电压应力下超薄栅氧化层n-MOSFET的击穿特性

研究了90nm工艺下栅氧化层厚度为1.4nm的n-MOSFET的击穿特性，包括V-ramp(斜坡电压)应力下器件栅电流模型和CVS(恒定电压应力)下的TDDB(经时击穿)特性，分析了电压应力下器件的失效和退化机理.发现器件的栅电流不是由单一的隧穿引起，同时还有电子的翻越和渗透.在电压应力下，SiO₂中形成的缺陷不仅降低了SiO₂的势垒高度，而且等效减小了SiO₂的厚度(势垒宽度).另外，每一个缺陷都会形成一个导电通道，这些导电通道的形成增大了栅电流，导致器件性能的退化，同时栅击穿时间变长. 关键词： 超薄栅氧化层 斜坡电压 经时击穿 渗透     

薄SixOyNz膜击穿机理的研究

本文在研究极薄Si_xO_yN_x膜击穿特性的基础上,探讨了氮化SiO₂膜的击穿机构,讨论了氮化影响击穿性能的因素。实验结果与理论分析表明,氮化后的SiO₂膜击穿性能的改善主要决定于膜中及表界面的微观结构的改善及成分的改变。虽然,氮化引起介质膜带隙宽度的变窄将导致击穿电场的下降,但致密的材料结构、变得平整的表界面及陷阱的影响将大大推迟击穿的发生。实验结果表明,氮化SiO₂膜的本征型 关键词：     

150?快速热氮化SiO2膜的击穿特性

对具有器件质量的150?厚SiO₂膜经传统的长时间热氮化和高温快速热氮化后,研究了其击穿特性及其在高场强下的耐久力。研究结果表明,氮化后击穿场强的分布变窄,对栅电极面积的依赖性减弱,最大击穿场强略微下降。热氮化对高电场下SiO₂/Si界面稳定性和决定于时间的介质击穿均有改善。这种改善既取决于所加栅电压的极性,又强烈依赖于氮化工艺条件。根据电流传输机构,本文提出一种考虑了电荷积累、陷阱密度及其重心位置的击穿模型。 关键词：     

超薄栅氧化层n-MOSFET软击穿后的导电机制

研究了恒压应力下超薄栅氧化层n型金属-氧化物-半导体场效应晶体管（n-MOSFET）软击穿 后的导电机制.发现在一定的栅电压V_g范围内，软击穿后的栅电流I_g符合Fowl er-Nordheim隧穿公式，但室温下隧穿势垒_b的平均值仅为0936eV，远小于S i/Si O₂界面的势垒高度315eV.研究表明，软击穿后，处于Si/SiO₂界 面量子化能级上的 电子不隧穿到氧化层的导带，而是隧穿到氧化层内的缺陷带上._b与缺陷带能 级和电 子所处的量子能级相关；高温下，激发态电子对隧穿电流贡献的增大导致_b逐 渐降低. 关键词： 软击穿 栅电流 类Fowler-Nordheim隧穿 超薄栅氧化层     

Au/(SiO2/Si/SiO2)纳米双势垒/n+-Si结构的电致发光研究

利用射频磁控溅射方法,在n⁺-Si衬底上淀积SiO₂/Si/SiO_{2纳米双势垒单势阱结构,其中Si层厚度为2至4nm,间隔为0.2nm,邻近n⁺-S i衬底的SiO2层厚度固定为1.5nm,另一SiO2层厚度固定为3nm.为了 对比研究,还制备了Si层厚度为零的结构,即SiO2(4.5nm)/n⁺-Si 结构.在经过600℃氮气下退火30min,正面蒸上半透明Au膜,背面也蒸Au作欧姆接触后,所 有样品都在反向偏置(n^＋-Si的电压高于Au电极的电压)下发光,而在正向偏压 下不发光.在一定的反向偏置下,电流和电致发光强度都随Si层厚度的增加而同步振荡,位 相相同.所有样品的电致发光谱都可分解为相对高度不等的中心位于2.26eV(550nm)和1.85eV (670nm)两个高斯型发光峰.分析指出该结构电致发光的机制是：反向偏压下的强电场使Au/( SiO2/Si/SiO2)纳米双势垒/n⁺-Si结构发生了雪崩击穿 ,产生大量的电子-空穴对,它们在纳米SiO2层中的发光中心(缺陷或杂质)上复 合而发光. 关键词： 电致发光 纳米双势垒 高斯型发光峰 雪崩击穿}     

薄栅氧化层经时击穿的实验分析及物理模型研究

通过衬底热载流子注入技术,对薄SiO₂层击穿特性进行了研究.与通常的F-N应力实验相比较,热载流子导致的薄栅氧化层击穿显示了不同的击穿特性.通过计算注入到氧化层中的电子能量和硅衬底的电场的关系表明,热电子注入和F-N隧穿的不同可以用氧化层中电子的平均能量来解释.热空穴注入的实验结果表明薄栅氧化层的击穿不仅由注入的空穴数量决定.提出了全新的热载流子增强的薄栅氧化层经时击穿模型 关键词： 薄栅氧化层 经时击穿 衬底热载流子 击穿电荷 模型     

