面心立方固溶体合金的团簇加连接原子几何模型及典型工业合金成分解析

工业合金牌号的成分选择体现了固溶体合金的化学短程有序结构,满足由最近邻两层原子组成的"团簇加连接原子"模型,例如对于置换型面心立方固溶体Cu-Zn,其合金牌号成分可以表述为[Zn-Cu_(12)]Zn_(1-6)和[Zn-Cu_(12)](Cu,Zn)_6,其中方括号内为第一近邻配位多面体团簇.基于此,本文赋予团簇式以具体原子结构的含义,对置换型面心立方固溶体结构中团簇的可能存在形式进行了穷尽,得出团簇式所对应的所有"团簇加连接原子"结构单元模型,给出团簇和连接原子之间的比例和空间排列的所有可能,并对Cu-Zn和Cu-Ni合金常用牌号对应的团簇式给出了三维结构模型,进一步验证了前期关于合金团簇式解析的正确性.用这些模型中原子化学序描述合金的成分,赋予团簇式以具体的原子结构意义,为进一步开发新的合金提供了理论依据.     

退火诱导亚稳态Fe80Cu20合金固溶体的结构相变

利用扩展x射线吸收精细结构和x射线衍射研究了机械合金化制备的体心立方(bcc)的亚稳态Fe₈₀Cu₂₀合金固溶体的结构随退火温度的变化特点.结果表明，在300—873 K温度范围内，随着退火温度的升高，bcc结构物相的晶格常数近于线性降低，这主要是由于Cu原子从bcc结构Fe₈₀Cu₂₀合金固溶体中逐渐偏析出来，生成面心立方(fcc)结构的Cu物相所致.经603K退火后，Cu原子的平均键长R_Cu—Cu增加了0.003 nm左右，大约有50%的Cu原子从bcc结构的Fe₈₀Cu₂₀合金固溶体中偏析出来.在773 K退火后，bcc结构Fe_８０Cu₂₀合金固溶体近于完全相分离，生成了bcc结构的α-Fe与fcc结构的Cu物相. 关键词： 扩展x射线吸收精细结构 x射线衍射 ８０Cu₂₀合金')" href="#">Fe_８０Cu₂₀合金 机械合金化     

Co100-xMnx合金在GaAs(001)表面的生长结构和磁性的实验研究

对Co_100-xMn_x合金在GaAs(001)表面的分子束外延生长、晶体结构和磁学性质进行了研究.结果表明,当0100-xMn_x合金薄膜是体材料中不存在的体心立方(bcc)结构,并且具有较强的铁磁性,当44100-xMn_x合金薄膜最初为bcc结构,随着厚度的增加,逐渐从bcc向面心立方(fcc)结构转化,最后成为完全的fcc结构,薄膜具有较 关键词：     

退火诱导亚稳态Fe80Cu20合金固溶体的结构相变

利用扩展x射线吸收精细结构和x射线衍射研究了机械合金化制备的体心立方(bcc)的亚稳态Fe80Cu20合金固溶体的结构随退火温度的变化特点.结果表明,在300-873 K温度范围内,随着退火温度的升高,bcc结构物相的晶格常数近于线性降低,这主要是由于Cu原子从bcc结构Fe80Cu20合金固溶体中逐渐偏析出来,生成面心立方(fcc)结构的Cu物相所致.经603 K退火后,Cu原子的平均键长RCu-Cu增加了0.003 nm左右,大约有50%的Cu原子从bcc结构的Fe80Cu20合金固溶体中偏析出来.在773 K退火后,bcc结构Fe80Cu20合金固溶体近于完全相分离,生成了bcc结构的α-Fe与fcc结构的Cu物相.     

机械合金化Fe100-xCux体系的X射线吸收精细结构研究

利用X射线吸收精细结构(XAFS)方法研究机械合金化制备的Fe_100-xCu_x(x=0,10,20,40,60,70,80,100,x为原子百分比)合金中Fe和Cu原子的局域环境结构.对于Fe_100-xCu_x(x≥40)二元混合物,球磨160h后,Fe原子的近邻配位结构从bcc转变为fcc,但Cu原子的近邻结构保持其fcc不变.与之相反,在Fe₈₀Cu₂₀和Fe₉₀Cu₁₀(x≤20)合金中,Fe原子的近邻配位保持其bcc结构而Cu原子的近邻配位结构从fcc转变为bcc结构.XAFS结果还表明,fcc结构的Fe_100-xCu_x样品中Fe的无序因子σ(0.0099nm)比bcc结构的Fe_100-xCu_x中的σ(0.0081nm)大得多;并且在机械合金化Fe_100-xCu_x(x≥40)样品中Fe原子的σ(0.0099nm)比其Cu原子的σ(0.0089nm)大.这表明机械合金化Fe_100-xCu_x样品中Fe和Cu原子可以有相同的局域结构环境但不是均匀的过饱和固溶体,而是由Fe富集区和Cu富集区组成的合金.我们提出互扩散和诱导相变机理来解释在球磨过程中Fe_100-xCu_x合金产生从bcc到fcc和从fcc到bcc变化的结构相变 关键词： XAFS 100-xCu_x合金')" href="#">Fe_100-xCu_x合金 机械合金化     

