(Co)polyimides from commonly used monomers, and their nanocomposites

Synthesis of (co)polyimides from aromatic dianhydrides (pyromellitic dianhydride (PMDA), symmetric 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA)) and diamines (4,4′-oxydianiline (ODA), p-phenylenediamine (PDA)) commonly used for the production of commercial polyimides, as well as the preparation of their nanocomposites with SiO₂ nanoparticles were performed with the aim to find ways to control technical performance of polyimides. The (co)polyimide films prepared under mild thermal imidization conditions were analyzed by FTIR, WAXD, DSC and TG, and characterized by transition temperatures and the temperatures of 5% and 10% mass loss, as well as tensile parameters.Films of PMDA/sBPDA–ODA copolyimides at the ambient temperature had a 20% higher ultimate strength and exhibited a higher tensile modulus than the reference polyimide (PMDA–ODA). However, lowering the transition temperature of the polyimide by partial substitution of an sBPDA monomeric unit for PMDA resulted in lowering the modulus at higher temperatures. The best performance was exhibited by semi-crystalline films of sBPDA–ODA/PDA copolyimide, which had a 35% higher ultimate strength and a 64% higher elongation at break at the ambient temperature than the reference polyimide (sBPDA–PDA), and also retained the strength and exhibited a 200% higher elongation at a temperature of 200 °C.Unexpectedly, the elongation at break of PMDA–ODA based (co)polyimide nanocomposites with hydrophobic SiO₂ nanoparticles was greater than that of the baseline (co)polyimides. It was neither the case with PMDA–ODA nanocomposites with hydrophilic SiO₂ nanoparticles, nor with sBPDA–PDA (co)polyimide based nanocomposites with hydrophobic SiO₂ nanoparticles.     

Partly Imidized Polyamic Acid and Its UniaxialStretched Polyimide Films

Partly imidized polyamic acid(PAA) has been used to prepare high performance polyimide films. The behaviors of two polyamic acids derived from pyromellitic dianhydride(PMDA)/4,4′-oxydianiline(ODA) and 3,3′,4,4′-biphenyltetracarboxylic diahhydride(BPDA)/paraphenylenediamine(PPD) containing dehydrating agents composed of acetic anhydride and a tertiary amine as the catalyst were investigated. The gel point was dependent on imidization degree in despite of temperature and the molar ratio of catalyst to acetic acid. Imdization content was about 35% for PMDA/ODA and about 22% for BPDA/PPD. The effect of catalyst on imidization possessed an order of triethylamine>3-methylpyridine>pyridine>isoquinoline>2-methylpyridine. The stretching of the films greatly reduced the coefficient of linear thermal expansion(CTE) either in the longitudinal direction or transversal direction. Compared to the film from polyamic acid, the partly imidized film had greater stretching ratio, so that the uniaxial stretched polyimide film from partly imidized PAA had higher tensile strength and tensile modulus, but lower elongation in the stretching direction.     

Synthesis and characterization of novel fluorinated polyimides derived from 1,1′-bis(4-aminophenyl)-1-(3-trifluoromethylphenyl)-2,2,2-trifluoroethane and aromatic dianhydrides

A novel fluorinated aromatic diamine 1,1′-bis(4-aminophenyl)-1-(3-trifluoromethylphenyl)-2,2,2-trifluoroethane (6FDAM) was synthesized in a simple procedure, which was then employed to prepare a series of fluorinated polyimides with commercial aromatic dianhydrides, such as pyromellitic dianhydride (PMDA), 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane (6FDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-oxydiphthalic anhydride (ODPA). The polyimides exhibited good solubility in strong dipolar solvents such as NMP, DMAc, DMF and m-cresol as well as some of low boiling point organic solvents of THF and CHCl₃, etc. Experimental results indicated the polyimides possessed low moisture adsorptions of 0.42-0.95%, low dielectric constant of 2.71-2.95 at 1 MHz, high dielectric strength of 92.0-122.6 kV/mm and good optical transparency with cutoff wavelengths of UV-vis at 330-375 nm. The polyimides also exhibited good mechanical properties as well as excellent thermal and thermo-oxidative stability. The fluorinated polyimides possessed better solubility, lower dielectric constant and water adsorption as well as higher optical transparency than the representative non-fluorinated polyimide derived from PMDA and 4,4′-oxydianiline (ODA).     

