阻率进行了测定,实验结果表明,当电镀时间为35 min时得到的镀层电阻率约为80×10^-9 Ω·m,仅为银块体材料电阻率16×10^-9 Ω·m的5倍.利用这种方法,我们制备了总长度为28.75 μm、周期为2.93 μm的悬空金属弹簧结构,其中弹簧圈数为9圈,直径为6 μm,弹簧线分辨率为1.17 μm.文中所述的将双光子微纳加工技术与化学镀技术相结合的方法可以实现任意三维微金属结构与器件的制备,在微光学器件、微机电系统(MEMS)及微传感器等领域有着广泛的应用前景.     

Coaxial metal and magnetic alloy nanotubes in polycarbonate templates by electroless deposition

We present a novel technique for the preparation of coaxial metal and magnetic alloy nanotubes, which is demonstrated for the coaxial nanotubes of Ni/Co and Ni/CoNiFe alloys deposited in activated polycarbonate templates using electroless plating. For each metal or alloy the tube wall thickness was controlled to be less than 100 nm. The process involved two consecutive deposition steps from hypophosphite and/or borane reducing agent based electroless plating solutions. We further characterise the magnetic properties of the ternary magnetic alloy films and coaxial nanotubes. The coaxial tubes show homogenous wall thickness and composition, which is delineated from the magnetic measurements.     

乙二胺在化学沉积Ni-B合金中的机理

研究乙二胺稳定剂对化学镀N i-B合金沉积速率和镀液稳定性的影响.实验表明,少量乙二胺可改善镀液的稳定性.镀液的电化学测试发现,乙二胺对体系的阳极过程和阴极过程均有影响,还原剂的氧化电流和合金的还原电流均随乙二胺加入量的增加而减少.红外光谱显示乙二胺附在镍基体表面发生化学吸附,从而抑制了还原剂的氧化,降低N i-B化学沉积速率(稳定了镀液).     

Fabrication of a gold microelectrode for amperometric detection on a polycarbonate electrophoresis chip by photodirected electroless plating

A novel method of photoresist-free micropatterning coupled with electroless gold plating is described for the fabrication of an integrated gold electrode for electrochemical detection (ED) on a polycarbonate (PC) electrophoresis microchip. The microelectrode layout was photochemically patterned onto the surface of a PC plate by selective exposure of the surface coated without photoresist to 254 nm UV light through a chromium/quartz photomask. Thus, the PC plate was selectively sensitized by formation of reactive chemical moieties in the exposed areas. After a series of wet chemistry reactions, the UV-exposed area was activated with a layer of gold nanoparticles that served as a seed to catalyze the electroless plating. The gold microelectrode was then selectively plated onto the activated area by using an electroless gold plating bath. Nonselective gold deposition on the unwanted areas was eliminated by sonication of the activated PC plate in a KSCN solution before electroless plating, and the adhesion of the plated electrodes to the PC surface was strengthened with thermal annealing. Compared with the previously reported electroless plating technique for fabrication of microelectrodes on a microchip, the present method avoided the use of a membrane stencil with an electrode pattern to restrict the area to be wet-chemically sensitized. The CE with integrated ED (CE-ED) microchip was assembled by thermal bonding an electrode-plated PC cover plate to a microchannel-embossed PC substrate. The novel method allows one to fabricate low-cost, electrode-integrated, complete PC CE-ED chips with no need of a clean room. The fabricated CE-ED microchip was demonstrated for separation and detection of model analytes, including dopamine (DA) and catechol (CA). Detection limits of 0.65 and 1.03 microM were achieved for DA and CA, respectively, and theoretical plate number of 1.4 x 10(4) was obtained for DA. The plated gold electrode can be used for about 4 h, bearing usually more than 100 runs before complete failure.     

Creation of magnetic cerasomes through electroless plating and their manipulation using external magnetic fields

Magnetic cerasome, an artificial cell membrane having ultrathin magnetic metal layers on the surface, was prepared through electroless plating of magnetic metal alloy onto an organic–inorganic vesicular nanohybrid “cerasome.” Morphological and functional characteristics of the magnetic cerasome were evaluated using various physical measurements: scanning and transmission electron microscopies, energy-dispersive X-ray spectroscopy, electron tomography, and vibrating sample magnetometry. The results proved that high morphological stability of the cerasome was important for constructing the magnetic lipid vesicle and that insertion of an alkylated metal ligand into the cerasome was essential to the magnetic metal alloy deposition on the cerasome surface. Fluorescence microscopic observations revealed that the magnetic cerasomes were collected reversibly on the slide glass surface and manipulated depending on external motion of a magnet. The potential use of the magnetic cerasomes as a novel vesicular nanohybrid is also described in this report.     

Ni-P-C复合材料的制备及其电催化产氢性能研究

通过化学镀技术制备了亚微米级的Ni-P镀层石墨粉复合粉体新材料(即Ni-PC).采用扫描电子显微镜、X-射线能谱仪、X-射线粉末衍射仪对Ni-P-C复合粉体分别进行表面形貌分析、表面成分分析和物相分析.通过对Ni-P-C材料电极进行电解水析氢、循环伏安和Tafel极化等电化学测试,研究对比了Ni-P-C(石墨)材料与试剂石墨粉体以及纯Ni电极的电化学催化产氢性能.结果表明:利用化学镀技术成功地在石墨粉体表面镀上了一层亚微米级且均匀、致密的非晶态Ni-P合金.Ni-P-C(石墨)复合电极材料析氢能力强,具有良好的电化学活性.