Vanillin‐derived phosphorus‐containing compounds and ammonium polyphosphate as green fire‐resistant systems for epoxy resins with balanced properties

Flame retardants from vanillin when utilized together with ammonium polyphosphate (APP) yield excellent synergistic flame retardancy toward epoxy resins. Bisphenol A epoxy resins have been widely used due to their excellent mechanical properties, chemical resistance, electrical properties, adhesion, etc., while they are flammable. Environment‐friendly and bio‐based flame retardants have captured increasing attention due to their ecological necessity. In this paper, 3 bio‐based flame retardants were synthesized from abundant and more importantly renewable vanillin, and their chemical structures were determined by ¹H NMR and ¹³C NMR. They were used together with APP (an environment‐friendly commercial flame retardant) to improve the fire resistance of bisphenol A epoxy resin. With the addition APP content of 15 phr, the modified bisphenol A epoxy resin could reach UL‐94V0 rating during vertical burning test and limit oxygen index values of above 35%, but reducing APP content to 10 phr, the flame retardancy became very poor. With the total addition content of 10 phr, the epoxy resins modified by 7 to 9 phr APP and 1 to 3 phr bio‐based flame retardants with epoxy groups or more benzene rings showed excellent flame retardancy with UL‐94V0 rating and limit oxygen index values of around 29%. The T_gs of the epoxy resins could be remained or even increased after introducing bio‐based flame retardants, as the control; those of APP alone‐modified epoxy resins compromised a lot. The green synergistic flame‐retardant systems have a great potential to be used in high‐performance materials.     

Thermal properties and flame retardancy of novel epoxy based on phosphorus‐modified Schiff‐base

Through addition reaction of Schiff‐base terephthalylidene‐bis‐(p‐aminophenol) ( DP‐1 ) and diethyl phosphite (DEP), a novel phosphorus‐modified epoxy, 4,4'‐diglycidyl‐(terephthalylidene‐bis‐(p‐aminophenol))diphosphonate ether ( EP‐2 ), was obtained. An modification reaction between EP‐2 and DP‐1 resulted in an epoxy compound, EP‐3 , possessing both phosphonate groups and C?N imine groups. The structure of EP‐2 was characterized by Fourier transform infrared (FTIR), elemental analysis (EA), ¹H, ¹³C, and ³¹P NMR analyses. The thermal properties of phosphorus‐modified epoxies cured with 4,4'‐diaminodiphenylmethane (MDA) and 4,4'‐diaminodiphenyl ether (DDE) were studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The activation energies of dynamic thermal degradation (E_d) were calculated using Kissinger and Ozawa's methods. The thermal degradation mechanism was characterized using thermogravimetric analysis/infrared spectrometry (TG‐IR). In addition, the flame retardancy of phosphorus‐modified epoxy thermosets was evaluated using limiting oxygen index (LOI) and UL‐94 vertical test methods. Via an ingenious design, phosphonate groups were successfully introduced into the backbone of the epoxies; the flame retardancy of phosphorus‐modified epoxy thermosets was distinctly improved. Due to incorporation of C?N imine group, the phosphorus‐modified epoxy thermosets exhibited high thermal stabilities; the values of glass‐transition temperatures (T_gs) were about 201–210°C, the values of E_d were about 220–490 kJ/mol and char yields at 700°C were 49–53% in nitrogen and 45–50% in air. These results showed an improvement in the thermal properties of phosphorus‐modified epoxy by the incorporation of C?N imine groups. Copyright © 2010 John Wiley & Sons, Ltd.     