Influence of Steric Hindrance Between Hydrogen Atoms of Linkage Groups and Adjacent Phenyls on Properties of Polyimide

A diamine monomer 4,4′-methylenedianiline(MDA) was introduced to modify the polyimide of pyromellitic dianhydride(PMDA) and 4,4′-oxydianiline(ODA) by polycondensation. A series of polyamic acids was synthesized from MDA and ODA of different molar ratios with PMDA of sum mole of moles of MDA and ODA, and polyimide films were obtained by thermal imidization. Polyimide(PI) films were characterized by tensile testing, dynamic mechanical analysis(DMA), thermal gravimetry analysis(TGA), Fourier transform infrared spectroscopy (FTIR), wide X-ray diffraction(WAXD) and molecular simulation. With the increase of MDA content, the tensile strength and thermal decomposition temperature remained generally stable compared with those of PMDA/ODA polyimide. Unexpectedly, the glass transition temperature(T_g) and Young’s modulus increased from 388.7 ℃ and 2.37 GPa to 408.3 ℃ and 5.74 GPa, respectively. The results of WAXD and molecular simulation indicate the steric hindrance among hydrogen atoms of the linkage groups and adjacent phenyls enhanced the properties of the polyimide modified with MDA.     

Preparation and characterization of a polyimide membrane

Two different polyimide semipermeable membranes have been prepared from two base polyimides of PMDA/ODA and BTDA/ODA by incorporation of lithium chloride with the respective poly(amic acids) and subsequently leaching out the maximum possible lithium chloride by water at slightly elevated temperature. The water and various organic vapor permeability of the lithium chloride modified films has been found to be better compared to the respective control films. BTDA/ODA based polyimide films show overall lower permeability.     

The effect of orientation on thermal expansion behavior in polyimide films

The anisotropy of the thermal expansion of polyimide films was investigated . Out-of-plane or thickness direction coefficients of linear thermal expansion (CTE) were calculated from the difference between the coefficient of volumetric expansion (CVE) and the sum of the in-plane or film direction coefficients of linear thermal expansion for commercial and spin-coated PMDA//ODA and BPDA//PPD films and spin coated BTDA//ODA/MPD films. The CVEs were obtained from a pressure-volume-temperature (PVT) technique based on Bridgeman bellows. The CVE was shown to be essentially constant, independent of molecular orientation and thickness. A decrease in the in-plane CTEs therefore occurs at the expense of an increase in the out-of-plane CTE. In all cases the calculated out-of-plane CTE was higher than the measured in-plane CTE. The ratio of the out-of-plane CTE to the in-plane CTE was 1.2, 3.8, and 49.3 for the spin-coated BTDA//ODA/MPD, PMDA//ODA, and BPDA//PPD films, respectively. © 1994 John Wiley & Sons, Inc.     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

Pretilt angle for BTDA,PMDA and CPDA series polyimides with various side chain lengths

Polyamic acid precursors were prepared by mixing dianhydride of 3,3',4,4'-benzophenone-tetracarboxylic dianhydride (BTDA), 1,2,3,4-benzene-tetracarboxylic dianhydride (pyrromellitic dianhydride PMDA), cis-1,2,3,4-cyclopentane-tetracarboxylic dianhydride (CPDA), the diamine (alkyl 3,5-diaminobenzoate) with side chain, and 4,4'-oxydianiline (ODA) without side chain. Copolyimide films with various side chain lengths were prepared by thermal imidization of polyamic acid precursors. The roughness of rubbed polyimide surface increased with increase in the side chain length. The pretilt angle for the BTDA and PMDA series polyimide (PI) increased exponentially with increase in side chain length. Various pretilt angles were obtained on the synthesized polyimides. In the case of CPDA series PI, the pretilt angle was nearly constant at 0 until the alkyl side chain length reached 12 (C12) and then increased markedly at C18. Models of pretilt angle generation were tested.     

