1064 nm激光致熔石英损伤的数值模拟研究

为了研究1064 nm激光对增透熔石英的热应力损伤机理以及等离子体分布等效应。基于热传导和气体动力学理论,探究了毫秒激光对增透熔石英的热应力损伤和致燃损伤的理论模型,利用comsol软件模拟了1064 nm激光作用增透熔石英时材料内部的热损伤、应力损伤以及激光支持燃烧波,模拟结果表明在激光光斑半径区域内,温升较为明显,形成较大的温度梯度,激光作用区域受热膨胀,其余区域会对膨胀发生抵制,因此材料内部产生应力,其中上表面的径向应力、环向应力在激光光斑边缘附近达到最大值,应力损伤应该先从辐照中心点或激光光斑边缘附近产生,同时发现等离子体的传播是稳态的,燃烧波的最大速度发生在最初时刻,并随着扩散时间逐渐变低。     

Surface damage morphology investigations of silicon under millisecond laser irradiation

The surface damage morphologies of single crystal silicon induced by 1064 nm millisecond Nd:YAG laser are investigated. After irradiation, the damage morphologies of silicon are inspected by optical microscope (OM) and atomic force microscope (AFM). The plasma emission spectra of the damaged region are detected by the spectrometer. It is shown that surface oxidation and nitridation have occurred during the interaction of millisecond laser with silicon. In addition, the damage morphologies induced by 2 ms and 10 ns pulse width laser are compared. The damage morphology obtained by 2 ms laser is an evident crater. Three types of damage morphologies are formed at different laser energy densities. The circular concentric ripples are found surrounding the rim of the crater. The spacing of the ripples is 15 ± 5 μm. Two types of cracks are observed: linear crack and circular crack. The linear crack is observed in the center of the damaged region which propagates to the periphery of the damaged region. The circular crack is located at the rim of the crater. The damage morphology induced by 10 ns laser is surface layer damage. The periodic linear waves are generated due to the interference between the incident beam and the scattered beam. The spacing of the ripples is 1.54 μm which is close to the incident laser wavelength 1.064 μm. The linear crack is located at the center of the damaged region. Furthermore, for the same laser energy density, the dimension of the damaged region and the crater depth induced by 2 ms laser are greater than that of 10 ns laser. It indicates that the damage mechanism under millisecond pulse laser irradiation is strongly different from the case of nanosecond pulse laser.     

强激光对燃烧室壳体的热-力毁伤研究

基于ANSYS有限元软件, 按有无内压作用, 分别对激光辐照下燃烧室壳体的温度场、热应力、应变与损伤进行了计算与分析.分析表明, 壳体的温度场分布与光束的功率分布一致, 光斑中心温度最高.壳体中应力最大值不在光斑中心, 而是位于光斑边缘处, 在壳体吸收的激光功率密度超过1 000 W/cm²时, 壳体中应力大于材料的强度极限, 壳体均会发生软化.在存在内部燃气压力的情况下, 壳体应力会产生局部集中, 沿壳体环向表面通过光斑中心中轴线区域很有可能裂口;相比较无内压的壳体, 存在内压的壳体中的应力和产生的形变均大于无内压时的壳体.因此, 为达到相同的毁伤效果, 在存在内压的情况下, 可以适当的降低激光的辐照强度.     

强激光对燃烧室壳体的热-力毁伤研究

基于ANSYS有限元软件,按有无内压作用,分别对激光辐照下燃烧室壳体的温度场、热应力、应变与损伤进行了计算与分析.分析表明,壳体的温度场分布与光束的功率分布一致,光斑中心温度最高.壳体中应力最大值不在光斑中心,而是位于光斑边缘处,在壳体吸收的激光功率密度超过1 000W/cm2时,壳体中应力大于材料的强度极限,壳体均会发生软化.在存在内部燃气压力的情况下,壳体应力会产生局部集中,沿壳体环向表面通过光斑中心中轴线区域很有可能裂口;相比较无内压的壳体,存在内压的壳体中的应力和产生的形变均大于无内压时的壳体.因此,为达到相同的毁伤效果,在存在内压的情况下,可以适当的降低激光的辐照强度.     

