去除铝基板的大功率LED热分析

提出一种大功率LED免铝基板封装方式,采用ANSYS有限元热分析软件对传统的铝基板封装和免铝基板封装的LED进行模拟对比分析。模拟结果表明:两种封装结构的LED,其最高温度均出现在LED芯片处;对于单颗功率1 W、3颗功率1 W和单颗功率3 W的器件,由于有效地简化了散热通道、大幅度降低了总热阻,采用免铝基板结构的最高温度分别降低了6.436,9.468,19.309 ℃。传统的铝基板封装即使选用热导率高达200 W/(m·K)的基板,其散热效果依旧略逊于免铝基板封装结构,且随着LED功率的增大,免铝基板的新型封装结构散热优势更加明显。本文的研究为解决大功率LED的散热问题和光色稳定性问题提供了一种新途径。     

基于开缝基板的大功率LED散热性能研究

为了实现大功率多芯片LED的芯片直装散热(COH)封装的高效散热,提出了一种开缝基板的新型散热结构,并运用Icepak仿真软件模拟分析了在自然对流下不同缝间距对结温、热阻、流场分布和换热特性的影响。结果表明,开缝基板能有效改善流场分布,提高表面换热系数,增加散热性能。在传导和对流的双重作用下,存在最佳缝间距使结温和热阻最低,输入功率为1 W时,结温和热阻分别降低3.2K和1.01K/W。随芯片输入功率的增加,开缝基板的散热效果愈发明显。同时,开缝基板的提出也节省了器件封装成本。     

微方肋冷却系统的换热特性

采用去离子水为冷却介质,对自行设计的不同结构微方肋散热器内的换热特性进行实验研究,结果表明:在进口温度为20 ℃、进口流量为57.225 L/h、底面平均温度为73.4 ℃时,散热器散热量可达2.83106 W/cm2,可以满足当前高热流密度散热需求;当散热面温度一定时,散热量随着散热器进口流量的增加而增加,但增速随散热器底面温度的增加变缓;努谢尔特数随雷诺数的增加而成幂次方增加,常规针肋结构和微针肋结构换热关系式不满足微方肋散热器特性。为了更好地表达微方肋散热器内的换热特性,拟合了微方肋散热器内对流换热关系式。     

电液动力微泵的改进

介绍了微型电液动力泵的优化设计和工艺改进。电液动力微泵制作工艺的改进包括:材料的选择,微电极的优化设计和封装工艺的改进。使用聚二甲基硅氧烷(PDMS)作为构建微流道的材料,采用浇注法制作了PDMS微流道,并采用阳极键合方式进行微泵的封装。使用无水乙醇为工作流体对微泵进行流动实验,在驱动电压为90 V时,电液动力微泵驱动流体的最大流速可以达到92 uL/min。     

大功率远程荧光粉型白光LED散热封装设计

针对大功率远程荧光粉型白光LED存在的散热问题,研究了其封装结构的散热设计方法。在分析现有远程荧光粉型白光LED封装结构及散热特点的基础上,提出将荧光粉层与芯片热隔离的同时开辟独立的荧光粉层散热路径的热设计方法。仿真分析结果表明:新的设计能够在不增加灯珠径向尺寸的同时改善荧光粉层的散热能力。在相同边界条件下,改进设计后的荧光粉层温度较改进前降低了10.7℃,芯片温度降低了0.55℃。在芯片基座上设置热隔离槽对芯片和荧光粉层温度的影响可以忽略。为了达到最优的芯片和荧光粉层温度配置,对荧光粉层与芯片之间封装胶层厚度进行优化是必要的。新的封装方法将芯片和荧光粉层的散热问题相互独立出来,既避免了二者的相互加热问题,又增加了灯珠光学设计的自由度。     

有机电致发光器件的封装热特性研究

有机电致发光器件的稳定性与其封装结构密切相关,封装技术的优劣直接影响有机电致发光二极管器件的寿命.本文采用热阻抗模型对三种常用有机电致发光二极管器件封装结构进行热阻抗分析,并利用ANSYS有限元分析软件的热分析模块对热特性进行研究,得出各种器件封装结构的温度场分布,根据温度场分布比较得出各种封装结构散热性能的差异.分析得出,传统后盖式封装结构与混合封装结构散热效果相差不大,Barix封装结构具有最好的散热性能.模拟仿真结果显示,当玻璃厚度从0.5 mm增加至0.9 mm时,传统封装结构的发光层温度升高了0.124℃,Barix封装结构的发光层温度升高了0.262℃,表明玻璃层厚度的增减对有机电致发光二极管器件的散热影响较小.改变器件表面空气流动速度,使对流系数从25W/(m²·K)变为85W/(m²·K)时,传统封装结构有机电致发光二极管发光层的温度由42.911℃递减到26.85℃,可见增大表面空气流动速度对降低有机电致发光二极管有源层的温度作用显著.     