Synthesis and properties of fluorinated polyimides. 1. Derived from novel 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl

A new diamine monomer, 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl (ATFT) was synthesized that led to a number of novel fluorinated polyimides by solution as well as thermal imidization routes when reacted with different commercially available dianhydrides like pyromellatic dianhydride (PMDA), benzophenone tetracarboxylic acid dianhydride (BTDA), or 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane (6FDA). The polyimides ATFT/BTDA and ATFT/6FDA derived from both routes were soluble in several organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, and dimethyl sulfoxide. The polyimide ATFT/PMDA was only soluble in N‐methylpyrollidone. The polyimide films had low water absorption of 0.3–0.7%, low dielectric constants of 2.72–3.3 at 1 Hz, refractive indices of 1.594–1.647 at 589.3 nm, and optical transparency >85%. These polyimides showed very high thermal stability with decomposition temperatures (5% weight loss) up to 532 °C in air and good isothermal stability; only 7% weight loss occurred at 400 °C after 7 h, and less than 0.6% weight loss was observed at 315 °C for 5 h. Transparent thin films of these polyimides exhibited tensile strengths up to 112 MPa, a modulus of elasticity up to 3.05 GPa, and elongation at break up to 21% depending on the repeating unit structure. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1016–1027, 2002     

Soluble copolyimides with high modulus and low moisture absorption

A series of transparent copolyimides were prepared from PMDA-ODPA-TFDB via chemical imidization of the corresponding poly(amic acid)s. Copolyimides containing less than 70% PMDA were completely soluble in DMAc and other amide solvents and gave ductile films with unexpectedly high tensile moduli (up to 8.9 GPa). Water absorption, after boiling in water for 72 h, were less than 1 % for the copolymer with 67% PMDA and less than 0.5% for copolymers with less PMDA. Thermooxidative stability was comparable to a commercial polyimide film up to 325°C. A copolyimide containing 34% PMDA had the best overall properties based on the above tests. Additional evaluations revealed a coefficient of linear expansion of about 6 X 10^?6/°C, an essentially frequency independent dielectric constant of 2.8, a dissipation factor of about 0.004–0.01 over the range of 1–1000 kHz, and complete retention of tensile properties after exposure to a humid environment for 16 weeks. A model compound study suggests the probable presence of short blocks in these copolymers. © 1993 John Wiley & Sons, Inc.     

Carbon nanocones/discs – a new type of filler to improve the thermal and mechanical properties of polymer films

The mechanical characteristics and thermal properties of composite films based on the thermally stable aromatic polyimide (PI) (PMDA‐ODA) and carbon nanocones/discs (CNC) were studied. The introduction of CNC to PMDA‐ODA leads to the substantial increase of film stiffness. The Young's modulus values of the composite films are somewhat higher than those of the previously characterized composite films of this PI filled with nanoclay, carbon nanofibers, and asbestos‐like hydrosilicate nanotubes. The introduction of CNC into PMDA‐ODA (concentrations of CNC were up to 15 vol%) does not cause any marked aggregation of nanoparticles. The presence of CNC in the PI matrix does not affect the glass transition temperature of the polymer but hinders chain mobility at temperatures above T_g. This behavior makes it possible to increase the working temperature range of the composite films containing more than 5 vol% of CNCs, up to the temperature of thermal decomposition. The introduction of CNC into PMDA‐ODA leads to dramatic (～12 orders of magnitude) increase of active electrical conductivity of the material. Copyright © 2011 John Wiley & Sons, Ltd.     

