功能梯度压电压磁材料中裂纹对SH波的散射

研究无限大功能梯度压电/压磁复合材料中裂纹对SH波的散射问题.为了便于分析,假设材料性质沿着裂纹的法线方向是指数变化.利用Fourier余弦变化,将问题转化为对偶积分方程的求解,此对偶积分方程采用Copson方法求解.然后求得应力强度因子、电位移强度因子、磁通量强度因子的解析表达式,最后数值算例给出了材料参数、入射角及波数对标准动应力强度因子的影响.     

功能梯度压电带中裂纹对SH波的散射

研究功能梯度压电带中裂纹对SH波的散射问题,为了便于分析,材料性质假定为指数模型,并假设裂纹面上的边界条件为电渗透型的.根据压电理论得到压电体的状态方程,利用Fourier积分变换,问题转化为对偶积分方程的求解.用Copson方法求解积分方程.求得了裂纹尖端动应力强度因子、电位移强度因子的解析表达式,最后数值结果显示了标准动应力强度因子与入射波数、材料参数、带宽、波数以及入射角之间的关系.     

SH波对一维六方准晶中直裂纹的散射

分析了SH波对一维六方准晶中直裂纹的散射问题。利用积分变换技术,结合Copson方法,通过求解对偶积分方程,得到声子场和相位子场应力、位移及裂纹尖端动应力强度因子的解析表达式。通过数值算例讨论了裂纹长度、入射角和入射波频率对标准动应力强度因子的影响,此研究在工程材料应用中有一定的参考价值。     

SH波在压电材料条中垂直界面裂纹处的散射

研究了SH波在压电材料条中裂纹处的散射.压电材料条两侧涂有相同梯度参数的两个半无限大功能梯度材料,裂纹垂直于界面.通过Fourier变换,利用边界条件把问题转化为柯西核奇异积分方程,然后利用Chebyshev多项式对奇异积分方程进行数值求解.通过数值计算,分析讨论了压电条的几何参数和SH波频率对标准动应力强度因子的影响.     

带功能梯度材料的压电底层中周期裂纹对SH波的散射

本文研究了压电材料底层中周期裂纹对SH波的散射,通过渗透边界条件和界面上连续边界条件,将问题转化为一组带Hilbter核的奇异积分方程。利用利用切比雪夫多项式逼近方法求解Hilbter核的奇异积分方程,给出了标准动应力强度因子和电位移强度因子的表达式。最后通过数值算例说明了几何参数、物性参数,入射波频率和振幅等对强度因子的影响.     

SH波与功能梯度材料静止裂纹的相互作用

利用功能梯度材料剪切模量和密度的指数模型，利用积分变换－积分方程方法，对无限大体SH波作用下的功能梯度材料理解纹进行了求解。通过理论分析给出了裂纹尖端的动应力强度因子，通过数值计算给出了材料的剪切模量梯度，频率对动应力强度因子的影响。     

压电压磁复合材料中裂纹对反平面简谐弹性波的散射问题

分析了压电压磁复合材料中裂纹对反平面简谐弹性波的散射问题。利用傅立叶变换,使问题的求解转换为对一对以裂纹表面上的位移差为未知变量的对偶积分方程的求解。为了求解对偶积分方程,把裂纹面上的位移差展开为雅可比多项式形式,进而得到了裂纹长度、入射波波速及入射波频率对裂纹应力强度因子的影响。从数值结果可以看出,压电压磁复合材料中可导通裂纹的反平面问题的动应力奇异性与一般弹性材料中的反平面断裂问题动应力奇异性相同。     

非均匀弹性材料中反平面的运动裂纹

用解析方法研究了非均匀弹性材料中反平面运动裂纹问题。首先采用余弦变换求解非均匀材料的基本方程，然后根据混合边值条件建立裂纹运动的对偶积分方程，再把对偶积分方程化为第二类Fredholm积分方程。给出了数值算例，计算结果表明材料的非均匀性对动应力强度因子有较大的影响。     

压电体中孔边Ⅲ型界面裂纹的动应力强度因子

采用Green函数法研究界面上含圆孔边界径向有限长度裂纹的两半无限压电材料对SH波的散射和裂纹尖端动应力强度因子问题.首先构造出具有半圆型凹陷半空间的位移Green函数和电场Green函数,然后采用裂纹"切割"方法构造孔边裂纹,并根据契合思想和界面上的连接条件建立起求解问题的定解积分方程.最后作为算例,给出了孔边界面裂纹尖端动应力强度因子的计算结果图并进行了讨论.     