内表面掺硅聚苯乙烯空心微球初步研究

靶丸内表面掺杂诊断元素可以为内爆压缩界面的研究提供必要的手段。以二甲基二乙氧基硅烷为原料，利用乳液微封装技术和界面聚合技术可以实现单一内表面掺硅的空心聚苯乙烯微球的制备。X光照相和X能谱分析表明:内表面掺硅量比外表面高出2~3个数量级。均匀内表面掺硅层的厚度小于0.3μm，掺杂层厚度越小，均匀性越好。     

准分子激光辐照K9玻璃的热力效应分析

基于传热学理论, 利用有限元法对KrF准分子激光辐照K9玻璃样品中的热力效应进行了数值分析, 并比较了脉冲数目和重频对损伤效果的影响。研究表明, 较低的准分子激光能量就能够使K9玻璃在表面和体内产生热应力损伤, 热应力损伤在光斑区域内主要由压缩热应力控制, 在光斑边缘和材料内部则主要由拉伸热应力控制。在激光脉冲结束时刻, 产生的温度和热应力最大, 且热应力以热冲击波的形式在材料内传播, 随时间变化而来回振荡, 逐渐减弱。这种热应力的反复冲击会对材料产生持续的损伤增长效应, 增加了材料的损伤时间, 并使材料更容易断裂。脉冲数目和重复频率对损伤效果有着较大影响, 在高重复频率下, 损伤累积效应明显。     

CO2激光局域辐照对熔石英损伤特性的影响

研究了CO₂激光局域辐照对熔石英损伤特性的影响, 发现当辐照中心温度较低时(1139 K), 辐照对损伤阈值没有明显影响, 但辐照中心温度较高时(1638 K), 辐照对损伤阈值有明显的影响, 损伤阈值随距离辐照中心间距的增大而减小, 在残余应力产生光程差最大处附近, 损伤阈值降到最小, 随着与辐照中心间距的进一步增加, 损伤阈值略有上升. 对导致此现象的原因做了分析. 由于残余应力的存在, 在辐照中心发生再损伤产生的裂纹后, 裂纹先沿径向扩展, 在残余应力产生光程差最大处附近, 裂纹转而向切向扩展, 这可能与径向和环向张应力随半径的变化有关. 在采用热处理炉退火消除残余应力时, 必须注意元件的洁净处理, 否则退火会出现析晶现象, 对损伤阈值和透射率造成不良影响. 关键词： 2激光局域辐照')" href="#">CO₂激光局域辐照 熔石英 损伤特性     

Thermal stress cleaving of silicon wafer by pulsed Nd：YAG laser

The applied laser energy absorbed in a local area in laser thermal stress cleaving of brittle materials using a controlled fracture technique produces tensile thermal stress that causes the material to separate along the moving direction of the laser beam. The material separation is similar to crack extension, but the fracture growth is controllable. Using heat transfer theory, we establish a three-dimensional （3D） mathematical thermoelastic calculational model containing a pre-existing crack for a two-point pulsed Nd：YAG laser cleaving silicon wafer. The temperature field and thermal stress field in the silicon wafer are obtained by using the finite element method （FEM）. The distribution of the tensile stress and changes in stress intensity factor around the crack tip are analyzed during the pulse duration. Meanwhile, the mechanism of crack propagation is investigated by analyzing the development of the thermal stress field during the cleaving process.     