一种大功率LED散热系统模糊控制器设计

基于当前的COB封装LED芯片,分析了芯片的热阻模型,推导出发光结在理想温度下工作时的基板温度。针对大功率LED存在的散热问题,基于课题组双进双出射流冲击水冷散热系统,设计了一种模糊控制器,选取温度变化和温度变化率为控制输入量,并对各控制输入量的范围设定进行了说明。根据设计的控制器进行程序编写,下载到控制芯片中进行实际验证,在20℃环境温度下,芯片基板温度最终维持在35.5~36.5℃之间,保证了灯具正常、稳定工作,为大功率LED散热系统提供了一种控制器设计方案,具有一定的实际意义。     

石墨片作辅助热沉的高功率半导体激光器热传导特性

为使边发射高功率单管半导体激光器有源区温度降低,增加封装结构的散热性能,降低器件封装成本,提出一种采用高热导率的石墨片作为辅助热沉的高功率半导体激光器封装结构。利用有限元分析研究了采用石墨片作辅助热沉后,封装器件的工作热阻更低,散热效果更好。研究分析过渡热沉铜钨合金与辅助热沉石墨的宽度尺寸变化对半导体激光器有源区温度的影响。新型封装结构与使用铜钨合金作为过渡热沉的传统结构相比,有源区结温降低4.5 K,热阻降低0.45 K/W。通过计算可知,激光器的最大输出功率为20.6 W。在研究结果的指导下,确定铜钨合金与石墨的结构尺寸,以达到最好的散热效果。     

高功率半导体巴条激光器的热特性分析

对采用5层叠焊的微通道无氧铜热沉冷却的巴条激光器进行了流体动力学(CFD)分析。建立了条宽10 mm、腔长1.5 mm巴条芯片的流固耦合共轭传热模型,得到了不同流量水冷下激光器的热阻和压力损失曲线。分析了300 m L/min水流时,激光器的温度分布和冷却水的流动性能。实验条件下,测试了该微通道热沉封装的808 nm巴条激光器的热阻和压力损失。数值计算和实验测试所得的结果一致,在300 m L/min水流下,巴条热阻为0.38℃/W,在温度不高于70℃时可满足连续模式下90 W的散热要求。     

照明用大功率发光二极管封装材料的优化设计

根据传热理论,建立了大功率发光二极管的有限元模型.选择了4种键合材料（高导热导电银胶、纳米银焊膏,大功率芯片键合胶、Sn70Pb30）,4种基板材料（Al2O3、AlN、Al-SiC、铜钼合金）.采用ANSYS有限元热分析软件进行了温度场仿真,得到了大功率发光二极管封装材料的最优选择.研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.结果表明:纳米银焊膏-AlN组合具有最优的散热效果|增加散热基板厚度提高散热能力的作用不大|单个发光二极管输出功率有限,应优化封装结构并采用多芯片阵列来满足照明级的需要|外接铝热沉能达到理想的散热效果.     

Thermo-Hydraulic Behavior of Microchannel Heat Exchanger System

This article presents an experimental study of thermo-hydrodynamic phenomena in a microchannel heat exchanger system. The aim of this investigation is to develop correlations between flow/thermal characteristics in the manifolds and the heat transfer performance of the microchannel. A rectangular microchannel fabricated by a laser-machining technique with channel width and hydraulic diameter of 87 μm and 0.17 mm, respectively, and a trapezoidal-shaped manifold are used in this study. The heat sink is subjected to iso-flux heating condition with liquid convective cooling through the channels. The temporal and spatial evolutions of temperature as well as total pressure drop across the system are monitored using appropriate sensors. Data obtained from this study were used to establish relationships between parameters such as longitudinal wall conduction factor, residence and switching time, and thermal spreading resistance with Reynolds number. Result shows that there exist an optimum Reynolds number and conditions for the microchannel heat exchanger system to result in maximum heat transfer performance. The condition in which the inlet manifold temperature surpasses the exit fluid temperature results in lower junction temperature. It further shows that for a high Reynolds number, the longitudinal wall conduction parameter is greater than unity and that the fluid has sufficient dwelling time to absorb heat from the wall of the manifold, leading to high thermal performance.     

