Formation of microvias in epoxy-glass composites by laser ablation

Single CO₂ laser pulses, of 10.6μm wavelength, are used to form blind microvias (holes in electronic boards for through-plating conducting paths) in copper-clad epoxy-glass laminates. The microvia dimensions depend on pulse energy and duration, the thicknesses of the epoxy-glass laminate and copper cladding, and the distribution of glass within the epoxy-glass laminate. The useful range of laser parameters, especially pulse energy, is primarily determined by the ability to metallize subsequently the blind microvias. Several conclusions can be drawn from the data. The pulse enegy should be within ±20% of the optimum value in order to form vias with a cylindrical geometry. For 300 μm thick laminates, the thickness of the copper on the bottom should be 18 μm or more. A larger range of pulse energies could be used if the glass fibre density was more uniform and if subsequent copper metallization of the blind vias could be improved.     

Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects

Machining of microvias in 100?C50???m thick CMZ glass using an excimer laser (248?nm) was investigated. The effect of various laser process parameters: pulse energy, repetition rate, irradiation time were studied to optimise the microvia drilling process and a process window was identified. Through-hole drilling of 100???m diameter (entry hole) microvias was achieved at a fluence (energy density) as low as 2.3?J/cm² with an irradiation time of 30?C40?s at a repetition rate of 20?Hz, giving a taper angle between 22?C24^° relative to the vertical. However, by increasing the fluence to 4.5?J/cm², this reduced the machining time to 5?C10?s and taper angle to 14^°, giving an exit hole diameter of around 45?C50???m. With 50???m thick glass, it was possible to machine through-hole microvias with smaller entry hole diameters down to 40???m. Machined microvias were characterised to investigate debris, recast layer and microcrack formation. Debris and recast layer around the machined features was minimised by using a protective photoresist layer coating on the glass and through appropriate operating parameter selection. Microcracks along the sidewalls of the microvias could not be avoided, but their severity depended on the laser machining parameters used.     

Numerical simulations and electrochemical experiments of the mass transfer of microvias electroforming under ultrasonic agitation

This paper explores the mass transfer mechanism of microvias electroforming under ultrasonic agitation by numerical simulations and electrochemical experiments. Firstly, the velocity distribution of electroforming solution inside the microvias under ultrasound treatment is simulated by COMSOL Multiphysics software. The ultrasonic frequency is that of 120 kHz. The ultrasonic powers are 100 W, 200 W, 300 W and 400 W, respectively. The simulation results indicate that the mean liquid velocity inside the microvias increases with the increasing of acoustic power. In addition, under a certain ultrasonic power, the mean liquid velocity will decrease with increasing the distance between microvias and transducer, the aspect ratio of microvias and the distance between cathode and central position. Secondly, electrochemical experiments are presented to investigate the effect of ultrasonic agitation on the electrode kinetics of microvias electroforming. It is found that ultrasonic treatment decreases the thickness of diffusion layer, increases the limiting diffusion current densities and further enhances the mass transfer of microvias electroforming. Compared with the silent condition, the diffusion layer thicknesses with the acoustic power of 100 W, 200 W, 300 W, 400 W are decreased by 50.0%, 64.1%, 69.3% and 74.5%, respectively. Finally, according to the results above, the 200 × 200 metal micro-column array structures are fabricated by ultrasonic electroforming under the condition of 120 kHz and 200 W. The metal micro-column is 250 μm high and has a diameter of 80 μm. The results show that ultrasonic electroforming can enhance the mass transfer of microvias electroforming, and further solve the problem of porous structure in electroforming layer. This work contributes to expanding the application of ultrasonic agitation in the microvias electroforming.     