Effect of ethyl‐bridged diphenylphosphine oxide on flame retardancy and thermal properties of epoxy resin

Three commercialized flame retardants, 1,2‐bis(diphenylphosphinoyl)ethane (EDPO), 6,6‐(1,2‐phenethyl)bis‐6H‐dibenz[c,e][1,2]oxaphosphorin‐6,6‐dioxide (HTP‐6123), and hexa‐phenoxy‐cyclotriphosphazene (HPCTP), were used to prepare the flame retardant diglycidyl ether of bisphenol A (DGEBA) epoxy resin (EP) under the same experimental conditions. The effects of T_g, thermal stability, and water absorption properties of EP caused by the three flame retardants were investigated and compared, together with their flame retardant efficiency. Results showed that the introduction of the three flame retardants improved the flame retardant performance of EP but led to decreases in T_g and decomposition temperature. EDPO showed higher flame retardant efficiency than the other two flame retardants. EP/EDPO showed higher thermal stability, better flame retardant performance, higher T_g value, and lower water absorption than EP/HTP‐6123 and EP/HPCTP. The study discovered that EDPO and HTP‐6123 primarily act through the gas phase flame retardant mechanism, while HPCTP is primarily driven by the condensed phase mechanism.     

7‐Deaza‐2,8‐diaza­adenosine

In the title compound [systematic name: 4‐amino‐7‐(β‐d ‐ribofuranos­yl)‐7H‐pyrazolo[3,4‐d][1,2,3]triazine], C₉H₁₂N₆O₄, the torsion angle of the N‐glycosylic bond is high anti [χ = −83.2 (3)°]. The ribofuran­ose moiety adopts the C2′‐endo–C1′‐exo (²T₁) sugar conformation (S‐type sugar pucker), with P = 152.4° and τ_m = 35.0°. The conformation at the C4′—C5′ bond is +sc (gauche,gauche), with the torsion angle γ = 52.0 (3)°. The compound forms a three‐dimensional network that is stabilized by several hydrogen bonds (N—H⋯O, O—H⋯N and O—H⋯O).     

Diborylated Magnesium Anthracene as Precursor for B2H5−‐Bridged 9,10‐Dihydroanthracene

9,10‐(Bpin)₂‐anthracene ( 3 , HBpin=pinacolborane) was synthesized from 9,10‐dibromoanthracene in a stepwise lithiation/borylation sequence. The reaction of 3 with highly activated magnesium furnished the diborylated magnesium anthracene 4 , which was quenched in situ with ethereal HCl to yield cis‐9,10‐(Bpin)₂‐DHA (cis‐ 5 , DHA=9,10‐dihydroanthracene). Compound cis‐ 5 , in turn, can be reduced with Li[AlH₄] in THF to give its diborate Li₂[cis‐9,10‐(BH₃)₂‐DHA] (Li₂[cis‐ 6 ]). In the crystal lattice, the THF solvate Li₂[cis‐ 6 ] ? 3 THF establishes a dimeric structure with Li‐(μ‐H)‐B coordination modes. Hydride abstraction from Li₂[cis‐ 6 ] with Me₃SiCl yields the B?H?B‐bridged DHA Li[ 7 ]. This product can also be viewed as a unique cyclic B₂H₇^? derivative with a hydrocarbon backbone. Treatment of Li₂[cis‐ 6 ] with the stronger hydride abstracting agent Me₃SiOTf (HOTf=trifluoromethanesulfonic acid) in THF affords the THF diadduct of cis‐9,10‐(BH(OTf))₂‐DHA.     

Syntheses of conductive adhesives based on epoxy resin and polyanilines by using N‐tert‐butyl‐5‐methylisoxazolium perchlorate as a thermally latent curing reagent

Conductive composites consisted of epoxy resin and polyanilines (PANIs) doped with dodecylbenzenesulfonic acid ( 1 ), dodecylsulfonic acid (2), di(2‐ethylhexyl)sulfosuccinic acid (3), and HCl were synthesized by use of N‐tert‐butyl‐5‐methylisoxazolium perchlorate (5) under various reaction conditions. It was found that the composites with PANI doped with acid 2 (PANI‐2) prepared by curing with 10 mol % of reagent 5 at 80 °C for 12 h showed high electroconductivity along with the low conducting percolation threshold (3 wt % of PANI‐2). Furthermore, the composite with even ?10 wt % of PANI‐2 exhibited ?10^?1 S/cm of electroconductivity. The UV–vis and IR measurements indicated that the conductive emeraldine salt form of PANI‐2 in the composite was maintained after the curing reaction. The thermal stability was studied by TGA and DSC measurements, and then, the T_d10 and T_g of the composite with 5 and 10 wt % of PANI‐2 were found to be similar to those with the cured epoxy resin itself. In addition, the similar investigation with an oxetane resin instead of the epoxy resin was also carried out. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 718–726, 2006     