Synthesis and characterization of soluble polyimides derived from a novel unsymmetrical diamine monomer: 1,4-(2′,4″-diaminodiphenoxy)benzene

A new aromatic unsymmetrical diamine monomer, 1,4-(2′,4″-diaminodiphenoxy)benzene (OAPB), was successfully synthesized in three steps using hydroquinone as starting material and polymerized with various aromatic tetracarboxylic acid dianhydrides, including 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA), 2,2′-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride (6FDA) and pyromellitic dianhydride (PMDA) via the conventional two-step thermal or chemical imidization method to produce a series of the unsymmetrical aromatic polyimides. The polyimides were characterized by solubility tests, viscosity measurements, IR, ¹H NMR, and ¹³C NMR spectroscopy, X-ray diffraction studies, and thermogravimetric analysis. The polyimides obtained had inherent viscosities ranged of 0.38-0.58 dL/g, and were easily dissolved in common organic solvents. The resulting strong and flexible PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) of above 505 °C and the glass transition temperature in the range of 230-299 °C. Moreover, the polymer films showed outstanding mechanical properties with the tensile strengths of 41.4-108.5 MPa, elongation at breaks of 5-9% and initial moduli of 1.15-1.68 GPa.     

A novel type of Si-containing poly(urethane-imide)s: synthesis, characterization and electrical properties

A novel type of a Si-containing poly(urethane-imide) (PUI) was prepared by two different methods. In the first method, Si-containing polyurethane (PU) prepolymer having isocyanate end groups was prepared by the reaction of diphenylsilanediol (DSiD) and toluene diisocyanate (TDI). Subsequently the PU prepolymer was reacted with pyromellitic dianhydride (PMDA) or benzophenonetetracarboxylic dianhydride (BTDA) in N-methyl pyrolidone (NMP) to form Si-containing modified polyimide directly. In the second method, PU prepolymer was reacted with diaminodiphenylether (DDE) or diaminodiphenylsulfone (DDS) in order to prepare an amine telechelic PU prepolymer. Finally, the PU prepolymer having diamine end groups was reacted with PMDA or BTDA to form a Si-containing modified polyimide. Cast films prepared by second method were thermally treated at 160 °C to give a series of clear, transparent PUI films. Thermogravimetric analysis indicated that the thermal degradation of PUI starts at 265 °C which is higher than degradation temperature of conventional PU, confirming that the introduction of imide groups improved the thermal stability of PU.To characterize the modified polyimides and their films, TGA, FTIR, SEM and inherent viscosity analyses were carried out. The dielectrical properties were investigated by the frequency-capacitance method. Dielectric constant, dielectric breakdown strength, moisture uptake and solubility properties of the films were also investigated.     

Preparation of Poly(amic acid) and Polyimide via Microwave-Assisted Polycondensation of Aromatic Dianhydrides and Diamines

Summary: A copolycondesation-type poly (amic acid) (PAA) was synthesized using pyromellitic dianhydride (PMDA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) as dianhydride monomers, and 4,4′-oxydianiline (ODA) as a diamine monomer under microwave irradiation in dimethylformamide (DMF). PAA was then converted into a polyimide (PI) by an imidization. The structure and performance of the polymer were characterized by Fourier-transform infrared (FT-IR) spectroscopy, Proton nuclear magnetic resonance (¹H NMR) spectrometry, viscosity, X-ray diffraction (XRD), and thermogravimetric (TG) analyses. The results showed that under microwave irradiation, the intrinsic viscosity and the yield of PAA were increases, and the reaction time was shortened. The FT-IR spectra of the polymer revealed characteristic peaks for PI around 1778^– and 1723 cm^–1. TG curves indicated that the obtained PI began to lose weight at 535 °C, and its 10% thermal decomposition temperature under N₂ was 587 °C.     