Role of thermal stresses on pulsed laser irradiation of thin films under conditions of microbump formation and nonvaporization forward transfer

This paper presents a theoretical analysis of the processes in thin solid films irradiated by short and ultrashort laser pulses in the regimes of film structuring and laser-induced forward transfer. The regimes are considered at which vaporization of the film materials is insignificant and film dynamics is governed mainly by mechanical processes. Thermoelastoplastic modeling has been performed for a model film in one- and two-dimensional geometries. A method has been proposed to estimate the height of microbumps produced by nanosecond laser irradiation of solid films. Contrary to femtosecond laser pulses, in nanosecond pulse regimes, stress waves across the film are weak and cannot induce film damage. The main role in laser-induced dynamics of irradiated films is played by radial thermal stresses which lead to the formation of a bending wave propagating along the film and drawing the film matter to the center of the irradiation spot. The bending wave dynamics depends on the hardness of the substrate underlying the film. The causes of the receiver substrate damage sometimes observed upon laser-induced forward transfer in the scheme of the direct contact between the film and the receiver are discussed.     

毫秒脉冲激光致硅光电二极管电学损伤的有限元分析及实验研究

为了研究毫秒脉冲激光致硅基PIN光电二极管电学损伤,基于热传导及弹塑性力学理论,在光电二极管内部材料各向同性并且P-I-N三层结构之间满足温度连续和热流平衡条件下,建立毫秒脉冲激光辐照硅基PIN光电二极管二维轴对称模型,采用有限元方法模拟分析了1064 nm Nd:YAG毫秒量级脉冲激光辐照硅基PIN光电二极管的温度场与应力场分布,并实验测量了硅基PIN光电二极管实验前后的电学参数.结果表明,激光辐照硅基PIN光电二极管时,温升使材料表面熔融、烧蚀,并且在空间上存在温度梯度变化,即激光辐照产生的热与应力使光敏面及硅晶格晶键损伤,最终造成光电探测器的探测性能下降.研究结果可为毫秒脉冲激光辐照硅基PIN光电二极管电学损伤机理奠定基础.     

高功率脉冲电子束辐照SiO$lt;sub$gt;2$lt;/sub$gt;的光学和激光损伤性能

研究了不同剂量的60 kW高功率脉冲电子束辐照对高纯熔石英玻璃的微观结构、光学性能和激光损伤特性的影响规律. 光学显微图像表明, 辐照后熔石英样品由于热效应导致表面破裂, 裂纹密度和尺寸随辐照剂量增加而增大, 采用原子力显微镜分析表面裂纹的微观形貌, 裂纹宽度约1 um, 同时样品表面分布着大量尺寸约0.1–1μm的碎片颗粒. 吸收光谱测试表明, 所有样品均在394 nm处出现微弱的吸收峰, 吸收强度随着电子束辐照剂量增大呈现先增加后减小的趋势. 荧光光谱测试发现辐照前后样品均有3个荧光带, 分别位于460, 494和520 nm, 荧光强度随辐照剂量的变化趋势与吸收光谱一致. 利用355 nm激光研究了不同剂量电子束辐照对熔石英激光损伤阈值的影响, 结果表明熔石英的损伤阈值随着辐照剂量的增加而降低. 在剂量较低时, 导致熔石英激光损伤阈值下降的原因主要是色心缺陷; 剂量较高时, 导致损伤阈值降低的原因主要是样品表面产生的大量微裂纹和碎片颗粒对激光的调制和吸收. 关键词： 熔石英 电子束辐照 色心 激光损伤阈值     

激光辐照碲镉汞红外焦平面探测器的热应力损伤研究

基于碲镉汞红外焦平面探测器的结构与其材料热力学相关特征,描述了激光辐照碲镉汞红外焦平面探测器造成的损伤机理。根据相关的辐照环境和条件,通过有限元分析法建立了三维仿真模型。基于COMSOL Multiphysics软件仿真了碲镉汞红外探测器受到波长10.6 μm的激光辐照时,探测器各部分的温度变化及应力变化情况;通过数值分析方法,比较了碲镉汞探测器在经过光斑面积相同。功率不同的激光辐照后,其表面径向及内部轴向的温度场变化及应力场变化情况。仿真结果表明:在经过106 W/cm2的连续激光辐照后碲镉汞探测器表面温度与应力快速升高,造成探测器表面损伤,同时探测器被辐照部位的温度变化也导致其内部局部应力值变化。将碲镉汞探测器的应力损伤阈值及变化趋势与文献中相关实验数据进行对比,发现二者结果基本一致,验证了模型的可行性。     