PCB板TEA脉冲CO2激光微孔研究

印刷电路板（PCB）微孔技术是实现高密度互联技术的关键,我国在这方面的研究还刚刚起步,所采用的激光器基本依赖进口,投资成本高,后期维护费用昂贵。研究了聚焦透镜焦距、激光腔内结构、外光阑、扩束系统及其组合方式对PCB激光微孔特性的影响,通过对国产的TEACO2脉冲激光器的激光光束输出模式进行改善、光学系统进行优化,得到了直径在φ170μm以下、孔形良好的微孔。     

10m×10m大靶面激光立靶设计

针对10m×10m大靶面、高精度立靶坐标测量的要求,提出了一种激光阵列式光电立靶坐标测量系统,该立靶采用半导体激光平行光管形成平行光光源,高灵敏度光电二极管及相应信号放大、转换电路组成接收阵列,光源和接收器件相距10m,当飞行弹丸穿越激光形成的光幕时,分别在X和Y方向上挡住了投射在某一个或几个光电二极管上的光线,该光电二极管对应的信号放大、转换电路将二极管产生的微弱电信号放大、整形,最后输出脉冲信号,后续信号编码识别电路将判断出被挡住光线的光电二极管的编号,进而得出弹丸穿越该光幕的X坐标和Y坐标。经实弹试验证明,系统具有测量靶面大,精度高的优点。     

纳秒激光在铜靶材中诱导冲击波的实验研究

基于聚偏二氟乙烯压电传感器, 对铜靶材中纳秒激光脉冲诱导的冲击波传播过程进行了实验研究, 给出了铜靶材内冲击压强随激光脉冲能量和靶材厚度的变化规律. 实验结果表明: 500 mJ激光脉冲能量作用到2 mm厚的铜靶材产生的冲击压强达到2.1 MPa; 激光脉冲能量从200 mJ 增加到500 mJ, 在铜靶材厚度为2和4 mm条件下, 冲击压强分别增加了162%和231%; 而当铜靶材厚度从2 mm增加到6 mm时, 在400和500 mJ激光脉冲能量作用下, 铜靶材内冲击压强分别降低了32%和49%.     

脉冲激光-铜靶等离子体产生及其演化过程的瞬态光谱研究

应用时间分辨光谱技术, 研究了高能量纳秒脉冲激光作用下铜靶表面等离子体产生及演化的物理过程. 实验中相互作用区固-气-液三相对激光能量的吸收明显地反映于激光反射强度随时间的演化中, 使得靶表面物质形态的改变导致激光反射强度随时间呈双峰分布.同时, 随着激光峰值功率密度的增加, 靶面等离子体(气)-固-液相变发生的时间相应提前.因此, 这些瞬态性质是诊断激光-固体靶相互作用中靶面物质相变时间的有效方法.     

Cold processing of green state LTCC with a CO2 laser

We report a novel “cold” self-cleaning technique for processing low temperature co-fired ceramic (LTCC) in the “green” state at high resolution and high speed, using a low power carbon dioxide laser. A particle ejection process involving both the ceramic grains and the organic binder produces material removal rates of >100 μm per pulse with lateral processing resolution of 50 μm and depth resolution comparable to ceramic grain size with no heat-effected zone or other deleterious thermal effects. The process has been used to drill microvias and to machine arbitrary shapes with high resolution. PACS 79.20.Ds; 42.62.Cf; 42.55.Lt; 81.20.Wk     

A microcomputer-controlled vacuum adiabatic calorimeter for the temperature range 4.2–300 K

In this paper, we describe the operation of a vacuum adiabatic calorimeter controlled by a Rockwell AIM 65 microcomputer, which is suitable for specific heat measurements in the temperature interval 4.2–300 K. The system measures and calculates the specific heat and the results are printed out on a thermal tape. The cryostat, the electronic circuitry and the software are described. Results obtained using a pulsed heat technique on a specimen of high purity copper are given and compared with values reported in the literature.     

Reduction of copper bromide molecules in the plasma of a CuBr laser during the interpulse period

The operation of a CuBr laser in an excitation pulse train mode has been investigated. The experimental data obtained allow one to determine the characteristic time for which copper atoms are lost by the active medium of the laser. The analysis performed based on a numerical simulation of the laser operation has shown that the copper atoms are lost in the processes of reduction of CuBr molecules due to reactions of interaction of copper atoms with bromine ions. The predicted time for which copper atoms are lost by the laser active medium (150 μs) is in good agreement with the experimental one.     

