大功率远程荧光粉型白光LED散热封装设计

针对大功率远程荧光粉型白光LED存在的散热问题,研究了其封装结构的散热设计方法。在分析现有远程荧光粉型白光LED封装结构及散热特点的基础上,提出将荧光粉层与芯片热隔离的同时开辟独立的荧光粉层散热路径的热设计方法。仿真分析结果表明:新的设计能够在不增加灯珠径向尺寸的同时改善荧光粉层的散热能力。在相同边界条件下,改进设计后的荧光粉层温度较改进前降低了10.7℃,芯片温度降低了0.55℃。在芯片基座上设置热隔离槽对芯片和荧光粉层温度的影响可以忽略。为了达到最优的芯片和荧光粉层温度配置,对荧光粉层与芯片之间封装胶层厚度进行优化是必要的。新的封装方法将芯片和荧光粉层的散热问题相互独立出来,既避免了二者的相互加热问题,又增加了灯珠光学设计的自由度。

Thermal Design of High Power Remote Phosphor White LED Package

Aiming at the heat dissipation problem of the high power remote phosphor white LED, the heat dissipation method of the package structure was studied. Based on the structure of the phosphor type white LED package and its characteristics of heat dissipation, a thermal managing method of the package was put forward, which both thermally insulated the chip and the phosphor layer and crea-ted a independent thermal dissipation path for the phosphor layer. The simulation results show that the redesigned package reduces the chip temperature by 0. 55 ℃ and the phosphor layer temperature by 10. 7 ℃ under the same boundary condition, indicating that the new design can reduce the phos-phor layer temperature without increasing the radius dimension of the package. The effect of the thermal isolation groove on the chip base can be ignored. To achieve the optimal chip and phosphor layer temperatures distribution, the thickness of the insulation layer between the chip and the phos-phor should be optimized. The new method makes the thermal management problems of the chip and the phosphor layer independent to each other, which avoids the mutual heating problems of the two, and also increases the optical design freedom of the lamp.