Fracture of diamond coatings by high velocity sand erosion

This paper describes a study of the behaviour of diamond coatings when subjected to solid particle erosion from sand particles. The coatings were deposited by chemical vapour deposition (CVD) onto tungsten substrates and tested using a high velocity air–sand erosion test facility. The erosion tests were conducted using particle impact velocities of between 33 and 268 m/s. Examination of the eroded test specimens showed that the principal damage features were circumferential cracks and pin-holes. Comparison with Hertz impact theory revealed that the measured circumferential crack diameters were more than double the predicted Hertzian contact diameter. Moreover, a trend of increasing circumferential crack diameter with coating thickness, which is not predicted by Hertz, was found. Instead, the crack diameters showed good agreement with those predicted by the theory of stress wave reinforcement, which is more commonly associated with liquid impact damage of brittle materials. During impact, the bulk compression and shear waves are reflected at the rear surface of debonded regions of the coating to return to the front surface and reinforce the Rayleigh surface wave, which generates a tensile stress. Where this stress exceeds the local tensile strength of the coating, a ring of cracks surrounding the area of impact is created. The results from the present study therefore suggest that stress wave reflection is responsible for the formation of the cracks at locally debonded regions of the coating. This hypothesis was supported by images acquired using scanning acoustic microscopy, which showed that circumferential cracks and pin-holes were only found on areas of the coating that had become delaminated by multiple particle impacts during the erosion tests.     

Visualization of nanosecond laser-induced dewetting,ablation and crystallization processes in thin silicon films

In the present work, nanosecond pulsed laser crystallization, dewetting and ablation of thin amorphous silicon films are investigated by time-resolved imaging. Laser pulses of 532 nm wavelength and 7 ns temporal width are irradiated on silicon film. Below the dewetting threshold, crystallization process happens after 400 ns laser irradiation in the spot central region. With the increasing of laser fluence, it is observed that the dewetting process does not conclude until 300 ns after the laser irradiation, forming droplet-like particles in the spot central region. At higher laser intensities, ablative material removal occurs in the spot center. Cylindrical rims are formed in the peripheral dewetting zone due to solidification of transported matter at about 500 ns following the laser pulse exposure.     

Experimental investigation on laser flattening of sheet metal

The purpose of this research is to establish the technique of laser flattening and to consider the fundamental mechanism. The thermal stress produced by heating with a laser beam is used to make a flat sheet from a sheet metal of protruded distortion. Three kinds of protrusions are chosen as the typical protruded distortion; point protrusion, line protrusion and face protrusion. For point protrusion, laser irradiation along the circular path is effective when the height of protrusion is large, and the laser irradiation along the radial path is effective when it is small. For line protrusion, laser beam is irradiated along the short straight path whose direction is normal to the centerline of the protrusion. For face protrusion, the height decreases from 1-0.1 mm by the laser irradiation along the circular path. The residual stress at the convex surface of a point protrusion on the sheet metal changes from a large compressive stress to a small tensile stress by the laser irradiation.     

CW-COIL激光辐射锗-硫化铅探测器的实验研究

本文叙述了锗－硫化铅（Ｇｅ－ＰｂＳ）探测器的基本特性。分析了激光辐射锗滤光片使用材料升温的穿透深度随时间的变化。在光斑面积２．４６ｍｍ×３．６９ｍｍ和辐照时间０．８ｓ的条件下，得到连续氧碘激光（ＣＷ－ＣＯＩＬ）辐照锗滤光片的烧蚀阈值为１２４Ｗ和破裂阈值为１７７Ｗ的实验数据。在此基础上，进行了ＣＷ－ＣＯＩＬ辐照Ｇｅ－ＰｂＳ探测器的热效应研究，在光斑直径２．１ｍｍ和辐照时间０．８ｓ的条件下，给出ＣＷ－ＣＯＩＬ使Ｇｅ－ＰｂＳ探测器致盲的阈值为１７Ｗ、永久失效的阈值为１９８Ｗ的实验结果。研究结果表明：ＣＷ－ＣＯＩＬ辐照Ｇｅ－ＰｂＳ探测器的破坏机理是激光加热和热应力联合作用的结果。锗滤光片升温，造成硫化铅探测器环境温度升高，导致其探测灵敏度下降为零是ＣＷ－ＣＯＩＬ辐照Ｇｅ－ＰｂＳ探测器产生致盲的原因。激光辐照功率越高，Ｇｅ－ＰｂＳ探测器致盲、恢复时间就越长，甚至造成永久性的失效。     