Phosphoryl‐Rich Flame‐Retardant Ions (FRIONs): Towards Safer Lithium‐Ion Batteries

The functionalized catecholate, tetraethyl (2,3‐dihydroxy‐1,4‐phenylene)bis(phosphonate) (H₂‐DPC), has been used to prepare a series of lithium salts Li[B(DPC)(oxalato)], Li[B(DPC)₂], Li[B(DPC)F₂], and Li[P(DPC)₃]. The phosphoryl‐rich character of these anions was designed to impart flame‐retardant properties for their use as potential flame‐retardant ions (FRIONs), additives, or replacements for other lithium salts for safer lithium‐ion batteries. The new materials were fully characterized, and the single‐crystal structures of Li[B(DPC)(oxalato)] and Li[P(DPC)₃] have been determined. Thermogravimetric analysis of the four lithium salts show that they are thermally stable up to around 200 °C. Pyrolysis combustion flow calorimetry reveals that these salts produce high char yields upon combustion.     

Synthesis and characterization of novel epoxy resins‐filled microcapsules with organic/inorganic hybrid shell for the self‐healing of high performance resins

Novel microcapsules (MCs) with organic/inorganic hybrid shell were successfully fabricated using epoxy resin as core material and nano boron nitride (BN) and mesoporous silica (SBA‐15) as inorganic shell materials in aqueous solution containing a water‐compatible epoxy resin curing agent. The morphologies, thermal properties and Young's moduli of MCs were investigated. The results indicated that epoxy resins were encapsulated by BN/SBA‐15/epoxy polymer hybrid layer, the resulting MCs were spherical in shape and the introduction of inorganic particles made MCs had rough surface morphology. The mean modulus value of MCs was from 2.8 to 3.1 GPa. The initial decomposition temperature (T_di) of MCs at 5 wt% weight loss was from 309 to 312°C. MCs showed excellent thermal stability below 260°C. The structures and properties of MCs could be tailored by controlling the weight ratio of inorganic particle. When the weight ratio of BN to SBA‐15 was 0.15:0.10, MCs had the highest T_di and modulus. The resulting MCs were applied to high performance 4,4′‐bismaleimidodiphenylmethane/O,O′‐diallylbisphenol A (BMI/DBA) system to design high performance BMI/DBA/MC systems. Appropriate content of MCs could improve the fracture toughness and maintain the glass transition temperature (T_g) of BMI/DBA system. The core materials released from fractured MCs could bond the fracture surfaces of the BMI/DBA matrix through the polymerization of epoxy resins. When the healing temperature schedule of 100°C/2h+150°C/1h was applied, 15 wt% MCs recovered 98% of the virgin fracture toughness of BMI/DBA. Copyright © 2016 John Wiley & Sons, Ltd.     

High resolution solid‐state 13C‐NMR study of as‐cured and irradiated epoxy resins

This article presents the effects of strong ionizing radiations on the physico‐chemical modifications of aliphatic or aromatic amine‐cured epoxy resins based on diglycidyl ether of bisphenol A (DGEBA). Such epoxy resins have a considerable number of applications in the nuclear industrial field and are known to be very stable under moderate irradiation conditions. Using extensively high resolution solid‐state ¹³C‐NMR spectroscopy we show that the aliphatic amine‐cured resin (DGEBA‐TETA) appears much more sensitive to gamma rays than the aromatic amine‐cured one (DGEBA‐DDM). On the one hand, qualitative analyses of the high resolution solid‐state ¹³C‐NMR spectra of both epoxy resins, irradiated under similar conditions (8.5 MGy), reveal almost no change in the aromatic amine‐cured resin whereas new resonances are observed for the aliphatic amine‐cured resin. These new peaks were interpreted as the formation of new functional groups such as amides, acids and/or esters and to alkene groups probably formed in the aliphatic amine skeleton. On the other hand, molecular dynamics of these polymers are investigated by measuring the relaxation times, T_CH, T_1ρH and T_1C , before and after irradiation. The study of relaxation data shows the formation, under irradiation, of a more rigid network, especially for the aliphatic amine‐cured system and confirms that aromatic amine‐cured resin [DGEBA‐4,4′‐diaminodiphenylmethane(DDM)] is much less affected by ionizing radiations than the aliphatic amine‐cured resin [DGEBA‐triethylenetetramine(TETA)]. Moreover, it has been shown that the molecular modifications generated by irradiation on the powder of the aliphatic‐amine‐cured resin appear to be homogeneously distributed inside the polymers as no phase separations can be deduced from the above analyses. Copyright © 2001 John Wiley & Sons, Ltd.     