Mechanical properties of clay–polyimide (BTDA–ODA) nanocomposites via ODA‐modified organoclay

Clay–polyimide [3,3′, 4,4′‐benzophenone tetracarboxylic dianhydride–4,4′‐oxydianiline (BTDA–ODA)] nanocomposites were synthesized from ODA‐modified montmorillonite (organoclay) and poly(amic acid). The layered silicates of organoclay were intercalated by polyimide (BTDA–ODA), as confirmed by X‐ray diffraction and by transmission electron microscopy, and the tensile mechanical properties of the nanocomposites were measured. It was found that the modulus and the maximum stress of these organoclay/BTDA–ODA nanocomposites were much higher than those of pure BTDA–ODA: a twofold increase in the modulus and a one‐half‐fold increase in the maximum stress in the case of 7/93 organoclay–BTDA‐ODA. In addition, the elongation‐for‐break of organoclay/BTDA–ODA nanocomposites is even slightly higher than that of pure BTDA–ODA, which is a sharp contrast to that of conventional inorganics‐filled polymer composites. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2873–2878, 2000     

Synthesis and characterization of new aromatic poly(ether imide)s and their gas transport properties

A series of processable fluorinated poly(ether imide)s (PIs) were synthesized by reacting a diamine monomer, 1,4-bis-[{2′-trifluromethyl 4′-(4″-aminophenyl)phenoxy}] benzene (HQA) with six different aromatic dianhydrides e.g., BPADA, 6FDA, ODPA, BPDA, BTDA and PMDA. The polyimides showed reasonably high glass-transition temperature (T_g up to 280 °C) and high thermal stability (T_d,10 up to 558 °C). The membranes of these polymers showed tensile strength up to 107 MPa with elongation at break up to 15%, low water absorption (0.61–1.29%), low dielectric constant (2.10–3.13 at 1 MHz) and high optical transparency (λ_cut-off up to 466 nm). The PI membrane prepared from 6FDA exhibited high permeability and permselectivity for O₂/N₂ (P_O2 = 11.8 and P_O2/P_N2 = 9.44) gas pair which eventually surpassed the present upper boundary limit drawn by L.M. Robeson.     

Preparation, morphology and properties of nano-sized Al2O3/polyimide hybrid films

Nano-sized Al₂O₃/polyimide (PI) hybrid films based on 4,4′-oxydianiline (ODA) and pyromellitic dianhydride (PMDA) were prepared by incorporation with different content of nano-sized Al₂O₃ via in situ polymerization. The TEM and SEM micrographs indicated that the Al₂O₃ particles were homogenously dispersed in the polyimide matrix by means of the ultrasonic treatment and the addition of coupling agent. The mechanical properties and thermal stability of the pure PI film can be improved by adequate addition of Al₂O₃. The PI hybrid film was strengthened and toughened simultaneously by the introduction of the well-dispersed Al₂O₃ particles. The PI hybrid films showed improved electrical aging performance as compared with pure PI film. Especially, the PI hybrid films with 10 wt.% of Al₂O₃ content exhibited obviously enhanced electrical aging performance with the time to failure of 3.4 times longer than that of pure PI film. The improved electrical aging performance of the hybrid film was attributed to the nano-sized Al₂O₃ particles highly dispersed in the hybrid film, which confirmed by the investigation of the morphology and the surface composition of PI hybrid film before and after electrical aging.     