含直对称裂纹的一维六方压电准晶对SH波的散射Scattering of SH wave by a linear symmetric crack at one-dimensional piezoelectric hexagonal quasicrystals

利用积分变换技术,结合Copson方法,研究了含直线型对称裂纹的一维六方压电准晶对SH波的散射问题。通过求解对偶积分方程,得到声子场、相位子场应力、位移及电场电位移分量的解析解。定义了裂纹尖端应力强度因子及电位移强度因子,给出了电非渗透性条件下应力强度因子及电位移强度因子的解析解。此研究结果对压电准晶材料的工程应用有一定的理论价值。     

SCATTERING OF THE HARMONIC STRESS WAVE BY CRACKS IN FUNCTIONALLY GRADED PIEZOELECTRIC MATERIALS

The present paper considers the scattering of the time harmonic stress wave by a single crack and two collinear cracks in functionally graded piezoelectric material （FGPM）. It is assumed that the properties of the FGPM vary continuously as an exponential function. By using the Fourier transform and defining the jumps of displacements and electric potential components across the crack surface as the unknown functions, two pairs of dual integral equations are derived. To solve the dual integral equations, the jumps of the displacement and electric potential components across the crack surface are expanded in a series of Jacobi polynomials. Numerical examples are provided to show the influences of material properties on the dynamic stress and the electric displacement intensity factors.     

Anti-plane dynamic hole–crack interaction in a functionally graded piezoelectric media

The anti-plane dynamic problem of a functionally graded piezoelectric plane containing a hole–crack system is treated by a non-hypersingular traction-based boundary integral equation method. The material parameters vary exponentially in the same manner in an arbitrary direction. The system is loaded by an incident SH-type wave, and impermeable boundary conditions are assumed. Using a frequency-dependent fundamental solution of the wave equation, the boundary value problem is transformed into a system of integro-differential equations along the boundary of the hole and on the crack line. Its numerical solution yields the dynamic stress intensity factors and stress concentration factors. A parametric study reveals their dependence on the hole–crack scenario and its geometry, characteristics of the dynamic load and magnitude and direction of material inhomogeneity.     

The scattering of general SH plane wave by interface crack between two dissimilar viscoelastic bodies

The scattering of general SH plane wave by an interface crack between two dissimilar viscoelastic bodies is studied and the dynamic stress intensity factor at the crack-tip is computed. The scattering problem can be decomposed into two problems: one is the reflection and refraction problem of general SH plane waves at perfect interface (with no crack); another is the scattering problem due to the existence of crack. For the first problem, the viscoelastic wave equation, displacement and stress continuity conditions across the interface are used to obtain the shear stress distribution at the interface. For the second problem, the integral transformation method is used to reduce the scattering problem into dual integral equations. Then, the dual integral equations are transformed into the Cauchy singular integral equation of first kind by introduction of the crack dislocation density function. Finally, the singular integral equation is solved by Kurtz's piecewise continuous function method. As a consequence, the crack opening displacement and dynamic stress intensity factor are obtained. At the end of the paper, a numerical example is given. The effects of incident angle, incident frequency and viscoelastic material parameters are analyzed. It is found that there is a frequency region for viscoelastic material within which the viscoelastic effects cannot be ignored. This work was supported by the National Natural Science Foundation of China (No.19772064) and by the project of CAS KJ 951-1-20     

Dynamic stress intensity factor for cracked functionally graded orthotropic medium under time-harmonic loading

Dynamic stress intensity factor for a Griffith crack in functionally graded orthotropic materials under time-harmonic loading is investigated in the present paper. By using the Fourier transform and defining the jumps of displacement components across the crack surface as the unknown functions, two pairs of dual integral equations are derived. To solve the dual integral equations, the jumps of the displacement components across the crack surface are expanded in a series of Jacobi polynomial. Numerical examples are provided to show the effects of material properties and the crack configuration on the dynamic stress intensity factors of the functionally graded orthotropic materials with a Griffith crack.     

SHEAR WAVE SCATTERING FROM A PARTIALLY DEBONDED PIEZOELECTRIC CYLINDRICAL INCLUSION

I. INTRODUCTION Owing to the intrinsic coupling characteristics between electric and elastic behaviors, piezoelectricmaterials have been used widely in technology such as transducers, actuators, sensors, etc. Studieson electroelastic problems of a piezo…     

DYNAMIC STRESS FIELD AROUND THE MODE Ⅲ CRACK TIP IN AN ORTHOTROPIC FUNCTIONALLY GRADED MATERIAL

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