基于β-FeSi2的(Fe, M)Si2三元合金相形成规律

二元β-FeSi₂相是一种重要的窄带半导体型金属硅化物,研究了基于该二元相的三元合金的形成规律,以丰富其材料范围.首先,利用团簇线判据作为理论依据,选取一个团簇和一个连接原子构成的模型,添加不同的第三组元作为连接原子,设计了Fe₃Si₈M(M=B, Cr, Ni, Cu, Co, Al）系列合金成分,即用添加组元替代二元相中的Fe连接原子.然后,用真空吸铸和真空甩带方法制备合金棒以及薄带,以获得无成分偏析的均匀合 关键词： 2')" href="#">β-FeSi₂ 三元合金 团簇线     

熔融Cu55团簇在铜块体中凝固过程的分子动力学模拟

应用基于嵌入原子势函数的分子动力学方法,模拟了嵌入在具有面心立方结构同质块体中的熔融Cu₅₅团簇在不同急冷温度下微观结构的演变情况.通过计算熔融Cu₅₅团簇的均方位移和原子平均能量随时间步的变化,并应用键对分析技术,分析了急冷温度对熔融Cu₅₅团簇结构变化的影响.研究结果表明,由于受到块体结构的影响,在所研究的急冷温度范围内,熔融Cu₅₅团簇在凝固过程中形成了以面心立方结构为主的微观结构.结晶过程是原子不断交换其位置的过程,团簇原子位置的重排敏感于温度的变化.随着急冷温度的升高,原子的扩散范围增大.在100,300和500 K三个较低的温度下有利于形成稳定的面心立方结构,但当急冷到100 K时,团簇中的原子在没有找到其最佳位置之前就已经完成晶化.在急冷到500 K时,团簇中的原子在块体中扩散充分,与块体中的原子形成理想的面心立方结构.在700,900和1100 K三个较高的温度上,局域结构表现为随时间步波动性变化. 关键词： 团簇 分子动力学 计算机模拟 凝固     

Invar合金的电子化学势均衡判据

用二元团簇作为描述Invar合金的基本结构单元,运用"团簇共振"结构模型,建立起以某一已知二元团簇与连接原子按1:x比例连接,描述Invar合金的电子化学势均衡判据.给出了Invar合金成分的经验分子式,即Invar合金成分=[团簇]1(连接原子)x.运用此判据,解析了部分Invar合金成分.发现典型的Invar合金实验成分与经验分子式相符合,说明基于"团簇共振"模型的Invar合金的电子化学势判据很好地解释了Invar合金成分的形成规律.     

自适应免疫优化算法研究大尺寸Cu-Au合金团簇稳定结构

合金团簇所具备的催化和光学等方面特性与团簇的尺寸、元素组成和元素序列密切关联,因而确定其稳定结构是研究纳米团簇合金性质的首要任务.本文利用基于内核构建的自适应免疫优化算法研究了完整元素组成的CunAum(n+m=61及79)二元合金团簇的稳定结构.应用多体Gupta势函数描述Cu-Au团簇原子间的相互作用.研究结果表明:对于CunAum(n+m=61)团簇,除了当n=12-15时为由三个双二十面体面面相连组成的环状结构外,其余均为二十面体结构.原子总数为79的Cu-Au合金团簇包括堆积缺陷的面心立方结构、双面心立方结构、二十面体、十面体和由四个双二十面体面面相连组成的环状结构.且当Au原子比例高和低时其主要构型分别为二十面体和十面体.此外,还分析了Cu-Au合金团簇结构势能量的分布情况及团簇的相对稳定性.原子分布规律显示Cu原子趋于占据内层,而Au原子趋向于分布在外层.     

合金效应加强水分子在PtRun团簇上的吸附作用

利用第一性原理计算方法,研究合金效应对PtRu_n-1（n=2-14）和H₂O-PtRu_n-1（n=2-14）体系的几何构型、稳定性及吸附水特性的影响.结果表明：铂原子替代钌原子的能量较低,容易与钌团簇形成合金,铂原子喜欢占据配位数较低位置.相对于纯钌团簇,合金效应很大程度上提高了水分子在PtRu_n团簇上的吸附能.考虑范德瓦尔斯力后,水分子在PtRu₇上的吸附能增大,分解势垒降低,水分子可以在PtRu₇上分解.铂钌合金更适合做分解水制取氢气的催化剂.     

Cluster formulae for metallic glasses derived from devitrification phases

Bulk metallic glasses are known to have a composition formula [cluster](glue atom)_1,3 within the framework of the cluster-plus-glue-atom model. The key issue in applying the cluster formula is the determination of the right clusters and glue atoms. As examples, alloy phases in the glass-forming systems Al–Ni–Zr and B–Co–Si are analysed from the viewpoint of nearest coordination polyhedral clusters. These alloy phases are described by [effective cluster](glue atom) _x , where the effective cluster refers to true cluster composition after taking account of cluster-sharing in the phase structure. For each alloy phase, a principal cluster can be identified that features the local short-range order of that phase. It is pointed out that the principal clusters can express compositions with high glass-forming abilities, as verified by our experiments in Al–Ni–Zr and B–Co–Si–Ta.     