Three styryl‐substituted tetrahydro‐1,4‐epoxy‐1‐benzazepines: configurations,conformations and hydrogen‐bonded chains

(2SR,4RS)‐7‐Chloro‐2‐exo‐[(E)‐styryl]‐2,3,4,5‐tetrahydro‐1H‐1,4‐epoxy‐1‐benzazepine, C₁₈H₁₆ClNO, (I), crystallizes as a racemic twin in the space group P2₁ and the molecules are linked into a chain of edge‐fused R₃³(9) rings by a combination of C—H...O and C—H...N hydrogen bonds. The diastereoisomer (2RS,4RS)‐7‐chloro‐2‐endo‐[(E)‐styryl]‐2,3,4,5‐tetrahydro‐1H‐1,4‐epoxy‐1‐benzazepine, (II), also crystallizes as a racemic twin, but in the space group P2₁2₁2₁, and a two‐centre C—H...N hydrogen bond and a three‐centre C—H...(O,N) hydrogen bond combine to link the molecules into a complex chain of rings. In (2R,4R)‐7‐fluoro‐2‐endo‐[(E)‐styryl]‐2,3,4,5‐tetrahydro‐1H‐1,4‐epoxy‐1‐benzazepine, C₁₈H₁₆FNO, (III), which is not isomorphous with (II), the molecules are linked by a single C—H...O hydrogen bond into simple chains, but the molecular arrangements in (II) and (III) are nonetheless very similar. The significance of this study lies in its observation of the variations in molecular configuration and conformation, and in the variation in the supramolecular aggregation, consequent upon modest changes in the peripheral substituents.     

Synthesis and properties of two novel silicon‐containing cycloaliphatic epoxy resins for electronic packaging application

In this paper, two silicon‐containing cycloaliphatic olefins were synthesized through the nucleophilic substitution reactions of cyclohex‐3‐enyl‐1‐methanol with di‐ or tri‐chlorosilane compounds. Then, after epoxidation, two new cycloaliphatic epoxy resins with different epoxy groups were successfully prepared. Their chemical structures were confirmed by ²⁹Si NMR, ¹H NMR, and Fourier‐transform infrared spectra (FTIR). The properties of cured products, including viscoelasticity, glass transition temperature (T_g), coefficient of thermal expansion, thermal stability and water absorption, were investigated. Compared to the difunctional epoxy resin, the trifunctional one exhibited a remarkably increased cross‐linking density from 0.82 to 4.08 × 10^?3 mol/cm³ and T_g from 157 to 228°C. More importantly, prior to curing, they had viscosities of only 240–290 mPa sec at 25°C, which were much lower than that of ERL‐4221 (409 mPa sec), providing the possibility of easy processing. The high glass transition temperatures, good thermal stabilities, and mechanical properties as well as excellent flowability endow the silicon‐containing epoxy resins with promising potential in microelectronic packaging application. Copyright © 2011 John Wiley & Sons, Ltd.     