Stress damage process of silicon wafer under millisecond laser irradiation

The stress damage process of a single crystal silicon wafer under millisecond laser irradiation is studied by experiments and numerical simulations. The formation process of low-quality surface is monitored in real-time. Stress damage can be observed both in laser-on and-off periods. Plastic deformation is responsible for the first stress damage in the laser-on period. The second stress damage in the laser-off period is a combination of plastic deformation and fracture, where the fundamental cause lies in the residual molten silicon in the ablation hole.     

脉冲激光辐照硅材料引起表面波纹的特性研究

叙述了激光与材料相互作用过程中引起相干受激光散射的机制,以及形成材料表面波纹的特性。在激光波长1．06μm、能量15mJ、光斑直径2mm、脉冲半峰全宽约10ns和入射方向为布儒斯特角的条件下,进行了脉冲激光辐照硅材料形成表面波纹的实验研究。在脉冲激光辐照硅材料表面功率密度略大于材料损伤阈值的条件下,发现了硅材料表面形成的平行等间距直线条纹结构。用光学显微镜和原子力显微镜分别测量了被辐照硅材料表面的波纹形貌特征。在假设硅材料表面波纹的产生与声波在材料中的传播速度有关的条件下,由声波传播速度和激光辐照硅材料的脉冲宽度较好地解释了材料表面形成条纹的宽度．并认为在形成表面波纹的过程中,热应力起主要作用。     

长脉冲激光对组成CCD图像传感器的MOS光敏单元的硬破坏机理研究

以帧转移型面阵CCD图像传感器为例,采用有限元法研究了波长1.06 μm,脉宽ms量级长脉冲Nd:YAG激光与组成CCD传感器的MOS光敏单元的作用过程及硬破坏机理.建立了长脉冲激光辐照MOS光敏单元的热力耦合模型,模拟了MOS光敏单元的温度分布和应力分布.研究结果表明:在长脉冲激光作用下,由于S层表面径向压应力超过其抗压强度引起MOS光敏单元出现了OS层间分裂,进而受径向、环向和轴向压应力的共同作用下,在光敏单元还未熔融时,层间分裂就扩大至光敏单元的整个OS层间.OS层间完全分裂会使光敏单元发生硬破坏,并造成CCD传感器中激光照射区的单个或一列光敏单元的功能完全失效.文章的研究结果可为CCD图像传感器的激光损伤及防护提供必要的理论依据. 关键词： 长脉冲激光 CCD图像传感器 硬破坏机理 层间分裂     

Numerical study on the thermo-stress of ZrO2 thermal and barrier coatings by high-intensity pulsed ion beam irradiation

This paper studies numerically the thermo-mechanical effects of ZrO2 thermal barrier coatings (TBCs) irradiated by a high-intensity pulsed ion beam in consideration of the surface structure.Taking the deposited energy of ion beams in TBCs as the source term in the thermal conduction equation,the distribution of temperature in TBCs was simulated.Then,based on the distribution,the evolution of thermal stress was calculated by the finite element method.The results show that tensile radial stress formed at the valley of TBC surfaces after irradiation by HIPIB.Therefore,if cracks happen,they must be at valleys instead of peaks.As for the stress waves,no matter whether through peak or valley position,tensile and compressive stresses are present alternately inside TBCs along the depth direction,and the strength of stress decreases with time.