XPS studies of short pulse laser interaction with copper

The effect of laser ablation on copper foil irradiated by a short 30 ns laser pulse was investigated by X-ray photoelectron spectroscopy. The laser fluence was varied from 8 to 16.5 J/cm² and the velocity of the laser beam from 10 to 100 mm/s. This range of laser fluence is characterized by a different intensity of laser ablation. The experiments were done in two kinds of ambient atmosphere: air and argon jet gas.The chemical state and composition of the irradiated copper surface were determined using the modified Auger parameter (α′) and O/Cu intensity ratio. The ablation atmosphere was found to influence the size and chemical state of the copper particles deposited from the vapor plume. During irradiation in air atmosphere the copper nanoparticles react with oxygen and water vapor from the air and are deposited in the form of a CuO and Cu(OH)₂ thin film. In argon atmosphere the processed copper surface is oxidized after exposure to air.     

Evaluating the use of laser radiation in cleaning of copper embroidery threads on archaeological Egyptian textiles

Cleaning of copper embroidery threads on archaeological textiles is still a complicated conservation process, as most textile conservators believe that the advantages of using traditional cleaning techniques are less than their disadvantages. In this study, the uses of laser cleaning method and two modified recipes of wet cleaning methods were evaluated for cleaning of the corroded archaeological Egyptian copper embroidery threads on an archaeological Egyptian textile fabric. Some corroded copper thread samples were cleaned using modified recipes of wet cleaning method; other corroded copper thread samples were cleaned with Q-switched Nd:YAG laser radiation of wavelength 532 nm. All tested metal thread samples before and after cleaning were investigated using a light microscope and a scanning electron microscope with an energy dispersive X-ray analysis unit. Also the laser-induced breakdown spectroscopy (LIBS) technique was used for the elemental analysis of laser-cleaned samples to follow up the laser cleaning procedure. The results show that laser cleaning is the most effective method among all tested methods in the cleaning of corroded copper threads. It can be used safely in removing the corrosion products without any damage to both metal strips and fibrous core. The tested laser cleaning technique has solved the problems caused by other traditional cleaning techniques that are commonly used in the cleaning of metal threads on museum textiles.     

Interface microstructure and mechanical properties of laser welding copper–steel dissimilar joint

Relatively the high reflectivity of copper to CO₂ laser led to the difficulty in joining copper to steel using laser welding. In this paper, a new method was proposed to complete the copper–steel laser butt welding. The scarf joint geometry was used, i.e., the sides of the copper and steel were in obtuse and acute angles, respectively. During the welding process, the laser beam was fixed on the steel side and the dilution ratio of copper to steel was controlled by properly selecting the deviation of the laser beam. The offset of laser beam depended on the scarf angle between the copper and steel, the thickness of plate and the processing parameters used in the laser welding. The microstructure near the interface between Cu plate and the intermixing zone was investigated. Experimental results showed that for the welded joint with high dilution ratio of copper, there was a transition zone with numerous filler particles near the interface. However, if the dilution ratio of copper is low, the transition zone is only generated near the upper side of the interface. At the lower side of the interface, the turbulent bursting behavior in the welding pool led to the penetration of liquid metal into Cu. The welded joint with lower dilution ratio of copper in the fusion zone exhibited higher tensile strength. On the bases of the microstructural evaluation at the interface of the welded joint, a physical model was proposed to describe the formation mechanism of the dissimilar joint with low dilution ratio of copper.     

激光冲击强化提高纯铜耐磨性能的研究

应用激光冲击强化对纯铜表面进行处理改善其耐磨性能。采用球磨实验分析了激光冲击强化前后的耐磨性能, 利用X-射线衍射仪和电子背散射衍射技术对表层的相结构和晶粒形态分布进行了分析, 并对耐磨性能提高机理进行了讨论。结果表明, 纯铜经激光冲击强化后其比磨损率降低了19.5%, 同时由于表面粗糙度增大, 使得初期摩擦系数增加, 但随着摩擦周数的增加, 激光冲击强化作用明显, 摩擦系数下降。这是由于激光冲击强化在纯铜中引入大量细化晶粒、孪晶和亚结构, 阻碍了位错的运动, 增强了变形抗力, 从而提高了材料的耐磨性能。     

飞秒激光分离同位素的模拟实验研究

利用飞秒激光与铜镍材料作用,在不同条件下得到了铜镍材料的分离,分离比可达30%.分析认为,激光等离子体中的自生轴向磁场和环形磁场在同位素的分离过程中可能起着相反的作用,二者相互竞争.不同的磁场构形将对同位素分离产生不同的结果,因此,通过控制不同的激光等离子体相互作用过程可以实现对激光分离同位素的控制 关键词： 飞秒激光等离子体 同位素 铜镍 自生磁场     