Regiodirected Synthesis and Stereochemistry of 2,4,8‐Trialkyl‐3‐thia‐1,5‐diazabicyclo[3.2.1]octanes and α,ω‐Bis(2,4,6‐trialkyl‐1,3,5‐dithiazinane‐5‐yl)alkanes

2,4,8‐Trialkyl‐3‐thia‐1,5‐diazabicyclo[3.2.1]octanes have been obtained by the regioselective and stereoselective cyclocondensation of 1,2‐ethanediamine with aldehydes RCHO (R═Me, Et, Prⁿ, Buⁿ, Pentⁿ) and H₂S at molar ratio 1:3:2 at 0°C. The increase in molar ratio of thiomethylation mixture RCHO–H₂S (6:4) at 40°C resulted in selective formation of bis‐(2,4,6‐trialkyl‐1,3,5‐dithiazinane‐5‐yl)ethanes. Cyclothiomethylation of aliphatic α,ω‐diamines with aldehydes RCHO (R═Me, Et) and H₂S at molar ratio 1:6:4 and at 40°С led to α,ω‐bis(2,4,6‐trialkyl‐1,3,5‐dithiazinane‐5‐yl)alkanes. Stereochemistry of 2,4,8‐trialkyl‐3‐thia‐1,5‐diazabicyclo[3.2.1]octanes have been determined by means of ¹H and ¹³С NMR spectroscopy and further supported by DFT calculations at the B3LYP/6‐31G(d,p) level. The structure of α,ω‐bis(2,4,6‐trialkyl‐1,3,5‐dithiazinane‐5‐yl)alkanes was confirmed by single‐crystal X‐ray diffraction study.     

A novel halogen‐free co‐curing agent with linear multi‐aromatic rigid structure as flame‐retardant modifier in epoxy resin

A novel halogen‐free 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO)‐containing co‐curing agent, 6,6′‐(1,4‐phenylenebis(((4‐(phenylamino)phenyl)amino)methylene))bis(dibenzo[c,e][1,2]oxaphosphinine 6‐oxide) (DPN) was synthesized via a simple 1‐pot or 2‐step procedure with yield of 86.2% and 70.8%, respectively. The molecular structures of 4,4′‐((1,4‐phenylenebis(methanylylidene))bis(azanylylidene))bis(N‐phenylaniline) (DPN intermediate) and DPN are characterized by FTIR, NMR, and MS. TGA tests show that the char yield of DPN/EP composites raises to 30.9% when the molar ratio of DPN to 4,4‐diaminodiphenyl methane(DDM) is 20:80. T_g values of DPN/EP composites tested by DSC and DMA are similar to neat epoxy resin (EP), which is due to the secondary amine in DPN that participates in the cross‐linking reaction of epoxy resin. The storage modulus in the rubber stage (E′‐190 °C) of flame‐retardant epoxy resin is close to that of neat EP, while their tanδ's are lower, which indicates the similarity of samples' cross‐linking density due to the participation of DPN in the cross‐linking reaction. The results show that when the molar ratio of DPN and DDM is 5:95, the epoxy has a higher T_g value and better mechanical properties than other samples. The introduction of DPN efficiently improves the flame‐retardant properties of epoxy resin with V‐0 rating of UL‐94 vertical burning test, non‐dripping, 41% of limit oxygen index (LOI) value, low peak heat release rate (PHRR), and total heat release (THR).     

Effect of a triazine ring‐containing charring agent on fire retardancy and thermal degradation of intumescent flame retardant epoxy resins

A triazine ring‐containing charring agent (PEPATA) was synthesized via the reaction between 2,6,7‐trioxa‐l‐phosphabicyclo‐[2.2.2]octane‐4‐methanol (PEPA) and cyanuric chloride. It was applied into intumescent flame retardant epoxy resins (IFR‐EP) as a charring agent. The effect of PEPATA on fire retardancy and thermal degradation behavior of IFR‐EP system was investigated by limited oxygen index (LOI), UL‐94 test, microscale combustion calorimetry (MCC), thermogravimetric analysis (TGA) and thermogravimetric analysis/infrared spectrometry (TG‐IR). The glass transition temperatures (T_g) of IFR‐EP systems were studied by dynamic mechanical analysis (DMA). The LOI values increased from 21.5 for neat epoxy resins (EPs) to 34.0 for IFR‐EP, demonstrating improved flame retardancy. The TGA curves showed that the amount of residue of IFR‐EP system was largely increased compared to that of neat EP at 700 °C. The new IFR‐EP system could apparently reduce the amount of decomposing products at higher temperatures and promotes the formation of carbonaceous charred layers that slowed down the degradation. Copyright © 2010 John Wiley & Sons, Ltd.     