SiOxNy薄膜的微观结构与新的电流传输机理模型

本文研究了SiO_xN_y薄膜的微观结构和电流传输行为,并提出一个新的,用于解释SiO_xN_y薄膜的电流传输,特别对于外加高场直到介质膜发生本征击穿前的电流传输行为的模型。理论与实验符合较好。采用新模型满意地解释了膜的l-V特性中出现的电流增加和陷阱台阶现象,并对外加电场和电子陷阱对电流传输行为的影响进行了讨论。 关键词：     

AlGaN/GaN异质结Ni/Au肖特基表面处理及退火研究

采用O₂等离子体及HF溶液对AlGaN/GaN异质结材料进行表面处理后，Ni/Au肖特基接触特性比未处理有了明显改善，反向泄漏电流减小3个数量级.对制备的肖特基接触进行200—600℃ 5min的N₂气氛退火，发现退火冷却后肖特基反向泄漏电流随退火温度增大进一步减小.N₂气中600℃退火后肖特基二极管C-V特性曲线在不同频率下一致性变好，这表明退火中Ni向材料表面扩散减小了表面陷阱密度；C-V特性曲线随退火温度增大向右移动，从二维电子气耗尽电压绝对值减小反映了肖特基势垒的提高. 关键词： AlGaN/GaN 肖特基接触 表面处理 退火     

激光诱导多层光学薄膜损伤分析与仿真

提出一种全面分析光学薄膜损伤特性的方法,根据热传导理论与电子增殖理论建立激光辐照下多层介质膜的损伤理论模型。以HfO₂/SiO₂多层高反膜为例,计算红外纳秒脉冲激光作用下膜系内部的温度场、应力场以及自由电子数密度分布,对其热学特性与电子增殖特性进行综合评估后,得到不同输入条件下膜系的损伤阈值。结果表明,薄膜材料的损伤特性会受到驻波场的影响,在1064 nm波长的激光辐照下HfO₂/SiO₂ 多层介质薄膜的热致应力损伤效应先于热熔融效应先于场效应发生,且薄膜中SiO₂层发生热损伤,而薄膜并未发生场损伤,此外薄膜的损伤阈值随着激光脉宽的增大而增大。     

Snapback应力引起的90 nm NMOSFET's栅氧化层损伤研究

实验结果发现突发击穿(snapback)，偏置下雪崩热空穴注入NMOSFET栅氧化层，产生界面态，同时空穴会陷落在氧化层中.由于栅氧化层很薄，陷落的空穴会与隧穿入氧化层中的电子复合形成大量中性电子陷阱，使得栅隧穿电流不断增大.这些氧化层电子陷阱俘获电子后带负电，引起阈值电压增大、亚阈值电流减小.关态漏泄漏电流的退化分两个阶段：第一阶段亚阈值电流是主要成分，第二阶段栅电流是主要成分.在预加热电子(HE)应力后，HE产生的界面陷阱在snapback应力期间可以屏蔽雪崩热空穴注入栅氧化层，使器件snapback开态和关态特性退化变小. 关键词： 突发击穿 软击穿 应力引起的泄漏电流 热电子应力     

SiOxNy薄膜高场电子陷阱和释放特性的研究

本文研究热氮氧化硅(SiO_xN_y)薄膜在高场下的电子陷阱和被陷电子的释放。发现:当样品被氮化的程度较轻时,膜中的有效电子陷阱表面浓度随着样品被氮化时间的增加而迅速增加,被陷电子的释放率近于零,与样品被短路的时间及外加反向电场的持续时间和大小(直到8MV/cm)无关,电子陷阱能级是较深的;当样品被氮化的程度较重时,随着对样品氮化时间的进一步增加,膜中的有效电子陷阱表面浓度逐渐减小,电子陷阱能级深度逐渐变浅,被陷电子的释放率逐渐增加,并与外加反向电场和外加反向电场的 关键词：     

Comparative analysis of breakdown mechanism in thin SiO<Subscript>2</Subscript> oxide films in metal–oxide–semiconductor structures under the action of heavy charged particles and a pulsed voltage

Regularities in the breakdown of thin SiO₂ oxide films in metal–oxide–semiconductors structures of power field-effect transistors under the action of single heavy charged particles and a pulsed voltage are studied experimentally. Using a phenomenological approach, we carry out comparative analysis of physical mechanisms and energy criteria of the SiO₂ breakdown in extreme conditions of excitation of the electron subsystem in the subpicosecond time range.     