基于康托尔分形微通道流动与传热的模拟

高密度、 小体积和高集成的电子元器件散热困难, 易造成过早失效, 采用微通道换热器可以实现小体积内高热流的散热, 但流动阻力很大. 为了保证传热效果, 降低流动阻力, 本文提出了一种新型的微通道结构并对其流动与传热特性进行了数值模拟. 首先研究了微通道形状和结构, 模拟结果表明: 进出口截面宽高比为0.8 的矩形微通道的换热效果最好; 并在此基础上提出一种康托尔分型凹槽结构, 研究了有无康托尔分形以及不同分形级数对流动与传热性能的影响, 综合对比发现: 第二级康托尔分形模型 N2 既能保证热阻显著降低, 又能相比阵列结构降低压降, 具有明显的换热优势; 最后对这种康托尔分形结构的凹槽形状, 尺寸及不同方向上的分形进行研究, 结果表明梯形凹槽的下上表面长度比b/a 为0.6 、 流动方向分形比fx 为1 .25 和通道高度方向分形比fy 为1 .5 时换热流动性能最佳.     

Design and Experimental Investigation of a Gas-to-Gas Counter-Flow Micro Heat Exchanger

In this work, a double-layered microchannel heat exchanger is designed for investigation on gas-to-gas heat transfer. The micro-device contains 133 parallel microchannels machined into a polished polyether ether ketone plate for both the hot side and cold side. The microchannels are 200 μm high, 200 μm wide, and 39.8 mm long. The design of the micro-device allows tests with partition foils in different materials and of flexible thickness. A test rig is developed with the integration of customized pressure and temperature sensors for in situ measurements. Experimental tests on the counter-flow micro heat exchanger have been carried out for five different partition foils and various mass flow rates. The experimental results, in terms of pressure drop, heat transfer coefficients, and heat exchanger effectiveness are discussed and compared with the predictions of the classic theory for conventionally sized heat exchangers.     

微通道换热器大温差条件下流动换热研究

随着高效预冷器在航天航空领域发挥越来越重要的作用,紧凑高效换热器的研究成为了人们关注的热点。本文基于紧凑微通道换热器的几何特征,针对矩形截面平行流道换热器内超临界压力低温流体(氢和氦)在大温差条件下的流动换热现象进行数值模拟研究。通道截面边长小于1 mm,热流体氦和冷流体氢的进出口温差均大于600 K。通道内流体换热系数在顺流和逆流条件下有不同的变化趋势,并出现峰值。换热量随着通道宽度的增大而增大,流动压降随着通道宽度的增大而减小。冷热流体逆流时换热量大,压降较小,但对换热器材料要求较高。     

微通道换热器大温差条件下流动换热研究

随着高效预冷器在航天航空领域发挥越来越重要的作用,紧凑高效换热器的研究成为了人们关注的热点。本文基于紧凑微通道换热器的几何特征,针对矩形截面平行流道换热器内超临界压力低温流体(氢和氦)在大温差条件下的流动换热现象进行数值模拟研究。通道截面边长小于1 mm,热流体氦和冷流体氢的进出口温差均大于600 K。通道内流体换热系数在顺流和逆流条件下有不同的变化趋势,并出现峰值。换热量随着通道宽度的增大而增大,流动压降随着通道宽度的增大而减小。冷热流体逆流时换热量大,压降较小,但对换热器材料要求较高。     

Influence of T-semi attached rib on turbulent flow and heat transfer parameters of a silver-water nanofluid with different volume fractions in a three-dimensional trapezoidal microchannel