Novel method for the preparation of poly(urethane–imide)s and their properties

A polymer blend consisting of polyimide (PI) and polyurethane (PU) was prepared by means of a novel approach. PU prepolymer was prepared by the reaction of polyester polyol and 2,4-tolylenediisocyanate (2,4-TDI) and then end-capped with phenol. Poly(amide acid) was prepared from pyromellitic dianhydride (PMDA) and oxydianiline (ODA). A series of oligo(amide acid)s were also prepared by controlling the molar ratio of PMDA and ODA. The PU prepolymer and poly(amide acid) or oligo(amide acid) solution were blended at room temperature in various weight ratios. The cast films were obtained from the blend solution and treated at various temperatures. With the increase of polyurethane component, the films changed from plastic to brittle and then to elastic. The poly(urethane–imide) elastomers showed excellent mechanical properties and moderate thermal stability. The elongation of films with elasticity was more than 300%. The elongation set after the breaking of films was small. From the dynamic mechanical analysis, all the samples showed a glass transition temperature (T_g) at ca. −15°C, corresponding to T_g of the urethane component, suggesting that phase separation occurred between the two polymer components, irrespective of polyimide content. TGA and DSC studies indicated that the thermal degradation of poly(urethane–imide) was in the temperature range 250–270°C. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 3745–3753, 1997     

Enhancement of properties of polyimide/silica hybrid nanocomposites by benzimidazole formed hydrogen bond

Polyimide/silica hybrid nanocomposites were prepared by sol–gel method without coupling agent. A novel diamine with a benzimidazole group, 2‐(4‐aminophenyl)‐5‐aminobenzimidazole (PABZ), was introduced to copolymerize with 4,4'‐oxydianiline (ODA) and pyromellitic dianhydride (PMDA) to synthesize polyimide (PI) matrix. The compatibility between PI and silica was improved by hydrogen bonds formed between silica phase and the –NH– group on benzimidazole of the new diamine. Highly transparent hybrid films were obtained when silica content reached as high as 30 wt%. SEM results show that silica particles with sizes much smaller than that in PMDA‐ODA/silica system disperse homogeneously in the PI matrix. Differing from most hybrid systems without coupling agent, the tensile strength of PABZ system increases from 152 MPa to 165 MPa with silica content increasing from 0 to 20 wt%, while, it decreases linearly in PMDA‐ODA system. DMA analysis shows that the introduction of PABZ largely increases the glass transition temperature (Tg) for all silica contents, which is suggested to be due to the more rigid structures and stronger interaction between the two phases. Meanwhile, the decomposition temperature and char yields at 800 °C are both higher than that of pure PIs. The structures of the hybrid films were identified by FTIR spectra, which indicate that different silica morphologies are developed, resulted from the hydrogen bonds between benzimidazole and silica phase. Copyright © 2011 John Wiley & Sons, Ltd.     

Novel Non‐Coplanar and Tertbutyl‐Substituted Polyimides: Solubility,Optical, Thermal and Dielectric Properties

A novel aromatic diamine monomer bearing tertbutyl and 4‐tertbutylphenyl groups, 3,3′‐ditertbutyl‐4,4′‐diaminodiphenyl‐4′′‐tertbutylphenylmethane (TADBP), was prepared and characterized. A series of non‐coplanar polyimides (PIs) were synthesized via a conventional one‐step polycondensation from TADBP and various aromatic dianhydrides including pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (OPDA), 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and 4,4′‐(hexafluoroisopropylidene)dipthalic anhydride (6FDA). All PIs exhibit excellent solubility in common organic solvents such as N,N‐dimethylformamide (DMF), N,N‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), dimethyl sulfoxide (DMSO), chloroform (CHCl₃), tetrahydrofuran (THF), and so on. Furthermore, the obtained transparent, strong and flexible polyimide films present good thermal stability and outstanding optical properties. Their glass transition temperatures (T_gs) are in the range of 298 to 347°C, and 10% weight loss temperatures are in excess of 490°C with more than 53% char yield at 800°C in nitrogen. All the polyimides can be cast into transparent and flexible films with tensile strength of 80.5–101 MPa, elongation at break of 8.4%–10.5%, and Young's modulus of 2.3–2.8 GPa. Meanwhile, the PIs show the cutoff wavelengths of 302–356 nm, as well as low moisture absorption (0.30% –0.55%) and low dielectric constant (2.78–3.12 at 1 MHz).