Wear-out and breakdown of rf sputtered Ta2O5 films on silicon

The evolution of the gate voltage during the constant current stress of Ta₂O₅ films grown on silicon exhibits an additional decreasing region, compared to the case of SiO₂ films. That phenomenon has been previously attributed to the thickness lowering of the ultrathin SiO₂ interfacial layer naturally grown during the Ta₂O₅ deposition. Based on the previously proposed method of the evolution of the capacity in accumulation with the stress time, a simplified phenomenological model of capacitors in series was developed and employed as a tool for monitoring the degradation of the insulating film. In some cases breakdown events manifested by abrupt changes of the capacity in accumulation were observed, e.g., the case with the voltage on the silicon dioxide films. In other cases, saturation of the capacity in accumulation was detected, indicating continuous degradation of the SiO₂ layer till its final destruction. The above effect was not observed in SiO₂ films and can be peculiar for Ta₂O₅/SiO₂ or similar stacked layers. PACS 73.61.-r; 77.22.Jp; 77.55.+f     

低成本溶胶-凝胶法制备SiO2/TiO2双层膜的减反射与自清洁性能

将玻璃基底依次在低成本的SiO₂溶胶和TiO₂溶胶中浸渍后,在500 oC下煅烧制备了同时具备减反射与自清洁性能的SiO₂/TiO₂双层膜．该膜的光学性能与结构特征分别通过紫外-可见分光光度计和场发射扫描电镜进行了表征．同时,源于超亲水性和光催化作用的自清洁性能也凸显出来．实验结果表明制备SiO₂/TiO₂双层膜对光的透射率最高可达到95%,同时具备自清洁性能．     

Photocatalytic TiO2 films deposited by rf magnetron sputtering at different oxygen partial pressure

Titanium dioxide (TiO₂) films were deposited onto non-alkali glass substrates by r.f. magnetron sputtering at an [O₂/(Ar + O₂)] flow-rate of 0, 20, 40, 60 and 70%, respectively. The sputtering pressure was 10 mtorr, substrate temperature was around 450 °C after 3 h deposition. The crystalline structure, surface morphology and photocatalytic activity of the TiO₂ films were affected by various [O₂/(O₂ + Ar)] flow-rate ratios. The films were characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and UV–vis–NIR spectroscopy. X-ray diffraction spectra showed that all the films display anatase (1 0 1) preferred orientation. Photoinduced decomposition of methylene blue (MB) and photoinduced hydrophilicity were enhanced when the [O₂/(Ar + O₂)] flow-rate increased to 60%.     

Interface modification and trap-type transformation in Al-doped CdO/Si-nanowire arrays/p-type Si devices by nanowire surface passivation

The present work reports the fabrication and detailed electrical properties of Al-doped CdO/Si-nanowire (SiNW) arrays/p-type Si Schottky diodes with and without SiNW surface passivation. It is shown that the interfacial trap states influence the electronic conduction through the device. The experimental results demonstrate that the effects of the dangling bonds at the SiNW surface and Si vacancies at the SiO_x/SiNW interface which can be changed by the Si–O bonding on the energy barrier lowering and the charge transport property. The induced dominance transformation from electron traps to hole traps in the SiNWs by controlling the passivation treatment time is found in this study.     

Electron and hole injection in metal-oxide-nitride-oxide-silicon structures

The kinetics of electron and hole accumulation in metal-oxide-nitride-oxide-semiconductor structures is studied. Experimental data are compared with a theoretical model that takes into account tunnel injection, electron and hole capture by traps in amorphous silicon nitride SiN_x, and trap ionization. Agreement between experimental and calculated data is obtained for the bandgap width E _g = 8.0 eV of amorphous SiO₂, which corresponds to the barrier for holes Φ_h = 3.8 eV at the Si/SiO₂ interface. The tunneling effective masses for holes in SiO₂ and SiN_x are estimated at m _h ^* ≈ (0.4–0.5)m ₀. The parameters of electron and hole traps in SiN_x are determined within the phonon-coupled trap model: the optical energy W _opt = 2.6 eV and the thermal energy W _T = 1.3 eV.     

LaTiON/LaON as band-engineered charge-trapping layer for nonvolatile memory applications

Charge-trapping characteristics of stacked LaTiON/LaON film were investigated based on Al/Al₂O₃/LaTiON-LaON/SiO₂/Si (band-engineered MONOS) capacitors. The physical properties of the high-k films were analyzed by X-ray diffraction, transmission electron microscopy and X-ray photoelectron spectroscopy. The band profile of this band-engineered MONOS device was characterized by investigating the current-conduction mechanism. By adopting stacked LaTiON/LaON film instead of LaON film as charge-trapping layer, improved electrical properties can be achieved in terms of larger memory window (5.4 V at ±10-V sweeping voltage), higher program speed with lower operating gate voltage (2.1 V at 100-μs +6 V), and smaller charge loss rate at 125 °C, mainly due to the variable tunneling path of charge carriers under program/erase and retention modes (realized by the band-engineered charge-trapping layer), high trap density of LaTiON, and large barrier height at LaTiON/SiO₂ (2.3 eV).