This study aimed at exploring influence of T-semi attached rib on the turbulent flow and heat transfer parameters of a silver-water nanofluid with different volume fractions in a three-dimensional trapezoidal microchannel. For this purpose, convection heat transfer of the silver-water nanofluid in a ribbed microchannel was numerically studied under a constant heat flux on upper and lower walls as well as isolated side walls. Calculations were done for a range of Reynolds numbers between 10,000 and 16,000, and in four different sorts of serrations with proportion of rib width to hole of serration width (R/W). The results of this research are presented as the coefficient of friction, Nusselt number, heat transfer coefficient and thermal efficiency, four different R/W microchannels. The results of numerical modeling showed that the fluid's convection heat transfer coefficient is increased as the Reynolds number and volume fraction of solid nanoparticle are increased. For R/W=0.5, it was also maximum for all the volume fractions of nanoparticle and different Reynolds numbers in comparison to other similar R/W situations. That's while friction coefficient, pressure drop and pumping power is maximum for serration with R/W=0 compared to other serration ratios which lead to decreased fluid-heat transfer performance.     

Experimental Investigation of the Effect of Flow Arrangements on the Performance of a Micro-Channel Heat Sink

Abstract

An experimental study is carried out to investigate the effect of entrance and exit conditions that prevail due to different flow arrangements on the thermal performance of a copper micro-channel heat sink. Three flow arrangements—U-type, S-type, and P-type—were considered for the analysis with a test piece having inlet and outlet plenum dimensions of 10 mm × 30 mm × 2.5 mm with an array of parallel micro-channels having an individual width of 330 μm and a uniform channel depth of 2.5 mm. Performance evaluations for different flow conditions at inlet and outlet plenums were made by maintaining constant heat supply at 125 W, 225 W, and 375 W with varying Reynolds number ranging from 224 to 1,121. Nusselt number and pressure drop were computed by measuring temperature difference and pressure drop across the inlet and outlet plenum for various test combinations. Maximum heat transfer was observed for the U-type flow arrangement, followed by the P-type and S-type; maximum pressure drop was noted for the S-type flow arrangement, followed by the U-type and P-type arrangements for a constant Reynolds number. A detailed analysis of the experimental results indicate that from a pressure drop point of view, the P-type flow arrangement is preferred, whereas from the heat transfer point of view, the U-type is found to be a better option.     

微通道冷却器内流动和传热特性的数值模拟

为满足固体激光器用微通道冷却器的换热要求, 根据冷却器结构分别建立了二维和三维物理模型, 利用计算流体力学方法首先对比研究两者的流动特性, 然后考察雷诺数和玻片生热量对微通道流动和传热特性的影响。结果表明:对于类似大平板间的矩形微通道层流流动区域, 其流动及传热特性可直接采用二维简化模型进行模拟分析;对于重点关注的转捩区, 采用三维模型模拟分析更好;当雷诺数增大到转捩点, 流体的传热效果得到明显增强;随着雷诺数的增大, 玻片生热量对通道内最低压力需求的影响逐渐减小;不同玻片生热量对微通道流动影响不可忽略, 对努赛尔数和通道总压降基本无影响。     

树型微通道网络在集成微电子冷却中的应用

本文通过数值求解三维的N-S方程以及能量守恒方程,研究了树型微通道网络热沉的温度分布特点,指出了常规树型网络结构在集成微电子冷却应用中的局限性,并通过详细的分析对其进行了局部改进.改进后的树型网络极大地提高了热沉的热性能同时还降低了压降.和平行微通道相比,改进后的树型微通道网络具有更小的压降,具有更小的热阻和更好的温度均匀性.因此具有很大的应用前景.     

Flow boiling heat transfer of water in microchannel heat sink

The flow boiling heat transfer of water in a microchannel heat sink with variable initial vapor quality at the inlet is investigated. The stainless steel microchannel heat sink contains ten 640 × 2050 μm channels with a length of 120 mm; the wall roughness is 10 μm. The data on the local heat-transfer coefficient distribution in heat sink length are obtained in the range of mass fluxes from 30 to 90 kg/m²s, heat fluxes from 40 to 170 kW/m², and vapor qualities from 0 to 1. The heat transfer instability associated with dry spots resulting from insufficient wetting of channel walls introduces substantial contribution to the heat transfer mechanism and leads to decreasing heat transfer in heat sink length downward the flow. The developed method for calculating the flow boiling heat transfer of water in a microchannel heat sink allows more accurate prediction of heat transfer drop than available methods.