超强激光与固体气体复合靶作用产生高能氦离子

激光氦离子源产生的MeV能量的氦离子因有望用于聚变反应堆材料辐照损伤的模拟研究而得到关注.目前激光驱动氦离子源的主要方案是采用相对论激光与氦气射流作用加速高能氦离子,但这种方案在实验上难以产生具有前向性和准单能性、数MeV能量、高产额的氦离子束,而这些氦离子束特性是材料辐照损伤研究中十分关注的.不同于上述激光氦离子产生方法,我们提出了一种利用超强激光与固体-气体复合靶作用产生氦离子的新方法.利用这种方法,在实验上,采用功率密度5×10~(18)W/cm~2的皮秒脉宽的激光脉冲与铜-氦气复合靶作用,产生了前向发射的2.7 MeV的准单能氦离子束,能量超过0.5 MeV的氦离子产额约为10~(13)/sr.二维粒子模拟显示,氦离子在靶背鞘场加速和类无碰撞冲击波加速两种加速机理共同作用下得到加速.同时粒子模拟还显示氦离子截止能量与超热电子温度成正比.     

全金属结构铜空心阴极激光器的研究

本文提出了一种全金属结构的铜空心阴极激光器,它具有耐高温烘烤、结构稳固的优点,大大改进了放电稳定性.该激光器已获得了Cu II740.4和780.8nm两条激光振荡线.通过研究铜空心阴极激光器阈值特性、气体混合比和放电温度对激光输出功率的影响,给出了一些新的结果.     

Development of insulated gate bipolar transistor-based power supply for elemental copper vapour laser

The elemental copper vapour laser is a widely used laser from a family of metal vapour lasers for applications such as dye laser pumping, micromachining etc. In this paper, we report the development and performance of IGBT-based pulsed power supply that replaced conventional thyratron-based power supply for 4.7 cm diameter, 150 cm long copper vapour laser. The laser tube delivered an average power of 51 W, which with conventional power supply was giving 40 W. The IGBT-based power supply offers considerable reduction in the running cost of the laser. It is more user-friendly when compared with the conventional power supply.     

基于激光焊接的网络滤波器无铅化封装

 采用激光直接焊接的方法,研究网络滤波器的无铅化封装技术,通过3种不同的方式进行了实验研究和理论分析,获得了将网络滤波器中直径为0.10 mm的极细铜芯漆包线在不去除绝缘漆的情况下直接焊接到铝引脚上的方法和途径。结果表明：焊接时用激光照射铜芯漆包线,去除绝缘漆后再熔化高熔点的、流动性好的铜芯,熔化后的液态金属铜向下流动,包覆难于焊接的、流动性差、易氧化、易形成气孔等焊接缺陷的铝材引脚,然后再与铝发生溶解、扩散,最后形成良好焊点。这种不需去除绝缘漆的方法使焊接过程大大简化,且满足无铅化的要求;通过辅助电路,能在一定程度上提高焊接的可靠性,便于进行自动化。     

锂离子动力电池极片的激光切割分析

为适应锂离子动力电池行业发展需求,寻求一种高效高质切片方式,本文研究了多种激光器的切片质量。通过影像测量仪和扫描电镜(SEM)对比发现,100 ns脉宽调Q型1 064 nm光纤激光器切割正极铝箔时毛刺和热影响区(HAZ)约为15μm和60μm,切负极铜箔时HAZ约为200μm; 20 ns脉宽的MOPA光纤激光器切割铝箔毛刺10μm,HAZ约为20μm,切铜箔时HAZ约70μm;脉宽为10 ps的固体激光器切割铝箔毛刺和HAZ分别约为6μm和10μm,切铜箔时实现无熔融重凝区; 20 ns脉宽的355 nm紫外和532 nm的绿光固体激光器切割铝箔HAZ分别为10μm和17μm,切铜箔时HAZ则分别为大于70μm和100μm。实验结果表明:脉宽越窄,重复频率越高,切割的极片质量越好,ps激光器切割的极片精度最高,质量最好,是切割极片最理想激光器。而目前,频率高、脉宽相对窄的MOPA光纤激光器切割速度最高,切割的正极片完全满足工业要求,更适合极片切割的工业推广。