Synthesis of 9,9‐bis(4‐aminophenyl)fluorene‐based benzoxazine and properties of its high‐performance thermoset

A benzoxazine ( P‐bapf ) based on 9,9‐bis(4‐aminophenyl)fluorene (BAPF), phenol, and formaldehyde was successfully prepared using two‐pot and one‐pot procedures. In the two‐pot approach, BAPF initially reacted with 2‐hydroxybenzaldehyde, leading to 9,9‐bis(4‐(2‐hydroxybenzylideneimino)phenyl)fluorene. The imine linkages of 9,9‐bis(4‐(2‐hydroxybenzylideneimino)phenyl)fluorene were then reduced by sodium borohydride, forming 9,9‐bis(4‐(2‐hydroxybenzylamino)phenyl)fluorene. Finally, paraformaldehyde was added to induce ring closure condensation, forming benzoxazine ( P‐bapf ). In the one‐pot approach, P‐bapf was obtained directly by reacting BAPF, phenol, and paraformaldehyde in various solvents. Among the solvents, we found that using toluene/ethanol (2/1, v/v) as a solvent leads to the best purity and yield. No gelation was observed in the preparation. The structure of the resulting benzoxazine was confirmed by ¹H, ¹³C, ¹H? ¹H and ¹H? ¹³C NMR spectra. P‐bapf exhibits a photoluminescent emission at 395 nm under an excitation of 275 nm. After curing, the resulting P‐bapf thermoset exhibits T_g as high as 236 °C, and the T_g can be further increased to 260 °C by copolymerization with an equal equivalent of cresol novolac epoxy. The 5% degradation temperature of the P‐bapf thermoset reaches as high as 413 °C (N₂) and 431 °C (air). The refractive index at 589 nm is as high as 1.70, demonstrating a high refractive index characteristic of fluorene linkage. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature T_g and thermal decomposition temperature T_d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol^?1. The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd.     

Curing kinetics,thermal, mechanical,and dielectric properties based on o‐cresol formaldehyde epoxy resin with polyhedral oligomeric (N‐aminoethyl‐γ‐amino propyl)silsesquioxane

The curing reaction and kinetics of o‐cresol formaldehyde epoxy resin (o‐CFER) with polyhedral oligomeric silsesquioxane of N‐aminoethyl‐γ‐amino propyl group (AEAP‐POSS) were investigated by differential scanning calorimetry (DSC). The thermal, mechanical, and dielectric properties of o‐CFER/AEAP‐POSS nanocomposites were investigated with thermogravimetric analysis (TGA), torsional braid analysis (TBA), tensile tester, impact tester, and electric analyzer, respectively. The results show that the activation energy (E) of curing reaction is 58.08 kJ/mol, and the curing reaction well followed the ?esták‐Berggren (S‐B) autocatalytic model. The glass transition temperature (T_g) increases with the increase in AEAP‐POSS content, and reaches the maximum, 107°C, when the molar ratio (N_s) of amino group to epoxy group is 0.5. The nanocomposites containing a higher percentage of AEAP‐POSS exhibited a higher thermostability. The AEAP‐POSS can effectively increase the mechanical properties of epoxy resin, and the tensile and impact strengths are 2.84 MPa and 143.25 kJ m^?2, respectively, when N_s is 0.5. The dielectric constant (ε), dielectric loss factor (tan δ), volume resistivity (ρ_v), and surface resistivity (ρ_s) are 4.98, 3.11 × 10^?4, 3.17 × 10¹² Ω cm³, and 1.41 × 10¹² Ω cm², respectively, similarly at N_s 0.5. Copyright © 2009 John Wiley & Sons, Ltd.     