Composition formulae of ideal metallic glasses and their relevant eutectics established by a cluster-resonance model

Composition formulae for ideal metallic glasses are explored by combining the cluster-plus-glue-atom model with the global resonance model, termed the cluster-resonance model for short. The former model gives the [cluster]₁(glue atom) _x cluster formulae, stressing the local cluster order of a glassy structure; the latter model extends the local cluster order to a medium-range one by introducing spherical periodicity that relates the cluster size with Fermi vector, k _F. Such a correlation allows the calculation of Fermi energy, E _F, and electrochemical potential of electrons of the system from any local clusters. The cluster-resonance model also implies the equilibrium of the electrochemical potentials of electrons between different clusters so that the number of glue atoms matching one cluster (x in the cluster formula) can be determined. Examples in the Cu–Zr–Al and B–Co–Si–Ta systems are given to show the effectiveness of the proposed model and the resulting cluster formulae in interpreting multicomponent metallic-glass compositions as well as their relevant binary eutectic points.     

Calculation of enhancement factors for solute diffusion in the fcc dilute random alloy

In this paper, we address the enhancement of solute diffusion by solute addition. We focus on the little studied kinetic effect leading to solute enhancement arising from the kinetics of the encounter of a solute atom with a vacancy in the presence of other solute atoms. The study complements an earlier study by two of the present authors of the enhancement of the solvent diffusivity. In the present paper, the fcc random alloy model is employed at the dilute limit. We employ Monte Carlo techniques to calculate the solute diffusion enhancement factors B ₁ and B ₂. Solute correlation factors, upon which the enhancement factors rely in this model, are calculated to a very high precision using long runs and averaging over a very large number of atoms. There is fair agreement with the kinetic treatments of Manning and of Holdsworth and Elliott, and excellent agreement with the self-consistent theory of Moleko et al.     

Onset of local ordering in some copper-based alloys: critical solute concentration vis-a-vis various solutionhardening parameters

The mode of planar distribution of solute atoms in Cu single crystals alloyed with 0.5 to 8.0 at.%Ge has been investigated via the temperature dependence of the critical resolved shear stress of these alloys. It is found that there exists a critical solute concentration c _m ≈ 5 at.%Ge below which the distribution of solute atoms in the crystal is random, and above which some local ordering occurs. This together with such data available in the literature for Cu-Zn, Cu-Al and Cu-Mn alloys, i.e. c _m ≈7 at. %Zn, 7 at.%Al and 1 at.%Mn, when examined as a function of the size-misfit factor δ = (1/b)(db/dc)of a given binary alloy system, shows that the value of c _m strongly depends on δ; the smaller the magnitude of δ, the greater the value of c _m and vice versa. Also, the value of c _m is found to correlate well with the electron-to-atom ratio (e/a)of the Cu-Zn, Cu-Al, Cu-Ge and Cu-Mn alloys with the solute concentration c = c _m . However, no systematic correlation exists between the critical solute concentration c _m for the onset of local ordering and the modulus-mismatch parameter η = (1/G)(dG/dc).      

24 electron cluster formulas as the ‘molecular’ units of ideal metallic glasses

It is known that ideal metallic glasses fully complying with the Hume-Rothery stabilization mechanism can be expressed by a universal cluster formula of the form [cluster](glue atom)_{1 or 3}. In the present work, it is shown, after a re-examination of the cluster-resonance model, that the number of electrons per unit cluster formula, e/u, is universally 24. The cluster formulas are then the atomic as well as the electronic structural units, mimicking the ‘molecular’ formulas for chemical substances. The origin of different electron number per atom ratios e/a is related to the total number of atoms Z in unit cluster formula, e/a?=?24/Z. The 24 electron formulas are well confirmed in typical binary and ternary bulk metallic glasses.     

Solute-diffusion-controlled dislocation creep in pure aluminium containing 0.026 at.% Fe

Pure aluminium containing about 200?at.ppm Fe in solution is shown to creep about 10⁶ times slower at 200°C than the same aluminium containing a negligible amount of iron in solution. The high creep resistance of the Al–200?at.ppm?Fe alloy is attributed to the presence of subgrain boundaries containing iron solute atoms. It is proposed that the opposing stress fields from subgrain boundaries and from the piled-up dislocations during creep are cyclically relaxed, by iron solute diffusion, to allow climb of the lead dislocation in the pile-up. The mechanism is a form of mechanical ratcheting. The model is applied to Al–Fe alloys and correctly predicts that the creep rate is controlled by the rate of iron solute diffusion and by a temperature dependence equal to the activation energy for iron diffusion, namely Q _c?=?221?kJ?mol^?1. Basic creep studies on solid-solution alloying with solute atoms that diffuse slowly in the lattice of aluminium (e.g. manganese, chromium, titanium and vanadium) appear worthy of study as a way of enhancing creep strength and of understanding creep mechanisms involving solute-atom-containing subgrain boundaries.