2‐Amino‐7‐chloro‐2′‐deoxy­tubercidin

In 4‐chloro‐7‐(2‐de­oxy‐β‐d ‐erythro‐pento­furanos­yl)‐7H‐pyr­rolo­[2,3‐d]­pyrimidine‐2,4‐diamine, C₁₁H₁₄ClN₅O₃, the conformation of the N‐glycosylic bond is between anti and high‐anti [χ = −102.5 (6)°]. The 2′‐deoxy­ribofuranosyl unit adopts the C3′‐endo‐C4′‐exo (³T₄) sugar pucker (N‐type) with P = 19.6° and τ_m = 32.9° [terminology: Saenger (1989). Landolt‐Börnstein New Series, Vol. 1, Nucleic Acids, Subvol. a, edited by O. Madelung, pp. 1–21. Berlin: Springer‐Verlag]. The orientation of the exocyclic C4′—C5′ bond is +ap (trans) with a torsion angle γ = 171.5 (4)°. The compound forms a three‐dimensional network that is stabilized by four inter­molecular hydrogen bonds (N—H⋯O and O—H⋯N) and one intra­molecular hydrogen bond (N—H⋯Cl).     

Bis(η5‐isopropyltetramethylcyclo­pentadienyl)(tetrahydroborato‐κ3H,H′,H′′)(tetrahydrofuran‐O)‐samarium(III): a lanthanidocene complex with a tridentate tetrahydroborato ligand

The lanthanidocene complex [Sm(BH₄)(C₁₂H₁₉)₂(C₄H₈O)], (I), shows a distorted tetrahedral arrangement around the central Sm^III atom. It consists of two η⁵‐isopropyltetramethylcyclopentadienyl ligands, one tetrahydroborato (BH₄^?) ligand bridging via H atoms to the lanthanide atom and one coordinating tetrahydrofuran (thf) molecule. The BH₄^? unit of (I) coordinates as a tridentate ligand with three bridging H atoms and one terminal H atom [Sm—B—H4 176 (2)°]. The η⁵‐isopropyl­tetra­methylcyclopentadienyl ligands of this bent‐sandwich complex [Cp1—Sm—Cp2 133.53 (1)° where Cp denotes the centroid of the cyclopentadienyl ring] adopt staggered conformations.     

Rearrangements in Model Peptide‐Type Radicals via Intramolecular Hydrogen‐Atom Transfer

Intramolecular H‐atom transfer in model peptide‐type radicals was investigated with high‐level quantum‐chemistry calculations. Examination of 1,2‐, 1,3‐, 1,5‐, and 1,6[C ? N]‐H shifts, 1,4‐ and 1,7[C ? C]‐H shifts, and 1,4[N ? N]‐H shifts (Scheme 1), was carried out with a number of theoretical methods. In the first place, the performance of UB3‐LYP (with the 6‐31G(d), 6‐31G(2df,p), and 6‐311+G(d,p) basis sets) and UMP2 (with the 6‐31G(d) basis set) was assessed for the determination of radical geometries. We found that there is only a small basis‐set dependence for the UB3‐LYP structures, and geometries optimized with UB3‐LYP/6‐31G(d) are generally sufficient for use in conjunction with high‐level composite methods in the determination of improved H‐transfer thermochemistry. Methods assessed in this regard include the high‐level composite methods, G3(MP2)‐RAD, CBS‐QB3, and G3//B3‐LYP, as well as the density‐functional methods B3‐LYP, MPWB1K, and BMK in association with the 6‐31+G(d,p) and 6‐311++G(3df,3pd) basis sets. The high‐level methods give results that are close to one another, while the recently developed functionals MPWB1K and BMK provide cost‐effective alternatives. For the systems considered, the transformation of an N‐centered radical to a C‐centered radical is always exothermic (by 25 kJ ? mol^?1 or more), and this can lead to quite modest barrier heights of less than 60 kJ ? mol^?1 (specifically for 1,5[C ? N]‐H and 1,6[C ? N]‐H shifts). H‐Migration barriers appear to decrease as the ring size in the transition structure (TS) increases, with a lowering of the barrier being found, for example when moving from a rearrangement proceeding via a four‐membered‐ring TS (e.g., the 1,3[C ? N]‐H shift, CH₃? C(O)? NH^. → ^.CH₂? C(O)? NH₂) to a rearrangement proceeding via a six‐membered‐ring TS (e.g., the 1,5[C ? N]‐H shift, ^.NH? CH₂? C(O)? NH? CH₃ → NH₂? CH₂? C(O)? NH? CH₂^.).